A CMOS current-mode squaring circuit free of error resulting from carrier mobility reduction

This paper presents a new current-mode squaring circuit. The design is based on MOSFETs translinear principle in strong inversion. A new compensation technique to minimize the second order effects caused by carrier mobility reduction in short channel MOSFETs is proposed. Tanner T-spice simulation tool is used to confirm the functionality of the proposed design in 0.18 µm CMOS process technology. Simulation results indicate that the maximum linearity error is 1.2 %; power consumption is 326 µW and bandwidth of 340 MHz.     

[110]-surface strained-SOI CMOS devices

We have newly developed [110]-surface strained-silicon-on-insulator (SOI) n- and p-MOSFETs on [110]-surface relaxed-SiGe-on-insulator substrates with the Ge content of 25%, fabricated by applying the Ge condensation technique to SiGe layers grown on [110]-surface SOI wafers. We have demonstrated that the electron and the hole mobility enhancement of [110]-surface strained-SOI devices amounts to 23% and 50%, respectively, against the mobilities of [110]-surface unstrained MOSFETs. As a result, the electron and the hole mobility ratios of [110]-surface strained-SOI MOSFETs to the universal mobility of (100)-surface bulk-MOSFETs increase up to 81% and 203%, respectively. Therefore, the current drive imbalance between n- and p-MOS can be reduced. Moreover, both the electron and the hole mobilities of the [110]-surface strained-SOIs strongly depend on the drain current flow direction, which is qualitatively explained by the anisotropic effective mass characteristics of the carriers on a [110]-surface Si. As a result, the [110]-surface strained-SOI technology with optimization of the current flow directions of n- and p-MOS is promising for realizing higher speed scaled CMOS.     

High-performance strained-SOI CMOS devices using thin film SiGe-on-insulator technology

We have developed high-performance strained-SOI CMOS devices on thin film relaxed SiGe-on-insulator (SGOI) substrates with high Ge content (25%) fabricated by the combination of separation-by-implanted-oxygen (SIMOX) and internal-thermal-oxidation (ITOX) techniques without using SiGe buffer structures. The maximum enhancement of electron and hole mobilities of strained-SOI devices against the universal mobility amounts to 85 and 53%, respectively. On the other hand, we have also observed the reduction of carrier mobility in a thinner strained-Si layer or at higher vertical electric field conditions. For the first time, we have demonstrated a high-speed CMOS ring-oscillator using strained-SOI devices, and its improvement amounts to 63% at the supply voltage of 1.5 V, compared to control-SOI CMOS.     

[110] strained-SOI n-MOSFETs with higher electron mobility

We have recently developed [110]-surface strained silicon-on-insulator (SOI) n-MOSFETs. The strained-silicon (Si) layer with the strain of about 0.6% has been fabricated on a relaxed SiGe-on-insulator (SGOI) structure with the germanium (Ge) content of 25%. The electron mobility characteristics along the various current directions have been experimentally studied and compared to those of [100]- and [110]-surface unstrained-bulk MOSFETs. We have demonstrated, for the first time, that the electron mobility of [110] strained-SOI MOSFETs is enhanced, compared to that of [110] unstrained-bulk MOSFETs. The electron mobility enhancement depends on the current-flow directions, and the maximum enhancement factor amounts to 23% along the <001> direction. As a result, the electron mobility ratio of [110] strained-SOI MOSFETs to [100] universal mobility is 81% at maximum, whereas the ratio of [110] unstrained-bulk MOSFETs is only 66%. Therefore, [110] strained-SOI devices are also promising candidates for future high-performance CMOS.     

Control of threshold-voltage and short-channel effects in ultrathin strained-SOI CMOS devices

This paper presents a quantitative study on the device design for the control of threshold-voltage and the suppression of short-channel effects (SCEs) in ultrathin strained-silicon-on-insulator (strained-SOI) CMOSFETs in the sub-100-nm regime. A two-dimensional device simulation is used for this purpose, with emphasis on the impact of band offset in Si/SiGe heterostructures. For the control of threshold-voltage, the combination of the gate work function and the back gate bias is needed to obtain appropriate values of threshold-voltage in n- and p-channel MOSFETs and to suppress SiGe buried channels in p-channel MOSFETs with thicker strained-Si layers. Regarding SCEs, the importance and the necessity of thin SiGe layers are pointed out from the viewpoint of the influence of the higher permittivity of SiGe layers. It is shown that the SCEs of strained-SOI MOSFETs with thinner SiGe layers are almost the same level as those of unstrained-SOI.     

A low-voltage low-power CMOS fully differential linear transconductor with mobility reduction compensation

A highly linear fully differential CMOS transconductor architecture based on flipped voltage follower (FVF) is proposed. The linearity of the proposed architecture is improved by mobility reduction compensation technique. The simulated total harmonic distortion (THD) of the proposed transconductor with 0.4V_pp differential input is improved from ?42 dB to ?55 dB while operating from 1.0 V supply. As an example of the applications of the proposed transconductor, a 4th-order 5 MHz Butterworth Gm-C filter is presented. The filter has been designed and simulated in UMC 130 nm CMOS process. It achieves THD of ?53 dB for 0.4V_pp differential input. It consumes 345 μw from 1.0 V single supply. Theoretical and simulated results are in good agreement.     

Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits

High leakage current in deep-submicrometer regimes is becoming a significant contributor to power dissipation of CMOS circuits as threshold voltage, channel length, and gate oxide thickness are reduced. Consequently, the identification and modeling of different leakage components is very important for estimation and reduction of leakage power, especially for low-power applications. This paper reviews various transistor intrinsic leakage mechanisms, including weak inversion, drain-induced barrier lowering, gate-induced drain leakage, and gate oxide tunneling. Channel engineering techniques including retrograde well and halo doping are explained as means to manage short-channel effects for continuous scaling of CMOS devices. Finally, the paper explores different circuit techniques to reduce the leakage power consumption.     

Low-temperature mobility measurements on CMOS devices

The surface channel mobility of carriers in n- and p-MOS transistors fabricated in a CMOS process was accurately determined at low temperatures down to 5 K. The mobility was obtained by an accurate measurement of the inversion charge density using a split C-V technique and the conductance at low drain voltages. The split C-V technique was validated at all temperatures using a one-dimensional Poisson solver (MOSCAP) which was modified for low-temperature application. The mobility dependence on the perpendicular electric field for different substrate bias values appeared to have different temperature dependences for n- and p-channel devices. The electron mobility increased with a decrease in temperature at all gate voltages. On the other hand, the hole mobility exhibited a different temperature behavior depending upon whether the gate voltage corresponded to strong inversion or was near threshold     

Thin-film SOI CMOS transistors with p+-polysilicon gates

A comparison is given of the use of p⁺-polysilicon and n⁺-polysilicon as the gate material for high-performance CMOS processes in fully depleted, thin SOI (silicon on insulator) films. Experimental devices on Simox substrates are compared with numerical simulations. It is found that n-channel transistors with p-poly gates require lower channel doping levels than their n-poly counterparts, leading to higher gains and easier control of the threshold voltage. The lower electric fields in the p-poly transistor also result in improved drain breakdown characteristics. Control of the subthreshold and punch-through characteristics of the p-poly device requires the use of very thin films when there is significant fixed positive charge at the interface with the buried oxide     

Kickback noise reduction techniques for CMOS latched comparators

The latched comparator is a building block of virtually all analog-to-digital converter architectures. It uses a positive feedback mechanism to regenerate the analog input signal into a full-scale digital level. The large voltage variations in the internal nodes are coupled to the input, disturbing the input voltage-this is usually called kickback noise. This brief reviews existing solutions to minimize the kickback noise and proposes two new ones. HSPICE simulations of comparators implemented in a 0.18-/spl mu/m technology demonstrate their effectiveness.     

Phase noise up-conversion reduction for integrated CMOS VCOs

The recent progress in standard CMOS integrated VCO design is mainly due to improved modelling and simulation techniques for integrated planar inductors. Further improvement can be achieved by focusing on the active circuitry. A discussion is presented into reducing the up-conversion of low frequency noise     

INDEP approach for leakage reduction in nanoscale CMOS circuits

Complementary metal oxide semiconductor (CMOS) technology scaling for improving speed and functionality turns leakage power one of the major concerns for nanoscale circuits design. The minimization of leakage power is a rising challenge for the design of the existing and future nanoscale CMOS circuits. This paper presents a novel, input-dependent, transistor-level, low leakage and reliable INput DEPendent (INDEP) approach for nanoscale CMOS circuits. INDEP approach is based on Boolean logic calculations for the input signals of the extra inserted transistors within the logic circuit. The gate terminals of extra inserted transistors depend on the primary input combinations of the logic circuits. The appropriate selection of input gate voltages of INDEP transistors are reducing the leakage current efficiently along with rail to rail output voltage swing. The important characteristic of INDEP approach is that it works well in both active as well as standby modes of the circuits. This approach overcomes the limitations created by the prevalent current leakage reduction techniques. The simulation results indicate that INDEP approach mitigates 41.6% and 35% leakage power for 1-bit full adder and ISCAS-85 c17 benchmark circuit, respectively, at 32 nm bulk CMOS technology node.     

Second-order intermodulation mechanisms in CMOS downconverters

An in-depth analysis of the mechanisms responsible for second-order intermodulation distortion in CMOS active downconverters is proposed in this paper. The achievable second-order input intercept point (IIP2) has a fundamental limit due to nonlinearity and mismatches in the switching stage and improves with technology scaling. Second-order intermodulation products generated by the input transconductor or due to self-mixing usually contribute to determine the IIP2 even though they can, at least in principle, be eliminated. The parasitic capacitance loading the switching-stage common source plays a key role in the intermodulation mechanisms. Moreover, the paper shows that, besides direct conversion and low intermediate frequency (IF), even superheterodyne receivers can suffer from second-order intermodulation if the IF is not carefully chosen. The test vehicle to validate the proposed analysis is a highly linear 0.18-/spl mu/m direct-conversion CMOS mixer, embedded in a fully integrated receiver, realized for Universal Mobile Telecommunications System applications.     

An efficient power reduction technique for CMOS flash analog-to-digital converters

An efficient power reduction technique for CMOS flash analog-to-digital converter (ADC) is presented. The presented technique adopts the procedure with a simple coarse comparison first followed by a finer comparison later. Our ADC design does not decrease the total number of comparators, though it is able to reduce the power consumption. Subject to time signal controlling, the manipulation is to interchangeably shut down the comparator sections for the coarse comparison function. Experimental results show that this new method consumes about 48.14 mW at 400 MHz with 3.3 V supply voltage in TSMC 0.35 μm 2P4 M process. Compared with the traditional flash ADC, our low power method can reduce up to 47.8% in power consumption. The DNL of our proposed flash ADC is 0.5 LSB, the INL is 0.7 LSB, and the ENOB is 5.75 bits. The chip area occupies 0.4 × 0.9 mm² without I/O pads.     

Fin-height controlled TiN-gate FinFET CMOS based on experimental mobility

This paper presents the fin-height controlled TiN-gate FinFET CMOS technology based on the experimental carrier mobility data. The good current matching by tuning the N-channel fin-height and the excellent transfer performance in the fabricated TiN-gate CMOS inverter are demonstrated. The developed technologies are attractive to materialize the high-performance FinFET CMOS circuits.     

LECTOR: a technique for leakage reduction in CMOS circuits

In CMOS circuits, the reduction of the threshold voltage due to voltage scaling leads to increase in subthreshold leakage current and hence static power dissipation. We propose a novel technique called LECTOR for designing CMOS gates which significantly cuts down the leakage current without increasing the dynamic power dissipation. In the proposed technique, we introduce two leakage control transistors (a p-type and a n-type) within the logic gate for which the gate terminal of each leakage control transistor (LCT) is controlled by the source of the other. In this arrangement, one of the LCTs is always "near its cutoff voltage" for any input combination. This increases the resistance of the path from V/sub dd/ to ground, leading to significant decrease in leakage currents. The gate-level netlist of the given circuit is first converted into a static CMOS complex gate implementation and then LCTs are introduced to obtain a leakage-controlled circuit. The significant feature of LECTOR is that it works effectively in both active and idle states of the circuit, resulting in better leakage reduction compared to other techniques. Further, the proposed technique overcomes the limitations posed by other existing methods for leakage reduction. Experimental results indicate an average leakage reduction of 79.4% for MCNC'91 benchmark circuits.     

Efficient algorithm for glitch power reduction [CMOS logiccircuits]

An efficient algorithm is proposed for reducing glitch power dissipation in CMOS logic circuits. The proposed algorithm takes a path balancing approach that is achieved using gate sizing and buffer insertion methods. The gate sizing technique reduces not only glitches but also the effective circuit capacitance. After gate sizing, buffers are inserted into the remaining unbalanced paths which have not been subjected to gate sizing. ILP has been employed to determine the location of inserted buffers. The proposed algorithm has been tested on LGSynth91 benchmark circuits. Experimental results show that 61.5% of glitches are reduced on average     

Application of high pressure deuterium annealing for improving thehot carrier reliability of CMOS transistors

We present the effect of high pressure deuterium annealing on hot carrier reliability improvements of CMOS transistors. High pressure annealing increases the rate of deuterium incorporation at the SiO₂ /Si interface. We have achieved a significant lifetime improvement (90×) from fully processed wafers (four metal layers) with nitride sidewall spacers and SiON cap layers. The improvement was determined by comparing to wafers that were annealed in a conventional hydrogen forming gas anneal. The annealing time to achieve the same level of improvement is also significantly reduced. The increased incorporation of D at high pressure was confirmed by the secondary ion mass spectrometry characterization     

Thin-film transistors based on liquid-crystalline tetrafluorophenylter thiophene derivatives: thin-film structure and carrier transport

The authors fabricated thin films by solution processes using liquid-crystalline (LC) semiconductors, 5-alkyl-5’’-(4-hexyltetrafluorophenyl)-2,2’:5’,2’’-terthiophene (2–5). Films of 5-propyl-5’’-(4-hexyltetrafluorophenyl)-2,2’:5’,2’’-terthiophene (2) show similar molecular packing as their non-fluorinated counterparts. However, the degree of molecular packing ordering from X-ray diffraction measurement is higher, and the films exhibit a more crystal-like structure. Moreover, fluorination has a remarkable effect on their mesomorphic behaviors. Films of 2 consist of large size LC domains (in the range of 100 μm) at room temperature. Thin-film transistors (TFTs) of 2 show p-type operation with good hole mobility up to 0.027 cm²/Vs as well as improved operation stability under ambient conditions and high on/off ratio. Tetrafluorophenyl substitution leads to lowering of HOMO energy by 0.15 eV for 2 and 0.35 eV for 5, resulting in operation stability. Variable-temperature current-voltage measurements indicate intrinsic carrier transport in films of 2.