用激光检验超大规模集成电路

检验大规模集成电路和诊断其缺陷的传统办法是使用尖状探针的机械法。但集成电路不断向亚微米尺度的进军以及随之而来的超大规模集成电路的成就要求有更高灵敏度和非接触式的检验方法，这一情况使设计者转向电子束和激光技术。     

集成电路掩模缺陷的检查

16.1、序言在集成电路制造工艺中,如果集成电路的图形尺寸超过了光的波长,那么用于光刻的光掩模今后也将继续使用。集成电路掩模的检查项目中,包括掩模材料的平面度、图形尺寸和重复节距等的尺寸精度及有无缺陷等。这些项     

用扫描电子显微镜透视半导体和集成电路

用普通扫描电子显微镜 (ＳＥＭ)只能观测样品的表面形貌 ,不能观测到隐藏在表面绝缘层下面的半导体材料和集成电路的微结构。在普通的ＳＥＭ中安装了我们研制成功的透表面检测仪后就可以突破普通的ＳＥＭ只能观测样品表面形貌的限制 ,透过表面绝缘层透视到下面的半导体材料的缺陷和集成电路的微结构。我们在本文中首次公布用改装的ＳＥＭ观测到该绝缘层下面的半导体材料缺陷的微结构 (图 1 )。在研制和生产多层结构的集成电路时 ,在两层电路之间要制作一层ＳｉＯ2 来作绝缘层 ,在制作好的集成电路表面需要制作一层ＳｉＯ2 和Ｓｉ3Ｎ4 组成的…     

厚膜混合集成电路常见工艺缺陷及其消除方法

除设计和材料外，工艺和操作对厚膜混合集成电路的质量和性能也有较大的影响。分析了厚膜混合集成电路生产过程中一些常见的工艺缺陷，如线条变形、起泡、阻值不稳、元件受损、锡珠等的产生原因，并提出了相应的消除方法。     

HIC导带缺陷的电学检测与评估

介绍了通过测试混合集成电路导带的方块电阻、温度系数等电学特性 ,再经过高温存贮试验考核其质量的稳定性 ,对其质量和缺陷进行评估分析 ,探索导带质量缺陷与电学特性的关系 ,为宏观评价导带质量缺陷提供一个快捷的途径。     

印制电路板生产中的自动光学检验

一、绪言最近廿年(特别近十年)以来,印制板自动光学检验问题引起人们广泛地讨论。实际上,在论述图象分析问题的一切参考书中均举例说明了印制板的检验算法。一般说印制板的各种缺陷是可以借助这些算法发现的。但这些年并未造出适合批量生产的目检设备。这可能是因为印制板层图的目检在质量和速度上尚能保证满足要求,从而使印制板生产厂家并未觉感到实行自动检验的紧迫性。然而近来情况有了变化;大规模集成电路和超大规模集成电路这些新型基础元件在设备中广为应用、电路技术已过渡到表面组装,结果是印制板导线宽度变小但布线密度增大、板的尺寸变大、层数增多。现     

掺氮直拉硅单晶的研究和应用

掺氮直拉硅单晶是最早由我国实现产业化并系统研究的集成电路用基础材料，它具有容易消除微缺陷，低成本制备高质量内吸杂洁净区和增加机械强度等优点，这对大直径的现代集成电路用硅片尤其重要。经过10多年的研究和开发，掺氮直拉硅单晶的优越性能逐渐被国际硅产业界和集成电路产业界所接受，目前已经在国际硅工业界相当广泛地使用，成为国际上硅单晶的一个重要新品种。     

厚混合集成电路常见工艺缺陷及其消除方法

除设计和材料外，工艺和操作对厚膜混合集成电路的质量和性能也有较大的影响。分析了厚膜混合集成电路生产过程中一些常见的工艺缺陷，如线条变形、起泡、阻值不稳、元件受损、锡球等的产生原因，并提出了相应的消除方法 。     

半透明氧化铝陶瓷基片的耐化学腐蚀性

<正> 在微波集成电路中,广泛地应用氧化铝陶瓷基底材料,它的性能直接影响着集成电路的优劣。应用于微波集成电路的基片材料,要求其介电常数适当(在C波段和X波段,氧化铝陶瓷的介电常数是较理想的);     

半导体集成电路检验中结构相似性的运用

介绍了结构相似性的含义和特点以及如何在半导体集成电路检验中合理地运用结构相似性程序,包括其运用方法、判别规则和注意事项等,从而提高检验效率,降低检验成本.     

FFT IMAGE APPLICATION TO DETECTION AND ANALYSIS OF THE DEFECTS IN GaAs MATERIALS

The presence of inhomogeneous distribution of defects in GaAs wafers strongly limits thereproductivity of IC fabrication processes.In this paper,we report for the first time a Fourier Transforma-tion Image Testing approach,called FTIT,for the two dimensional evaluation of the disorder in a wafer,asit appears in infrared transmission images.The fourier analysis of the cell struchture reveals a dominant statis-tical rectangular organization of the dislocations along<110>and<010>directions.The definitionsof α and β in the paper are typical of the organization of the cells to evaluate quantitatively properties ofIC materials.     

Defect Detection of IC Wafer Based on Spectral Subtraction

In this paper, spectral subtraction is successfully applied to image processing and to detect defects in the integrated circuit (IC) image. By utilizing the characteristics of many of the same chips in a wafer, three images with defects located in the same position and different chips are obtained. The defect images contain the spectrum of standard image without any defects. Spectral subtraction presented in the paper can extract the standard image from the three defect images. The algorithm complexity of spectral subtraction detecting defects is close to that of Fourier transform. After obtaining the standard image, the speed and accuracy of defects detection can be greatly enhanced using the detection method presented in the paper. Using the image gray-scale matching technology, impact of illumination on IC defect detection is solved. Experiments demonstrate that spectral subtraction is fast and accurate to defect detection in an IC image, and the method has high robustness for illumination.      

高速数字微波共面带线电磁互耦全波分析及模拟器

报道了采用电磁场全波分析方法模拟高速数字微波共面带线传输线电磁互耦特性。共面带线传输线电磁互耦模拟器具有很好的交互式界面，能用于高速集成电路共面带经传输线的电磁场全波分析。     

0.5-μm CMOS circuits for demodulation and decoding of anOFDM-based digital TV signal conforming to the European DVB-T standard

In the context of digital terrestrial TV based on the DVB-T standard, four 0.5-μm CMOS IC's (IC1-IC4) are presented. IC1 integrates an 8-K fast Fourier transform for orthogonal frequency division multiplexing demodulation, IC2 performs channel estimation/correction, and IC3 is a forward error corrector implementing a Viterbi and a Reed-Solomon decoder. IC4, which is based on a digital signal-processing core, performs the synchronization tasks of the complete receiver. These four chips have been designed and manufactured using a 0.5-μm, 3,3-V, triple-metal CMOS process. Their global complexity is about 500 kgates of standard cells and 1.5 Mbits of memory, which represents a total die area of 435 mm² in 0.5 μm. The total power dissipation is about 3.5 W when working at nominal frequency. More generally, these four IC's constitute the digital front-end part of a global chipset receiver (specified within the European project DVBird), also including an analog front end and a MPEG2 demultiplexer IC     

IC设计网上合作研究中心的网络结构及应用

文章阐述了国内第一个将IC设计与网络很好结合的实验基地：IC设计网上合作研究中心的建设及应用情况，中心从技术上实现了IC设计资源的共享和项目的协同开发。文中详细论述了中心总体及局部结构、软件系统和网站结构，多项目晶圆工程（MPW）合作以及LMS集成电路测试验证系统网上应用共享。文章总结了IC设计与网络结合从而促进自身发展的模型，并对以后的发展规划进行了展望。     

Full-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transforms

The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns during modern IC design. This paper presents an accurate and fast analytical full-chip thermal simulator for early-stage temperature-aware chip design. By using the generalized integral transforms (GIT), an accurate formulation is derived to estimate the temperature distribution of full-chip with a truncated set of spatial bases which only needs very small truncation points. Then, we develop a fast Fourier transform like evaluating algorithm to efficiently evaluate the derived formulation. Experimental results confirm that the proposed GIT-based analyzer can achieve an order of magnitude speedup compared with a highly efficient Green's function-based thermal simulator. Finally, we propose a 3-D IC thermal simulator and demonstrate its efficiency and accuracy.     

On computing dominant frequency from bipolar intracardiac electrograms

Dominant frequency (DF) computed from action potentials is a key parameter for investigating atrial fibrillation in animal studies and computer models. A recent clinical trial reported consistent results computing DF from 30 Hz to 400 Hz bandpass filtered bipolar electrograms in humans. The DF (< 15 Hz and, thus, filtered out) was recovered by rectifying the signal, while the theoretical background of this approach was left uncommented. It is the focus of this paper to provide this background by a Fourier analysis. We demonstrate that it is mainly the timing of the narrow deflections (local activation at the catheter tip) which contribute to the DF peak in the frequency spectrum. Due to the typical signal morphology pronounced harmonic peaks occur in the spectrum. This is a disadvantage when computing the regularity index (RI) as a parameter for local organization and signal quality. It is demonstrated for synthetical and patient data that at low DF the RI is far below the optimal value one even for high underlying organization and good signal quality. The insight obtained promotes the development of better measures for organization. The finding that mainly timing of activation contributes to DF might promote the development of powerful realtime signal processing tools for computing DF.     

浅谈新编教材《数字集成电路教程》的特色

介绍了科学出版社2001年出版的新编教材《数字集成电路教程》一书在内容选取、结构编排和讲授方法等方面的特色。指出该教程内容较为先进实用且不失强化基础,信息量大而篇幅适中,重能力培养且具较好可读性。     

IC卡读写器在医疗保险管理信息系统中的应用

IC卡作为一种信息技术可以广泛应用于许多行业领域,如金融、电信等,不同领域均有各自不同的应用特点、应用环境和应用要求,必须适应该领域的特点。国际上有关组织及部分针对各个领域的不同要求,制定了IC卡在某一领域应用的参考或遵循的应用标准。讨论了接触式IC卡读写器作为医疗保险管理信息系统中的一个重要部分的设计应用和基于PC/SC行业规范的读写器驱动程序设计。     

Practical use of CAM in the IC industry

Based on an extensive improvement of cycle time, yield, defect density, equipment utilization and productivity, this paper will review in detail practical examples of data management and utilization through a CAM system. The basis for data utilization is made through the set of CAM reports which has to be designed for its usage by the manufacturers: shift changes, daily, weekly, monthly meetings; orientation towards problem solving; high level of commitment to organization goals. The short-cycle-time culture developed in our international IC manufacturing company has led us to enhance our WIP (Work in Process) management concept and our interaction with production control. It has therefore changed our requirements towards the CAM system especially in terms of scheduling: lot priority, WIP projection, start scheduler.