Synthesis,characterization, and properties of low viscosity tetra‐functional epoxy resin N,N,N′,N′‐ tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane

Tetra‐functional epoxy resin N,N,N′,N′‐tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane (TGDEDDM) was synthesized and characterized. The viscosity of TGDEDDM at 25°C was 7.2 Pa·s, much lower than that of N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM). DSC analysis revealed that the reactivity of TGDEDDM with curing agent 4,4′‐diamino diphenylsulfone (DDS) was significantly lower than that of TGDDM. Owing to its lower viscosity and reactivity, TGDEDDM/DDS exhibited a much wider processing temperature window compared to TGDDM/DDS. Trifluoroborane ethylamine complex (BF₃‐MEA) was used to promote the curing of TGDEDDM/DDS to achieve a full cure, and the thermal and mechanical properties of the cured TGDEDDM were investigated and compared with those of the cured TGDDM. It transpired that, due to the introduction of ethyl groups, the heat resistance and flexural strength were reduced, while the modulus was enhanced. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014 , 131, 40009.     

Thermal characterization of carbon‐nanofiber‐reinforced tetraglycidyl‐4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone epoxy composites

The thermal properties of carbon nanofibers (CNF)/epoxy composites, composed of tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) resin and 4,4′‐diaminodiphenylsulfone (DDS) as a curing agent, were investigated with differential scanning calorimetry (DSC), thermogravimetric analysis, and dynamic mechanical thermal analysis. DSC results showed that the presence of CNF had no pronounced influence on the heat of the cure reaction. However, the incorporation of CNF slightly improved the thermal stability of the epoxy. Furthermore, the storage modulus of the TGDDM/DDS epoxy was significantly enhanced, whereas the glass‐transition temperature was not significantly affected, upon the incorporation of CNFs. The storage modulus of 5 wt % CNF/epoxy composites at 25°C was increased by 35% in comparison with that of the pure epoxy. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 295–298, 2006     

Phosphorus‐containing epoxy resins: Thermal characterization

Three novel aromatic phosphorylated diamines, i.e., bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl} pyromellitamic acid (AP), 4,4′‐oxo bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl}phthalamic acid (AB) and 4,4′‐hexafluoroisopropylidene‐bis N,N′‐{3‐[(3‐aminophenyl)methyl phosphinoyl] phenyl}phthalamic acid (AF) were synthesized and characterized. These amines were prepared by solution condensation reaction of bis(3‐aminophenyl)methyl phosphine oxide (BAP) with 1,2,4,5‐benzenetetracarboxylic acid anhydride (P)/3,3′,4,4′‐benzophenonetetracarboxylic acid dianhydride (B)/4,4′‐(hexafluoroisopropylidene)diphthalic acid anhydride (F), respectively. The structural characterization of amines was done by elemental analysis, DSC, TGA, ¹H‐NMR, ¹³C‐NMR and FTIR. Amine equivalent weight was determined by the acetylation method. Curing of DGEBA in the presence of phosphorylated amines was studied by DSC and curing exotherm was in the temperature range of 195–267°C, whereas with conventional amine 4,4′‐diamino diphenyl sulphone (D) a broad exotherm in temperature range of 180–310°C was observed. Curing of DGEBA with a mixture of phosphorylated amines and D, resulted in a decrease in characteristic curing temperatures. The effect of phosphorus content on the char residue and thermal stability of epoxy resin cured isothermally in the presence of these amines was evaluated in nitrogen atmosphere. Char residue increased significantly with an increase in the phosphorus content of epoxy network. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2235–2242, 2002     

Synthesis and characterization of high‐performance epoxy resin based on disiloxane and 4,4′‐oxybis(benzoic acid) ester

Epoxy‐terminated siloxane‐contained resin (BCDS/OBBA‐ETS) with high tensile strength and lap shear strength as well as good thermal stability was synthesized and characterized by ¹H‐NMR and Fourier transform infrared spectroscopy. Carboxy‐capped disiloxane‐4,4′‐oxybis (benzoic acid) ester oligomer (BCDS/OBBA) was firstly prepared from the reaction between 1,3‐bis(chloromethyl)‐1,1,3,3‐tetramethyl‐disiloxane and 4,4′‐oxybis(benzoic acid) (OBBA) in N,N‐dimethylformamide in the presence of triethylamine. Then, the BCDS/OBBA oligomer was reacted with epichlorohydrin to obtain the title BCDS/OBBA‐ETS resin. Cured with liquid polyamide L‐651, or diethylenetriamine, the mechanical and thermal properties as well as the lap shear strength of the BCDS/OBBA‐ETS resin were evaluated. The results indicated that the BCDS/OBBA‐ETS resin exhibited good thermal stability below 200°C, and the glass transition temperature (T_g) was about 64°C after cured with L‐651. The tensile strength of same cured BCDS/OBBA‐ETS resin was 27.46 MPa with a stain at break of 42.11%, and the lap shear strength for bonding stainless steel was 18.59 MPa. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Resistive switching characteristics of polyimides derived from 2,2′‐aryl substituents tetracarboxylic dianhydrides

2,2′‐Position aryl‐substituted tetracarboxylic dianhydrides including 2,2′‐bis(biphenyl)‐4,4′,5,5′‐biphenyl tetracarboxylic dianhydride and 2,2′‐bis[4‐(naphthalen‐1‐yl)phenyl)]‐4,4′,5,5′‐biphenyl tetracarboxylic dianhydride were synthesized. A new series of aromatic polyimides (PIs) were synthesized via a two‐step procedure from 3,3′,4,4′‐biphenyl tetracarboxylic dianhydride and the newly synthesized tetracarboxylic dianhydrides monomers reacting with 2,2′‐bis[4′‐(3″,4″,5″‐trifluorophenyl)phenyl]‐4,4′‐biphenyl diamine. The resulting polymers exhibited excellent organosolubility and thermal properties associated with T_g at 264 °C and high initial thermal decomposition temperatures (T_5%) exceeding 500 °C in argon. Moreover, the fabricated sandwich structured memory devices of Al/PI‐a/ITO was determined to present a flash‐type memory behaviour, while Al/PI‐b/ITO and Al/PI‐c/ITO exhibited write‐once read‐many‐times memory capability with different threshold voltages. In addition, Al/polymer/ITO devices showed high stability under a constant stress or continuous read pulse voltage of ? 1.0 V. Copyright © 2011 Society of Chemical Industry     

Synthesis and characterization of organosoluble and transparent polyimides derived from trans‐1,2‐bis(3,4‐dicarboxyphenoxy)cyclohexane dianhydride

A novel dianhydride, trans‐1,2‐bis(3,4‐dicarboxyphenoxy)cyclohexane dianhydride (1,2‐CHDPA), was prepared through aromatic nucleophilic substitution reaction of 4‐nitrophthalonitrile with trans‐cyclohexane‐1,2‐diol followed by hydrolysis and dehydration. A series of polyimides (PIs) were synthesized from one‐step polycondensation of 1,2‐CHDPA with several aromatic diamines, such as 2,2′‐bis(trifluoromethyl)biphenyl‐4,4′‐diamine (TFDB), bis(4‐amino‐2‐trifluoromethylphenyl)ether (TFODA), 4,4′‐diaminodiphenyl ether (ODA), 1,4‐bis(4‐aminophenoxy)benzene (TPEQ), 4,4′‐(1,3‐phenylenedioxy)dianiline (TPER), 2,2′‐bis[4‐(3‐aminodiphenoxy)phenyl]sulfone (m‐BAPS), and 2,2′‐bis[4‐(4‐amino‐2‐trifluoromethylphenoxy)phenyl]sulfone (6F‐BAPS). The glass transition temperatures (T_gs) of the polymers were higher than 198°C, and the 5% weight loss temperatures (T_d5%s) were in the range of 424–445°C in nitrogen and 415–430°C in air, respectively. All the PIs were endowed with high solubility in common organic solvents and could be cast into tough and flexible films, which exhibited good mechanical properties with tensile strengths of 76–105 MPa, elongations at break of 4.7–7.6%, and tensile moduli of 1.9–2.6 GPa. In particular, the PI films showed excellent optical transparency in the visible region with the cut‐off wavelengths of 369–375 nm owing to the introduction of trans‐1,2‐cyclohexane moiety into the main chain. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42317.     

Synthesis and characterization of phenylsiloxane‐modified bismaleimide/barbituric acid‐based polymers with 3‐aminopropyltriethoxysilane as the coupling agent

The preparation and characterization of phenylsiloxane (PhSLX)‐modified N,N′‐bismaleimide‐4,4′‐diphenylmethane (BMI)/barbituric acid (BTA) (10/1 mol/mol) oligomers are described. 3‐Aminopropyltriethoxysilane (APTES) was used as the coupling agent. The resultant hybrid BMI/BTA‐APTES‐PhSLX polymers were characterized primarily using thermogravimetric analysis in combination with differential scanning calorimetry and Fourier transform infrared measurements. The thermal stability of the BMI/BTA oligomer was improved significantly by incorporation of a small amount (20–30 wt%) of the copolymer of PhSLX and APTES (PASi). After adequate post‐curing reactions, the PASi‐modified BMI/BTA oligomers (HYBRID20 and HYBRID30 containing 20 and 30 wt% PASi, respectively) exhibited greatly reduced thermal degradation rates in the temperature range 300–800 °C and an increased level of residues at 800 °C as compared to the native BMI/BTA oligomer. This was further confirmed by thermal degradation kinetic studies, in which the activation energies for the thermal degradation reactions of the cured PASi‐modified BMI/BTA oligomers were shown to be higher than that of the pristine BMI/BTA oligomer. © 2012 Society of Chemical Industry     

Effect of monomer composition on properties of copolyimides derived from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride/4,4′‐oxydianiline/1,3‐bis (4‐aminophenoxy)benzene

A series of uncontrolled molecular weight homopolyimides and copolyimides based on 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA)/4,4′‐oxydianiline (4,4′‐ODA)/1,3‐bis(4‐aminophenoxy)benzene (TPER) were synthesized. All the polyimides displayed excellent thermal stability and mechanical properties, as evidenced by dynamic thermogravimetric analysis and tensile properties testing. A singular glass transition temperature (T_g) was found for each composite from either differential scanning calorimetry (DSC) or dynamic mechanical analysis (DMA), but the values determined from tan δ of DMA were much different from those determined from DSC and storage modulus (E′) of DMA. The Fox equation was used to estimate the random T_g values. Some composites exhibited re‐crystallization after quenching from the melt; upon heating, multi‐melting behavior was observed after isothermal crystallization at different temperatures. The equilibrium melting temperature was estimated using the Hoffman‐Weeks method. Additionally, DMA was conducted to obtain E′ and tan δ. Optical properties were strongly dependent on the monomer composition as evidenced by UV‐visible spectra. X‐ray diffraction was used to interpret the crystal structure. All the results indicated that composites with TPER composition ≥ 70% were dominated by the TPER/s‐BPDA polyimide phase, and ≤40% by the 4,4′‐ODA/s‐BPDA polyimide phase. When the ratio between the two diamines was close to 1:1, the properties of the copolyimides were very irregular, which means a complicated internal structure. Copyright © 2011 Society of Chemical Industry     

Synthesis and properties of poly(amide imide)s based on 2,2′‐ or 4,4′‐bis(4‐aminophenoxy)biphenyl and various bis(trimellitimide)s

Three series of isomeric poly(amide imide)s (series III, IV, and V) were synthesized by the direct polycondensation of 2,2′‐bis(4‐aminophenoxy)biphenyl (2,2′‐BAPB), 4,4′‐bis(4‐aminophenoxy)biphenyl (4,4′‐BAPB), or their equimolar mixture (2,2′‐BAPB/4,4′‐BAPB = 1/1) with 12 diimide diacids and with triphenyl phosphite and pyridine as condensing agents. A comparison of the physical properties of these three series was also made. The inherent viscosities of series III, IV, and V were 0.25–0.84, 0.25–1.52, and 0.43–1.30 dL g^?1, respectively. Most of the series III polymers showed better solubility because of the non‐para structure, with the solubility order found to be III > V > IV. According to X‐ray diffraction patterns, the amorphous poly(amide imide)s had excellent solubility, whereas the crystalline polymers were less soluble. All the soluble polymers afforded transparent, flexible, and tough films, which had tensile strengths of 57–104 MPa, elongations at break of 3–20%, and initial moduli of 2.05–2.86 GPa. The glass‐transition temperatures (measured by differential scanning calorimetry) were highest for series IV, which contained the rigid 4,4′‐biphenyl units (254–299°C); copolymer series V ranked second (237–277°C), and series III, with crank 2,2′‐biphenyl structures, had the lowest values (227–268°C). The 10% weight‐loss temperatures (measured by thermogravimetric analysis) were close to one another, ranging from 527 to 574°C in nitrogen and from 472 to 543°C in air. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 2763–2774, 2002     

Highly fluorinated poly(ether‐imide)s derived from 2,2′‐bis(3,4,5‐trifluorophenyl)‐4,4′‐diaminodiphenyl ether and aromatic dianhydrides

A new diamine, 2,2′‐bis(3,4,5‐trifluorophenyl)‐4,4′‐diaminodiphenyl ether (FPAPE) was synthesized through the Suzuki coupling reaction of 2,2′‐diiodo‐4,4′‐dinitrodiphenyl ether with 3,4,5‐trifluorophenylboronic acid to produce 2,2′‐bis(3,4,5‐trifluorophenyl)‐4,4′‐dinitrodiphenyl ether (FPNPE), followed by palladium‐catalyzed hydrazine reduction of FPNPE. FPAPE was then utilized to prepare a novel class of highly fluorinated all‐aromatic poly(ether‐imide)s. The chemical structure of the resulting polymers is well confirmed by infrared and nuclear magnetic resonance spectroscopic methods. Limiting viscosity numbers of the polymer solutions at 25 °C were measured through the extrapolation of the concentrations used to zero. M_n and M_w of these polymers were about 10 000 and 25 000 g mol^?1, respectively. The polymers showed a good film‐forming ability, and some characteristics of their thin films including color and flexibility were investigated qualitatively. An excellent solubility in polar organic solvents was observed. X‐ray diffraction measurements showed that the fluoro‐containing polymers have a nearly amorphous nature. The resulting polymers had T_g values higher than 340 °C and were thermally stable, with 10% weight loss temperatures being recorded above 550 °C. Based on the results obtained, FPAPE can be considered as a promising design to prepare the related high performance polymeric materials. Copyright © 2011 Society of Chemical Industry     

Bis[4‐(4‐maleimidephen‐oxy)phenyl]propane/N,N‐4,4′‐bismaleimidodiphenylmethyene blend modified with diallyl bisphenol A

In this article, 2,2′‐bis[4‐(4‐maleimidephen‐oxy)phenyl)]propane (BMPP) resin and N,N‐4,4′‐bismaleimidodiphenylmethyene (BDM) resin blends were modified by diallyl bisphenol A (DABPA). The effects of the mole concentration of BMPP on mechanical properties, fracture toughness, and heat resistance of the modified resins were investigated. Scanning electron microscopy was used to study the microstructure of the fractured modified resins. The introduction of BMPP resin improves the fracture toughness and impact strength of the cured resins, whose thermal stabilities are hardly affected. Dynamic mechanical analysis shows that the modified resins can maintain good mechanical properties at 270.0°C, and their glass transition temperatures (T_g) are above 280.0°C. When the mole ratio of BDM : BMPP is 2 : 1(Code 3), the cured resin performs excellent thermal stability and mechanical property. Its T_g is 298°C, and the Charpy impact strength is 20.46 KJ/m². The plane strain critical stress intensity factor (K_IC) is 1.21 MPa·m^0.5 and the plane strain critical strain energy release rate (G_IC) is 295.64 J/m². Compared with that of BDM/DABPA system, the K_IC and G_IC values of Code 3 are improved by 34.07% and 68.10%, respectively, which show that the modified resin presented good fracture toughness. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40395.     

N‐(2‐biphenylenyl)‐4‐[2′‐phenylethynyl] phthalimide: 2. Detailed study of the monomer cure and properties of the resulting polymer

A detailed study is presented of the high‐temperature cure of the difunctional monomer N‐(2‐biphenylenyl)‐4‐[2′‐phenylethynyl]phthalimide (BPP) and the thermal properties of the resulting homopolymer. Although the phenylethynyl groups are consumed within 1 h at 370 °C, other reactions continue well after this, leading to a cured polymer whose glass transition temperature (T_g) is highly dependent on cure time and temperature. A T_g of 450 °C is achieved after a 16 h cure at 400 °C. Use of chemometrics to analyse the infrared spectra of curing BPP provides evidence for changes in the aromatic moieties during cure, perhaps indicative of co‐reaction between the biphenylene and phenylethynyl groups; however, other processes also contribute to the overall complex cure mechanism. Despite the high T_g values, BPP homopolymer exhibits unacceptably poor thermo‐oxidative stability at 370 °C, showing a weight loss of about 50 % after 100 h ageing. This is perhaps a result of formation of degradatively unstable crosslink structures during elevated‐temperature cure. Copyright © 2004 Society of Chemical Industry     

Synthesis and characterization of new optically active poly(amide‐imide‐urethane) thermoplastic elastomers,derived from 4,4′‐(hexafluoroisopropylidene)‐N,N′‐bis(phthaloyl‐L‐leucine‐p‐aminobenzoic acid) and PEG‐MDI

A new class of optically active poly(amide‐imide‐urethane) was synthesized via two‐step reactions. In the first step, 4,4′‐methylene‐bis(4‐phenylisocyanate) (MDI) reacts with several poly(ethylene glycols) (PEGs) such as PEG‐400, PEG‐600, PEG‐2000, PEG‐4000, and PEG‐6000 to produce the soft segment parts. On the other hand, 4,4′‐(hexafluoroisopropylidene)‐N,N′‐bis(phthaloyl‐L ‐leucine‐p‐amidobenzoic acid) (2) was prepared from the reaction of 4,4′‐(hexafluoroisopropylidene)‐N,N′‐bis(phthaloyl‐L ‐leucine) diacid chloride with p‐aminobenzoic acid to produce hard segment part. The chain extension of the above soft segment with the amide‐imide 2 is the second step to give a homologue series of poly(amide‐imide‐urethanes). The resulting polymers with moderate inherent viscosity of 0.29–1.38 dL/g are optically active and thermally stable. All of the above polymers were fully characterized by IR spectroscopy, elemental analyses, and specific rotation. Some structural characterization and physical properties of this new optically active poly(amide‐imide‐urethanes) are reported. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 91: 2288–2294, 2004     

Effect of chlorine substitution in 4,4′‐diaminodiphenylmethane hardener on shelf life and mechanical properties of epoxies

Curing of N,N,N′,N′‐tetraglycidyldiaminodiphenylmethane with new curing agents like 3,3′‐dichloro‐4,4′‐diaminodiphenylmethane and 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane in comparison with diaminodiphenylmethane and 4,4′‐diaminodiphenylsulphone (DDS) was carried out using dynamic differential scanning calorimetry. The shelf life of various epoxy formulations was evaluated by the residual cure exotherm method. The glass‐transition temperatures of cured epoxy formulations were determined using dynamic mechanical analysis. The mechanical properties such as the tensile strength, tensile modulus, flexural strength, and Izod impact strength were also evaluated and compared. The activation energy, frequency factor, and shelf life of chloro‐substituted hardener formulations were high as compared to those of unsubstituted hardener formulations. The marginal differences in the glass‐transition temperature, tensile strength, tensile modulus, and flexural strength and the small decrement in the Izod impact strength values were interpreted in terms of chlorine substitution. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 3082–3088, 2002; DOI 10.1002/app.2337     

New poly(amide imide imide)s based on tetraimide dicarboxylic acid condensed from 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride,m‐aminobenzoic acid,and 4,4″‐oxydianiline and various aromatic diamines

A series of new, organosoluble, and light‐colored poly(amide imide imide)s were synthesized from tetraimide dicarboxylic acid ( I ) and various aromatic diamines by direct polycondensation with triphenyl phosphite and pyridine as condensing agents. I was prepared by the azeotropic condensation of 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride, m‐aminobenzoic acid, and 4,4′‐oxydianiline at a 2/2/1 molar ratio in N‐methyl‐2‐pyrrolidone (NMP)/toluene. The thin films cast from N,N‐dimethylacetamide (DMAc) had cutoff wavelengths shorter than 400 nm (365–394 nm) and color coordinate b* values between 13.10 and 36.07; these polymers were lighter in color than the analogous poly(amide imide)s and isomeric polymers. All of the polymers were readily soluble in a variety of organic solvents, including NMP, DMAc, N,N‐dimethylformamide, dimethyl sulfoxide, and even less polar dioxane and tetrahydrofuran. The cast films exhibited tensile strengths of 90–104 MPa, elongations at break of 7–22%, and initial moduli of 1.9–2.4 GPa. The glass‐transition temperatures of the polymers were recorded at 274–319°C. They had 10% weight losses at temperatures beyond 520°C and left more than a 50% residue even at 800°C in nitrogen. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 669–679, 2003     

Synthesis and characterization of novel polyaspartimides derived from 2,2′‐dimethyl‐4,4′‐bis(4‐maleimidophenoxy)biphenyl and various diamines

A novel bismaleimide, 2,2′‐dimethyl‐4,4′‐bis(4‐maleimidophenoxy)biphenyl, containing noncoplanar 2,2′‐dimethylbiphenylene and flexible ether units in the polymer backbone was synthesized from 2,2′‐dimethyl‐4,4′‐bis(4‐aminophenoxy)biphenyl with maleic anhydride. The bismaleimide was reacted with 11 diamines using m‐cresol as a solvent and glacial acetic acid as a catalyst to produce novel polyaspartimides. Polymers were identified by elemental analysis and infrared spectroscopy, and characterized by solubility test, X‐ray diffraction, and thermal analysis (differential scanning calorimetry and thermogravimetric analysis). The inherent viscosities of the polymers varied from 0.22 to 0.48 dL g⁻¹ in concentration of 1.0 g dL⁻¹ of N,N‐dimethylformamide. All polymers are soluble in N‐methyl‐2‐pyrrolidone, N,N‐dimethylacetamide, N,N‐dimethylformamide, dimethylsulfoxide, pyridine, m‐cresol, and tetrahydrofuran. The polymers, except PASI‐4, had moderate glass transition temperature in the range of 188°–226°C and good thermo‐oxidative stability, losing 10% mass in the range of 375°–426°C in air and 357°–415°C in nitrogen. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 279–286, 1999     

Flexible aliphatic poly(isocyanurate–oxazolidone) resins based on poly(ethylene glycol) diglycidyl ether and 4,4′‐methylene dicyclohexyl diisocyanate

New flexible aliphatic oxazolidone‐isocyanurate networks (AISOX) are obtained by reacting a low molecular weight diisocyanate (4,4′‐methylene dicyclohexyl diisocyanate, H₁₂MDI) and a macro‐diepoxyde (poly(ethylene glycol) diglycidyl ether, M_n = 526, PEGDGE) in different molar ratio. The curing reaction, carried out from 25 °C to 200 °C, is studied by using DSC and FTIR. The effect of the molar ratio of the two monomers on thermal and mechanical properties of AISOX resins is investigated by DSC, thermogravimetric analysis, stress?strain measurements and optical microscopy. Independently from the feed composition, it is observed that the reaction steps are: (i) partial hydrolysis of isocyanate caused by water traces, (ii) incomplete trimerization of isocyanate to give isocyanurate, and (iii) formation of oxazolidone and complete conversion of isocyanate. At the highest concentration of the soft macrodiepoxyde (PEGDGE), the AISOX resin is in the rubbery state at room temperature and shows an elastomeric behavior. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43404.     

Synthesis of soluble and thermally stable polyimides from 3,5‐diamino‐N‐(4‐(8‐quinolinoxy) phenyl) aniline and various dianhydrides

Three novel polyimides (PIs) having pendent 4‐(quinolin‐8‐yloxy) aniline group were prepared by polycondensation of a new diamine with commercially available tetracarboxylic dianhydrides, such as pyromellitic dianhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride, and bicyclo[2.2.2]‐oct‐7‐ene‐2,3,5,6‐tetracarboxylic dianhydride. These PIs were characterized by FTIR, ¹H NMR, and elemental analysis; they had high yields with inherent viscosities in the range of 0.4–0.5 dl g⁻¹, and exhibited excellent solubility in many organic solvents such as N,N‐dimethyl acetamide, N,N′‐dimethyl formamide, N‐methyl pyrrolidone (NMP), dimethyl sulfoxide, and pyridine. These PIs exhibited glass transition temperatures (T_g) between 250 and 325° C. Their initial decomposition temperatures (T_i) ranged between 270 and 450°C, and 10% weight loss temperature (T₁₀) up to 500°C with 68% char yield at 600°C under nitrogen atmosphere. Transparent and hard polymer films were obtained via casting from their NMP solutions. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Preparation and properties of organo‐soluble polyimides based on 4,4′‐diamino‐3,3‐dimethyldiphenylmethane and conventional dianhydrides

4,4′‐Diamino‐3,3′‐dimethyldiphenylmethane was used to prepare polyimides in an attempt to achieve good organo‐solubility and light color. Polyimides based on this diamine and three conventional aromatic dianhydrides were prepared by solution polycondensation followed by chemical imidization. They possess good solubility in aprotonic polar organic solvents such as N‐methyl 2‐pyrrolidone, N,N‐dimethyl acetamide, and m‐cresol. Polyimide from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and diphenylether‐3,3′,4,4′‐tetracarboxylic acid dianhydride is even soluble in common solvents such as tetrahydrofuran and chloroform. Polyimides exhibit high transmittance at wavelengths above 400 nm. The glass transition temperature of polyimide from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and pyromellitic dianhydride is 370°C, while that from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and diphenylether‐3,3′,4,4′‐tetracarboxylic acid dianhydride is about 260°C. The initial thermal decomposition temperatures of these polyimides are 520–540°C. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 72: 1299–1304, 1999     

Studies on crosslinking and thermal behavior of phthalonitrile end‐capped imide monomer in presence of aromatic amines

This paper describes the synthesis and characterization of a bisphthalonitrile monomer having an imide linkage prepared by reacting 4,4′‐(hexafluoroisopropylidene) diphthalic anhydride with 4‐(4‐aminophenoxy) phthalonitrile. The structure of the monomer was confirmed by Fourier transform infrared, ¹H‐NMR, and ¹³C‐NMR spectroscopy. The curing behavior of bisphthalonitrile monomer was investigated in the absence or presence of different diamines using differential scanning calorimetry. Diamines 4,4′‐diaminodiphenyl ether (DDE) and 4,4′‐diaminodiphenylsulfone (DDS) were used to investigate the effect of the structure of diamines on the curing behavior of bisphthalonitrile monomer. An exothermic transition due to curing was observed in the DSC scan, and the curing temperature was found to be dependent on the nucleophilicity of the amine. DDE was found to be more reactive than DDS. The thermal stability of the cured resins was evaluated using thermogravimetry in nitrogen atmosphere. All of the cured samples were stable up to 400 °C and leave behind 62% char residue at 800 °C, which was found to be dependent on the structure of the diamine used for curing as well as on the curing conditions. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46151.