Cure kinetics of epoxy resins by differential scanning calorimetry technique

The curing reactions of epoxy resins with aliphatic amine are investigated using the differential scanning calorimetry technique with a single dynamic scan. The rate of the reaction was followed over the temperature range 30–250°C, and the activation energy and the order of the reaction are determined using four different computational methods. The activation energy for the various epoxy systems is observed in the range 40–76 kJ mol^?1 and the order of the reaction is observed to be ? 1·0.     

Kinetics of aryl phosphinate anhydride curing of epoxy resins using differential scanning calorimetry

The curing reaction of two kinds of epoxy resins, (bisphenol A epoxy DER331, and novolac epoxy DEN438) with aryl phosphinate anhydride (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide)-methyl succinic anhydride (DMSA), and benzyldimethylamine (BDMA) as the catalyst, was investigated by differential scanning calorimetry (DSC) using an isothermal approach over the temperature range 130–160°C. The experimental results showing autocatalytic behaviour were compared with the model proposed by Kamal, including two rate constants (k₁ and k₂) and two reaction orders (m and n). The model predictions are in good agreement with the experimental data and demonstrate that the autocatalytic model is capable of predicting the curing kinetics of both systems without any additional assumptions. The activation energies for the rate constants of DER331/DMSA and DEN438/DMSA are 77–92 kJmol^-1 and 83–146 kJmol^-1, respectively. The obtained overall reaction order of 2 is in agreement with the reaction mechanism reported by several workers. © 1998 SCI.     

Fourier transform IR and differential scanning calorimetry study of curing of trifunctional amino‐epoxy resin

The curing process was studied for a trifunctional epoxy resin, triglycidyl‐p‐aminophenol, using the hardener 4,4′‐diaminodiphenylsulfone. Two curing cycles were carried out: one following the manufacturer's guidelines (2 h at 80°C, 1 h at 100°C, 4 h at 150°C, and 24 h at 200°C) and another proposed in this study, in which the two stages at low temperatures were excluded. Fourier transform IR spectroscopy was used to quantify the conversion of different functional groups (primary amine, secondary amine, epoxide, hydroxyl and ether functional groups), and these conversions could be used to infer the type of reactions that took place. These results allowed us to analyze the evolution of the curing process over time and the influence of the curing cycle. Furthermore, the enthalpy of the curing process was determined using differential scanning calorimetry, and from this the thermal conversion for the whole process was evaluated. By taking into account the autocatalytic kinetic model, the rate constants were evaluated. The glass‐transition temperatures were also estimated by applying different curing cycles to the resin. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 1524–1535, 2005     

Dynamic cure kinetics of epoxy resins using an amine‐containing borate as a latent hardener

An amine‐containing borate (labeled NBD) was obtained by a one‐step esterification using neopentyl glycol, boric acid and N,N‐dimethylethanolamine (DMEA) as reactants, and nuclear magnetic resonance as well as Fourier transform infrared (FTIR) measurements were used to characterize its chemical structure. The thermally latent curing properties of NBD were confirmed by differential scanning calorimetry (DSC), FTIR and gelation time results. The cure processes of bisphenol A diglycidyl ether epoxy resins (E51) using NBD as a latent hardener in comparison with a common hardener, DMEA, were studied by DSC measurements. The Avrami and Arrhenius methods as well as the Horowitz‐Metzger method were used to calculate kinetic parameters. These methods also revealed a transition at which the cure reaction mechanism showed a marked change and provided the apparent activation energy E_a associated with the cure reaction at different reaction stages. Copyright © 2012 Society of Chemical Industry     

Differential scanning calorimetric study of curing of acrylated epoxy resin with benzoyl peroxide

The curing reaction of the acrylated diglycidyl ether of bisphenol-A (DGEBA) with benzoyl peroxide has been investigated by differential scanning calorimetry at three different heating rates. The overall cure kinetics were found to be first-order, with Arrhenius parameters E=83 kJ mol^?1 and In A = 16.5 min^?1, independent of the scan rate, up to at least 90% conversion.     

环氧电工塑料的固化反应动力学研究

以双马来酰亚胺(BMI)/二氨基二苯砜(DDS)为组合固化剂,采用非等温示差扫描量热法(DSC)研究了邻甲酚醛环氧树脂(ECN)/DDS/BMI三元体系的固化反应动力学,用Kissinger法和Crane公式进行DSC数据处理,获得了固化反应动力学参数,并建立了固化动力学模型,同时结合红外光谱分析探讨了该体系的反应机理。结果表明,ECN/DDS/BMI体系固化反应级数n=0.93;表观活化能Ea=58.2 kJ/mol,与ECN/DDS体系相差很小,BMI的加入对体系的固化工艺影响不大,ECN/DDS/BMI体系的固化动力学模型与ECN/DDS体系相似。     

Curing behavior of epoxy resins in two‐stage curing process by non‐isothermal differential scanning calorimetry kinetics method

In this research, a new thermal curing system, with two‐stage curing characteristics, has been designed. And the reaction behaviors of two different curing processes have been systematically studied. The non‐isothermal differential scanning calorimetry (DSC) test is used to discuss the curing reaction of two stages curing, and the data obtained from the curves are used to calculate the kinetic parameters. Kissinger‐Akahira‐Sunose (KAS) method is applied to determine activation energy (E_a) and investigate it as the change of conversion (α). Málek method is used to unravel the curing reaction mechanism. The results indicate that the curing behaviors of two different curing stages can be implemented successfully, and curing behavior is accorded with ?esták‐Berggren mode. The non‐isothermal DSC and Fourier transform infrared spectroscopy test results reveal that two different curing stages can be implemented successfully. Furthermore, the double x fitting method is used to determine the pre‐exponential factor (A), reaction order (m, n), and establish the kinetic equation. The fitting results between experiment curves and simulative curves prove that the kinetic equation can commendably describe the two different curing reaction processes. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40711.     

Cure kinetics of biphenyl epoxy resin system using latent catalysts

The investigation of the cure kinetics of a biphenyl epoxy–phenol resin system with different kinds of latent catalysts was performed by differential scanning calorimetry using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicated that the curing reaction of the biphenyl epoxy resin system in this experiment proceeded through an autocatalytic kinetic mechanism, irrespective of the kind of catalyst. The epoxy resin system with acid/diazabicycloundecene (DBU) salt as the latent catalyst showed a second overall reaction order; however, a third reaction order was represented for microencapsulated triphenylphosphine (TPP). The storage stability tests for these systems were performed, and a good shelf life was observed in the epoxy resin system with pyromellitic acid/DBU salt, trimellitic acid/DBU salt, and microencapsulated TPP as the latent catalyst. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2711–2720, 2001     

Kinetic analysis of curing behavior of diglycidyl ether of bisphenol A with imidazoles using differential scanning calorimetry techniques

The curing kinetics and mechanisms of diglycidyl ether of bisphenol A (DGEBA) using imidazole (H‐NI) and 1‐methyl imidazole (1‐MI) as curing agents are studied with differential scanning calorimetry (DSC) under isothermal (90–120°C) and dynamic conditions (50–250°C). The isothermal DSC thermograms of curing DGEBA with H‐NI and 1‐MI curing agents show two exothermic peaks. These peaks are assigned to the processes of adduct formation and etherification. These results indicate that there is no difference in the initiation mechanism of 1‐unsubstituted (H‐NI) and 1‐substituted (1‐MI) imidazoles in the curing reaction with epoxy resin. A kinetic analysis is performed using different kinetic models. The activation energies obtained from DSC scanning runs using the Ozawa and Kissinger methods are similar and in the range of 75–79 and 76–82 kJ/mol for DGEBA/H‐NI and DGEBA/1‐MI systems, respectively. These values compare well with the activation energies obtained from isothermal DSC experiments using the autocatalytic method (74–77 kJ/mol). © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 2634–2641, 2006     

Comparison of the curing kinetics of the RTM6 epoxy resin system using differential scanning calorimetry and a microwave‐heated calorimeter

The cure of a commercial epoxy resin system, RTM6, was investigated using a conventional differential scanning calorimeter and a microwave‐heated calorimeter. Two curing methods, dynamic and isothermal, were carried out and the degree of cure and the reaction rates were compared. Several kinetics models ranging from a simple nth order model to more complicated models comprising nth order and autocatalytic kinetics models were used to describe the curing processes. The results showed that the resin cured isothermally showed similar cure times and final degree of cure using both conventional and microwave heating methods, suggesting similar curing mechanisms using both heating methods. The dynamic curing data were, however, different using two heating methods, possibly suggesting different curing mechanisms. Near‐infrared spectroscopy showed that in the dynamic curing of RTM6 using microwave heating, the epoxy‐amine reaction proceeded more rapidly than did the epoxy‐hydroxyl reaction. This was not the case during conventional curing of this resin. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3658–3668, 2006     

Cure kinetics of a glass/epoxy prepreg by dynamic differential scanning calorimetry

Dicyandiamide (DICY)‐cured epoxy resins are important materials for structural adhesives and matrix resins for fiber‐reinforced prepregs. Dynamic differential scanning calorimetry (DSC) with heating rates of 2.5, 5, 10, and 15°C/min was used to study the curing behavior of the epoxy prepreg Hexply 1454 system, which consisted of diglycidyl ether of bisphenol A, DICY, and Urone reinforced by glass fibers. The curing kinetic parameters were determined with three different methods and compared. These were the Kissinger, Ozawa, and Borchardt–Daniels kinetic approaches. The lowest activation energy (76.8 kJ/mol) was obtained with the Kissinger method, whereas the highest value (87.9 kJ/mol) was obtained with the Borchardt–Daniels approach. The average pre‐exponential factor varied from 0.0947 × 10⁹ to 2.60 × 10⁹ s⁻¹. The orders of the cure reaction changed little with the heating rate, so the effect of the heating rate on the reaction order was not significant. It was interesting that the overall reaction order obtained from all three methods was nearly constant (≅2.4). There was good agreement between all of the methods with the experimental data. However, the best agreement with the experimental data was seen with the Ozawa kinetic parameters, and the most deviation was seen with the Borchardt kinetic parameters. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

The use of differential scanning calorimetry to study polymer crystallization kinetics

A Tektronix-31 programmable calculator interfaced to a Perkin Elmer differential scanning calorimeter, model 2, substantially improves the accuracy of measuring the time-dependent development of the degree of crystallinity (× 10) and hence improves the quality of the rate data. Storing energy flow data at preset time intervals directly into the memory of the calculator improves the accuracy of the measurement of time, and enables the evaluation of the onset of crystallization and the baseline of the calorimeter initially. This substantially improves the measurement of the degree of crystallinity developing with time by integrating the energy flow data over the time interval from the onset of crystallization. Polyethylene samples are studied since their rate constants have a marked temperature dependence which enables the accuracy of the analytical procedure to be assessed. Primary and secondary crystallization processes are separated.     

Novel nitrogen‐containing epoxy resin. II. Cure kinetics by differential scanning calorimetry

The isothermal and nonisothermal cure behaviors of a novel nitrogen‐containing epoxy resin (XT resin) were studied by differential scanning calorimetry (DSC). Various kinetic parameters and details of cure process were obtained based on the Avrami theory. The results indicated that Avrami method is suitable for calculating the kinetic parameters up to the gel point at least. The apparent activation energy (E_a) for isothermal cure process was in agreement with that for nonisothermal cure process. E_a value in the early stage (78.5–81.0 KJ mol^?1) was about three times than that in the later stage (23.3–26.5 KJ mol^?1). The kinetic results from Avrami theory may present a combined effect of all factors, and which is helpful to understand the cure technique for XT–DDS system. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 3483–3489, 2006     

Kinetics analysis of the curing reaction of fast cure epoxy prepregs

In this article, the curing kinetics of two fast cure flip-chip epoxy encapsulants under both isothermal and nonisothermal conditions are investigated by differential scanning calorimetry. The method allows determination of the most suitable kinetic model and corresponding parameters. The kinetic analysis suggests that the two-parameter autocatalytic model is more appropriate to describe the kinetics of the curing reaction. There are certain differences between the kinetic data from isothermal and that from nonisothermal measurements. The apparent activation energy Ea and pre-exponential factor A of E-AB1 determined from nonisothermal experiments were higher than the isothermal values, whereas the Ea and A of E-RV2 determined from both methods are relatively close. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1501–1508, 1999     

Comparison of the curing kinetics of a DGEBA/acid anhydride epoxy resin system using differential scanning calorimetry and a microwave‐heated calorimeter

The cure of an epoxy resin system, based upon a diglycidyl ether of bisphenol‐A (DGEBA) with HY917 (an acid anhydride hardener) and DY073 (an amine–phenol complex that acted as an accelerator), was investigated using a conventional differential scanning calorimeter and a microwave‐heated power‐compensated calorimeter. Dynamic cure of the epoxy resin using four different heating rates and isothermal cure using four different temperatures were carried out and the degree of cure and reaction rates were compared. The cure kinetics were analyzed using several kinetics models. The results showed different activation energies for conventional and microwave curing and suggested different reaction mechanisms were responsible for curing using the two heating methods. Resins cured using conventional heating showed higher glass transition temperatures than did those cured using microwave heating. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 2054–2063, 2007     

差示扫描量热法表征氯化镁乙醇醇合物结构

采用差示扫描量热法（DSC）研究了EtOH/MgCl2的摩尔比在1.5～2.8的氯化镁乙醇醇合物的结构。研究表明,该区间的氯化镁乙醇醇合物存在两种稳定的组分,经推断这两种组分分别是MgCl2?2.8EtOH和MgCl2?1.5EtOH,它们的熔融峰值分别在115℃和155℃附近,该区间的氯化镁醇合物是由这两种稳定的组分组成的混合物。另外,氯化镁醇合物的熔点对水分很敏感,微量的水分会使醇合物的熔点降低。热分析结果显示,在MgCl2?2.8EtOH醇合物中存在微量的水分时会在100℃形成特征峰。对具有微量水分且EtOH/MgCl2的摩尔比在1.55～2.64的氯化镁醇合物进行减压脱醇时,首先减少的是MgCl2?2.8EtOH组分,其次是MgCl2?2.8EtOH与微量水分形成的组分,并且没有水分被脱除掉。     

Model‐free kinetics: Curing behavior of phenol formaldehyde resins by differential scanning calorimetry

Isoconversional analysis was used to treat nonisothermal DSC data and yield the dependence of activation energy on conversion during the curing process of PF resins. The shape of the dependence revealed that the curing process of PF resins displayed a change in the reaction mechanism from a kinetic to a diffusion regime. In the kinetic regime a comparative DSC experimental analysis between monomer mixtures and PF resins showed that the addition reactions between phenol and formaldehyde had been mostly completed during the synthesis of PF resins and that the main kinetic reactions contained parallel condensations in the curing process. For the diffusion regime a modified equation for the diffusion rate constant, k_D = D₀ exp(?E_D /RT + K₁α + K₂α²), is proposed. This equation is in good agreement with the experimental dependence of E_α on α in the diffusion regime, which shows the effect of both temperature and conversion on diffusion. A prediction of the conversion advancement with the reaction time under isothermal condition for PF resin has been made. This prediction can be useful in practical applications for evaluating isothermal behavior of thermosetting systems from nonisothermal experimental data. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 87: 433–440, 2003