轴向超声振动辅助磨削的磨削力研究

假设未变形磨屑厚度服从瑞利分布,推导了切削变形力的计算表达式;根据磨粒与工件的相对运动,探讨了超声振动对摩擦力的影响,分析了超声磨削时磨粒在砂轮切线方向上的摩擦力变化规律。综合切削变形力和摩擦力的理论分析,建立了轴向超声振动辅助磨削中磨削力的预测模型。对比实验的研究结果表明：由实验得到的磨削参数和振动参数对磨削力的影响规律与理论分析相一致,且仿真计算结果与实验测量结果的变化规律一致,从而验证了磨削力模型的可行性。     

单颗粒金刚石平面磨削C/SiC复合材料的有限元仿真

建立有限元模型对C/SiC复合材料单颗金刚石磨粒平面磨削加工过程进行数值模拟,结合Abaqus有限元分析软件建立材料本构模型,仿真分析单颗粒平面磨削过程中不同砂轮转速和磨削深度对磨削力、工件表面形貌的影响规律。结果表明,随着砂轮转速的提高,法向及切向磨削力变小,表面质量提高,亚表面裂纹变小;随着磨削深度的增加,法向及切向磨削力变大,表面质量变差,亚表面裂纹变深。该研究为陶瓷基复合材料磨削加工机理的研究及磨削工艺参数优化,提供了高效的方法和理论依据。     

纳米结构陶瓷涂层的外圆磨削力以及磨削表面精度的实验研究

使用功率计监测磨削加工的能量消耗，探讨了纳米结构陶瓷涂层的外圆磨削过程；对纳米陶瓷涂层和传统陶瓷涂层在磨削力和磨削表面精度方面进行了比较．磨削实验使用了外圆磨床和陶瓷结合剂金刚石砂轮．通过测量主轴功率获得切向磨削力，讨论了加工参数，如切深、进给率以及砂轮粒度对切向磨削力的影响．还对磨削后的涂层表面用粗糙度仪和扫描电镜进行了评估，揭示了表面粗糙度与加工参数的关系．     

轴向超声振动辅助磨削的表面残余应力建模

以单颗磨粒为对象,分析了轴向超声振动下磨粒的运动特性;在此基础上,将磨削力分为切削变形力和摩擦力两部分,分别分析了轴向超声振动对切屑变形力和摩擦力的影响。在切削变形力方面,轴向超声振动改变了磨粒的运动方向和运动轨迹;在摩擦力方面,轴向超声振动降低了磨粒与工件间的摩擦因数;结合切向磨削力与热源强度的关系,以及温升是磨削表面残余应力产生的主要因素,建立了轴向超声振动辅助磨削的表面残余应力模型。进行轴向超声振动辅助磨削45钢的表面残余应力实验,确定了模型的常数,并验证了所建模型的正确性。     

轴向超声振动辅助磨削的表面残余应力建模EI北大核心CSCD

以单颗磨粒为对象,分析了轴向超声振动下磨粒的运动特性;在此基础上,将磨削力分为切削变形力和摩擦力两部分,分别分析了轴向超声振动对切屑变形力和摩擦力的影响。在切削变形力方面,轴向超声振动改变了磨粒的运动方向和运动轨迹;在摩擦力方面,轴向超声振动降低了磨粒与工件间的摩擦因数;结合切向磨削力与热源强度的关系,以及温升是磨削表面残余应力产生的主要因素,建立了轴向超声振动辅助磨削的表面残余应力模型。进行轴向超声振动辅助磨削45钢的表面残余应力实验,确定了模型的常数,并验证了所建模型的正确性。     

不同晶粒度硬质合金的磨削力预测

介绍了磨削力数学模型研究现状,在断裂力学基础上建立了与工艺参数和材料物理机械性能相关的磨削力数学模型,可根据数学模型预报不同晶粒度硬质合金的磨削力为了论证此磨削力数学模型,对不同晶粒度的硬质合金进行了磨削实验．分析了晶粒度和工艺参数对磨削力、磨削表面形貌的影响,讨论了硬质合金物理机械性能对磨削力的影响．实验研究结果表明,数学模型预估值与实验数据吻合程度高,晶粒度对磨削力和磨削表面形貌都有显著影响．在相同磨削条件下,减少硬质合金晶粒度则磨削力减少,并且磨削表面质量改善,反之亦然．细磨粒砂轮磨削时晶粒度对磨削力的影响程度减弱．     

考虑机床-磨削交互的工件表面形貌仿真

磨削加工方法是保证加工表面质量的重要手段,机床结构与磨削过程之间存在的交互作用会对工件表面质量产生不利影响。以砂轮端面磨削加工过程为研究对象,在研究磨削工件表面形貌仿真方法的基础上,深入分析了机床结构与磨削过程之间交互作用对工件表面形貌的影响。首先基于砂轮表层磨粒的随机分布特性建立了虚拟砂轮形貌,然后通过对磨削过程中砂轮磨粒与工件几何干涉作用的分析,建立了磨粒运动轨迹方程和工件表面形貌方程。考虑砂轮变形对磨削过程的反向作用,建立了主轴-砂轮结构与磨削过程间的交互模型,采用耦合仿真的方法对机床-磨削交互过程进行了仿真,并考虑磨削过程中的交互作用提出了一种新的磨削工件表面形貌仿真模型,实验结果验证了所给算法的正确性和有效性,该方法为进一步优化磨削工艺参数提供了依据。     

磨粒有序化排布砂轮缓进给磨削温度场的仿真分析

为了更好地分析磨削过程中温度场的分布情况,获得磨粒有序化排布砂轮磨削工件表面温度的变化规律,对磨粒有序化排布的砂轮进行了三维建模,并利用有限元仿真软件Abaqus,对磨粒叶序排布、错位排布、矩阵排布和无序排布砂轮磨削温度场分别进行有限元仿真.分析了磨削液、磨削深度、砂轮线速度和工件进给速度对磨削工件表面最高温度的影响.结果表明,在相同磨削条件下,磨粒叶序排布砂轮磨削工件表面的最高温度相较于其他3种排布形式最低.     

电镀砂轮磨粒等高性影响磨削性能研究

为解决电镀砂轮表面磨粒等高性差导致的磨削性能不佳的问题,提出磨粒等高性的测量方法和量化指标(H_r和H_s),采用金刚石滚轮对砂轮进行微量修整,检测磨削功率和磨削表面质量以评价砂轮磨削性能,分析磨粒等高性与砂轮磨削性能的关系。实验结果表明:微量修整可以明显提高电镀砂轮表面磨粒的等高性,从而改善磨削表面振纹和粗糙度,但应防止修整钝化;为获得良好修整效果,通过H_r定量分析,修整前H_r值不能大于磨粒直径的30%,修整后不宜大于磨粒直径的8%。     

反应烧结碳化硅的磨削特征

采用金刚石砂轮对(RBSiC)进行磨削, 系统研究了表面形貌、残余应力和弯曲强度等磨削特征. 结果显示, 材料主要以脆性断裂去除, 局部区域为塑性切除. 随着轴向进给增大, 表面粗糙度(R_a)增加, 为降低R_a可进行适当光刀. 随着轴向进给增加, 磨削区的冷却效果被削弱, 使磨削残余压应力值下降. 与0.9 μm/s相比, 用1.35 μm/s磨削后试样的表面损伤程度增加. 工作台转速2.1 r/min、轴向进给0.9 μm/s并光刀1 min是保证高加工效率并获得较好质量表面的最优参数.     

Study into grinding force in back grinding of wafer with outer rim

Back grinding of wafer with outer rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. At present, the effects of process parameters on the grinding force remain debatable. Therefore, a BGWOR normal grinding force model based on grain depth-of-cut was established, and the relationship between grinding parameters (wheel infeed rate, wheel rotational speed, and chuck rotational speed) and normal grinding force was discussed. Further, a series of experiments were performed to verify the BGWOR normal grinding force model. This study proves that the BGWOR normal grinding force is related to the rotational direction of the wheel and chuck, and the effect of grinding mark density on the BGWOR normal grinding force cannot be ignored. Moreover, this study provides methods for reducing the grinding force and optimizing the back thinning process of the silicon wafer.The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-020-00316-z     

单颗CBN磨粒磨削20CrMo的微观成屑过程研究

为研究20CrMo材料的磨削去除机理与微观成屑过程,采用Johnson-Cook模型作为20CrMo的本构模型,应用有限元软件Abaqus建立了单颗CBN磨粒磨削20CrMo成屑过程的三维有限元分析模型。通过该模型探究不同磨削参数下的微观成屑过程,仿真分析结果表明:磨削速度对成屑过程中的耕犁与成屑阶段影响较大,磨削深度对滑擦与成屑阶段影响较大。设计了单颗磨粒磨削实验装置,对微观成屑进行了实验研究与分析,从磨痕沟槽和磨屑的整体特征来看,实验结果与仿真结果都较为吻合,验证了该三维仿真模型的正确性。     

Ductile Regime Mirror Finish Grinding of Ceramics with Electrolytic In-process Dressing (ELED) Grinding

Advanced structural ceramics, such as silicon nitride based materials, are of interest owing to their unique physical and mechanical properties. However the cost of grinding these ceramics, which is an integral part of their fabrication, is very high. Moreover, grinding can result in surface and sub-surface damage in the material and these defects can significantly reduce the strength and reliability of the finished components. Grinding damage is sensitive to grinding parameters. Two types of silicon nitride based ceramic materials were ground with Electrolytic In-Process Dressing (ELID) using different grit sized metal bonded diamond grinding wheels. With the application of ELID technology, mirror surface finish was realized with a #4000 mesh size wheel (average grain size = 4μm). Differences in ground surface topography caused by wheel grain size were analyzed using scanning electron microscopy (SEM) and atomic force microscopy (AFM). The SEM and AFM studies reveal that material was predominantly removed in the ductile mode when ELID grinding was performed with a #4000 grit size wheel or finer.     

An investigation on machined surface quality and tool wear during creep feed grinding of powder metallurgy nickel-based superalloy FGH96 with alumina abrasive wheels

In this study, the machined surface quality of powder metallurgy nickel-based superalloy FGH96 (similar to Rene88DT) and the grinding characteristics of brown alumina (BA) and microcrystalline alumina (MA) abrasive wheels were comparatively analyzed during creep feed grinding. The influences of the grinding parameters (abrasive wheel speed, workpiece infeed speed, and depth of cut) on the grinding force, grinding temperature, surface roughness, surface morphology, tool wear, and grinding ratio were analyzed comprehensively. The experimental results showed that there was no significant difference in terms of the machined surface quality and grinding characteristics of FGH96 during grinding with the two types of abrasive wheels. This was mainly because the grinding advantages of the MA wheel were weakened for the difficult-to-cut FGH96 material. Moreover, both the BA and MA abrasive wheels exhibited severe tool wear in the form of wheel clogging and workpiece material adhesion. Finally, an analytical model for prediction of the grinding ratio was established by combining the tool wear volume, grinding force, and grinding length. The acceptable errors between the predicted and experimental grinding ratios (ranging from 0.6 to 1.8) were 7.56% and 6.31% for the BA and MA abrasive wheels, respectively. This model can be used to evaluate quantitatively the grinding performance of an alumina abrasive wheel, and is therefore helpful for optimizing the grinding parameters in the creep feed grinding process.The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-020-00305-2     

An experimental study on grinding of Zr-based bulk metallic glass

There are limited studies in the literature about machinability of bulk metallic glass(BMG).As a novel and promising structural material,BMG material machining characteristics need to be verified before its utilization.In this paper,the effects of cutting speed,feed rate,depth of cut,abrasive particle size/type on the BMG grinding in dry conditions were experimentally investigated.The experimental evaluations were carried out using cubic boron nitride(CBN) and Al_2O_3 cup wheel grinding tools.The parameters were evaluated along with the results of cutting force,temperature and surface roughness measurements,X-ray,scanning electron microscope(SEM)and surface roughness analyse.The results demonstrated that the grinding forces reduced with the increasing cutting speed as specific grinding energy increased.The effect of feed rate was opposite to the cutting speed effect,and increasing feed rate caused higher grinding forces and substantially lower specific energy.Some voids like cracks parallel to the grinding direction were observed at the edge of the grinding tracks.The present investigations on ground surface and grinding chips morphologies showed that material removal and surface formation of the BMG were mainly due to the ductile chip formation and ploughing as well as brittle fracture of some particles from the edge of the tracks.The roughness values obtained with the CBN wheels were found to be acceptable for the grinding operation of the structural materials and were in the range of 0.34-0.58 μm.This study also demonstrates that conventional Al_2O_3 wheel is not suitable for grinding of the BMG in dry conditions.     

Material removal characteristics of 20CrMnTi steel in single grit cutting

The single grit cutting test was regarded as an important approach for understanding a complex grinding process, and revealed the connection between grinding wheel state, grinding parameters, and the surface integrity of workpieces. To investigate the formation mechanisms and morphology of grinding chips of 20CrMnTi steel, experiments on the high-speed grinding of a single grit on the surface of 20CrMnTi steel were performed by the finite element method. Combining this with the analysis of scratch morphology and the use of the finite element method, the authors showed that the process included sliding friction, ploughing, and produced fragmented, and continuous chips which changed with the cutting depth. Moreover, the distributions of physical quantities including stress, strain, heat, and temperature fields in the three areas subjected to cutting deformation were analyzed in greater detail. Moreover, combined with the deduced theoretical formulae, finite element simulation tests were conducted to analyze the undeformed chip thickness, shear angle, chip shape, strain in the formation process of chips from a single grit grain, and its changes with grinding parameters and the shape of abrasive grains.     

The measurement and analysis of micro bonding force for electroplated CBN grinding wheels based on response surface methodology

The superabrasive (e.g. CBN or diamond) grain dislodgement occurrence on the wheel surface due to insufficient bonding force is the major failure phenomena in the grinding process with electroplated grinding tools. This failure leads to the abrupt increase of load on the immediate grains, accelerating more grain dislodgement on wheel surface. Ultimately, the aggregated grain dislodgement causes the workpiece profile accuracy degradation and catastrophic wheel sharpness loss. Therefore, the provision of sufficient and uniform micro bonding force all through the wheel surface is the critical task in electroplated superabrasive grinding wheel design. Considering the complexity in the micro bonding force enabling factors, e.g. the grain shape, dimensional size, spatial orientation, and bond layer thickness, it is vital to establish the quantitative and comprehensive relationship between these factors with the micro bonding force for optimal electroplated grinding wheel design. In this paper, an inclined micro-thread turning test is developed to measure the single grain micro bonding force. In addition, the finite element model of single CBN grain bonding force is established and validated to simulate the grain dislodgement. Finally, the response surface methodology (RSM) is applied to build the comprehensive correlation of the bonding force with its dimensional size, spatial orientation, and bond layer thickness. Therefore, the optimal bonding condition through regressed prediction model is identified to provide the quantitative basis for the electroplated CBN grinding wheels design, which indicates that the bonding force can be predicted for specific wheel manufacturing parameters and improved by related variable adjustment.     

Influence of a Retaining Ring on Strain and Stress in the Chemical Mechanical Polishing Process

In this article, a two-dimensional axisymmetric quasi-static finite element wafer scale model for chemical mechanical polishing (CMP) process involved in the wafer carrier, the carrier film, the wafer, the pad, and the retaining ring was developed to investigate the effect of a retaining ring surrounding the wafer carrier to the strain, stress, and nonuniformity of the wafer surface for the purpose of improving edge exclusion of wafer and preventing the wafer sliding from the carrier while grinding. Considering the same revolutions of the wafer and the pad and the axisymmetric distributed force forms of the wafer carrier and the retaining ring, and applying the principle of minimum potential energy, a two-dimensional axisymmetric quasi-static finite element model for CMP process was established. Following the developed model, the effects of the retaining ring on the strain components, the stress components, the von Mises stress, and the wafer's nonuniformity were investigated. The findings indicated that a retaining ring installed in the conventional CMP mechanism could reduce the variation of the von Mises stress distribution to reach the lower wafer's nonuniformity effectively, improve the over-grinding phenomenon and prevent the wafer sliding from the carrier while grinding.