稻壳SiO2/环氧树脂纳米复合材料的吸水性及弯曲性能

将稻壳用酸处理后在600℃焚烧得到纯度为99.3%,比表面积为212 m2/g的SiO2,用偶联荆γ-氨丙基三乙氧基硅烷(KH550)改性后,SiO2的平均粒径为60 nm.将改性后的稻壳SiO2与环氧树脂(EP)复合,考察稻壳SiO2含量为1%、3%、5%、10%时复合材料在不同温度下的吸水率和弯曲性能,并探讨偶联剂KH550的用量、材料的孔隙率对吸水性的影响.结果表明:稻壳SiO2/EP纳米复合材料的吸水性先随SiO2含量增加而增加,当SiO2质量含量为10%时开始下降.温度和材料中孔隙含量增加使复合材料的吸水率增加,而KH550用量增加能降低吸水率.此外不同组成的复合材料弯曲性能优于纯EP树脂,相同SiO2含量的复合材料,弯曲性能提高幅度依赖于偶联剂的用量.     

稻壳SiO_2/聚氨酯纳米复合材料的制备及性能研究

将酸处理后稻壳在600℃焚烧,得到比表面积为212 m2/g,纯度99.3%的稻壳SiO2纳米凝聚体,用偶联剂γ-氨丙基三乙氧基硅烷(KH550)改性后,SiO2纳米凝聚体在溶液中以纳米状态分散,大部分粒子尺寸约30~50 nm。将其与聚氨酯(PU)复合,探讨了不同SiO2含量复合材料的力学性能、热分解性能以及吸水性。研究结果表明:与纯PU相比,稻壳SiO2/PU纳米复合材料的力学性能有不同程度的提高,其耐热性能和耐水性明显增强。     

偶联剂对稻壳纳米SiO2/EP复合材料力学性能影响

利用硅烷偶联剂(KH550)作为稻壳纳米SiO2(以下简称SiO2)的表面改性剂,研究了KH550用量对SiO2性质的影响.结果表明,KH550能将团聚的SiO2分散开,改善SiO2的表面性质;随KH550用量增加,团聚体尺寸减小,纳米粒子之间的空隙增大.将SiO2作为环氧树脂(EP)填料,探讨了KH550用量对复合材料力学性能的影响.当SiO2质量分数为5％时,材料的拉伸强度、拉伸模量、断裂伸长率和玻璃化转变温度(tg)先随KH550用量增加然后再减小.KH550质量分数5％～8％时,复合材料各项性能之间平衡性好,综合性能最佳.     

纳米SiO2/竹纤维/环氧树脂复合材料性能研究

将竹纤维加入到环氧树脂中以形成增强环氧复合材料,研究了竹纤维竹粉和纳米二氧化硅（SiO2）对环氧树脂的力学性能和耐溶剂浸蚀性能的影响。竹纤维含量为15%时,竹纤维/环氧树脂的冲击强度比纯环氧树脂提高50%。纳米SiO2能同时增强和增韧竹纤维/环氧树脂,并提高其耐溶剂浸蚀性能,纳米SiO2含量为4%时,纳米SiO2/竹纤维/环氧树脂三元复合材料的冲击和拉伸强度分别比未添加纳米SiO2的竹纤维/环氧树脂提高40%和30%。当纳米SiO2/竹纤维/环氧树脂的质量比为4/15/85时,三元复合材料的综合性能较好。     

铝粉的表面有机化改性及其对环氧基复合材料介电性能的影响

通过溶胶-凝胶法制备了铝粉（Al）的二氧化硅（SiO2）包覆粒子SiO2@Al,并用硅烷偶联剂KH550进行有机化改性得到SiO2@Al-KH550。通过FT-IT表征其包覆与处理效果,通过缓蚀效率实验与静态水接触角实验验证其耐腐性与疏水性,以及SEM测试分析其微观结构。利用浇注法制备SiO2@Al-KH550/环氧树脂复合材料,介电性能测试表明当SiO2@Al- KH550含量为35%wt时,介电常数达到30,为纯环氧树脂的6倍,介电损耗0.065,为制备金属粒子/环氧树脂介电复合材料提供了新的思路。     

偶联剂处理纳米SiO2对尼龙1010力学与摩擦学性能的影响

用A171和KH550 2种硅烷偶联剂对纳米SiO2进行分散处理,然后用注射成型法制备了纳米SiO2/尼龙1010复合材料。研究了改性处理纳米SiO2对尼龙1010复合材料的结晶性能、力学性能以及摩擦学性能的影响。结果表明:纳米SiO2表面的改性处理均使尼龙1010基体的结晶度降低,而拉伸强度、硬度和耐磨性提高。A171处理纳米SiO2/尼龙1010复合材料的断裂伸长率大于纯尼龙1010。改性处理纳米SiO2使尼龙1010复合材料的摩擦因数降低。     

埃洛石纳米管对线形低密度聚乙烯的改性作用

采用天然纳米材料埃洛石纳米管（HNTs）通过普通的塑料加工方法制备了线形低密度聚乙烯/埃洛石（LLDPE/HNTs）纳米复合材料,研究了用偶联剂KH550改性HNTs前后纳米复合材料的力学性能、阻燃性能和热稳定性.结果表明：HNTs的加入能明显提高LLDPE的阻燃性能,增加LLDPE的拉伸强度,但引起冲击强度和5%～10%热失重温度的明显下降 用KH550改性HNTs能进一步提高HNTs的阻燃效果,并提高复合材料的冲击强度和热稳定性.     

纳米SiO_2对聚丙烯/环氧树脂共混物性能的影响

采用熔融共混法制备了聚丙烯(PP)/环氧树脂(EP)共混物,研究了纳米SiO2对共混物性能的影响。结果表明:与纯PP相比,PP/EP共混物的冲击强度、断裂伸长率及黏度降低,弯曲模量增大;在PP/EP共混物中加入纳米SiO2后,共混物弯曲模量和冲击强度明显提高;将硅烷偶联剂KH550改性的纳米SiO2(SiO2-KH550)添加到共混物中,在EP为17%、SiO2-KH550为7%时,共混物的弯曲模量比纯PP提高了64%;EP降低了PP的结晶温度。     

碳纤维增强环氧树脂复合材料的制备及性能

采用二苯甲基二异氰酸酯(MDI)和硅烷偶联剂(KH550)对碳纤维进行表面改性,将改性后的碳纤维(MDI/KH550-CFs)与环氧树脂(EP)复合,制备了不同碳纤维添含量的环氧树脂基复合材料,通过扫描电镜、拉伸测试、抗冲测试、磨损测试等研究改性碳纤维含量对环氧树脂基复合材料力学性能的影响。扫描电镜结果表明,采用MDI和KH550改性后的碳纤维与环氧树脂具有较好的界面粘结性能;力学及摩擦磨损性能测试结果显示,加入碳纤维有利于改善材料的拉伸性能及耐磨性能,能够延长材料的使用寿命,并且不影响材料的抗冲击性能。当MDI/KH550-CFs含量为4%时,拉伸强度为25.862 4 MPa,与纯环氧树脂相比增强了62.4%;当其含量为2%时,最低磨损率为0.7×10^-4mm³/(N·m)。     

稻壳二氧化硅/环氧树脂纳米复合材料机械性能研究

将稻壳用10%的盐酸处理后在600℃焚烧得到纯度为99.3%的SiO_2,将SiO_2用偶联剂γ-氨丙基三乙氧基硅烷(KH550)改性后与环氧树脂(EP)复合,探讨了SiO_2质量分数在0～5%范围内复合材料的力学性能.研究结果显示:经硅烷偶联剂KH550改性后稻壳SiO_2粒子为无定形态,尺寸在30～50 nm且能显著提高环氧树脂的力学性能.当稻壳SiO_2质量分数为3%时,材料的拉伸性能以及弯曲性能的提高率最大,拉伸强度、拉伸模量、弯曲模量和弯曲强度的提高率分别为27.25%、6.54%、61.7%和24.56%.SEM研究结果显示:复合材料中SiO_2与基体树脂之间有较好的相容性.     

SiO2/聚氨酯纳米复合物的在位合成及其在环氧树脂中分散行为的研究

以水性阳离子聚氨酯纳米粒子为纳米微囊,利用原位水解法使正硅酸乙酯(TEOS)在囊内水解、聚合生成二氧化硅(SiO2)纳米粒子,从而合成出SiO2/聚氨酯纳米复合物的稳定水基乳液,实现纳米复合物中SiO2纳米粒子的均匀分散和良好的界面结合。并以此作为已表面改性的纳米粒子实现SiO2纳米粒子在环氧树脂的均匀分散。通过能谱扫描、透射电镜和乳液粒子粒径与分布等测试方式对含有环氧树脂的水性SiO2/聚氨酯纳米复合物进行测试。结果表明,SiO2/聚氨酯纳米复合物可以在环氧树脂中均匀分散且不团聚,同时也可促进环氧树脂在水中的分散。     

聚酰胺6/环氧树脂改性蒙脱土纳米复合材料的制备与性能

采用环氧树脂改性蒙脱土（MMT）得到有机化蒙脱土（OMMT）,再用熔融插层法制备了聚酰胺6 （PA6）/ OMMT纳米复合材料。采用X射线衍射仪、透射电子显微镜、万能材料试验机、热重分析仪等研究了PA6/OMMT复合材料的形态结构、力学性能和热稳定性。结果表明,经环氧树脂改性得到的OMMT的层间距明显增加,从未改性的1.22 nm增加到5.13 nm,并以纳米尺度分散于PA6基体中;随着OMMT含量的增加,PA6/ OMMT复合材料的强度和模量增加,热变形温度提高,其拉伸强度可达76 MPa,弯曲模量达到3.462 GPa,热变形温度为134 ℃;PA6/ OMMT复合材料失重10 %时的温度为422 ℃,比纯PA6的406 ℃提高了16 ℃,改善了PA6的热稳定性。     

Synthesis of epoxy resin–silica nanocomposites provided from perhydropolysilazane as a curing reagent and the precursor of silica domain

Epoxy resin–silica nanocomposites with spherical silica domains with 29.0 nm in diameter in an epoxy resin matrix were synthesized from Bisphenol‐A type epoxide monomer, 2,2‐bis(4‐glycidyloxyphenyl)propane (DGEBA), and perhydropolysilazane (PHPS, ? [Si₂? NH]_n? ). The volume fraction of silica domain in the composite varied from 5.4 to 37.8 vol % by varying the feed ratio of PHPS to the epoxide monomer. The reaction mechanism of epoxy group and PHPS was investigated by using glycidyl methacrylate as a model compound of the epoxy monomer by ¹H‐nucular magnetic resonance and Fourier transform infrared spectrometry. Ammonia gas provided by the decomposition of PHPS with moisture converted PHPS to silica and cured the epoxy monomer. The curing of epoxy monomer preferably proceeded than the conversion of silica. The addition of 1,4‐diaminobutane drastically accelerated the rate of curing; white and hard epoxy resin–silica nanocomposites were obtained. The good thermal stability of the composite prepared with DGEBA/PHPS/1,4‐diaminobutane was observed by thermogravimetric analysis. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Preparation of epoxy resin/silica hybrid composites for epoxy molding compounds

Phenolic novolac/silica and cresol novolac epoxy/silica hybrids were prepared through in situ sol‐gel reaction of tetraethoxysilane (TEOS). The formed hybrids were utilized as a curing agent and an epoxy resin in epoxy curing compositions, respectively. Via the two‐step preparation route, the resulting epoxy resin/silica hybrid nanocomposites exhibited good thermal stability, high glass transition temperatures, and low coefficients of thermal expansion. High condensation degree of the condensed silica was observed with a high content of siloxane bridges, p > 85%, measured by ²⁹Si NMR. The two‐step route also provides feasibility of preparation of epoxy resin/silica hybrid nanocomposites compatible with the current processes of manufacturing of epoxy molding compounds. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 4047–4053, 2003     

Rice‐husk‐ash‐based silica as a filler for embedding composites in electronic devices

We carried out a feasibility study of the use of black rice husk ash (RHA) as a filler in epoxy resin for embedding material in electrical and electronic applications. We made a comparison by mixing RHA and two commercial fillers, fused and crystalline silica, with epoxy resin at weight fractions ranging from 20–60%. RHA‐filled epoxy resin had higher mixing viscosity, coefficient of thermal expansion, and water absorption percentage than commercial‐silica‐filled epoxy composite. However, the impact strength of all composites was comparable, but the tensile strength and elongation at break of silica‐filled epoxy were slightly superior. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 3013–3020, 2002     

Preparation of SiO2/epoxy nanocomposite via reverse microemulsion in situ polymerization

Reverse water/oil (w/o) microemulsions composed of epoxy resin (EP) (the oil phase) and nonionic surfactant and ammonia aqueous solutions (the water phase) were used in the synthesis of SiO2/EP nanocomposites. The stability of reverse microemulsion was evaluated by measuring water solubilization of the microemulsion. Effects of surfactant type and content, ammonia concentration and temperature on the water solubilization were systematically investigated. Higher water solubilization capacity was obtained by nonionic surfactant TX‐100 compared with other two surfactants, Span‐80 and Tween‐80. Ammonia concentration of 5 wt% and preparation temperature at 35°C were favorable for forming a stable microemulsion and enabling the subsequent hydrolysis and condensation reaction of inorganic precursor tetraethoxysilane (TEOS). SiO2/ epoxy nanocomposites were prepared via in situ polymerization of TEOS within the nanoscale reverse microemulsion “water pool”. FTIR, SEM, and universal testing machine were used to characterize the structural and mechanical properties of the composite. The results revealed that the optimal mechanical properties were obtained at 3 wt% TEOS content. Compared with neat epoxy resin, the tensile and flexural strength of the composite were 40% and 12% higher, respectively. The formation of the silica structure in the hybrid was investigated with FTIR. The SEM and optical observations showed a ductile fracture morphology and good miscibility between inorganic and organic phases. POLYM. COMPOS., 35:1388–1394, 2014. © 2013 Society of Plastics Engineers     

有机硅改性环氧树脂的合成与性能

热熔法制备了系列聚甲基苯基硅氧烷(PMPS)改性环氧树脂,通过环氧值、红外光谱(IR)和凝胶色谱(GPC)分析表明,有机硅接枝到了环氧树脂上,且环氧基保持不变。探讨了改性方法、有机硅含量对改性树脂固化体系的微观形态、韧性及耐热性的影响。实验表明,当m(E-20)∶m(DC-3074)=7∶3时,化学改性树脂固化体系的韧性和耐热性能明显提高,玻璃化转变温度(Tg)为88.33℃,质量损失50%时的热分解温度(Td)为487.80℃,分别比物理改性环氧树脂提高了52.63℃和36.75℃,同时此改性树脂固化物还具有优良的涂膜性能。     

有机硅改性环氧树脂及其室温固化的性能研究

采用二苯基硅二醇(DSPD)改性双酚A型环氧树脂(E-51)制备了有机硅改性的环氧树脂,采用硫脲改性聚酰胺650制备了室温快速固化的环氧固化剂。合成产物通过红外进行表征,用盐酸-丙酮法测定改性环氧树脂的环氧值,通过指干时间确定聚酰胺650和改性聚酰胺650与E-51的较优配比。通过差示扫描量热分析法(DSC)和热重分析法(TG)表征改性环氧树脂固化物的耐热性,通过拉伸性能和扫描电镜测试(SEM)表征改性环氧树脂固化物的韧性。实验结果表明,环氧树脂经改性后,其玻璃化温度升高了27℃,与聚酰胺650固化后,固化产物的起始热分解温度明显增加,失重50%的分解温度升高了180℃,固化物的断裂伸长率增加了3.41%,断裂面呈现明显韧性断裂特征。