Fabrication and characteristics of the nc-Si/c-Si heterojunction MAGFET

A MAGFET using an nc-Si/c-Si heterojunction as source and drain was fabricated by CMOS technology, using two ohm-contact electrodes as Hall outputs on double sides of the channel situated 0.7L from the source. The experimental results show that when V_(DS) = -7.0 V, the magnetic sensitivity of the single nc-Si/c-Si heterojunction magnetic metal oxide semiconductor field effect transistor (MAGFET) with an L : W ratio of 2 : 1 is 21.26 mV/T,and that with an L : W ratio of 4 : 1 is 13.88 mV/T. When the outputs of double nc-Si/c-Si heterojunction MAGFETs with an L : W ratio of 4 : 1 are in series, their magnetic sensitivity is 22.74 mV/T, which is an improvement of about 64% compared with that of a single nc-Si/c-Si heterojunction MAGFET.     

金纳米粒子-黑磷异质结的光学性能研究

为了改善黑磷(BP)光探测器因BP的弱光吸收导致的光电流小和在空气中不稳定的问题,采用加热蒸发金纳米粒子(Au NP)水溶液的方法将Au NP集合到BP光探测器的表面,增强整个结构对光的吸收率和稳定性,并通过改变Au NP水溶液的加热温度控制Au NP的密度分布。结果表明,当Au NP的密度分布达到4.5×109 cm^-2时,Au NP-BP光探测器的光电流从1.02μA(BP光探测器)增加到13.36μA(电压=1 V),光响应度也相应地增加了12倍。同时,Au NP-BP光探测器的电流值在空气中保持数天无明显变化且暗电流较低。Au NP能够有效地提升光探测器的性能,有助于光探测器的实际应用。     

纳米硅/单晶硅异质结MAGFET制作及特性

A MAGFET using an nc-Si/c-Si heterojunction as source and drain was fabricated by CMOS technology, using two ohm-contact electrodes as Hall outputs on double sides of the channel situated 0.7L from the source. The experimental results show that when VDS = -7.0 V, the magnetic sensitivity of the single nc-Si/c-Si heterojunction magnetic metal oxide semiconductor field effect transistor （MAGFET） with an L ： W ratio of 2 ： 1 is 21.26 mV/T, and that with an L ： W ratio of 4 ： 1 is 13.88 mV/T. When the outputs of double nc-Si/c-Si heterojunction MAGFETs with an L ： W ratio of 4 ： 1 are in series, their magnetic sensitivity is 22.74 mV/T, which is an improvement of about 64% compared with that of a single nc-Si/c-Si heterojunction MAGFET.     

Ti/Al/Ti/Au与AlGaN欧姆接触特性

研究了溅射 Ti/ Al/ Ti/ Au四层复合金属与 Al Ga N / Ga N的欧姆接触特性 ,并就环境温度对欧姆接触特性的影响进行了分析研究 .试验证实 :溅射的 Ti/ Al/ Ti/ Au与载流子浓度为 2 .2 4× 10 1 8cm- 3的 Al Ga N之间在室温下无需退火即可形成欧姆接触 .随快速退火温度的升高接触电阻降低 .快速退火时间 30 s已可实现该温度下最佳欧姆接触 .当工作温度不高于 30 0℃时接触电阻几乎不受温度的影响     

Ti/Al/Ni/Au在GaN N面上的欧姆接触

以Ti/Al/Ni/Au作为欧姆接触金属体系,通过电感耦合等离子体(ICP)刻蚀的预处理,在氢化物气相外延法生长的单晶氮化镓(GaN)材料的N面实现了良好的欧姆接触,其比接触电阻率为3.7×10-4 Ω·cm2.通过扫描电子显微镜、原子力显微镜、阴极荧光和光致发光谱对GaN N面的表面、光学特性进行了对比表征.结果表明:未刻蚀GaN衬底的N面表面存在一定的损伤层,导致近表面处含有大量缺陷,不利于欧姆接触的形成;而ICP刻蚀处理有效地去除了损伤层.X射线光电子能谱(XPS)分析显示刻蚀后样品的Ga 3d结合能比未刻蚀样品向高能方向移动了约0.3 eV,其肖特基势垒则相应降低,有利于欧姆接触的形成.同时对Fe掺杂半绝缘GaN的N面也进行了刻蚀处理,同样实现了良好的Ti/Al/Ni/Au欧姆接触,其比接触电阻率为0.12 Ω·cm2.     

Long-term thermal stability of Ti/Al/Mo/Au ohmic contacts on n-GaN

Improved performance of the ohmic contacts on n-GaN has been demonstrated with the use of MoAu as the capping layer on TiAl metallization. Contact resistance as low as 0.13 Θ-mm was achieved in these ohmic contacts when annealed at 850°C for 30 sec. We have studied the long-term thermal stability of these contacts at 500°C, 600°C, 750°C, and 850°C, respectively. The Ti/Al/Mo/Au metallization forms low contact-resistance ohmic contacts on n-GaN that are stable at 500°C and 600°C after 25 h of thermal treatment. The ohmic-contact performance degrades after 10 h of thermal treatment at 750°C, while the contacts exhibit nonlinear current-voltage (I-V) characteristics after 1 h of thermal treatment at 850°C with the formation of oxide on the surface of the contacts accompanied by surface discoloration. The intermetallic reactions taking place in the contacts during the long-term thermal treatments were studied using Auger electron spectroscopy (AES), and the surface morphology was characterized using atomic force microscopy (AFM).     

Ti/Al/Ni/Au金属体系在N-polar GaN上的欧姆接触特性

利用金属有机化合物化学气相淀积(MOCVD)在SiC衬底上外延生长了N-polar GaN材料,采用传输线模型(TLM)分析了Ti/Al/Ni/Au金属体系在N-polar GaN上的欧姆接触特性.结果表明,Ti/Al/Ni/Au (20/60/10/50 nm)在N-polar GaN上可形成比接触电阻率为2.2×10-3Ω·cm2的非合金欧姆接触,当退火温度升至200℃,比接触电阻率降为1.44×10-3 Ω·cm2,随着退火温度的进一步上升,Ga原子外逸导致欧姆接触退化为肖特基接触.     

高Al组分n-AlGaN的Ti/Al/Ti/Au欧姆接触

采用Ti/Al/Ti/Au多层金属电极对高Al组分n-AlxGa1-xN(x=0.6)欧姆接触的制备进行了研究,通过优化Ti接触层厚度以及合金退火条件,获得了较低的比接触电阻率(5.67×10-5Ω.cm2)。研究证实,Ti接触层厚度对欧姆接触特性有着重要影响,同时发现,高低温两步退火方式之所以能够改善欧姆接触特性的本质是与Al3Ti及TiN各自的生成条件直接相关,即低温利于生成Al3Ti,高温利于生成TiN,而这对n型欧姆接触的有效形成至关重要。     

基于c-Si(P)衬底的a-Si/c-Si异质结模拟研究

本文中研究了影响 a-Si/c-Si 异质结界面复合的主要因素： 表面固定电荷 ,缺陷态载流子俘获界面： ,以及界面缺陷态密度 。当缺陷能级 接近c-Si本征能级,且 满足时,缺陷态复合中心复合速度达到最大。AFORS-HET 软件模拟显示, a-Si/c-Si界面能带不连续显著影响电池Voc、界面缺陷态密度大于1*1010 cm-2.eV-1时,界面态密度的增加会严重降低电池Voc,但其对电池电流密度影响不大。对于c-Si (P)/a-Si (P ) 结构异质结,C-Si衬底的势垒 和a-Si材料内的势垒 对降低c-Si (P)/a-Si (P ) 结构的接触电阻和界面复合速度,表现各不相同。     

Effect of annealing temperature on Ti/Al/Ni/Au ohmic contacts on undoped AlN films

The Ti/Al/Ni/Au metals were deposited on undoped AlN films by electron beam evaporation. The influence of annealing temperature on the properties of contacts was investigated. When the annealing temperatures were between 800 and 950℃, the AlN-Ti/Al/Ni/Au contacts became ohmic contacts and the resistance decreased with the increase of annealing temperature. A lowest specific contacts resistance of 0.379 Ω·cm² was obtained for the sample annealed at 950℃. In this work, we confirmed that the formation mechanism of ohmic contacts on AlN was due to the formation of Al-Au, Au-Ti and Al-Ni alloys, and reduction of the specific contacts resistance could originate from the formation of Au₂Ti and AlAu₂ alloys. This result provided a possibility for the preparation of AlN-based high-frequency, high-power devices and deep ultraviolet devices.     

非故意掺杂GaN上Ti/Al/Ni/Au欧姆接触研究

基于圆形传输线模型,研究了背景载流子浓度为71016cm3的非故意掺杂GaN与Ti/Al/Ni/Au多层金属之间欧姆接触的形成。样品在N2气氛中,分别经过温度450,550,700,800,900℃的1 min快速热退火处理后发现,当退火温度高于700℃欧姆接触开始形成,随着温度升高欧姆接触电阻持续下降,在900℃时获得了最低比接触电阻6.6106O·cm2。研究表明,要获得低的欧姆接触电阻,需要Al与Ti发生充分固相反应,并穿透Ti层到达GaN表面;同时,GaN中N外扩散到金属中,在GaN表面产生N空位起施主作用,可提高界面掺杂浓度,从而有助于电子隧穿界面而形成良好欧姆接触。     

Comparison of the agglomeration behavior of Ag(Al) films and Ag(Au) films

It is essential to suppress agglomeration of Ag films caused by thermal treatment for their successful application as new metallization materials. Co-sputtered Ag(Al) and Ag(Au) films were investigated, with regard to their change in morphology and electrical resistivity after vacuum annealing. As a result, agglomeration of the Ag(Al) film (Al: 4.3 at.%) was not recognized even after annealing at 600 °C. However, void formation followed by de-wetting was observed for the Ag(Au) film after annealing, similar to that for a pure Ag film. The morphological change was accompanied by an increase in the resistivity of the Ag(Au) films with annealing temperature. On the other hand, the resistivity of the Ag(Al) films did not increase by annealing at temperatures from 400 to 600 °C. However, the film with the highest Al content, which was most resistive to agglomeration, had too high resistivity for use as a metallization material. By analysis of the Auger depth profile, the presence of very thin oxide layers at the surface of the film and at the interface with the substrate was confirmed for Ag(Al) films after annealing. This was considered to be the reason for the large difference in agglomeration behavior between the Ag(Au) and Ag(Al) films.     

用于紫外探测器的AlGaN/GaN异质结构的Ti/Al/Ni/Au欧姆接触特性

采用Ti/Al/Ni/Au多层金属体系在Al0.27Ga0.73N/GaN异质结构上制备了欧姆接触.分别采用线性传输线方法(LTLM)和圆形传输线方法(CTLM)对其电阻率进行了测试.当Ti(10nm)/Al(100nm)/Ni(40nm)/Au(100nm)金属体系在650℃高纯N2气氛中退火30s时,测量得到的最小比接触电阻率为1.46×10-5Ω·cm2.并制备了Al0.27Ga0.73N/GaN光导型紫外探测器,通过测试发现探测器的暗电流.电压曲线呈线性分布.实验结果表明在Al0.27 Ga0.73N/GaN异质结构上获得了好的欧姆接触,能够满足制备高性能AlGaN/GaN紫外探测器的要求.     

用于紫外探测器的AlGaN/GaN异质结构的Ti/Al/Ni/Au欧姆接触特性

采用Ti/Al/Ni/Au多层金属体系在Al0.27Ga0.73N/GaN异质结构上制备了欧姆接触. 分别采用线性传输线方法(LTLM)和圆形传输线方法(CTLM)对其电阻率进行了测试. 当Ti(10nm)/Al(100nm)/Ni(40nm)/Au(100nm)金属体系在650℃高纯N2气氛中退火30s时,测量得到的最小比接触电阻率为1.46E-5Ω·cm2. 并制备了Al0.27Ga0.73N/GaN光导型紫外探测器,通过测试发现探测器的暗电流-电压曲线呈线性分布. 实验结果表明在Al0.27Ga0.73N/GaN异质结构上获得了好的欧姆接触,能够满足制备高性能AlGaN/GaN紫外探测器的要求.     

Microstructural analysis of a Au/Pt/Pd/Zn ohmic contact to an AlGaAs/GaAs heterojunction bipolar transistor

Gold-based ohmic contacts, incorporating Pt, Pd, and Zn layers, to AIGaAs/GaAs heterojunction bipolar transistors (HBTs) have been characterized using transmission electron microscopy (TEM). The metallization was deposited onto a 30 nm graded emitter layer of n-type Al_xGa_1−xAs, which was on a 30 nm emitter layer of n-type Al_0.3Ga_0.7As, with the aim of contacting the underlying 80 nm thick graded base layer of p-type Al_xGa_1−xAs. Metal layers were deposited sequentially using electron beam evaporation and the resultant metallizations were annealed at temperatures ranging from 250-500°C for up to several minutes. A minimum contact resistance of ≈8.5 × 10⁻⁷ Ω-cm² was achieved, which corresponded to the decomposition of ternary phases at the metallization/semiconductor interface, to binary phases, i.e., PdGa and PtAs₂. Long term stability tests were done on the optimum contacts. Anneals at 270°C for up to four weeks in duration produced virtually no change in microstructure, with the exception of some outward diffusion of Ga and As.     

Large current gain and low operational voltage permeable metal-base organic transistors based on Au/Al double layer metal base

In order to realize the common-emitter characteristics of the tris(8-hydroxyquinoline) aluminium (Alq₃)-based organic transistors, we used Au/Al double metal layer as the base, thus the vertical metal-base transistors with structure of Al/n-Si/Au/Al/Alq₃/LiF/Al were constructed. It was found that the contact properties between the base and the organic semiconductors play an important role in the device performance. The utilization of Au/Al double layer metal base allows the devices to operate at high gain in the common-emitter and common-base mode at low operational voltage.     

Optical characterization of (GaIn)(NAs)/GaAs MQW structures

(GaIn)(NAs)/GaAs multiple quantum well (MQW) structures with high structural perfection as determined from high-resolution x-ray diffraction (XRD) analysis have been deposited by low-temperature metal organic vapor phase epitaxy (MOVPE) at 525°C using triethylgallium (TEGa) and trimethylindium (TMIn) in combination with 1,1-dimethylhydrazine (UDMHy) and tertiarybutylarsine (TBAs). The optical characteristics of as-grown MQW structures as a function of quaternary composition and of well width are established by PL spectroscopy at 300 K. With increasing N-content a reduction in PL efficiency and an increase in PL linewidth is observed. This behavior might be correlated to an increase in defect density with increasing N-content and/or to a bandstructure effect in this novel material system. For an increase in Inconcentration the tendency for a reduction in the extreme bowing of the band gap is detected. Strong quantization effects are observed for well widths below 5 nm only in this novel MQW system, which indicates significantly larger electron masses as compared to N-free (GaIn)As.     

Frequency and temperature dependence of the dielectric and AC electrical conductivity in (Ni/Au)/AlGaN/AlN/GaN heterostructures

The dielectric properties and AC electrical conductivity (σ_ac)of the (Ni/Au)/Al_0.22Ga_0.78N/AlN/GaN heterostructures, with and without the SiN_x passivation, have been investigated by capacitance-voltage and conductance-voltage measurements in the wide frequency (5kHz-5 MHz) and temperature (80-400 K) range. The experimental values of the dielectric constant (ε′), dielectric loss (ε′′), loss tangent (tanδ), σ_ac and the real and imaginary part of the electric modulus (M′ and M′′) were found to be a strong function of frequency and temperature. A decrease in the values of ε′ and ε′′ was observed, in which they both showed an increase in frequency and temperature. The values of M′ and M′′ increase with increasing frequency and temperature. The σ_ac increases with increasing frequency, while it decreases with increasing temperature. It can be concluded, therefore, that the interfacial polarization can occur more easily at low frequencies and temperatures with the number of interface states density located at the metal/semiconductor interface. It contributes to the ε′ and σ_ac.     

Radiation effect on the optical and electrical properties of CdSe(In)/p-Si heterojunction photovoltaic solar cells

The efficiency and radiation resistance of solar cells are graded. They are then fabricated in the form of n-CdeSe(In)/p-Si heterojunction cells by electron beam evaporation of a stoichiomteric mixture of CdSe and In to make a thin film on a p-Si single crystal wafer with a thickness of 100 μm and a resistivity of ～ 1.5 Ω·cm at a temperature of 473 K. The short-circuit current density (j_sc), open-circuit voltage (V_oc), fill factor (ff) and conversion efficiency (η) under 100 mW/cm² (AM1) intensity, are 20 mA/cm², 0.49 V, 0.71 and 6% respectively. The cells were exposed to different electron doses (electron beam accelerator of energy 1.5 MeV, and beam intensity 25 mA). The cell performance parameters are measured and discussed before and after gamma and electron beam irradiation.     

Atmospheric and low pressure shadow masked MOVPE growth of InGaAs(P)/InP and (In)GaAs/(Al)GaAs heterostructures and quantum wells

The shadow masked growth technique is presented as a tool to achieve thickness and bandgap variations laterally over the substrate during metalorganic vapor phase epitaxy. Lateral thickness and bandgap variations are very important for the fabrication of photonic integrated circuits, where several passive and active optical components need to be integrated on the same substrate. Several aspects of the shadow masked growth are characterized for InP based materials as well as for GaAs based materials. Thickness reductions are studied as a function of the mask dimensions, the reactor pressure, the orientation of the masked channels and the undercutting of the mask. The thickness reduction is strongly influenced by the mask dimensions and the reactor pressure, while the influence of the orientation of the channels and the amount of undercutting is only significant for narrow mask windows. During shadow masked growth, there are not only thickness variations but also compositional variations. Therefore, we studied the changes in In/Ga and As/P ratios for InGaAs and InGaAsP layers. It appears that mainly the In/Ga-ratio is responsible for compositional changes and that the As/P-ratio remains unchanged during shadow masked growth.