Effect of the extrusion conditions on microstructure evolution of the extruded Al–Mg–Si–Cu alloy rods

Hot extrusion experiment was conducted using an Al–Mg–Si–Cu alloy and the effect of the extrusion conditions on microstructure and texture changes through the radial direction was investigated by using SEM/EBSP analysis method. In the surface layer where severe frictional shear deformation is predominant, the recrystallized 1 1 0//ED grains surrounded by high angle grain boundaries are formed in spite of the existence of some peripheral overcoarse grains. Strong 1 0 0//ED and 1 1 1//ED fiber textures evolve in the center where axisymmetric deformation along the extrusion direction is intensive. As the extrusion ratio increases, number of 1 1 1//ED grains remarkably decreases while the number of 1 0 0//ED grains apparently increases. It is also found that the 1 0 0//ED grains surrounded by low angle grain boundaries form orientation colonies in the center of the extruded rods.     

Dependencies of grain refinement on processing route and die angle in equal channel angular extrusion of bcc materials

The efficiency of grain refinement in equal channel angular extrusion of body-centered cubic (bcc) materials is investigated based on slip activities from crystal plasticity simulations, which account for both the macroscopic and crystallographic features of deformation. It is shown that the characteristics of slip activities, especially the relative contributions of slip systems newly activated or reversed at the transitions between successive passes, vary significantly with the processing routes (A, B and C) and die angles ( = 90° and 120°). The simulations assuming {1 1 0}111 slip suggest that routes B and A lead to the most significant contributions of newly activated slip systems and hence are most efficient for grain refinement with  = 90° and 120°, respectively. Further incorporation of {1 1 2}111 slip systems leads to the highest efficiency by route B for both die angles. These predictions are in partial agreement with experimental observations in the literature. Comparison of these results with those of face-centered cubic materials reveals the relevance of crystal structure and deformation mechanism during grain refinement.     

Grain-boundary structure of oxygen-free high-conductivity (OFHC) copper subjected to severe plastic deformation and annealing

The influence of grain-boundary structure on grain growth in copper subjected to severe plastic deformation has been studied using orientation imaging microscopy. The investigation was carried out on oxygen-free high-conductivity (OFHC) copper which was wire drawn to a true strain of about 4 and processed by equal-channel angular extrusion (ECAE) to 4 and 8 passes via “route B_c” (where the billet is rotated by 90° in the same direction between consecutive passes). The grain-boundary character distribution (GBCD) of the as-drawn wire was similar to that of ECAE-processed specimens, and both materials possessed a higher fraction of high-angle grain boundaries (HAGBs) than special coincidence-site lattice (CSL) boundaries. While the high fraction of HAGBs was retained in the annealed wires, they were transformed to CSL boundaries in the annealed ECAE-processed materials. In spite of an initially smaller grain size, when annealed at 750 °C for 1 h, the grain size of the 4-pass ECAE-processed material was larger than that of the wire drawn to a similar strain. This difference was attributed to a high density of high-mobility 35–50° 0 0 1 boundaries in the 4-pass ECAE materials. On the other hand, the presence of 50–60° 1 1 1  pinning boundaries in the annealed 8-pass material accounted for the smaller grain size after recrystallization.     

Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals

Fatigue tests were performed on pure copper polycrystals with a crystallographic texture different from that produced by ‘standard’ thermomechanical treatments, which emphasize multi-slip 111–100 textures. The texture along the loading axis deviated by 10–15° from these two poles for the samples used here. The experiments were initiated by ramp loading as a mechanical pretreatment and the cyclic stress–strain curve (CSSC) was established by step tests using enough cycles at each step to insure saturation. Under these conditions, a plateau was observed in the CSSC at an appropriate stress level and in a reproducible fashion.     

Experiments and simulations of directionally annealed ODS MA 754

Both directional and isothermal annealing experiments have been performed on the hot-rolled ODS nickel-based superalloy MA 754. Directional annealing of MA 754 produced an elongated, coarse grain structure with a {1 1 0}1 0 0 texture for all hot-zone velocities examined, with the grain aspect ratio and twin boundary density decreasing with increasing hot-zone velocity. Isothermal annealing also produced elongated structures, but with larger grain aspect ratios and a stronger {1 1 0}1 0 0 texture. In order to elucidate the results of the experimental studies, a front-tracking computer-based model [H.J. Frost, C.V. Thompson, C.L. Howe, J.H. Whang, Scripta Metall. 22 (1988) 65–70] was modified to simulate the directional/isothermal annealing processes for materials with particles. Simulations of directional annealing with particles aligned in the direction of hot-zone movement could produce (at the appropriate hot-zone velocities) columnar grain structures with some finer grains clustered around the particles. Contrary to experimental observations, simulations of isothermal annealing in similar particle-containing material did not produce columnar grain structures, but equi-axed grains whose size was defined by the spacing between the lines of particles. Thus, the simulation results suggest that it is the texture, and not the particles, of the hot-rolled MA 754 that leads to a columnar grain structure.     

Grain boundary plane distributions and single-step versus multiple-step grain boundary engineering

The ‘five-parameter’ (i.e. both misorientation and grain boundary plane) distribution in type 304 austenitic stainless steel has been measured and evaluated for an ‘as-received’ (AR) specimen and specimens undergoing both single-step grain boundary engineering processing (SSGBE) and multiple-step grain boundary engineering processing (MSGBE) comprising three iterations. The results showed that the fundamental requirement for twinning-related GBE is to maximise concomitantly the proportion of both Σ3 and Σ9 boundaries, which in turn supports the development of special planes in the grain boundary network. 1 1 0 and 1 1 1 tilt and twist boundaries play a key role in the formation of ‘special’ grain boundary planes. MSGBE added increased proportions of Σ3 boundaries and resulted in development of different characteristics in the planes distribution compared to SSGBE. These modifications are likely to result in improved grain boundary properties after MSGBE compared to SSGBE.     

Length scale effects on recrystallization and texture evolution in Cu layers of a roll-bonded Cu–Nb composite

Recrystallization textures were investigated in thin layers of both pure Cu and alloyed Cu combined with Nb in roll-bonded composites. Texture analysis using X-ray revealed that Cube orientation was the dominant texture component after recrystallization in rolled monolithic pure Cu whereas {2 1 5} 2 1 1 and B/S were the dominant components for the recrystallized alloyed Cu. In the composites, however, the rolling texture is retained during annealing in both the pure Cu and the alloyed Cu layers when the layer thickness enters the sub-micron regime. This is attributed to the nucleation and growth of recrystallizing grains being impeded via a reduction in recrystallization driving pressure and the grain boundary movement and growth being limited due to the layer thickness effect. A new term—“confined recrystallization” was also introduced to describe more accurately the morphological evolution observed within the sub-micron thick layers after annealing and highlights the contrast to either simple recovery or continuous recrystallization.     

Electrical characterization of CMOS transistors subject to externally applied mechanical stress

Hole and electron mobilities in CMOS structures are significantly influenced by a mechanical strain state. In the present work a new experimental device has been designed, able to apply a uniaxial in-plane strain along different crystallographic orientations. A hole mobility enhancement of +10% and an electron mobility decrease of −5% have been demonstrated with the application of a 0.05% compressive 1 1 0 strain; a hole mobility enhancement of +2% and an electron mobility decrease of −3% have been induced into the material with the application of a 0.05% compressive 1 0 0 strain.     

Molecular dynamics simulations on nanoindentation mechanisms of multilayered films

Molecular dynamics (MD) simulations were carried out to study the effects of indention deformation, contact, and adhesion on Al, Ni, and Al/Ni multilayered films. The results show that when the indention depth of the sample increased, the maximum load, plastic energy, and adhesion increased. Jump-contact behavior was observed at the beginning of the loading process. Force relaxation and adhesion took place at the holding depth and during the unloading process, respectively. The glide bands of the interface were on the {1 1 1} 1 1 0 slip systems and the maximum width of the glide bands was about 1 nm. The mechanical responses of the indented films are also discussed.     

Mechanism of nucleation and growth of cubic boron nitride thin films

The mechanism and the crystallography of the nucleation and growth of cubic boron nitride (c-BN) films deposited on 100-oriented silicon substrate by RF bias sputtering have been studied by means of cross-sectional high-resolution transmission electron microscopy and X-ray photoelectron spectroscopy. Both methods provide experimental information showing no sp²-bonded BN layer formation in the subsurface region of c-BN phase. This is clear evidence for layer-by-layer homoepitaxial growth of cubic boron nitride without graphitic monolayers in the near-surface region of the film. The turbostratic boron nitride (t-BN) consists of thin sub-layers, 0.5–2 nm thick, growing in such a way that a sub-layer normal is almost parallel to the growth direction. t-BN also comprises a large volume fraction of the grain boundaries with high interface energies. The present result and the finding by Shtansky et al. [Acta Mater. 48, 3745 (2000)], who showed that an individual sub-layer consists of parallel lamellae in both the hexagonal (h-BN) and rhombohedral (r-BN) configurations, demonstrate that high intrinsic stress in the films is due to the complex structure of sp²-bonded BN. The crystallography of c-BN films indicates heteroepitaxial nucleation of cubic phase on the graphitic BN structural precursor. The present results are consistent with stress-induced c-BN formation.     

Effect of orientational order of tris(8-hydroxyquinolinato)aluminum(III) on electroabsorption

The electroabsorption (EA) spectrum was analyzed in terms of the orientational order of tris(8-hydroxyquinolinato)aluminum(III) (Alq₃) molecules, where the orientational order parameter P_n(cosθ) (θ: the tilt angle of molecule; P_n: nth Legendre polynomial; : thermodynamic average) was used to quantify the anisotropic orientational order of Alq₃. It was shown that the EA intensity is a function of S₁ and S₂ at the modulation frequency ω, whilst it is a function of S₂ at the second-harmonic frequency 2ω. The EA spectrum for the vacuum deposited Alq₃ was obtained from the optical transmittance measurement. The results suggested that the spontaneous polarization of Alq₃ is generated in the evaporated films.     

Dynamic recrystallization during high temperature deformation of magnesium

As a consequence of the high critical stresses required for the activation of non-basal slip systems, dynamic recrystallization plays a vital role in the deformation of magnesium, particularly at a deformation temperature of 200 °C, where a transition from brittle to ductile behavior is observed. Uniaxial compression tests were performed on an extruded commercial magnesium alloy AZ31 at different temperatures and strain rates to examine the influence of deformation conditions on the dynamic recrystallization (DRX) behavior and texture evolution. Furthermore, the role of the starting texture in the development of the final DRX grain size was investigated. The recrystallized grain size, measured at large strains (  −1.4) seemed to be more dependent on the deformation conditions than on the starting texture. In contrast to pure magnesium, AZ31 does not undergo grain growth at elevated deformation temperatures, i.e. 400 °C, even at a low strain rate of 10⁻⁴ s⁻¹. Certain deformation conditions gave rise to a desired fully recrystallized microstructure with an average grain size of 18 μm and an almost random crystallographic texture. For samples deformed at 200 °C/10⁻² s⁻¹, optical microscopy revealed DRX inside of deformation twins, which was further investigated by EBSD.     

Effect of strain rate on the tensile behavior of a single crystal nickel-base superalloy

The effect of various strain rates on the tensile behavior of a single crystal nickel-base superalloy was studied. Single crystals with 0 0 1 crystal orientation were tested at 800 and 1000 °C under three kinds of strain rate of 10⁻³, 10⁻⁴ and 6 × 10⁻⁵ s⁻¹. The yield strength increased with the increase of strain rate, while the configuration of the stress–strain curves was independent of strain rate. Additionally, fracture surface was related to strain rate at two temperatures. At 800 °C the amount of cleavage surface was different at three strain rates, which resulted from the difference of activated slip systems. The elongation increased with the decrease of strain rate, which was influenced by the heterogeneous ductile deformation. At 1000 °C the difference of fracture surface was attributed to the microvoid at higher strain rate, while the γ/γ′ interfaces also played an important role at lower strain rate; elongation rate was independent of strain rate.     

Microstructure and mechanical properties of nanocrystalline high strength Al–Mg–Si (AA6061) alloy by high energy ball milling and spark plasma sintering

In the present paper, the microstructure and mechanical properties of nanostructured Al–Mg–Si based AA6061 alloy obtained by high energy ball milling and spark plasma sintering were reported. Gas atomized microcrystalline powder of AA6061 alloy was ball milled under wet condition at room temperature to obtain nanocrystalline powder with grain size of 30 nm. The nanocrystalline powder was consolidated to fully dense compacts by spark plasma sintering (SPS) at 500 °C. The grain size after SPS consolidation was found to be 85 nm. The resultant SPS compacts exhibited microhardness of 190–200 HV_100 g, compressive strength of 800 MPa and strain to fracture of 15%.     

Solid phase epitaxy on N-type polysilicon films formed by aluminium induced crystallization of amorphous silicon

In this work, undoped amorphous silicon layers were deposited on n-type AIC seed films and then annealed at different temperatures for epitaxial growth. The epitaxy was carried out using halogen lamps (rapid thermal process or RTP) or a tube conventional furnace (CTP). We investigated the morphology of the resulting 2 µm thick epi-layers by means of optical microscopy. An average grain size of about 40 µm is formed after 90 s annealing at 1000 °C in RTP. The stress and degree of crystallinity of the epi-layers were studied by micro-Raman Spectroscopy and UV–visible spectrometer as a function of annealing time. The presence of compressive stress is observed from the peak position which shifts from 520.0 cm^− 1 to 521.0 cm^− 1 and 522.3 cm^− 1 after CTP annealing for 10 min and 90 min, respectively. It is shown that the full width at half maximum (FWHM) varies from 9.8 cm^− 1 to 15.6 cm^− 1, and the magnitude of stress is changing from 325 MPa to 650 MPa. Finally, the highest crystallinity is achieved after annealing at 1000 °C for 90 min in a tube furnace exhibiting a crystalline fraction of 81.5%. X-ray diffraction technique was used to determine the preferential orientation of the poly-Si thin films formed by SPE technique on n⁺ type AIC layer. The preferential orientation is 100 for all annealing times at 1000 °C.     

Influence of additives on the impact toughness of Al–10.8% Si near-eutectic cast alloys

This article investigates the effects of melt treatment and addition of alloying elements on the impact toughness of as-cast and heat-treated Al–10.8% Si near-eutectic alloys. Increasingly precise impact behaviors are discussed in the context of differentiating between initiation and propagation energies, including the ductility index, which is the ratio of the propagation to initiation energies; total energy as a useful measure is also discussed. Details concerning the evaluation of tensile properties are reported in a separate article [Mohamed AMA, Samuel FH, Samuel AM, Doty HW. Influence of additives on the microstructure and tensile properties of near-eutectic Al–10.8%Si cast alloy. Mater Des, in press]. The concentration of elements in the alloys was changed to the following range: Fe 0.5–1 wt%, Mn 0.5–1 wt%, Cu 2.25–3.25 wt%, and Mg 0.3–0.5 wt%, while the impact toughness upon artificial aging in a temperature range of 155–240 °C for 5 h was also investigated. The results indicate that the morphology of fibrous Si in Sr-modified alloys enhances toughness because of its profound effect on crack initiation and crack propagation resistance. The combined addition of modifier and grain refiner leads to a 33% increase in the impact strength compared to the untreated alloy. In alloys containing high levels of iron, such as the RF2 (1% Fe, 1% Mn) and RF4 (1% Fe, 0.5% Mn) alloys, the addition of iron leads to an increased precipitation of sludge or β-Fe platelets, respectively; these particles also act as crack initiation sites and reduce the impact properties noticeably. In alloys already containing high levels of copper, such as the RC2 (3.25% Cu, 0.3% Mg) and RC5(0.3.25% Cu, 0.5% Mg) alloys, increasing the copper level lowers the impact properties significantly, in view of the fact that the fracture behavior is now predominantly influenced by the Al₂Cu phase rather than by the Si particles. The average crack propagation speed of impact-tested samples shows a good inverse relationship to impact energy. Crack propagation speed can thus provide a qualitative estimation of the impact energy expected for special alloy conditions.     

Joining of CBN abrasive grains to medium carbon steel with AgCu/Ti powder mixture as active brazing alloy

In order to develop new generation brazed CBN grinding wheels, the joining experiments of CBN abrasive grains and medium carbon steel using the powder mixture of AgCu alloy and pure Ti as active brazing alloy are carried out at elevated temperature under high vacuum condition. The relevant characteristics of the special powder mixture, the microstructure of the interfacial region, which are both the key factors for determining the joining behavior among the CBN grains, the filler layer and the steel substrate, are investigated extensively by means of differential thermal analysis (DTA), scanning electron microscope (SEM) and energy dispersion spectrometer (EDS), as well X-ray diffraction (XRD) analysis. The results show that, similar to AgCuTi filler alloy, AgCu/Ti powder mixture exhibits good soakage capability to CBN grains during brazing. Moreover, Ti in the powder mixture concentrates preferentially on the surface of the grains to form a layer of needlelike TiN and TiB compounds by chemical metallurgic interaction between Ti, N and B at high temperature. Additionally, based on the experimental results, the brazing and joining mechanism is deeply discussed in a view of thermodynamic criterion and phase diagram of TiBN ternary system.     

The cathode strip chamber data acquisition electronics for CMS

Data Acquisition (DAQ) electronics for Cathode Strip Chambers (CSC) [CMS Collaboration, The Muon Project Technical Design Report, CERN/LHCC 97-32, CMS TDR3, 1997] in the Compact Muon Solenoid (CMS) [CMS Collaboration, The Compact Muon Solenoid Technical Proposal, CERN/LHCC 94-38, 1994] experiment at the Large Hadron Collider (LHC) [The LHC study group, The Large Hadron Collider: Conceptual Design, CERN/AC 1995-05, 1995] is described. The CSC DAQ system [B. Bylsma, et al., in: Proceedings of the Topical Workshop on Electronics for Particle Physics, Prague, Czech Republic, CERN-2007-007, 2007, pp. 195–198] includes on-detector and off-detector electronics, encompassing five different types of custom circuit boards designed to handle the high event rate at the LHC. The on-detector electronics includes Cathode Front End Boards (CFEB) [R. Breedon, et al., Nucl. Instr. and Meth. A 471 (2001) 340], which amplify, shape, store, and digitize chamber cathode signals; Anode Front End Boards (AFEB) [T. Ferguson, et al., Nucl. Instr. and Meth. A 539 (2005) 386], which amplify, shape and discriminate chamber anode signals; and Data Acquisition Motherboards (DAQMB), which controls the on-chamber electronics and the readout of the chamber. The off-detector electronics, located in the underground service cavern, includes Detector Dependent Unit (DDU) boards, which perform real time data error checking, electronics reset requests and data concentration; and Data Concentrator Card (DCC) boards, which further compact the data and send it to the CMS DAQ System [CMS Collaboration, The TriDAS Project Technical Design Report, Volume 2: Data Acquisition and High-level Trigger, CERN/LHCC 2002-26, 2002], and serve as an interface to the CMS Trigger Timing Control (TTC) [TTC system http://ttc.web.cern.ch/TTC/intro.html] system.Application Specific Integrated Circuits (ASIC) are utilized for analogous signal processing on front end boards. Field Programmable Gate Arrays (FPGA) are utilized on all boards in the system to provide programmability. The DAQ system has been installed and commissioned, and is ready for LHC data taking.     

Preparation of multilayered nanocrystalline thin films with composition-modulated interfaces

The properties of multilayer thin film structures depend on the morphology and structure of interfaces. A broad interface, in which the composition is varying, can enhance, e.g., the hardness of multilayer thin films. In the present experiments multilayers of TiAlN and CrN as well as TiAlN, CrN and MoS₂ were studied by using unbalanced magnetron sputter sources. The sputter sources were arranged side by side on an arc. This arrangement permits development of a transition zone between the layers, where the composition changes continuously. The multilayer system was deposited by one-fold oscillating movement of substrates in front of sputter sources. Thicknesses of layers could be changed both by oscillation frequency and by the power applied to sputter sources. Ti/Al: 50/50 at%, pure chromium and MoS₂ targets were used in the sputter sources. The depositions were performed in an Ar–N₂ mixture at 0.22 Pa working pressure. The sputtering power of the TiAl source was feed-back adjusted in fuzzy-logic mode in order to avoid fluctuation of the TiAl target sputter rate due to poisoning of the target surface. Structure characterization of films deposited on 1 0 0 Si wafers covered by thermally grown SiO₂ was performed by cross-sectional transmission electron microscopy. At first a 100 nm thick Cr base layer was deposited on the substrate to improve adhesion, which was followed by a CrN transition layer. The CrN transition layer was followed by a 100 nm thick TiAlN/CrN multilayer system. The TiAlN/CrN/MoS₂ multilayer system was deposited on the surface of this underlayer system. The underlayer systems Cr, CrN and TiAlN/CrN were crystalline with columnar structure according to the morphology of zone T of the structure zone models. The column boundaries contained segregated phases showing up in the under-focused TEM images. The surface of the underlayer system was wavy due to dome-shaped columns. The nanometer-scaled TiAlN/CrN/MoS₂ multilayer system followed this waviness. Crystallinity of the TiAlN and CrN layers in the multilayer system decreases with increasing thickness of the MoS₂ layer.     

Low cycle fatigue mechanism of René 80 at high temperature–high strain

The low cycle fatigue René 80, a Ni-base superalloy, was studied at temperature of 871 °C, R = (_min/_max) = 0 and strain rate of about 2 × 10⁻³ s⁻¹. The dislocation structure and failure surface observations were evaluated through TEM and SEM. TEM studies showed that at Δ_t = 0.8% during the first cycle the dislocations formed a hexagonal network in the γ-phase matrix. When the number of cycles increased, the density of dislocations increased as well. At N = N_f and Δ_t = 0.8% the cutting of γ′ precipitates took place. SEM studies at Δ_t = 0.8% and N = N_f showed that fatigue crack initiation generally occurred at the surface, where it is depleted of the γ′ phase as a result of oxidation by the high-temperature exposure. In addition to depleted zones, the grain boundary oxidation and oxide spikes were also considered as further crack initiation sites.