吸收层与倍增层分离的4H-SiC雪崩光电探测器

设计和制备了吸收层和倍增层分开的4H-SiC穿通型雪崩紫外光电探测器.设计器件的倍增层和吸收层厚度分别为0.25和1μm.采用multiple junction termination extension(MJTE)方法减少器件的电流集边效应和器件表面电场.对器件的暗电流、光电流和光谱响应进行了测量.器件在55V的低击穿电压下获得了一个高的增益(＞104);穿通前器件暗电流约为10pA数量级;0V偏压下器件光谱响应的紫外可见比大于103.光谱响应的峰值波长随反向偏压的增大而向短波方向移动,在击穿电压附近光谱响应的峰值波长移到210nm,此波长远远小于在0V时的响应峰值.结果显示器件在紫外光探测中具有优良的性能.     

高速InP/InGaAs雪崩光电二极管

采用分层吸收渐变电荷倍增(SAGCM)结构,通过两次扩散、多层介质淀积、AuZn p型欧姆接触、AuGeNi n型欧姆接触等工艺,设计制造了正面入射平面InP/InGaAs雪崩光电二极管,器件利用InGaAs做吸收层,InP做增益层,光敏面直径50 μm;测试结果表明器件有正常的光响应特性,击穿电压32～42 V,在低于击穿电压2 V左右可以得到大约10A/W的光响应度,在0到小于击穿电压1 V的偏压范围内,暗电流只有1 nA左右;器件在2.7 GHz以下有平坦的增益.     

AIInGaN／GaN PIN紫外光电探测器的研制

用AlInGaN四元合金代替AlGaN作为PIN探测器的有源层,研制出AlInGaNPIN紫外探测器。详细介绍了该器件的结构设计和制作工艺,并对器件进行了光电性能测试。测试结果表明,器件的正向开启电压约为1．5V,反向击穿电压大于40V;室温-5V偏压下,暗电流为33pA,350nm处峰值响应度为0．163A／W,量子效率为58％。     

硅基雪崩光电探测器倍增层掺杂的研究

硅基雪崩光电探测器的器件性能与倍增层的掺杂浓度有着密切联系。研究了硅基雪崩光电探测器倍增层的掺杂浓度对雪崩击穿电压和光谱响应度等特性的影响。在硼的注入剂量由5.0×1012 cm-2减小为2.5×1012cm-2时,倍增层内电场强度逐渐降低,吸收区电场强度迅速增大,器件的雪崩击穿电压由16.3V迅速上升到203V,而光谱响应在95%的击穿电压下,峰值响应波长由480nm红移至800nm,对应的响应度由11.2A/W剧增到372.3A/W。综合考虑光谱响应和雪崩击穿电压的影响,在硼注入剂量为3.5×1012 cm-2时,可获得击穿电压为43.5V和响应度为342.5A/W的器件模型,对实际器件的制备具有一定参考价值。     

AlInGaN/GaN PIN紫外光电探测器的研制

用AlInGaN四元合金代替AlGaN作为PIN探测器的有源层,研制出AlInGaNPIN紫外探测器.详细介绍了该器件的结构设计和制作工艺,并对器件进行了光电性能测试.测试结果表明,器件的正向开启电压约为1.5 V,反向击穿电压大于40 V;室温-5 V偏压下,暗电流为33 pA,350 nm处峰值响应度为0.163 A/W,量子效率为58%.     

基于异质结倍增层的InAlAsSb SACM雪崩光电二极管的优化

使用低工作电压的雪崩光电二极管(APD)有利于提高集成电路的稳定性和降低功耗.文章建立了一个分离吸收、电荷、倍增(SACM)型的雪崩光电二极管的模型,为了在低偏压下获得高增益同时不降低工作电压范围,这个模型采用了具有高低禁带宽度的异质结倍增层.同时,文章研究了异质结倍增层的厚度和掺杂浓度对暗电流和增益的影响.通过对掺杂浓度的优化,击穿电压和穿通电压可以同时下降.     

InGaAs/InP雪崩光电探测器异质结结构优化分析

根据一个吸收层、电荷层和倍增层分立结构(SACM)的InGaAs/InP雪崩光电探测器,减薄电荷层的厚度而引入渐变层,保持材料与厚度不变,改进成吸收层、电荷层、过渡层与倍增层分立结构(SAGCM)的雪崩光电探测器,优化了吸收层与倍增层间材料的异质结结构.采用APSYS软件对其能带结构、电场分布以及暗电流和1.55μm的脉冲光响应电流、增益等进行仿真与计算.对比两种器件的性能,结果分析表明,改进后的器件获得更低的穿通值电压,降低探测器在低偏压下的漏电流,同时得到更大的增益.     

In0.53Ga0.47As/InP高速光电二极管材料生长及光电性能

利用低压MOCVD技术制备PIN结构的InP基InGaAs外延材料。采用分层吸收渐变电荷倍增(SAGCM)结构,通过两次Zn扩散、多层介质膜淀积、Au/Zn p型欧姆接触、Au/Ge/Ni n型欧姆接触等标准半导体平面工艺,设计制造正入射平面In_(0.53)Ga_(0.47)As/InP雪崩光电二极管器件。该器件采用与InP衬底晶格匹配的In_(0.53)Ga_(0.47)As材料做吸收层,InP材料做倍增层,同时引入InGaAsP梯度层。探测器件光敏面直径50μm,器件测试结果表明该器件光响应特性正常,击穿电压约43 V,在低于击穿电压3 V左右可以得到大约10 A/W的光响应度,在0 V到小于击穿电压1 V的偏压范围内,暗电流只有1 nA左右。光电二极管在8 GHz以下有平坦的增益,适用于5 Gbit/s光通信系统。     

4H-SiC 雪崩光电探测器中倍增层参数的优化模拟

应用ATLAS模拟软件,设计了吸收层和倍增层分离的（SAM）4H-SiC 雪崩光电探测器（APD）结构。分析了不同外延层厚度和掺杂浓度对器件光谱响应的影响,对倍增层参数进行优化模拟,得出倍增层的最优化厚度为0.26μm,掺杂浓度为9.0×1017cm^-3。模拟分析了APD的反向IV特性、光增益、不同偏压下的光谱响应和探测率等,结果显示该APD在较低的击穿电压66.4V下可获得较高的倍增因子105;在0V偏压下峰值响应波长（250nm）处的响应度为0.11A/W,相应的量子效率为58%;临近击穿电压时,紫外可见比仍可达1.5×103;其归一化探测率最大可达1.5×1016cmHz ^1/2 W^-1。结果显示该APD具有较好的紫外探测性能。     

Ge/Si SACM-APD器件分析

Ge/Si吸收区-电荷区-倍增区分离(SACM)结构的APD作为一种新型光电探测器已成为硅基APD器件研究的重点.对SACM Ge/Si型APD器件的基本结构及其主要特性参数,包括量子效率、响应度、暗电流等进行了理论分析及仿真验证.实验结果表明:在给定的器件参数条件下,所设计的APD器件的雪崩击穿电压为25.7 V,最大内部量子效率为91%,单位增益下响应度峰值为0.55 A/W,在750~1 500 nm范围内具有较高响应度,其峰值波长为1 050 nm;在高偏压以及高光照强度情况下,倍增区发生空间电荷效应从而导致增益降低.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first