共查询到19条相似文献,搜索用时 93 毫秒
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以低温界面热阻实验研究为基础,以氮化铝(AlN)和无氧铜(Cu)样品为对象,研究了温度和压力对陶瓷(AlN)和金属(Cu)之间的界面热阻的影响。应用最小二乘法和MATLAB软件工具,得到界面热阻和界面温度以及接触压力之间的关系,建立其数学模型和计算机仿真模型,从而可以预测在不同的界面温度和不同接触压力作用下AlN和Cu之间的界面热阻。界面热阻温度范围90-200K,压力变化范围0.273-0.985MPa,仿真结果与实验结果误差小于5%。这对低温与超导、超导材料及其应用技术有重要意义。 相似文献
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有效导热系数(ETC)是预测火灾下混凝土结构内部温度时空分布的关键物性参数,为此提出了基于考虑界面热阻和粒子形状系数的改进Maxwell-Eucken模型的多相复合材料多尺度均质化方法,以预测高温后纤维增强水泥基复合材料的ETC。首先针对经历不同温度(20、60、150、300、450和600℃)处理后的砂浆、普通高性能混凝土和聚丙烯纤维增强混凝土开展了导热系数和孔隙率的测量试验,随后利用部分试验数据确定所提方法关键参数。最终利用所提方法预测经历不同温度处理后掺加不同含量和尺寸纤维的混凝土的ETC,方法预测结果与其余试验结果吻合良好。研究发现:粒子形状(纤维长度)对水泥基复合材料ETC的影响甚微;界面热阻(粒子与基体脱粘)对ETC的影响显著,界面热阻系数与经历温度呈线性增长关系;聚丙烯纤维熔化蒸发后干燥空气填充,形成管状裂缝热阻,同时柔软的细聚丙烯纤维在浇筑过程中附着在粗骨料表面,蒸发后进一步增加骨料与砂浆之间的界面热阻效应。 相似文献
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高温超导直接冷却中AlN与Bi-2223间界面热阻的实验研究 总被引:4,自引:2,他引:2
基于微结构低温工程学,提出三维低温界面层的概念,指出界面热阻是制冷机直接冷却超导磁体需要解决的关键技术之一。以GM制冷机为冷源,按稳态热流法原理测量了Bi-2223、AIN的热导率及它们之间的低温界面热阻。在0.15MPa-0.55MPa压力范围内,AIN和Bi-2223间的界面热阻随界面层温度和接触压力的升高而降低,并随接触界面处温度的不同表现出不同的变化率。当界面层Bi-2223侧温度为55K时,在0.5469MPa的接触压力作用下,Bi-2223和AIN间的界面热阻是厚度为10mm的AIN垫片体积热阻的38.86倍,是接触压力0.2281MPa时界面热阻的38.7%。 相似文献
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搭建了镓铟锡合金低温液态金属接触热阻实验平台,验证了实验系统的可靠性,对比了常规导热硅脂和液态金属的热阻特性,研究了压力、温度和界面特性对接触热阻的影响规律。实验结果表明,特征测点温度稳定变化且在稳态下具有很小的线性偏差(ε<6%),表明该实验系统具有较高的可靠性。与导热硅脂相比,在74 kPa的界面压力下液态金属的接触热阻降低约71%,且界面接触热阻随着压力的增加而降低。此外,界面温度的升高造成试件界面处液态金属导热系数降低,进而增加界面接触热阻。通过对铜表面镀镍处理能够有效防止液态金属对铜表面发生腐蚀,但镍层存在造成接触热阻增大。 相似文献
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热物理性质不同的材料之间存在界面热阻,界面热阻对热传输过程产生极大的影响,并在很大程度上决定了复合材料的导热性能。金刚石颗粒增强金属基复合材料(Metal matrix composites,MMCs)充分发挥了金刚石的高热导率和低热膨胀系数的优点,有望获得高的热导率以及与半导体相匹配的热膨胀系数,可满足现代电子设备在散热能力上提出的越来越高的要求,作为新一代电子封装材料已引起广泛关注。界面热导(界面热阻的倒数)既是决定复合材料导热能力的关键因素,也是研究的难点,复合材料制备工艺、界面改性方式(金属基体合金化或金刚石表面金属化)以及改性金属种类均会影响界面热导。详细论述了界面热导理论及实验研究的最新成果,并对金刚石/金属复合材料在未来研究中面临的主要问题进行探讨。 相似文献
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为准确测量Ga N HEMT与夹具界面层的热阻,在两种不同的管壳界面材料条件下,利用经过改进的显微红外热像仪测量Ga N HEMT的降温曲线。采用结构函数算法对两种降温曲线进行分析,得到反映器件各层材料热阻的积分结构函数曲线。利用JESD51-14中的方法分别确定结壳热阻分离点和夹具到热沉的热阻分离点,得到结壳热阻Rj-c为1.078 K/W,夹具到热沉的热阻Rf-s为0.404 K/W。利用两种条件下的总热阻减去结壳热阻和夹具到热沉的热阻得到管壳界面材料热阻,导热硅脂热阻为0.657 K/W,空气介质热阻为1.105 K/W。依据该方法可以实现对界面层热阻的测量。 相似文献
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真空低温环境下,接触热阻对热传递有十分重要的影响。根据接触热阻产生机理和实验测试原理,建了一套真空低温环境下固体界面接触热阻测试的实验装置。实验对比研究了不同温度和不同预紧力条件下,固体界面裸接与在界面之间添加真空硅脂、铟膜、石墨烯、石墨片导热填料时的接触热阻。实验结果表明,接触界面的接触热阻都随温度升高和预紧力增大而减小。在接触界面添加真空硅脂或铟膜后接触热阻随预紧力变化非常,裸接或添加石墨烯的接触热阻随预紧力变化较大,但是当预紧力大于2.5 N·m时其接触热阻基本不变。温度越低时添加导热填料减小接触热阻的效果越明显。总之在两界面之间添加铟膜时效果最佳,此时接触热阻随预紧力和温度的变化都较小,此种情况下接触热阻最小可以达到3.5×10~(-6)K·m~2/W。 相似文献
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Juekuan Yang Yang Yang Scott W. Waltermire Timothy Gutu Alfred A. Zinn Terry T. Xu Yunfei Chen Deyu Li 《Small (Weinheim an der Bergstrasse, Germany)》2011,7(16):2334-2340
The intrinsic thermal conductivity of an individual carbon nanotube and its contact thermal resistance with the heat source/sink can be extracted simultaneously through multiple measurements with different lengths of the tube between the heat source and the heat sink. Experimental results on a 66‐nm‐diameter multiwalled carbon nanotube show that above 100 K, contact thermal resistance can contribute up to 50% of the total measured thermal resistance; therefore, the intrinsic thermal conductivity of the nanotube can be significantly higher than the effective thermal conductivity derived from a single measurement without eliminating the contact thermal resistance. At 300 K, the contact thermal resistance between the tube and the substrate for a unit area is 2.2 × 10?8 m2 K W?1, which is on the lower end among several published data. Results also indicate that for nanotubes of relatively high thermal conductance, electron‐beam‐induced gold deposition at the tube–substrate contacts may not reduce the contact thermal resistance to a negligible level. These results provide insights into the long‐lasting issue of the contact thermal resistance in nanotube/nanowire thermal conductity measurements and have important implications for further understanding thermal transport through carbon nanotubes and using carbon nanotube arrays as thermal interface materials. 相似文献
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With a knowledge of the thermal resistance value associated with an asperity, a model for the thermal contact resistance of a given interface is obtained by considering that each asperity of surfaces in contact is a flux tube. Calculation of any of the thermal conductances depends on the contact radius of each asperity. This radius increases with load, as asperities are compressed. Contact area is calculated for a plastic load. Values of thermal contact conductance (or resistance) are compared with experimental results. 相似文献
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L. K. KEPPAS N. K. ANIFANTIS 《Fatigue & Fracture of Engineering Materials & Structures》2010,33(3):174-182
The present study investigates the transient behaviour of interfacial cracks in thermal barrier coatings. It is assumed that a TBC withstands a thermal shock in the presence of external mechanical load acting on its surface. Crack closure takes place while the thermal contact resistance as well the friction between the crack faces is considered. The dependence of the thermal resistance on the contact pressure invokes coupling between the temperature and displacement fields. An appropriate boundary element procedure based on two‐dimensional time‐dependent thermoelasticity, is utilized for the numerical solution. A series of parametric analyses examines the impact of the coefficient of friction, thermal contact resistance and coefficient of heat convection on the crack severity. 相似文献
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M. A. Raza A. V. K. Westwood A. P. Brown C. Stirling 《Journal of Materials Science: Materials in Electronics》2012,23(10):1855-1863
Graphite nanoplatelets (GNP)/silicone composites are potential thermal interface materials due to their high thermal conductivity and compliance. In this study, performance as thermal interface materials is studied by measuring thermal contact resistance. The effect of surface roughness, particle size of GNPs, wt% GNPs, temperature and applied pressure on the thermal contact resistance of the composite coatings was determined. The GNP/silicone coating performed much better on rough surfaces than on smooth surfaces. The composite coating consisting of large GNPs is more effective than small GNPs probably due to the two times higher thermal conductivity of the former. The thermal contact resistance of the GNP/silicone composite increased by ~3–10% with an increase of temperature but remained unaffected by an increase of pressure. The comparison of GNP/silicone composite coatings with GNP-based thermal pastes showed that the former perform much better in thick bond lines. 相似文献