Cu／Mo／Cu爆炸复合界面组织特征

用爆炸复合的方法,试制出了Cu/Mo/Cu板材。用光学显微镜和扫描电镜研究了其界面组织特征;并利用显微硬度考察了界面附近硬度及界面附近的形变特点。结果表明：Cu/Mo/Cu复合材具有波形结合面和平直结合面;波形界面存在熔区,其熔区的显微硬度高于Cu基体而低于Mo基体。     

Cu/Mo/Cu复合板界面变形及厚度配比

采用热轧+温轧方法制备Cu/Mo/Cu复合板,研究轧制工艺对复合板结合界面及组元厚度配比的影响。结果表明：经过轧制变形后,铜钼界面实现紧密结合且结合机制为齿状啮合,铜层外表面和靠近界面层的晶粒比中部细小;随着变形量的增加,铜层等轴状晶粒沿轧制方向被拉伸,界面结合效果明显改善,且由齿状变得较为平直。分析组元厚度配比,铜层变形量较钼层的大,随着总压下量的增加,组元压下率的差值减小,变形量逐渐趋于一致;首次提出了Cu/Mo/Cu三层复合板厚度配比的关系,为实际选择原料提供依据     

电子封装用Cu/Mo/Cu复合材料的工艺研究

研究了浸涂助复剂（铝基合金）和室温轧制工艺对Cu／Mo／Cu复合界面结合强度的影响，简述了Cu／Mo／Cu复合板室温轧制成形工艺过程，详细分析了表面和界面清理、初道次轧制临界变形率及热处理工艺等因素对复合板结合强度的影响。实验结果得出，钼板浸涂Al—Mn—Zn—Sn合金助复剂后的热处理温度为800～850℃；初道次轧制变形率为45％最佳；复合轧制后合适的退火工艺为450℃，保温60min。     

Cu/Al层厚比对波纹辊轧制Cu/Al复合板变形行为和结合性能的影响

本工作通过抗剪切强度测试、剪切断面显微观察和有限元仿真等手段对不同Cu/Al层厚比下波纹辊轧制（CRB）Cu/Al复合板的金属的变形行为和界面结合性能进行了研究。结果发现，CRB过程中界面处形成了局部强正应力和多个“搓轧区”，促进了复合板的塑性变形和界面结合。增大Cu/Al层厚比可提升Cu层的变形率和波谷界面处的正应力，有利于降低Cu/Al复合板的翘曲程度，并增强界面的整体结合性能。当层厚比从2:10增加到2:4时，界面抗剪切强度从40.39MPa上升到47.24 MPa，但界面抗剪切强度的波动逐渐增大。     

冷轧制备AlSn20Cu/钢多层板的微观组织和力学性能（英文）

通过室温冷轧制备出了1060Al/AlSn20Cu/1060Al/钢多层复合板材,并探索了轧制压下量对复合板微观组织和力学性能的影响。利用扫描电子显微镜和电子背散射衍射（EBSD）对复合板微观组织进行表征,通过拉伸试验测量了复合板力学性能。复合板的初始轧制压下量为17%,最小稳定压下量为40%。结果表明,随着轧制压下量的增加,铝合金层中锡相和钢中组织沿轧制方向被拉长,但是纯铝层呈现出等轴晶。随着轧制压下量的增大,复合板抗拉伸强度和界面结合强度增加,而延伸率下降。AlSn20Cu合金层的断裂主要跟其中的锡相有关。     

Interface characterization of Al/Cu 2-ply composites under various loading conditions

The effects of reduction ratio during roll bonding on the microstructural evolution at interface and subsequent mechanical properties of roll-bonded Al/Cu 2-ply sheets were investigated. The interface microstructures for several Al/Cu 2-ply sheets fabricated under different reduction ratios between 30% and 65% were verified by transmission electron microscopy (TEM). Taking the difference of interface microstructure into consideration, 3-point bending and peel tests were performed for obtaining flexural and bonding strengths for Al/Cu 2-ply sheets. The effect of the quantified areas of metallurgical bonding at interfaces on the bonding strength was also discussed. The results show that both the bonding and flexural strengths for Al/Cu 2-ply sheets are reduced by decreasing the reduction ratio during the roll bonding process, which is strongly correlated with the interface microstructure. This was especially verified by observing the interface delamination from the 3-point bent samples.     

Cu/WCu/Cu复合薄板的组织和性能研究

为减少传统工艺制备的钨/铜薄板在压力加工过程中产生过多缺陷,提高板材的力学和电学性能,设计了一种新型的具有Cu/WCu/Cu三明治结构的超薄板,对比分析了两种结构板材在轧制过程中组织和性能的变化。结果表明:与传统结构试样相比,三明治结构试样表面覆铜层能够完成对基体表层钨颗粒的包覆和孔隙的填充,进而实现表面改性;三明治结构试样在轧制过程中产生缺陷相对较少,加工硬化不明显,抗拉强度和导电性能也优于传统试样。     

高导热金刚石/铜复合材料的导热研究进展

金刚石/铜复合材料具有密度低、热导率高及热膨胀系数可调等优点,且与新一代芯片具有良好的热匹配性能,因此其在高热流密度电子封装领域具有非常广泛的应用前景。然而由于金刚石与铜界面润湿性差,界面热阻高,导致材料热导率比铜还低,限制了其应用。为了改善其界面润湿性,国内外通过在金刚石表面金属化或对铜基体预合金化等手段来修饰复合材料界面,以提高金刚石/铜复合材料的热导率。本文综述了表面改性、导热模型相关的界面理论以及有限元模拟的研究进展,讨论了制备工艺、导热模型和未来发展的关键方向,总结了金刚石添加量、颗粒尺寸等制备参数对其微观组织结构和导热性能的影响规律。     

Cu／FeNi系复合材料的热膨胀性能

在实验的基础上研究了低膨胀高导热Ｃｕ／ＦｅＮｉ粉末冶金复合材料膨胀性能的影响因素。实验表明，随着Ｃｕ含量增加、烧结温度升高、轧制率减小，材料的膨胀系数增加；而ＦｅＮｉ粒度对材料膨胀系数的影响较复杂。这是由ＦｅＮｉ和Ｃｕ之间的相互配比、相互扩散、ＦｅＮｉ合金的特别性质以及ＦｅＮｉ、Ｃｕ在复合材料中的分布状态共同决定的。     

Ag/Cu钎焊复合带材轧制和退火研究

利用Ag-28Cu合金钎焊复合制备Ag/Cu复合材料,经轧制加工成复合带材。研究轧制变形和扩散退火对复合界面形貌、界面组织和性能的影响,以及界面元素扩散特征。结果表明,随着轧制变形量增加,Cu、Ag-28Cu和Ag发生协调变形,复合界面由波浪形,转变成锯齿状,最后Cu层整体向Ag层倾斜。随着加工率增加,Cu层硬度逐渐降低,Ag-28Cu层硬度显著升高,Ag层硬度不变。随着退火温度增加,界面组织逐渐长大粗化,复合层宽度增加。界面原子扩散行为主要是Cu原子向Ag中发生扩散,退火温度增加时,Ag-28Cu层中Cu原子向Ag侧逐渐减少,Ag层中的Cu原子含量增加,Cu和Ag层硬度没有发生变化,而Ag-28Cu层硬度逐渐降低。     

具有金刚石/铜中间层W-RAFM模块的制备与评价

为了缓解钨-低活化钢(W-RAFM)直接连接产生的热应力,加入热膨胀系数介于二者之间的高导热金刚石/铜复合材料作为中间层,并在金刚石/铜两侧辅以Cu Cr Zr箔,达到较高的连接强度。利用超高压力通电短时高效的特点,一次性制备出有金刚石/铜层的W-RAFM模块。ANSYS Workbench的热冲击数值模拟显示,模块可承受1~2 MW/m2的稳态热流冲击。     

Bonding strength of Invar/Cu clad strips fabricated by twin-roll casting process

Based on traditional twin-roll casting process, Invar/Cu clad strips were successfully fabricated by using solid Invar alloy strip and molten Cu under conditions of high temperature, high pressure and plastic deformation. A series of tests including tensile test, bending test, T-type peeling test and scanning electron microscope (SEM) and energy dispersive spectrometer (EDS) measurements were carried out to analyze the mechanical properties of Invar/Cu clad strips and the micro-morphology of tensile fracture surfaces and bonding interfaces. The results indicate that no delamination phenomenon occurs during the compatible deformation of Invar/Cu in bending test and only one stress platform exists in the tensile stress?strain curve when the bonding strength is large. On the contrary, different mechanical properties of Invar and Cu lead to delamination phenomenon during the uniaxial tensile test, which determines that two stress platforms occur on the stress?strain curve of Invar/Cu clad strips when two elements experience necking. The average peeling strength can be increased from 13.85 to 42.31 N/mm after heat treatment at 800 °C for 1 h, and the observation of the Cu side at peeling interface shows that more Fe is adhered on the Cu side after the heat treatment. All above illustrate that heat treatment can improve the strength of the bonding interface of Invar/Cu clad strips.     

Sn-3.5Ag-0.5Cu/Cu界面的显微结构

研究了热-剪切循环条件下Sn-3．5Ag-0．5Cu钎料／Cu界面的显微结构，分析了界面金属间化合物的生长行为，并与恒温时效后的Sn-3．5Ag-0．5Cu／Cu界面进行了对比。结果表明：恒温时效至100h，Sn-3．5Ag-0．5Cu／Cu界面上已形成Cu6Sn5和Cu3Sn两层金属间化合物；而热-剪切循环至720周Sn-3．5Ag-0．5Cu／Cu界面上只存在Cu6Sn5金属间化合物层，无Cu3Sn层生成，在界面近域的钎料内，颗粒状的Ag3Sn聚集长大成块状；在热-剪切循环和恒温时效过程中，界面金属间化合物的形态初始都为扇贝状，随着时效时间的延长逐渐趋于平缓，最终以层状形式生长。     

The Microstructure,Texture and Mechanical Properties of the Rolled Al/Mg/Al Clad Sheets

Two types of three-layered Al/Mg/Al clad sheets were fabricated by hot rolling. The first (sheet A) underwent a single pass with a small rolling reduction of 33% and the second (sheet B) underwent four passes with a large rolling reduction of 71%, and both were subsequently annealed at 200 °C for 1 h. Microstructural examination and tensile tests on the fabricated sheets revealed that 17.8-μm-thick intermetallic compound layers (IMCLs) appeared at AZ31/5052 interfaces in sheet B while none were observed in sheet A. The AZ31 layers in sheets A and B exhibited basal textures with intensities of 15.1 and 9.8, respectively, and only sheet A exhibited tensile twins (TTs) in the AZ31 layer. Recrystallization resulting in grains was preferred near the AZ31/5052 interface and the intersections between TTs. Owing to its larger rolling reduction, more extensive recrystallization was observed in the sheet B component layers than in sheet A. Sheet B exhibited better mechanical properties with a much higher ultimate tensile strength (UTS) than sheet A (230 versus 102 MPa) and a slightly larger elongation (19 versus 17%).This indicates that texture intensities and the extent of recrystallization of component layers have a significant effect upon the mechanical properties of clad sheets.     

Effects of processing parameters on the bond strength of Cu/Cu roll-bonded strips

Roll bonding, widely used in manufacturing large layered composite sheets, is a solid phase method for bonding similar or dissimilar metals by rolling. In this study, the effects of process parameters such as rolling reduction, rolling temperature, rolling speed, initial thickness of strip, and surface roughness on the bond strength between two-layer strips of Cu/Cu were investigated. The strips were subjected to chemical and mechanical cleaning prior to rolling, and after rolling, bond strengths were measured using the peeling test. It was observed that increased reduction, rolling temperature, strip width, and surface roughness led to an increase in peeling strength while increased rolling speed and initial thickness of strips caused peeling strength to decrease. Results also showed that increasing the initial thickness of strips would increase threshold deformation.     

Cu/Mo双涂层改性SiCf/Ti6Al4V复合材料的界面与性能

采用箔-纤维-箔(FFF)法分别制备无涂层、C涂层和Cu/Mo双涂层改性的SiCf/Ti6Al4V复合材料,对制备态复合材料的力学性能和界面微观组织进行对比分析,进一步研究不同真空热暴露处理对Cu/Mo双涂层改性复合材料的界面微区的影响规律。结果表明,制备态下Cu/Mo涂层比C涂层较好地改善了复合材料的界面组织和性能,且对基体和纤维中元素扩散均具有一定的阻挡作用;求得900℃下SiCf/Cu/Mo/Ti6Al4V界面反应的生长动力学公式为H=1.380t1/2+5.397。     

铜铝异步轧制复合工艺及组织性能

采用异步轧制工艺进行了铜铝薄带的复合,并对复合带进行了退火处理,利用金相显微镜、扫描电镜和拉伸试验机进行了复合带组织的观察和性能的测定.结果表明,异步轧制相比同步轧制的界面波浪状形貌明显减少,界面更加平整;在相同的压下率下,异步轧制的轧制力要小于同步轧制的轧制力,使轧制的稳定性和精度得到了提高,有益于提高界面剥离强度;异步速比与复合带界面的剥离强度呈抛物线关系,异速比为1.25界面的剥离强度最大;异步速比增加,铜/铝复合带Cu/Al厚度比增加.所得结果在铜铝薄带轧制复合领域的研究有重要意义.     

Cu/Al复合板双辊铸轧复合界面压力分布与结合特性（英文）

双辊铸轧工艺制备双金属层复合板的力学性能和产品厚度规格与结合界面相互作用力学行为密切相关。以铸轧速度为变量,建立热流耦合模拟与界面压力分布计算模型。结果表明,随着铸轧速度的降低,界面温度降低,界面压力与出口铝侧厚度占比增大。铜带减薄主要发生在后滑移区。较高的界面压力和较长的固体/半固体接触时间使结合面充分浸润,为原子扩散提供有利条件。当铸轧速度为2.4 m/min时,扩散层宽度为4.9μm,剥离后铜侧表面被铝覆盖,铝侧发生韧性断裂,有效防止界面分层及裂纹扩展。同时,高界面压力及塑性应变下的剪切作用更显著,铝侧显微组织为细长柱状晶体。因此,结合界面实现冶金结合并细化铝侧晶粒可以使复合板获得较高的结合强度和拉伸性能。     

Deformation and heat treatment ability of three-layer 6009/7050/6009 Al alloy clad slab prepared by direct-chill casting

Three-layer 6009/7050/6009 aluminum alloy clad slab was fabricated by an innovative direct-chill casting process. To study the response of the clad slab to plastic deformation and heat treatments, homogenization annealing, hot rolling, solution and aging were successively performed on the as-cast 6009/7050/6009 clad samples. The results revealed that excellent metallurgical bonding between 7050 alloy layer and 6009 alloy layer was achieved under optimal parameters. The clad ratio obviously decreased when the annealed sample was rolled to 55% hot reduction level, and then changed slightly with further rolling. Furthermore, the content of rodlike Zn-rich phases increased significantly in 7050 alloy layer in the homogenized clad samples after rolling at 55%, 65% and 75% hot reduction levels, and the higher level of hot reduction resulted in narrower diffusion layer. Subsequent solution and aging significantly improved the hardness in 7050 alloy layer, interfaces and 6009 alloy layers of the rolled samples except for the thin side for the 75% hot reduction sample.     

放电等离子烧结法和热压法制备的镀钛金刚石/铜多层复合材料的结构和热性能

采用放电等离子烧结技术(SPS)和热压法(HP)分别制备用于电子封装领域的多层镀钛金刚石/铜复合材料获得。借助扫描电子显微镜(SEM)分析了复合材料的显微组织,同时对热导率(TC)和热膨胀系数(CTE)等热性能参数进行了分析。层状复合材料的热导率理论值参考改良的哈塞尔曼-约翰逊(HJ)模型,同时考虑TiC界面的影响计算,结果为446.66 W·(m·K)~(-1),而热膨胀系数则通过热膨胀仪测试确定。结果显示,经放电等离子烧结的试样与经热压制备的试样相比,缺陷相对较少,界面的结合对于复合材料热导率的影响十分明显。提出了一个界面影响的模型示意图,热导率随着碳化物层厚度的增加和气孔的出现而减小。由此可见,实现高热导率的条件是复合材料中的碳化物层较薄、同时没有气孔的出现。