共查询到19条相似文献,搜索用时 196 毫秒
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采用简单的双台面工艺制作了完全平面结构的5个单元、10个发射极指大面积的SiGe HBT.器件表现出了良好的直流和高频特性,最大电流增益β为214.BVCEO为9V,集电极掺杂浓度为1×1017 cm-3,厚度为400nm时,BVCBO为16V.在直流偏置下IC=30mA,VCE=3.0V得到fT和fmax分别为18.0GHz和19.3GHz,1GHz下最大稳定增益为24.5dB,单端功率增益为26.6dB.器件采用了新颖的分单元结构,在大电流下没有明显的增益塌陷现象和热效应出现. 相似文献
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在研制了AlGaN/GaN HEMT外延材料的基础上,采用标准工艺制作了2.5mm大栅宽AlGaN/GaNHEMT。直流测试中,Vg=0V时器件的最大饱和电流Ids可达2.4A,最大本征跨导Gmax为520mS,夹断电压Voff为-5V;通过采用带有绝缘层的材料结构及离子注入的隔离方式,减小了器件漏电,提高了击穿电压,栅源反向电压到-20V时,栅源漏电在10-6A数量级;单胞器件测试中,Vds=34V时,器件在8GHz下连续波输出功率为16W,功率增益为6.08dB,峰值功率附加效率为43.0%;2.5mm×4四胞器件,在8GHz下,连续波输出功率42W,功率增益8dB,峰值功率附加效率34%。 相似文献
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顾子悦吴灯鹏程新红刘晓博俞跃辉 《微波学报》2019,35(4):16-20
5G 通信中3. 4~3. 6 GHz 是主要使用频段。GaN 射频器件由于高频、低功耗、高线性度等优势,满足5G 通信应用需求。文中在高阻硅基GaN 外延片上研制了AlGaN/GaN 高电子迁移率晶体管(High Electron Mobility Transistor, HEMT),并分析了金属鄄绝缘层鄄半导体(Metal-Insulator-Semiconductor,MIS)栅对器件直流和射频特性的影响。研究发现:相比于肖特基栅结构,MIS 栅结构器件栅极泄漏电流减少2~5 个数量级,漏极驱动电流能力和跨导提高10%以上;频率为3. 5 GHz 时,增益从1. 5 dB 提升到4. 0 dB,最大资用增益从5. 2 dB 提升到11. 0 dB,电流增益截止频率为8. 3 GHz,最高振荡频率为10. 0 GHz。 相似文献
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报道了基于50 nm栅工艺的AlN/GaN异质结的G波段器件结果。在AlN/GaN HEMT外延结构上,采用电子束直写工艺制备了栅长50 nm的"T"型栅结构。器件直流测试最大漏电流为2.1 A/mm,最大跨导为700 mS/mm;小信号测试外推其电流增益截止频率和最大振荡频率分别为180 GHz及350 GHz。采用该工艺制备的共面波导(CPW)结构的放大器工作电压6 V,在162 GHz小信号增益大于10 dB。166 GHz连续波峰值输出功率11.36 dBm,功率密度达到684 mW/mm,功率密度水平达到GaN器件在G频段的高水平。 相似文献
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采用在发射区台面腐蚀时保留InGaP钝化层和去除InGaP钝化层的方法制备了两种InGaP/GaAs异质结双极晶体管(HBT)器件,研究了InGaP钝化层对HBT器件基区表面电流复合以及器件直流和射频微波特性的影响.对制备的两种器件进行了对比测试后得到:保留InGaP钝化层的HBT器件最大直流增益(β)为130,最高振荡频率(fmax)大于53 GHz,功率附加效率达到61%,线性功率增益为23 dB;而去除InGaP钝化层的器件最大β为50,fnax大于43 GHz,功率附加效率为57%,线性功率增益为18 dB.测试结果表明,InGaP钝化层作为一种耗尽型的钝化层能有效抑制基区表面电流的复合,提高器件直流增益,改善器件的射频微波特性. 相似文献
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Design and Fabrication of Power Si1-xGex/Si Heterojunction Bipolar Transistor for Wireless Power Amplifier Applications 总被引:1,自引:1,他引:0
采用简单的双台面工艺制作了完全平面结构的2个单元4个发射极指的SiGe HBT.在没有扣除测试结构的影响下,当直流偏置IC=10mA,VCE=2.5V时,FT和fmax分别为1.8和10.1GHz.增益β为144.25,BVCBO为9V. 相似文献
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郑瑞英 《固体电子学研究与进展》1983,(1)
本文采用二维直流传输特性和s、y参数分析双栅MESFET的性能,介绍了器件设计和实验结果.得到的最佳性能为:在1GHz下噪声系数0.7dB,相关增益22.4dB;在1.9GHz下,噪声系数0.9dB,相关增益15.5dB. 相似文献
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Yu Jinyong Yan Beiping Su Shubing Liu Xunchun Wang Runmei Xu Anhuai Qi Ming Liu Xinyu 《半导体学报》2006,27(10):1732-1736
报道了发射极自对准的InP基异质结双极型晶体管.在集电极电流Ic=34.2mA的条件下,发射极面积为0.8μm×12μm的InP HBT截止频率fT为162GHz,最大振荡频率fmax为52GHz,最大直流增益为120,偏移电压为0.10V,击穿电压BVCEO达到3.8V(Ic=0.1μA).这种器件非常适合在高速低功耗方面的应用,例如OEIC接收机以及模拟数字转换器. 相似文献
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Hsing-Yuan Tu Tao-Hsuan Chou Yo-Sheng Lin Hsien-Chin Chiu Ping-Yu Chen Wen-Chung Wu Shey-Shi Lu 《Electron Device Letters, IEEE》2003,24(3):132-134
The DC and RF characteristics of Ga/sub 0.49/In/sub 0.51/P-In/sub 0.15/Ga/sub 0.85/As enhancement- mode pseudomorphic HEMTs (pHEMTs) are reported for the first time. The transistor has a gate length of 0.8 /spl mu/m and a gate width of 200 /spl mu/m. It is found that the device can be operated with gate voltage up to 1.6 V, which corresponds to a high drain-source current (I/sub DS/) of 340 mA/mm when the drain-source voltage (V/sub DS/) is 4.0 V. The measured maximum transconductance, current gain cut-off frequency, and maximum oscillation frequency are 255.2 mS/mm, 20.6 GHz, and 40 GHz, respectively. When this device is operated at 1.9 GHz under class-AB bias condition, a 14.7-dBm (148.6 mW/mm) saturated power with a power-added efficiency of 50% is achieved when the drain voltage is 3.5 V. The measured F/sub min/ is 0.74 dB under I/sub DS/=15 mA and V/sub DS/=2 V. 相似文献
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从理论上和实验上对InAlAs/InGaAs调制掺杂场效应晶体管(MODFET)进行了研究。建立了简单的一维电荷控制模型,并进行二维数值模拟,得到了不同偏压下器件内部电势分布和电子浓度分布。在上述理论的指导下,设计了我们所需要的器件纵向和横向结构,并对设计器件的直流特性进行了计算机辅助分析。最后叙述了利用国产Ⅳ型MBE设备生长的材料制作出MODFET的工艺过程,并对器件的直流特性和射频特性进行了测试和分析。直流测试表明,器件的最大饱和电流密度为125mA/mm,最大非本征跨导达250mS/mm;射频测试得到器件(L_g=1.0~1.2βm,W_g=150μm)的特征频率f_T为26GHz,最高振荡频率f_(max)为43GHz。 相似文献
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Jae Yeob Shim Hyung‐Sup Yoon Dong Min Kang Ju Yeon Hong Kyung Ho Lee 《ETRI Journal》2005,27(6):685-690
DC and RF characteristics of 0.15 °m GaAs power metamorphic high electron mobility transistors (MHEMT) have been investigated. The 0.15 °m ° 100 °m MHEMT device shows a drain saturation current of 480 mA/mm, an extrinsic transconductance of 830 mS/mm, and a threshold voltage of ‐0.65 V. Uniformities of the threshold voltage and the maximum extrinsic transconductance across a 4‐inch wafer were 8.3% and 5.1%, respectively. The obtained cut‐off frequency and maximum frequency of oscillation are 141 GHz and 243 GHz, respectively. The 8 ° 50 °m MHEMT device shows 33.2% power‐added efficiency, an 18.1 dB power gain, and a 28.2 mW output power. A very low minimum noise figure of 0.79 dB and an associated gain of 10.56 dB at 26 GHz are obtained for the power MHEMT with an indium content of 53% in the InGaAs channel. This excellent noise characteristic is attributed to the drastic reduction of gate resistance by the T‐shaped gate with a wide head and improved device performance. This power MHEMT technology can be used toward 77 GHz band applications. 相似文献
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A low-voltage single power supply enhancement-mode InGaP-AlGaAs-InGaAs pseudomorphic high-electron mobility transistor (PHEMT) is reported for the first time. The fabricated 0.5/spl times/160 /spl mu/m/sup 2/ device shows low knee voltage of 0.3 V, drain-source current (I/sub DS/) of 375 mA/mm and maximum transconductance of 550 mS/mm when drain-source voltage (V/sub DS/) was 2.5 V. High-frequency performance was also achieved; the cut-off frequency(F/sub t/) is 60 GHz and maximum oscillation frequency(F/sub max/) is 128 GHz. The noise figure of the 160-/spl mu/m gate width device at 17 GHz was measured to be 1.02 dB with 10.12 dB associated gain. The E-mode InGaP-AlGaAs-InGaAs PHEMT exhibits a high output power density of 453 mW/mm with a high linear gain of 30.5 dB at 2.4 GHz. The E-mode PHEMT can also achieve a high maximum power added efficiency (PAE) of 70%, when tuned for maximum PAE. 相似文献