Microstructure Characteristics of Interaction Layer of Zn-Al Eutectic Alloy with Al_2O_3p/6061Al Composites

The interaction between Zn-AI eutectic alloy and Al203p/6061AI composites in the vacuum furnace was investigated. Great attention has been paid to the elements diffusion, the microstructure and formation of the interface between Zn-AI eutectic alloy and Al2O3p/6061AI composites. Experimental results show that Zn-AI eutectic alloy has a good wetting ability to Al2O3p/6061 Al composites and the wetting angle decreases with increasing the temperature in vacuum. After the interaction, an interaction layer forms between Zn-AI alloy and Al2O3p/6061 Al composites. The phases in the interaction layer mainly consist of α-AI(Zn), Al2O3 and CuZn5 resulted from the diffusion of elements from the Zn-AI alloy. Several porosities distribute in the region near the interface of the Zn-AI alloy/interaction layer. The amount of shrinkage voids in the interacting layer is relevant to the penetration of Zn element into Al2O3p/6061Al composites which is a function of temperature. So it is necessary to lower heating temperat     

搅拌摩擦焊辅助Al/Zn/Mg接头扩散连接

对2mm厚的AZ31B镁合金和6061铝合金平板进行添加夹层Zn的搅拌摩擦诱导扩散连接实验。通过SEM,EPMA,XRD,拉伸实验和维氏硬度测试研究Al/Zn/Mg搭接接头显微组织和力学性能。结果表明:当旋转速率合适时,扩散层存在Al富集区,Al5Mg11Zn4层及Mg-Zn共晶区;而旋转速率较低时,扩散层存在残留的Zn层;旋转速率过大时,扩散层出现Al-Mg系金属间化合物。由于扩散层主要为金属间化合物,其显微硬度明显高于母材。Zn箔的加入提高了Al/Mg搭接接头的力学性能。断口观察分析表明,接头失效发生在靠近Al侧的扩散层上。     

Behaviors of oxide film at the ultrasonic aided interaction interface of Zn–Al alloy and Al2O3p/6061Al composites in air

Ultrasonic aided interactions between Zn–Al alloy and Al₂O_3p/6061Al composites were investigated. Ultrasonic vibration imposed on the composite plate can cause high cavitation intensity in the liquid Zn–Al alloy which disrupts and flakes off surface oxides, thereby allowing the Zn–Al alloy to wet the bare composite surfaces and form a metallurgical bond. Whether the undermining phenomena occurred or not, the spreading of Zn–Al liquid over the composite did not occur until the ultrasonic vibration amplitude reached 10 μm. The Zn–Al liquid spread quickly over the composite despite that the surface oxide had not been fully disrupted when the ultrasonic vibration higher than 10 μm was applied. When undermining phenomena occurred during interaction, the oxide layer at the interaction interface was firstly lifted up by the undermining alloy, suspending in the Zn–Al liquid, and subsequently broke up by the ultrasonic excitation. Gas escaping from the base metal was observed to be helpful in decohesion of the oxide layer from the composite. When undermining phenomena did not occur during interaction, the removal of the oxide layer was based upon the melting of the nether base metal. The disruption of oxide initiated from the composite surface where the drop center located and the surface oxide layer near the drop edge was lastly removed.     

6061铝颗粒层增强7075铝基复合材料的微观结构及阻尼性能

采用热轧法制备出具有颗粒层状结构的6061p/7075铝基复合材料以改善7075铝合金的阻尼性能。通过OM、SEM、EDS和XRD分析6061p/7075层状铝基复合材料的微观组织,分别采用万能力学试验机和动态热机械分析仪分析其力学性能和阻尼行为。研究表明,6061铝颗粒层存在大量的颗粒间界面和微小孔隙,6061铝颗粒层与7075铝基体之间界面结合良好,没有发生界面反应;6061p/7075层状铝基复合材料最大抗拉强度为370.5 MPa,比7075铝基体提高了30%;6061p/7075层状铝基复合材料和基体材料的内耗值分别随着温度和应变量的升高而增大,复合材料的阻尼性能明显优于7075铝基体,在360℃时,复合材料的内耗值高达0.117,比7075铝基体提高了149%;6061p/7075层状铝基复合材料和基体材料的储能模量分别随着温度和应变量的升高而降低,在30℃时,复合材料的储能模量为38601 MPa,比7075铝基体高16%。      

亚微米颗粒增强6061铝基复合材料的微塑变特性

发现亚微米级Ａｌ２Ｏ３ｐ／６０６１复合材料的微屈服抗力较高，组织稳定性良好，其微屈服抗力与微塑变符合Ｂｒｏｗｎ和Ｌｕｋｅｎｓ提出的线性规律；通过与ＳｉＣｐ／６０６１和ＡｌＮｐ／６０６１的微屈服行为与组织的对比分析，认为增强颗粒形状，尺寸以及基体中位错密度，亚晶粒尺寸等因素直接影响屈服抗力，亚微米级颗粒增强复合材料对尺寸稳定性要求来说，微观组织形态较合理，是较理想的精密仪表材料。     

Interaction of Al-Si,Al-Ge,and Zn-Al eutectic alloys with SiC/Al discontinuously reinforced metal matrix composites

Interactions between Al-Si, Al-Ge, and Zn-Al eutectic alloys with SiC whisker-reinforced aluminium metal matrix composites were studied as a function of temperature above the eutectic melting temperature. Penetration extended several millimetres into the composite for the Al-Si and Al-Ge alloys but was restricted to a thin surface layer (50 m) for the Zn-Al alloy. The extent of the penetration zone for the aluminium alloys containing silicon and germanium was also affected by the thermal-mechanical treatment of the composite: limited penetration was observed for hot-pressed material whereas extensive penetration was observed for mechanically worked material. Mechanisms for the observed phenomena are discussed in terms of the wettability of the SiC whiskers by the eutectic alloys, the formation of channels during mechanical working as well as the fine grain size of the composite.     

亚微米级Al2O3P/6061Al 复合材料的断裂行为

本文通过对亚微米级Al₂O₃P/6061A l 复合材料的SEM 的动态拉伸观察, 研究了该材料的微观断裂行为及其与宏观力学性能的关系, 定量地描述了亚微米级Al₂O₃P/6061A l 复合材料的断裂过程, 并讨论了该种复合材料的断裂机制。      

Al2O3@Y3Al5O12纳米短纤维对铝合金基复合材料的增强作用

采用一种具有芯-壳结构的复合纳米纤维增强铝合金复合材料,可以在提高抗拉强度的同时增加塑性。通过真空热压烧结技术制备了Al₂O₃@Y₃Al₅O₁₂复合纳米短纤维增强2024铝合金复合材料。研究了纤维添加质量分数对复合材料致密度、硬度、抗拉强度及延伸率的影响;并探究了芯-壳结构在复合材料增韧中的作用。结果表明:Al₂O₃@Y₃Al₅O₁₂纳米短纤维具有良好的分散性,在超声分散及机械搅拌混粉后均匀吸附在铝合金颗粒表面,无分层及团聚现象;经热压烧结后,Al₂O₃@Y₃Al₅O₁₂纳米短纤维以短纤维形态均匀分散在铝合金基体内,少量添加Al₂O₃@Y₃Al₅O₁₂纳米短纤维起到了桥联和孔洞填充作用,使复合材料致密度和硬度提高;添加质量分数为1wt%时,抗拉强度和延伸率取得最大值,由铝合金的249.3 MPa、2.9%增加到299.1 MPa、4.3%。Al₂O₃@Y₃Al₅O₁₂纳米短纤维的添加可以细化晶粒,阻碍裂纹扩展,且在拔出/断过程中Al₂O₃@Y₃Al₅O₁₂纳米短纤维芯-壳结构的塑性变形起到了增强增韧作用。      

Zn层添加AZ31/7075合金复合成形工艺及组织与性能研究EI北大核心CSCD

通过在异种材料界面添加厚度为100μm的Zn箔,采用预挤压与孔型轧制复合工艺成功制备出AZ31/7075复合材料,并利用光学显微镜(OM)、扫描电子显微镜(SEM)、能谱分析(EDS)对复合界面进行表征及显微硬度测试,探究Zn过渡层在挤压复合孔型轧制过程中对产品的影响。结果表明:7075硬质铝合金芯部可细化AZ31镁合金,引入Zn过渡层可减少或者避免镁铝系金属间化合物生成;挤压及变形温升使Mg-Zn互扩散形成的低熔点共晶相熔化,同时加速元素自固相向液相扩散;然而降温冷却使Mg-Zn扩散层易出现不连续裂缝,但后续孔型轧制可显著改善;Mg-Zn扩散层经变形生成的MgZn_(2)金属间化合物具备较高的显微硬度(161HV),但Mg-Zn扩散层变形后厚度则较薄,结合层整体硬度变化不明显。     

原位反应烧结块的高能超声稀释过程分析

对高能超声稀释原位反应烧结块制备锌铝合金基复合材料过程进行了研究,简要分析了超声稀释机理。研究表明,高能超声快速稀释烧结块是声空化与声流效应协同作用的结果。空化产生的瞬时高温可促进界面区域元素扩散,瞬时高压将裸露在界面上的长棒状的TiAl₃击断,打破了烧结块的网状结构,并将其周围的高致密度的Al₂O₃和TiB₂颗粒聚集区击碎。另一方面,声流引起的强烈搅拌作用减薄了过渡层,并使短棒状的TiAl₃颗粒及Al₂O₃、TiB₂微细颗粒均匀分布在熔体中。在上述分析基础上,建立了元素扩散模型和烧结块在锌铝合金中的稀释过程模型。      

Al含量对Zn-xAl-4Sb合金平衡凝固组织的影响

利用SEM、EDS、XRD研究了不同Al含量的Zn-xAl-4Sb(x=0、0.5、1.0、2.0、4.0、6.0)合金在炉冷条件下(冷却速度0.04℃/s)的凝固组织,探讨了Al和Sb以Zn-Al-Sb三元中间合金加入锌液的可能性.结果表明:合金中的Al优先与Sb生成AlSb相;当Al含量小于1.0%时,随着Al含量的增加,合金中AlSb相的量增加,β-Sb3Zn4相逐渐减少;当Al含量为1.0%时,β-Sb3Zn4相消失,合金组织为Zn基体上分布AlSb相;当Al含量大于1.0%时,合金中出现Zn-Al共晶,且共晶的量随Al含量的增加而增多;用Zn-Al-Sb室温下等温截面的富锌角表示了Zn-xAl-4Sb体系的室温相组成.因Al和Sb形成高熔点AlSb相,很难在锌液中溶解,故Al和Sb不宜以Zn-Al-Sb三元中间合金的方式加入.     

6061铝合金分别在Q235钢和纯钛表面的反应润湿

采用座滴法在高真空条件下研究了熔融6061铝合金在600~700℃分别与Q235钢和纯钛的润湿行为。研究表明两者都为典型的反应润湿,且最终润湿性随着温度的升高而改善;界面反应的自由能变化对最终润湿性及界面结构影响较小,而基板金属在铝中的溶解度不同决定了界面反应层厚度(即溶解度越大则反应层越厚);三相线附近的还原反应诱发了前驱膜的产生,且最终润湿性越好则前驱膜越宽;两者体系的铺展动力学均可以由RPC模型描述:在Al/Ti体系中整个润湿过程分为两个阶段,即先非线性铺展,后线性铺展阶段,两个阶段的铺展活化能分别为72kJ/mol、118kJ/mol,且界面上存在Si的富集;在Al/Q235钢体系中整个润湿过程呈线性铺展,铺展活化能为86kJ/mol,无Si元素在界面富集。     

Si对SiC－Al系统浸润行为的影响

用液滴技术（Ｔｈｅ　Ｓｅｓｓｉｌｅ　Ｄｒｏｐ　Ｔｅｃｈｎｉｑｕｅ）、ＳＥＭ、ＥＤＳ等研究了Ｓｉ对ＳｉＣ－Ａｌ系统浸润行为的影响，结果表明，在较低温度下，Ｓｉ在熔融Ａｌ合金中的含量不明显影响Ａｌ对ＳｉＣ的浸润行为，然而，在高温下ＳｉＣ和Ａｌ的接触角θ值随时间而减小的速率随Ｓｉ含量的增加而增大；ＳｉＣ－Ａｌ系统从非浸润到浸润的转变温度随Ｓｉ含量的增加而降低；Ｓｉ的添加引起Ａｌ合金在ＳｉＣ表面扩展和向ＳｉＣ基体渗透，而且扩展和渗透的程度随Ｓｉ含量增加而增大。说明在Ａｌ合金中添加Ｓｉ可促进对ＳｉＣ的浸润。本研究还证实了基体参加反应可增强金属Ａｌ对ＳｉＣ陶瓷的浸润能力。     

无压浸渗制备的SiC/Al复合材料的微观组织研究

利用SRD,OM,SEM,TEM等微观结构分析手段,对无压浸渗制备的SiCp/Al复合材料的微观结构进行了研究。结果表明,SiCp/Al复合材料中存在SiC,Al,MgAl2O4,Si和Mgi2Si诸相。在组织中没有粗大的铝硅共晶体针条,铝基体被众多SiC颗粒分割,成为细小的连续的空间网络。在铝基体中分布着Si相及Mg2Si相。透射电子显微镜高分辨像表明,在SiC与铝合金的界面上存在镁铝尖晶石（MgAl2O4）相,没有出现Al4C3相。     

SiC_P/Al基复合材料在等径角挤扭变形中的界面原子扩散行为

为了研究金属基复合材料在剧烈塑性变形(SPD)过程中增强颗粒与金属基体的界面连接机制,通过等径角挤扭(ECAP-T)工艺在较低温度下制备块状10wt%SiCP/Al基复合材料,并对经过1、2和4道次ECAP-T变形的SiC颗粒与纯Al之间的界面反应以及元素扩散进行了研究。通过TEM和XPS研究了界面和元素扩散,结果表明:即使在较低的外界制备温度下,Al和SiC颗粒表面的SiO2层也能够发生反应,形成主要由Al2O3组成的界面层。相比理论计算值,ECAP-T变形可以将Al的扩散系数提高约1016倍,增强扩散的原因主要是ECAP-T变形促使界面温度升高,且在铝基体内产生空位、位错和晶界等高密度晶格缺陷。     

P/6061Al的变形断裂特征和塑性

为了更清楚地认识颗粒增强铝塑性差的细微观机制, 进行了(Al₂O₃)_P/6061Al的拉伸和三点弯曲变形实验,并用扫描电镜观察了变形与断裂的细微观特征。发现: (1) 在加载过程中,总是基体先发生变形局部化,形成变形带; 变形带内较大的Al₂O₃颗粒优先开裂,形成颗粒尺度的微裂纹; 变形带内的集中变形和Al₂O₃颗粒的继续开裂交互作用,导致微裂纹沿着变形带连接与扩展进而发生宏观低塑性断裂;(2) 加载方式、材料状态和变形温度对上述过程没有本质影响。根据以上观察结果和颗粒增强铝的强化机理,讨论了塑性差的细微观机制以及材料状态和变形温度对(Al₂O₃)_P/6061Al塑性的影响。      

Effect of thermal ageing on (Sn-Ag, Sn-Ag- Zn)/PtAg, Cu/Al2O3 solder joints

As-fabricated solders of eutectic Sn-Ag and ternary Sn-3.5 wt% Ag-1 wt% Zn alloys are coupled with metallized substrates including PtAg/Al2O3 and Cu/Al2O3 to simulate the solder joint in microelectronics. The growth mechanism of intermetallics and the mechanical properties of solder joints after thermal ageing (150 °C and 200 °C) are evaluated. In this study, a 1206 passive device/solder/metallization/Al2O3 surface mount technology (SMT) assembly is employed, and a Cu stud is attached on the ceramic substrate assembly to evaluate mechanical properties and the fracture morphology by the pull-off test. In addition, microstructure evolution of the interfacial morphology, elemental and phase distribution are probed with the aid of scanning electron microscopy (SEM), electron probe micro-analysis (EPMA) and X-ray diffraction (XRD) techniques. There are two intermetallics (Cu3Sn and Cu6Sn5) formed at the eutectic Sn-Ag solder/Cu metallized layer interface, while only Cu6Sn5 is observed in the Sn-3.5 Ag-1Zn/Cu system. However, in the PtAg metallized substrate, only Ag3Sn is present, regardless of which solders are employed. Cu6Sn5 and Ag3Sn in the Sn-3.5 Ag-1Zn system contain 2–5 at% Zn due to the higher solubility of Zn in both Cu and Ag. The adhesion strength decreases as the time increases for all solder joint systems in the thermal ageing test. The solder joint with eutectic Sn-Ag alloy exhibits higher fracture load than that with Sn-3.5 Ag-1Zn alloy. From the fracture surface analysis, as the ageing time increases, the fracture takes place from the solderconductor interface toward the inside of the IMC (intermetallic compound). © 1998 Kluwer Academic Publishers     

影响内氧化生成Al2O3/Cu表面复合层厚度及组织的因素

采用真空条件,用CuO作氧化剂,在一定的温度下使Cu-Al合金内氧化,获得Al₂O₃/Cu表面复合材料。金相分析发现,在较低温度下内氧化,表面复合层中Al₂O₃颗粒晶界处多于晶内;在较高温度下内氧化,复合层中Al₂O₃颗粒呈弥散状分布;表面复合层厚度随Al含量的增加而减薄,显微硬度随Al含量的增加而升高。      

Brazing of Aluminum Matrix Composite with Sn10Ag4Ti Active Filler Metal

The joining of 6061 aluminum matrix composites (6061 MMC) was conducted using a low temperature filler metal, Sn₁₀Ag₄Ti, in a vacuum of 1×10^-4torr. The results showed that Sn₁₀Ag₄Ti had superior wettability on the 6061 aluminum matrix composites surface. It was evident from the EPMA analyses of Sn₁₀Ag₄Ti brazements that a significant reaction zone could be observed at the 6061 aluminum matrix composites/filler metal interface. The Sn, Ag and Ti elements in the filler metal play different roles during the brazing. The good wetting behavior of the Sn₁₀Ag₄Ti/ monolithic 6061 alloy and Sn₁₀Ag₄Ti/Al₂O₃ system was suspected to cause the enhancement of the joint strength of the Sn₁₀Ag₄Ti/6061 MMC during the brazing.     

铝基钎料在SiC及SiC_p/6061复合材料上的润湿性研究

对多种铝基钎料在SiC、6 0 6 1及SiCp 6 0 6 1复合材料上进行了润湿性试验。结果表明 :炉中钎焊时 ,钎料与钎剂的成分、加热温度与保温时间、钎料与钎剂熔化温度的匹配等是影响铝基钎料润湿性的主要因素 ;真空钎焊时 ,镁含量不同的各种含镁Al 2 8Cu 5Si钎料在Al基复合材料连接的温度范围内都不能润湿SiC陶瓷表面 ;配合QJ2 0 1钎剂 ,Al 2 8Cu 5Si 2Mg钎料对 15 %SiCp 6 0 6 1Al复合材料具有良好的润湿性 ,但对 30 %SiCp 6 0 6 1Al复合材料却润湿不良 ;在加钎剂的情况下 ,钎料中的镁反而对在铝合金及铝基复合材料上的润湿性有不利影响 ;在Al 2 8Cu 5Si 2Mg钎料和 15 %SiCp 6 0 6 1Al复合材料的钎焊界面处存在SiC颗粒的偏聚现象