HgCdTe focal plane arrays for dual-color mid- and long-wavelength infrared detection

Raytheon Vision Systems (RVS, Goleta, CA) in collaboration with HRL Laboratories (Malibu, CA) is contributing to the maturation and manufacturing readiness of third-generation, dual-color, HgCdTe infrared staring focal plane arrays (FPAs). This paper will highlight data from the routine growth and fabrication of 256×256 30-μm unit-cell staring FPAs that provide dual-color detection in the mid-wavelength infrared (MWIR) and long wavelength infrared (LWIR) spectral regions. The FPAs configured for MWIR/MWIR, MWIR/LWIR, and LWIR/LWIR detection are used for target identification, signature recognition, and clutter rejection in a wide variety of space and ground-based applications. Optimized triple-layer heterojunction (TLHJ) device designs and molecular beam epitaxy (MBE) growth using in-situ controls has contributed to individual bands in all dual-color FPA configurations exhibiting high operability (>99%) and both performance and FPA functionality comparable to state-of-the-art, single-color technology. The measured spectral cross talk from out-of-band radiation for either band is also typically less than 10%. An FPA architecture based on a single-mesa, single-indium bump, and sequential-mode operation leverages current single-color processes in production while also providing compatibility with existing second-generation technologies.     

中/长波切换工作模式的双色量子阱红外焦平面研制

报道了中/长波切换工作模式的双色量子阱红外焦平面研制。通过特殊设计的器件和读出电路结构,获得了可对中波波段和长波波段选择的切换架构。突破了双色量子阱材料、器件以及读出电路等关键技术,研制出384288规模、25 m中心距双色量子阱红外焦平面探测器。在70 K条件下器件性能优良,噪声等效温差为28 mK(中波)和30 mK(长波),响应峰值波长分别为5.1 m(中波)和8.5 m(长波)。室温目标红外成像演示了探测器的双色探测功能。     

Demonstration and Performance Assessment of Large Format InP–InGaAsP Quantum-Well Infrared Photodetector Focal Plane Array

There have been various studies showing that InP-InGaAs quantum-well infrared photodetectors (QWIPs) are potential alternatives to AlGaAs-GaAs QWIPs in the long wavelength infrared (LWIR) band, especially for applications requiring high responsivity. Being on InP substrate, this material system also offers lattice matched mid-wavelength infrared (MWIR)/LWIR dual band QWIP stack when it is used with the AlInAs-InGaAs system. It is desirable to extend the cut-off wavelength of InP based LWIR QWIPs to , which can be accomplished by replacing the QW material with InGaAsP. In this paper, we report the first InP-InGaAsP QWIP focal plane array (FPA). The 640 512 FPA displayed remarkably low noise equivalent temperature difference (NETD) with very short integration times (46 mK at 66 K with and f/1.5 optics). The results show that these QWIPs can be operated with high responsivity (1 A/W) while offering bias adjustable gain in a wide range where the detectivity is almost constant at a reasonably high level.     

High-Performance MWIR/LWIR Dual-Band 640 × 480 HgCdTe/Si FPAs

HgCdTe grown on large-area Si substrates allows for larger array formats and potentially reduced focal-plane array (FPA) cost compared with smaller, more expensive CdZnTe substrates. The goal of this work is to evaluate the use of HgCdTe/Si for mid-wavelength/long-wavelength infrared (MWIR/LWIR) dual-band FPAs. A series of MWIR/LWIR dual-band HgCdTe triple-layer n-P-n heterojunction (TLHJ) device structures were grown by molecular-beam epitaxy (MBE) on 100-mm (211)Si substrates. The wafers showed low macrodefect density (<300 cm⁻²) and was processed into 20-μm-unit-cell 640 × 480 detector arrays which were mated to dual-band readout integrated circuits (ROICs) to produce FPAs. The measured 80-K cutoff wavelengths were 5.5 μm for MWIR and 9.4 μm for LWIR, respectively. The FPAs exhibited high pixel operabilities in each band, with noise equivalent differential temperature (NEDT) operabilities of 99.98% for the MWIR band and 99.6% for the LWIR band demonstrated at 84 K.     

High-Performance M/LWIR Dual-Band HgCdTe/Si Focal-Plane Arrays

Mercury cadmium telluride (HgCdTe) grown on large-area silicon (Si) substrates allows for larger array formats and potentially reduced focal-plane array (FPA) cost compared with smaller, more expensive cadmium zinc telluride (CdZnTe) substrates. In this work, the use of HgCdTe/Si for mid- wavelength/long-wavelength infrared (M/LWIR) dual-band FPAs is evaluated for tactical applications. A number of M/LWIR dual-band HgCdTe triple-layer n-P-n heterojunction device structures were grown by molecular-beam epitaxy (MBE) on 100-mm (211)Si substrates. Wafers exhibited low macrodefect densities (< 300 cm^?2). Die from these wafers were mated to dual-band readout integrated circuits to produce FPAs. The measured 81-K cutoff wavelengths were 5.1 μm for band 1 (MWIR) and 9.6 μm for band 2 (LWIR). The FPAs exhibited high pixel operability in each band with noise-equivalent differential temperature operability of 99.98% for the MWIR band and 98.7% for the LWIR band at 81 K. The results from this series are compared with M/LWIR FPAs from 2009 to address possible methods for improvement. Results obtained in this work suggest that MBE growth defects and dislocations present in devices are not the limiting factor for detector operability, with regards to infrared detection for tactical applications.     

双波段红外光学系统设计与像质评价

双波段/多波段成像技术受到普遍重视,使得双波段光学系统特别是中、长波红外成像系统成为研究的热门之一。设计了折反射式光学系统、离轴三反射式光学系统和全折射式光学系统,分析了3种不同类型光学系统及其成像性能。采用了能同时响应中、长波红外的探测组件,系统的主要技术指标为:工作波段3~5 m、8~12 m,F/#=2,2=5.74,f=100 mm,全视场畸变2%,空间频率16.7 lp/mm处的MTF0.4。对3种不同类型系统的特点进行分析和研究,给出了各种像差曲线和光学传递函数曲线,总结了3种不同类型光学系统的优缺点。     

Recent developments of high-complexity HgCdTe focal plane arrays at leti infrared laboratory

In this article, we present recent developments of the research in France at LETI infrared laboratory in the field of complex third-generation HgCdTe IRCMOS focal plane arrays (FPAs). We illustrate this with three prototypes of FPAs made at LETI, which have involved some technological improvements from the standard process today in production at Sofradir. We present, using molecular-beam epitaxy (MBE) growth, a 128 × 128 dual-band infrared (photodetector)-complementary metal oxide semiconductor (IRCMOS) with a pitch of 50 μm operating within 2–5 μm. Using the more conventional liquid-phase epitaxy (LPE) growth, we show a new generation of high-performance long linear arrays (1500 × 2; pitch, 30 μm) operating in medium-wavelength infrared (MWIR) or long-wavelength infrared (LWIR) bands based on a modular architecture of butted HgCdTe detection circuit and SiCMOS multiplexers. Finally, we present for the first time a megapixel (1000 × 1000) FPA with a pitch of 15 μm operating in the MWIR band that exhibits a very high performance and pixel operability.     

A monolithic dual-band HgCdTe infrared detector structure

A monolithic HgCdTe photoconductive device structure is presented that is suitable for dual-band optically registered infrared photodetection in the two atmospheric transmission windows of 3-5 μm and 8-12 μm, which correspond to the mid-wave and long-wave infrared bands; MWIR and LWIR, respectively. The proposed structure employs a wider bandgap isolating layer between the two photosensitive layers such that an effective electrical barrier is formed thus prohibiting carrier transport between the two infrared absorbing layers of different cutoff wavelengths. The technology is demonstrated using a mature HgCdTe photoconductive device fabrication process. The resulting detectors have an MWIR cutoff of 5.0 μm, and LWIR cutoff of 10.5 μm     

Large-Format HgCdTe Dual-Band Long-Wavelength Infrared Focal-Plane Arrays

Raytheon Vision Systems (RVS) continues to further its capability to deliver state-of-the-art high-performance, large-format, HgCdTe focal-plane arrays (FPAs) for dual-band long-wavelength infrared (L/LWIR) detection. Specific improvements have recently been implemented at RVS in molecular-beam epitaxy (MBE) growth and wafer fabrication and are reported in this paper. The aim of the improvements is to establish producible processes for 512 × 512 30-μm-unit-cell L/LWIR FPAs, which has resulted in: the growth of triple-layer heterojunction (TLHJ) HgCdTe back-to-back photodiode detector designs on 6 cm × 6 cm CdZnTe substrates with 300-K Fourier-transform infrared (FTIR) cutoff wavelength uniformity of ±0.1 μm across the entire wafer; demonstration of detector dark-current performance for the longer-wavelength detector band approaching that of single-color liquid-phase epitaxy (LPE) LWIR detectors; and uniform, high-operability, 512 × 512 30-μm-unit-cell FPA performance in both LWIR bands.     

宽波段DMD动态红外景象仿真器投影光学系统设计

宽波段红外景象仿真器可用于内场评价和验证中波/长波红外双波段成像仪。详细介绍了基于数字微镜器件(DMD)的动态红外景象仿真器的组成和工作原理。重点介绍了覆盖中波和长波红外的宽波段红外投影光学系统的指标要求、设计思想和设计结果。基于离轴三反射镜系统设计的系统,具有无色差、适用波段宽、相对孔径大、结构较紧凑、成像质量好等优点。根据待测设备要求,设计了一款口径100、相对孔径F/2.84、全面视场角4.4°、成像质量接近于衍射极限的宽波段投影光学系统。     

Large-Format Voltage-Tunable Dual-Color Midwavelength Infrared Quantum-Well Infrared Photodetector Focal Plane Array

We report a large-format (640 times 512) voltage-tunable quantum-well infrared photodetector (QWIP) focal plane array (FPA) for dual-color imaging in the midwavelength infrared (3-5 mum) band. Voltage-tunable spectral response has been achieved through series connection of two eight-well stacks of AlGaAs-InGaAs epilayers grown by molecular beam epitaxy on GaAs substrate. The peak responsivity wavelength of the detectors is shifted from 4.1 mum (color 1) to 4.7 mum (color 2) as the bias is increased within the limit applicable by commercial read-out integrated circuits. The operability of the FPA is ~99.5% with noise equivalent temperature differences of ~60 and 30 mK (f/1.5) in color modes 1 and 2, respectively. To our knowledge, this is the first large-format voltage-tunable dual-color QWIP FPA reported for midwavelength thermal imaging.     

红外双波段谐衍射光学系统设计

为提高红外系统探测能力,满足探测器在红外中长波双波段同时成像的要求,提出一种基于谐衍射的光学系统设计.根据谐衍射透镜的特点,通过合理选择谐衍射波长和衍射级次,采用折射式共光路构型成功完成了中/长波双波段光学系统的设计.系统在3.7～4.8μm和7.7～9.5μm两个波段成像,F数为2,视场角10°.优化结果表明,成像质...     

中波-长波红外双色QWIP探测器设计

双色QWIP是一类重要的第三代红外探测器,但很少有研究报道对其有源区结构以及耦合光栅参数进行系统的计算分析和优化设计。文中基于包络函数近似、传输矩阵模型、经典光学原理等理论对中波-长波红外双色QWIP探测器的多周期有源区以及二维耦合光栅进行了较为详细的优化设计。长波红外(LWIR)有源区采用GaAs/AlGaAs准匹配体系的多量子阱结构,峰值响应波长为8.5 m;中波红外(MWIR)有源区采用InGaAs/GaAs/AlGaAs应变体系的微带超晶格结构,峰值响应波长为4.5 m;子带间跃迁类型均设计为束缚态-准束缚态(B-QB)以降低暗电流,提高探测率。此外,通过折衷优化设计,采用单周期二维光栅以有效实现LWIR与MWIR的双色耦合。上述设计对双色QWIP器件的研制具有较好的实际指导意义。     

国外中长波双波段红外成像技术的发展及应用

中长波双波段红外成像技术能同时获得中波、长波两个大气窗口的红外辐射信息,同时具有两种单波段成像技术的优点。通过优势互补,中长波双波段红外成像技术能够提高装备对各种复杂环境条件的适应能力,提高各类作战任务的成功率。在过去二十几年中,欧美主要国家实现了从双探测器双波段成像到单探测器双波段成像的发展及批量装备,目前正向更高分辨率、更远作用距离的方向发展。中长波双波段红外成像技术主要用于提高各类主战装备对不同的作战环境的适应能力以及各类搜索跟踪识别系统对目标的探测识别成功率。此外,可以通过中长波双波段红外成像技术获取目标的温度、光谱特性等特征信息,可用于反干扰、反伪装。     

Design and development of multicolor MWIR/LWIR and LWIR/VLWIR detector arrays

Multicolor infrared (IR) focal planes are required for high-performance sensor applications. These sensors will require multicolor focal plane arrays (FPAs) that will cover various wavelengths of interest in mid wavelength infrared/long wavelength infrared (MWIR/LWIR) and long wavelength infrared/very long wavelength infrared (LWIR/VLWIR) bands. There has been significant progress in HgCdTe detector technology for multicolor MWIR/LWIR and LWIR/VLWIR FPAs.^1–3 Two-color IR FPAs eliminate the complexity of multiple single-color IR FPAs and provide a significant reduction of weight and power in simpler, reliable, and affordable systems. The complexity of a multicolor IR detector MWIR/LWIR makes the device optimization by trial and error not only impractical but also merely impossible. Too many different geometrical and physical variables need to be considered at the same time. Additionally, material characteristics are only relatively controllable and depend on the process repeatability. In this context, the ability of performing “simulation experiments” where only one or a few parameters are carefully controlled is paramount for a quantum improvement of a new generation of multicolor detectors for various applications.     

HgCdTe/Si materials for long wavelength infrared detectors

The heteroepitaxial growth of HgCdTe on large-area Si substrates is an enabling technology leading to the production of low-cost, large-format infrared focal plane arrays (FPAs). This approach will allow HgCdTe FPA technology to be scaled beyond the limitations of bulk CdZnTe substrates. We have already achieved excellent mid-wavelength infrared (MWIR) and short wavelength infrared (SWIR) detector and FPA results using HgCdTe grown on 4-in. Si substrates using molecular beam epitaxy (MBE), and this work was focused on extending these results into the long wavelength infrared (LWIR) spectral regime. A series of nine p-on-n LWIR HgCdTe double-layer heterojunction (DLHJ) detector structures were grown on 4-in. Si substrates. The HgCdTe composition uniformity was very good over the entire 4-in. wafer with a typical maximum nonuniformity of 2.2% at the very edge of the wafer; run-to-run composition reproducibility, realized with real-time feedback control using spectroscopic ellipsometry, was also very good. Both secondary ion mass spectrometry (SIMS) and Hall-effect measurements showed well-behaved doping and majority carrier properties, respectively. Preliminary detector results were promising for this initial work and good broad-band spectral response was demonstrated; 61% quantum efficiency was measured, which is very good compared to a maximum allowed value of 70% for a non-antireflection-coated Si surface. The R₀A products for HgCdTe/Si detectors in the 9.6-μm and 12-μm cutoff range were at least one order of magnitude below typical results for detectors fabricated on bulk CdZnTe substrates. This lower performance was attributed to an elevated dislocation density, which is in the mid-10⁶ cm⁻² range. The dislocation density in HgCdTe/Si needs to be reduced to <10⁶ cm⁻² to make high-performance LWIR detectors, and multiple approaches are being tried across the infrared community to achieve this result because the technological payoff is significant.     

Improvements of MCT MBE Growth on GaAs

In recent years, continuous progress has been published in the development of HgCdTe (MCT) infrared (IR) focal plane arrays (FPAs) fabricated by molecular beam epitaxy on GaAs substrates. In this publication, further characterization of the state-of-the art 1280 × 1024 pixel, 15-μm pitch detector fabricated from this material in both the mid-wavelength (MWIR) and long-wavelength (LWIR) IR region will be presented. For MWIR FPAs, the percentage of defective pixel remains below 0.5% up to an operating temperature (T _OP) of around 100 K. For the LWIR FPA, an operability of 99.25% was achieved for a T _OP of 76 K. Additionally, the beneficial effect of the inclusion of MCT layers with a graded composition region was investigated and demonstrated on current–voltage (IV) characteristics on test diodes in a MWIR FPA.     

Physical structure of molecular-beam epitaxy growth defects in HgCdTe and their impact on two-color detector performance

The flexible nature of molecular-beam epitaxy (MBE) growth is beneficial for HgCdTe infrared-detector design and allows for tailored growths at lower costs and larger focal-plane array (FPA) formats. Control of growth dynamics gives the MBE process a distinct advantage in the production of multicolor devices, although opportunities for device improvement still exist. Growth defects can inhibit pixel performance and reduce the operability in FPAs, so it is important to understand and evaluate their properties and impact on detector performance. The object of this paper is to understand and correlate the effects of macrodefects on two-color detector performance. We observed the location of single-crystal and polycrystalline regions on planar and cross-sectioned surfaces of two-color device structures when void defects were viewed by scanning electron microscopy (SEM). Compositional analysis via energy dispersive x-ray analysis (EDXA) of voids in the cross section showed elevated Te and reduced Hg when compared to defect-free growth areas. The second portion of this study examined the correlation of macrodefects with pixel operability and diode current-voltage (I–V) characteristics in mid-wavelength infrared (MWIR)/MWIR (M/M) and long wavelength infrared (LWIR)/LWIR (L/L) two-color devices. The probability of diode failure when a void is present is 98% for M/M and 100% for L/L. Voids in two-color detectors also impact diodes neighboring their location; the impact is higher for L/L detectors than M/M detectors. All void-containing diodes showed early breakdown in the I–V characteristics in one or both bands. High dislocation densities were observed surrounding voids; the high density spread further from the void for L/L detectors compared to M/M detectors.     

Molecular beam epitaxy growth of HgCdTe on Ge for third-generation infrared detectors

The Leti-Lir has studied II–VI compounds for infrared (IR) detection for more than 20 years. The need to reduce the production cost of IR focal plane arrays (FPAs) sparked the development of heteroepitaxy on large-area substrates. Germanium has been chosen as the heterosubstrate for the third generation of IR detectors. First, we report on the progress achieved in HgCdTe growth on 3-in. and 4-in. (211)B CdTe/Ge. Then, we discuss the choice of a new machine for larger size and better homogeneity. Finally, we present the latest results on third-generation IR multicolor and megapixel devices. First-time results regarding a middle wavelength infrared (MWIR) dual-band FPA, with a reduced pitch of 25 μm, and a MWIR 1,280×1,024 FPA will be shown. Both detectors are based on molecular beam epitaxy (MBE)-grown HgCdTe on Ge. The results shown validate the choice of Ge as the substrate for third-generation detectors.     

HgCdTe Growth on 6 cm × 6 cm CdZnTe Substrates for Large-Format Dual-Band Infrared Focal-Plane Arrays

This paper describes molecular-beam epitaxy growth of mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) dual-band device structures on large-area (6 cm × 6 cm) CdZnTe substrates. Wafer-level composition and defect mapping techniques were used to investigate the limiting mechanisms in improving the cutoff wavelength (λ _c) uniformity and reducing the defect density. Structural quality of epitaxial layers was monitored using etch pit density (EPD) measurements at various depths in the epitaxial layers. Finally, 640 × 480, 20-μm-pixel-pitch dual-band focal-plane arrays (FPAs) were fabricated to demonstrate the overall maturity of growth and fabrication processes of epitaxial layers. The MWIR/LWIR dual-band layers, at optimized growth conditions, show a λ _c variation of ±0.15 μm across a 6 cm × 6 cm CdZnTe substrate, a uniform low macrodefect density with an average of 1000 cm⁻², and an average EPD of 1.5 × 10⁵ cm⁻². FPAs fabricated using these layers show band 1 (MWIR) noise equivalent temperature difference (NETD) operability of 99.94% and band 2 (LWIR) NETD operability of 99.2%, which are among the highest reported to date.