Arsenic incorporation in MBE grown Hg1−xCdxTe

The p-type doping of Hg_1−xCd_xTe (MCT) has proven to be a significant challenge in present day MCT-based detector technology. One of the most promising acceptor candidates, arsenic, behaves as an amphoteric dopant which can be activated as an acceptor during Hg-rich, low temperature annealing of as-grown molecular beam epitaxy (MBE) samples. This study focuses on developing an understanding of the microscopic behavior of arsenic incorporation during MBE growth. In particular, the question of whether arsenic incorporates as individual As atoms, as As₂ dimers, or as As₄ tetramers is addressed for MBE growth with an As₄ source. A quasithermodynamical model is employed to describe the MCT growth and As incorporation, with parameters fitted to an extensive database of samples grown at the Microphysics Laboratory. The best fits for growth temperatures between 175 and 185°C are obtained for arsenic incorporation as As₄ or possibly as As₄ clusters, with lower probabilities for As₂ and individual As atoms. Based on these results, we investigate the relaxed atomic configurations of As₄ and As₂ in bulk HgTe by ab initio total energy calculations. The calculations are performed in the pseudopotential density-functional framework within the local density approximation, employing supercells with periodic boundary conditions. The lattice distortions due to As₄ and As₂ in bulk HgTe are predicted to be modest due to the small size of these arsenic clusters.     

Gas source molecular beam epitaxy grown strained-Si films on step-graded relaxed Si1−xGex for MOS applications

Gas source molecular beam epitaxy has been employed for the growth of a high quality strained-Si layer on a completely relaxed step-graded Si_1−xGe_x buffer layer. As-grown strained-Si layers have been characterized using secondary ion mass spectroscopy, Rutherford backscattering spectroscopy, atomic force microscopy, and spectroscopic ellipsometry for the determination of composition, thickness, crystalline quality, and surface roughness. Heterojunction conduction and valence band offsets (ΔE_c, ΔE_υ) of strained-Si/SiGe heterostructure have been determined from measured threshold voltages of a strained-Si channel p-metal oxide semiconductor field effect transistor (MOSFET) fabricated using grown films. MOS capacitance-voltage profiling has been employed for the extraction of strained-Si layer thickness and apparent doping profile in the device.     

β-Ga_2O_3 thin film grown on sapphire substrate by plasmaassisted molecular beam epitaxy

Monoclinic gallium oxide(Ga_2O_3) has been grown on(0001) sapphire(Al_2O_3) substrate by plasma-assisted molecular beam epitaxy(PA-MBE). The epitaxial relationship has been confirmed to be [010]( 2ˉ01) β-Ga_2O_3||[ 011ˉ0](0001)Al_2O_3 via in-situ reflection high energy electron diffraction(RHEED) monitoring and ex-situ X-ray diffraction(XRD) measurement. Crystalline quality is improved and surface becomes flatter with increasing growth temperature, with a best full width at half maximum(FWHM) of XRD ω-rocking curve of( 2ˉ01) plane and root mean square(RMS) roughness of 0.68° and 2.04 nm for the sample grown at 730 °C,respectively. Room temperature cathodoluminescence measurement shows an emission at ～417 nm, which is most likely originated from recombination of donor–acceptor pair(DAP).     

Structural and optical properties of GaxIn1−xP layers grown by chemical beam epitaxy

Chemical beam epitaxial (CBE) Ga_xIn_1?xP layers (x≈0.5) grown on (001) GaAs substrates at temperatures ranging from 490 to 580°C have been investigated using transmission electron diffraction (TED), transmission electron microscopy, and photoluminescence (PL). TED examination revealed the presence of diffuse scattering 1/2{111}_B positions, indicating the occurrence of typical CuPt-type ordering in the GaInP CBE layers. As the growth temperature decreased from 580 to 490°C, maxima in the intensity of the diffuse scattering moved from ½{111}_B to ½{?1+δ,1?δ,0} positions, where δ is a positive value. As the growth temperature increased from 490 to 550°C, the maxima in the diffuse scattering intensity progressively approached positions of $\frac{1}{2}\{\bar 110\} $ , i.e., the value of δ decreased from 0.25 to 0.17. Bandgap reduction (～45 meV) was observed in the CBE GaInP layers and was attributed to the presence of ordered structures.     

Transient behavior of Hg1−xCdxTe film growth on (111)B CdTe substrates by chemical vapor transport

As part of a systematic investigation of the effects of substrate surfaces on epitaxial growth, the transient behavior of Hg_1−xCd_xTe film growth on (111)B CdTe by chemical vapor transport (CVT) has been studied as a function of growth time under vertical stabilizing (hot end on top) and vertical destabilizing (hot end at bottom) ampoule orientations. The experim ental results show the morphological transition of the Hg_1−xCd_xTe deposition on (111)B CdTe at 545°C from three-dimensional islands to layers within about 0.5 and 0.75 h for the growth under vertical stabilizing and destabilizing conditions, respectively. The combined effects of small convective flow disturbances on the growth morphology and defect formation are measurable. The overall trends of the time dependent growth rates and compositions of the Hg_1−xCd_xTe epitaxial layers under stabilizing and destabilizing conditions are similar. The system atically higher growth rates of the Hg_1−xCd_xTe films by about 10% under vertical destabilizing conditions could be influenced by a small convective contribution to the mass transport. The combined results show that improved Hg_1−xCd_xTe epitaxial layers of low twin density on (111)B CdTe substrates can be obtained by CVT under vertical stabilizing conditions.     

Microscopic defects on MBE grown LWIR Hg1−xCdxTe material and their impact on device performance

Long wavelength infrared molecular beam epitaxy (MBE) grown p-on-n Hg_1−xCd_xTe double layer planar heterostructure (DLPH) detectors have been characterized to determine the dominant mechanisms limiting their performance. Material defects have been identified as critical factors that limit 40K performance operability. This effort has concentrated on identifying microscopic defects, etch pit density (EPD) and relating these defects to the device performance. Visual inspection indicates defect densities as high as 10⁵ per cm² with a spatial extent as observed by atomic force microscope in the range of micrometers extending several micrometers beneath the surface. At high EPD values (greater than low 10⁶ cm⁻²) zero bias resistance (R₀) at 40K decreases as roughly as the square of the EPD. At 78K, however, measured R₀ is not affected by the EPD up to densities as high as mid-10⁶ cm⁻². Visual defects greater than 2–3 μm than ∼2 μm in size (micro-void defects) result in either a single etch pit or a cluster of etch pits. Large variations in a cross-wafer etch pit distribution are most likely a major contributor to the observed large spreads in 40K R₀. This study gives some insight to the present limitation to achieve higher performance and high operability for low temperature infrared applications on MBE grown HgCdTe material.     

Interaction Between AsHg and V Hg in Arsenic-Doped Hg1−x Cd x Te

Arsenic-related defect complexes have been proven responsible for the charge-compensation effects in arsenic-doped Hg_1?x Cd _x Te, but the underlying mechanism is still unclear. In this study, we systematically investigated the interaction between arsenic donor (As_Hg) and mercury vacancy (V _Hg) versus the As_Hg–V _Hg separation in arsenic-doped Hg_1?x Cd _x Te using first-principles calculations. A new long-range interaction between As_Hg and V _Hg is found, and the related binding energies and electronic structures are calculated to reveal its coupling mechanism. Our results show that V _Hg can increase the distortion of the lattice collaboratively with As_Hg due to the different characteristics of As_Hg and V _Hg in distorting the lattice. The relaxational enhancement as well as the electrical compensation of the As_Hg donor is weakened as V _Hg moves away from As_Hg, and the underlying mechanism is revealed. In addition, a set of defect levels in the band gap generated from the donor–acceptor interaction are also shown, and the origin of these levels is explored. The results of this work are important for theoretically explaining the characteristics of complicated defect levels found in experiments.     

Defects Study in Hg x Cd1−x Te Infrared Photodetectors by Deep Level Transient Spectroscopy

At high temperature, infra-red focal plane arrays are limited by their performance in operability, detectivity D ^* or noise equivalent temperature difference. Trap characterization and defect studies are necessary to better understand these limitations at high temperature. In this paper, we use deep level transient spectroscopy to study electrically active defects in mercury cadmium telluride n ⁺/p diodes. The material investigated has a cut-off frequency (λ _c) of 2.5 μm at 180 K and p doping performed with mercury vacancy. Trap energy signatures as well as capture cross-section measurements are detailed. A low temperature hole trap close to midgap is observed in the range 150–200 K with an activation energy around 0.18 ± 0.025 eV. A high temperature hole trap is also observed in the range 240–300 K with an activation energy of 0.68 ± 0.06 eV. A hole capture cross-section of 10^?19 cm² is obtained for both traps. The nature of the defects and their correlation with dark current are discussed.     

Si1 − x Ge x /Si heterostructures grown by molecular-beam epitaxy on silicon-on-sapphire substrates

The growth of heterostructures with Si_{1 ? x} Ge _x layers on $\left( {1\bar 102} \right)$ sapphire substrates by molecular-beam epitaxy with a silicon sublimation source and a germanium gas source (GeH₄) is reported. The systematic study of the influence of substrate temperature and thickness of the silicon buffer layer shows that the optimal conditions for growing epitaxial Si_{1 ? x} Ge _x layers are provided at a temperature of T _S = 375–400°C. There are significant differences in the orientations of Si_{1 ? x} Ge _x layers, depending on the thickness d of the Si buffer layer: the preferred orientations are (100) at d ≥ 100 nm and (110) for thinner layers. Heterostructures with thick (～1 μm) Si_{1 ? x} Ge _x layers, doped with erbium atoms, exhibit intense photoluminescence at λ = 1.54 μm.     

Mechanisms of homo- and heteroepitaxial growth of SiC on α-SiC(0001) by solid-source molecular beam epitaxy

Epitaxial growth of SiC on hexagonal (or α)-SiC(0001) has been performed by means of solid-source molecular beam epitaxy (MBE). The solid-source MBE growth conditions have been analyzed concerning the supersaturation and the excess phase formation of silicon and carbon. In general, our results demonstrate that control of the Si/C ratio and the supersaturation (S) is essential for the growth mode and the kind of polytype grown. Low temperature (T<1450K) deposition on on-axis SiC substrates always results in the growth of 3C-SiC, which is significantly improved by an alternating supply of Si and C. On vicinal substrates, a step flow growth mode has been realized at T down to 1300K. In experiments performed at T>1450K under near surface equilibrium conditions, different growth modes, and conditions stabilizing the growth of certain polytypes have been found. With a step decrease of S, a step-flow growth mode of both 4H-and 6H-SiC was obtained and, for the first time in case of epitaxial SiC growth, a homogeneous nucleation of α-SiC at more C-rich conditions has been realized. Conditions stabilizing the growth of certain polytypes have been estimated by thermodynamic calculations considering the influence of polytype structure on the supersaturation and the surface energy. Based on these results, we have demonstrated the growth of a double-heterostructure by firstly growing a 3C-SiC layer on 4H-SiC(0001) at low temperature and a subsequent growth of 4H-SiC under near surface equilibrium conditions on a C-stabilized surface on top of this layer.     

Evaluation of compositional intermixing at interfaces in Si(Ge)/Si1−x Gex heteroepitaxial structures grown by molecular beam epitaxy with combined sources of Si and GeH4

The main causes of the diffusion spreading of a solid-solution composition near the boundaries of the Si transport channel in a Si/Si_1?x Ge_x heterostructure grown by molecular-beam epitaxy combined with solid (Si) and gaseous (GeH₄) sources are considered. For the grown structures, the contributions from various mechanisms involved in forming the profile of the metallurgical boundary of the layer are compared and the effect of channel boundary spreading on the mobility of a two-dimensional electron gas in the channel is evaluated.     

Surface second harmonic generation in the characterization of anodic sulphide and oxide films on Hg1−xCdxTe (MCT)

Rotation anisotropy by second harmonic generation (SHG) is carried out on epitaxial Hg_1−xCd_xTe (MCT) and oxide- and sulphide-covered MCT surfaces and shows the fourfold symmetry pattern expected from the {100} surface (C_4v symmetry). The uneven nature of the four peaks confirm the vicinal surface obtained from the growth of the MCT on GaAs {100} substrate orientated 4° toward the 〈110〉 direction. The increase in the SH intensity observed for the oxide-covered MCT surface is associated with charge accumulation at the MCT/oxide interface since the oxide is centrosymmetric and cannot generate SH. The CdS layer on the other hand is strongly nonlinear active and generation here comes from a composite of one noncentrosymmetric layer on top of another. This leads to interactions in the observed SH arising from the coupling depths (∼40 nm) at the two interfaces and from the coherence length (∼1200 nm) in the CdS layer. The in-situ SHG measurements during the growth of the anodic oxide and sulphide layers would suggest that a species, most likely HgTe is embedded in the anodic layer during the initial stages and absorbs the SH radiation at 532 nm. The rotational anisotropy of the sulphide-covered MCT surface confirms that the CdS layer formed maintains the cubic closed pack symmetry of the underlying MCT.     

Variable-Field Hall Measurement and Transport in LW Single-Layer n-Type MBE Hg1−x Cd x Te

Molecular beam epitaxy n-type long-wavelength infrared (LWIR) Hg_1?x Cd _x Te (MCT) has been investigated using variable-field Hall measurement in the temperature range from 50 K to 293 K. A quantitative mobility spectrum analysis technique has been used to determine the role of multicarrier transport properties with respect to epilayer growth on lattice-matched cadmium zinc telluride, as well as lattice-mismatched silicon (Si) and gallium arsenide (GaAs) buffered substrates. Overall, after postgrowth annealing, all layers were found to possess three distinct electron species, which were postulated to originate from the bulk, transitional (or higher-x-value) regions, and an interfacial/surface layer carrier. Further, the mobility and concentration with respect to temperature were analyzed for all carriers, showing the expected mobility temperature dependence and intrinsic behavior of the bulk electron. Electrons from transitional regions were seen to match expected values based on the carrier concentration of the resolved peak. At high temperature, the lowest-mobility carrier was consistent with the properties of a surface carrier, while below 125 K it was postulated that interfacial-region electrons may influence peak values. After corrections for x-value and doping density at 77 K, bulk electron mobility in excess of 10⁵ cm² V^?1 s^?1 was observed in all epilayers, in line with expected values for lightly doped n-type LWIR material. Results indicate that fundamental conduction properties of electrons in MCT layers are unchanged by choice of substrate.     

Avalanche Mechanism in p +-n −-n + and p +-n Mid-Wavelength Infrared Hg1−x Cd x Te Diodes on Si Substrates

Hg_1−x Cd _x Te mid-wavelength infrared (MWIR) p ⁺-n ⁻-n ⁺ and p ⁺-n ⁻ avalanche photodiodes (APDs) with a cut-off of 4.9 μm at 80 K were fabricated on Si substrates. Diode characteristics, avalanche characteristics, and excess noise characteristics were measured on two devices. Temperature-dependent diode and avalanche characterization was performed. Maximum 3 × 10⁶ Ω cm² and 9 × 10⁵ Ω cm² zero-bias resistance times active area (R ₀ A) products were measured for the p ⁺-n ⁻-n and p ⁺-n devices at 77 K, respectively. Multiplication gains of 1250 and 410 were measured at −10 and −4 V for the p ⁺-n ⁻-n ⁺ and p ⁺-n APDs at 77 K, respectively, in the front-illumination mode with the help of a laser with an incident wavelength of 632 nm. The gains reduce to 200 and 50 at 120 K, respectively. The excess noise factor in all APDs was measured to be in the range of 1 to 1.2.     

Structural characterization of Zn1−xCdxO (0≤x≤0.20) microrods grown by spray pyrolysis

Zn_1−xCd_xO (x= 0.00, 0.05, 0.10, 0.15 and 0.20) thin films were obtained by spray pyrolysis and characterized by XRD, SEM, EDAX and optical measurements. The Zn_1−xCd_xO microrods are in the wurtzite crystallographic phase with (0 0 2) preferred orientation. A narrowing of the fundamental band gap from 3.30 to 3.10 eV was observed with the increasing nominal Cd content up to 20 at% due to the direct modulation of the band gap caused by Cd substitution. The undoped ZnO film showed two emission bands in the spectra: one sharp UV luminescence at ∼382 nm and one broad visible emission ranging from 430 to 600 nm. The sharp peak at ∼382 nm is split into two at 376 and 400 nm upon Cd doping at levels of 5 and 10 at%. However this splitting is not observed in the doped ZnO samples containing 15 at% Cd and more. It should also be mentioned that the broad peak at the range of 430–600 nm has almost disappeared in the films containing 5, 10 and 15 at% Cd.     

In-situ evaluation of the anodic oxide growth on Hg1−xCdxTe (MCT) using ellipsometry and second harmonic generation

In-situ measurements of ellipsometry and second harmonic generation (SHG) were carried out to monitor the electrochemical growth of native anodic oxide films on Hg_1?xCd_xTe (MCT). Growth of the anodic oxide was performed using two different methods viz., by linear sweep voltammetry and by applying a constant current density. The influence of scan rate and the magnitude of the applied current density on the properties of the growing films were examined. From the ellipsometry data, we have shown that the measured refractive index value of 2.19 for the oxide film remains unchanged for moderate and high oxide growth rates. Only at very slow growth rates were significant increases in the refractive index observed (n=2.4), indicating an increase in the compactness of the layer. For film thicknesses in excess of ～1200 Å, a non-zero value for the extinction coefficient was found, indicating the incorporation of HgTe particles within the anodic oxide film. SHG rotational anisotropy measurements, performed on the MCT with and without an anodic oxide film showed only the four-fold symmetry associated with the MCT and so confirmed that the oxide was centrosymmetric. However, an increase in the SH intensity was observed in the presence of the oxide and this has been attributed to multiple reflections in the thin oxide film and also to the increase in the χ⁽²⁾ non-linear susceptibility tensor as a result of charge accumulation at the MCT/anodic oxide interface.     

Structural and optical properties of ZrB2 and HfxZr1−xB2 films grown by vicinal surface epitaxy on Si(1 1 1) substrates

ZrB₂ and Hf_xZr_1?xB₂ films were grown on 4° miscut Si(1 1 1) substrates by chemical vapor deposition of gaseous Hf(BH₄)₄ and Zr(BH₄)₄. The films display superior structural and optical properties when compared with ZrB₂ films grown on on-axis Si(1 1 1). The observed improvements include an optically featureless surface with rms roughness of ～2.5–3.5 nm, a ～50% reduction in the amount of residual strain, and a ～50% lower resistivity. These properties should promote the use of diboride films as buffer layers for nitride semiconductor epitaxy on large-area Si substrates.     

Strain relaxation mechanisms in Si1−xGex layers grown by solid-phase epitaxy: Influence of the layer composition and growth temperature

The influence of the composition and growth temperature on the strain and defect structure of Si_1−xGe_x layers of 0.21≤x≤0.34 grown on (001) Si wafers by solid phase epitaxy is presented. The strain in the layers was measured by Raman spectroscopy and Rutherford backscattering spectrometry/channeling angular scans. The defects were analyzed using high resolution electron microscopy. Three different relaxation mechanisms have been identified and characterized. The first mechanism occurs at the layer-substrate interface of the samples by the introduction of isolated defects. It is found to be thermally activated with an activation energy of E_a=0.16 eV and a prefactor that depends on the Gecontent of the layer. This mechanism produces partial relaxation of the layers and hinders the growth of fully strained layers. The second relaxation mechanism emerges at a distance from the interface which depends on the stress in the crystallized portion of the layer. In this case, the strain relaxation is caused by stacking faults that nucleate when they are energetically feasible and propagate toward the surface of the sample during growth. At low growth temperatures, the defects are confined to the upper part of the epitaxial layers at a distance from the interface that agrees with the theoretical predictions based on the equilibrium critical layer thickness. The third relaxation mechanism is introduced at high growth temperature and is based on the gliding of the stacking faults toward the layer-substrate interface. As a result of this mechanism, the stress in the layers is reduced compared to the stress in the layers grown at lower temperatures and approaches the equilibrium value corresponding to the total layer thickness. This behavior indicates that the layers grown at low temperature, where the stacking faults are confined to the upper part, are to some extent metastable.     

1～3微米光谱区用(Hg,Cd)Te光电二极管激光接收器

各种组分的(Hg,Cd)Te灵敏高速光电二极管探测器已制成,用于1～3微米的光谱区。这些探测器工作于室温,量子效率为40～70％,比探测度由1.3微米波长的3×10~(11)厘米·赫~(1/2)/瓦到3微米波长的5×10~9厘米·赫~(1/2)/瓦。冷却光电二极管探测器可改进性能。在77°K下2.2微米波长的比探测度测得为2×10~(12)厘米·赫~(1/2)/瓦,接近背景限。对探测器-前置放大器组件进行了响应时间测量,用的是0.9、1.06及1.54微米的脉冲辐射。响应时间约为10毫微秒,似乎与波长无关,但受RC乘积和放大器频带宽的限制。若光电二极管接一频带很宽的放大器,脉冲响应就被RC之积限制到0.5毫微秒,并测得另一时间常数(约为5毫微秒),据说它是由储存的载流子的渡越时间决定的。     

Effects of mesa area and orientation on defects in strained InxGa1−xAs films grown by LPOMCVD

We have selectively grown In_xGa_1?xAs (0.04 <x < 0.20, 200 ? 7000Å) on rectangular growth areas (100 μm by 200 mil) patterned on GaAs substrates with very low etch pit densities (～200 cm^?2). The edge orientations of the growth areas were varied on the substrate resulting in distinct facet formation on the deposited mesa structures. Layers were grown using Low-Pressure Organometallic Chemical Vapor Deposition (LPOMCVD) and all samples were annealed for 1 hr at 700° C. Indium content and film thicknesses were very uniform across a wafer so that only the facet shape was varied. Observation of Crosshatch defect densities as a function of growth window orientation showed that 2900Å In_0.08Ga_0.92As mesas with [010] edge orientations exhibited no Crosshatch defects. Identical mesas grown in windows with other edge orientations exhibited varying crosshatch defect densities. Large unpatterned areas of growth were heavily crosshatched. This variation in Crosshatch defect density as a function of mesa orientation appears to be associated with non-area related dislocation nucleation mechanisms at the mesa edges. Proper choice of window orientation for patterned substrate epitaxy will allow the mesa facets to be controlled thereby reducing misfit dislocations in the heterostructure interface.