高亮度AlGaInP红光发光二极管

对用于提高AlGaInP红光发光二极管(LED)出光效率的分布布拉格反射镜(DBR)和增透膜进行了分析,用金属有机物化学气相沉积(MOCVD)生长了包含DBR和增透膜的LED,在20 mA注入电流下,LED的峰值波长为623 nm,光强达到200 mcd,输出光功率为2.14 mW.与常规的LED相比,光强和输出光功率有很大的提高.     

高亮度AIGalnP红光发光二极管

对用于提高AlGaInP红光发光二极管(LED)出光效率的分布布拉格反射镜(DBR)和增透膜进行了分析,用金属有机物化学气相沉积(MOCVD)生长了包含DBR和增透膜的LED,在20mA注入电流下,LED的峰值波长为623nm,光强达到200mcd,输出光功率为2.14mW。与常规的LED相比,光强和输出光功率有很大的提高。     

面向投影仪的LED阵列单位Etendue光通量的研究

基于各种结构LED芯片的出光特性,计算了得到的芯片及集成阵列实际的光学扩展量(Etendue),以此分析了面向投影仪光源的LED集成阵列在不同芯片间距和芯片厚度条件下的单位光学扩展量的光通量.结果表明,在面向LED投影仪的多芯片集成阵列光源中,使用剥离衬底的垂直结构芯片容易获得更高的单位Etendue光通量,从而有利于提高投影仪亮度.同时,对一种表面球形凹坑周期性微结构的倒装垂直结构LED芯片的集成阵列单位Etendue光通量进行了分析.在无封装的情况下,该结构芯片集成阵列的单位Etendue光通量较普通蓝宝石正装芯片和SiC倒装芯片的集成阵列分别高出164%和150%.     

采用ICP干法刻蚀ITO提高GaN基LED的特性

针对常规双电极蓝宝石衬底GaN基LED,为了提高出光效率,在P-GaN表面生长一层ITO作为电流扩展层和增透膜。但是,在腐蚀ITO的过程中,经常会遇到ITO被侧向腐蚀的问题。本文中,通过湿法腐蚀得到的ITO薄膜大概被腐蚀掉6.43%～1/3的面积。这个问题可以通过ICP干法刻蚀来解决,ICP干法刻蚀能很好的改善ITO侧向腐蚀,并且工艺简单,能很好的改善LED器件的特性。得到的ITO薄膜边缘陡峭,面积完整,相较于湿法腐蚀ITO,在工作中ICP干法刻蚀ITO的LED,发光面积最少能提高6.43%,光强最高能提高45.9%。     

透明导电ITO欧姆接触的AlGaInP薄膜发光二极管

提出了一种透明导电氧化铟锡(ITO)欧姆接触的AlGaInP薄膜发光二极管(LED)的结构和制作工艺.在这个结构里,ITO还作为窗口层材料,增强电流扩展,并应用了高反射率的金属作为反光镜.用Au-Sn合金(Au∶Sn＝8∶2,重量比)作为焊料,把带有金属反光镜的AlGaInP LED(RS-LED)外延片倒装键合到GaAs基板上,并去掉外延GaAs衬底,把被GaAs衬底吸收的光反射出去.与常规AlGaInP吸收衬底LEDs(AS-LED)和带有分布布拉格反光镜(DBR)的AlGaInP吸收衬底LEDs(DBR-AS-LED)电、光特性的比较,用透明导电ITO做欧姆接触的AlGaInP薄膜RS-LED结构能极大提高光输出功率和发光强度.正向电流20 mA时,RS-LED的光输出功率分别是AS-LED和DBR-AS-LED的2.4倍和1.7倍;RS-LED 20 mA下峰值波长624 nm的轴向光强达到了179.6 mcd,分别是AS-LED 20 mA下峰值波长627 nm和DBR-AS-LED 20 mA下峰值波长623 nm轴向光强的2.2倍和1.3倍.     

具有ITO/Ti3O5薄膜结构的高亮度AlGaInP LED

采用ITO/Ti_3O_5薄膜结构作为高亮度AlGaInP LED的电流扩展层、窗口层、电流阻挡层和增透膜层。通过在电极下形成肖特基结,避免电极下方无效电流注入,提高局域电流密度。通过ITO/Ti_3O_5增透膜设计提升LED的光提取效率。具有该ITO/Ti_3O_5薄膜结构的主波长621 nm的高亮度AlGaInP LED芯片(150μm×150μm)较传统结构芯片发光强度提升40%,20 mA注入电流下,电压均值在2.1 V左右。     

Ni纳米粒子掩膜用于提高GaN基LED出光率的研究

以无水乙醇为溶剂、柠檬酸为分散剂,用超声分散技术配制Ni纳米粒子分散液;将分散液用旋涂的方法在GaN基发光二极管(LED)的ITO电流扩展层上制备单层Ni纳米粒子掩膜,采用ICP(inductively coupledplasma)干法刻蚀技术在ITO层上制作出表面粗化的结构。在20 mA工作电流下,与普通GaN基LED相比,这种ITO表面粗化的GaN基LED芯片发光强度提高了30%,并且对器件的电性能影响很小。结果表明,该表面粗化技术是一种工艺简单、成本低和能有效提高LED发光效率的方法。     

快速热退火对真空蒸镀ITO InGaN/GaN蓝光LED的影响

制作了8milX 10mil的InGaN/GaN 蓝光LED(λ=460nm),采用了真空蒸镀在P-GaN上淀积了240nm的ITO。对不同温度下(100℃至550℃)热退火ITO的电学特性和光学特性进行了比较分析。实验发现,450℃下热退火ITO电阻率低至1.19X10_-4Ω?cm,而此温度下得到高透射率94.17%。在20mA注入电流下,正向电压和输出功率分别为3.14V and 12.57mW。另外,550℃ITO退火下制备的LED光通量最大,为0.49lm,这是因为此温度下透射率较大。     

白光 LED 封装材料的光学特性对光通量的影响

封装材料的光学特性是影响白光 LED 光通量的主要因素之一,基于蒙特卡洛非序列光线追迹的方法,应用专业光学仿真软件 Lighttools 系统地研究了硅胶折射率、荧光粉颗粒粒径、反光杯表面反光类型及反光率几种光学特性条件下的白光 LED 光通量。研究结果表明：硅胶折射率存在最优值（n=1.48）使得白光 LED 光通量最大;在相同色温的前提下荧光粉颗粒粒径与光通量成反比关系;漫反射表面对于光通量的提高优于镜面反射,同时光通量均随着反光率的升高而升高,这些规律对于实际生产研究具有指导意义。     

图形蓝宝石衬底GaN基发光二极管的研制

采用抗刻蚀性光刻胶作为掩膜,并利用光刻技术制作周期性结构,进行ICP干法刻蚀C面(0001)蓝宝石制作图形蓝宝石衬底(PSS);然后,在PSS上进行MOCVD制作GaN基发光二极管(LED)外延片;最终,进行芯片制造和测试。PSS的基本结构为圆孔,直径为3μm,间隔为2μm,深度为864 nm,呈六角形分布。与同批生长的普通蓝宝石衬底(CSS)GaN基LED芯片相比,PSS芯片的光强和光通量比CSS分别提高57.32%和28.33%(20 mA),并可减小芯片的反向漏电流,且未影响芯片的波长分布和电压特性。     

Materials for light emitting diodes

III–V semiconductor display diodes fall into three material categories: direct, indirect, and diode-phosphor combinations. The light generation mechanisms are well understood in each case. On the basis of the luminous efficacy achieved in the laboratory, the merit of the various materials is in the order: GaP: N (green), GaP: Zn, O (red), GaInP (yellow), GaAsP (red), GaAlAs (red) and GaAs-phosphor combinations (red, green, blue). A more comprehensive assessment of quality must take into account factors such as the economic feasibility of the methods of synthesis, the applicability to monolithic arrays, and the suitability of spectra (hue, contrast, saturation, etc.). The degree of importance of these matters and the limitations of the various materials are less well-defined at present. New developments which may have an impact on the future of display diodes include the use of Al_xGa_1-xP in place of GaP to shift spectra to shorter wavelengths, the possible development of very bright direct alloys of InP with either GaP or A1P, and the doping of GaAsP with N to extend its range of colors.     

有机白光LED

有机白光LED主要有电致发光与光致发光两类。电致发光的主要机理有:量子阱发光、激基复合物发光和能量转移。人们对有机电致发光白光LED研究较多,不久将有产品问世;而对光致发光研究较少。与电致发光相比,光致发光造价更小,其荧光量子效率或许比电致发光更高。有机白光LED制备工艺简单、成本低功耗小,具有巨大的应用价值及潜在的市场。对发光显示技术,有机白光LED代表了一条“便宜”经济的路径。综述了有机白光LED的机理及发展现状。     

High-brightness AlGaInP light emitting diodes

First commercially introduced in 1990, AlGaInP light emitting diodes (LEDs) currently are the highest (luminous) efficiency visible solid-state emitters produced to date in the red through yellow spectral regime. The attainment of this high-efficiency performance is a result of the development of advanced metalorganic chemical vapor deposition crystal growth techniques, which have facilitated the high-quality growth of this quaternary alloy as well as the implementation of complex device designs. Furthermore, the highest efficiency family of AlGaInP devices (based upon a transparent-substrate platform and commercially introduced in 1994) have been realized as result of the development and implementation of direct compound semiconductor wafer bonding technology. As a result, the luminous efficiency of AlGaInP LEDs exceeds or rivals that of unfiltered incandescent lamps and other conventional lighting sources. Further improvements in these techniques (and the realization of efficient, high-power LEDs) are expected to make AlGaInP LEDs even more competitive with conventional lamp technology, thus enhancing the position of LED's in many applications as a preferred lighting source     

Silicon compatible organic light emitting diode

As an effort toward a goal of monolithic optoelectronics for silicon (Si) chip-to-chip connections, we have fabricated organic light emitting diodes (LED's) using either heavily N-doped silicon (Si) as a cathode or P-doped Si as an anode. A thin silicon dioxide (SiO₂ ) layer, thermally grown on Si before deposition of a polymer or a molecular organic layer, enhances the electron injection into the semiconducting emissive layer. Without the thin oxide layer, no light was observed from LED's made from either (2-methoxy, 5-(2'-ethyl-hexoxy)-1, 4-phenylene vinylene) (MEH-PPV) or 8-hydroxyquinoline aluminum (Alq). With the SiO₂ layer,the internal quantum efficiencies as high as 0.02% and 0.5% have been observed for MEH-PPV and Alq, respectively, and the turn-on voltages were as low as 2.5 V and 8 V, again for MEH-PPV and Alq, respectively. From the LED response time measurement, we identified RC constant and the recombination time of transport-related traps as the speed limiting factors     

高亮度LED调光技术

高亮度发光二极管(HB LED)在各种领域应用普及.并要求HB LED具备有调光功能.在现有的几种调光技术中,从简单的可变电阻负载到复杂的脉冲宽度调制(PWM)开关,每一种方法均有其利弊.PWM调光的效率最高,电流控制也最精准.论述了HB LED在调光时的特性,介绍了LM3405评估板及其功能.包括其布局、原理图和元件清单.     

Degradation of AlGaN-based ultraviolet light emitting diodes

Aging the LEDs by driving at high current, results in the decrease of optical power proportional to the reciprocal square route of stress time. With aging time, change in the current–voltage characteristics indicates decrease of the current at low voltage below the light emission threshold, decrease of the forward voltage drop at high currents and usually no change in the series resistance. No change in the peak wavelength and half bandwidth were found with aging. Low frequency noise measured at low and high currents either did not depend on aging time or decreased. No correlation between noise, the device power, and the rate of the power degradation were found. These results are in strong contrast to previous studies of longer wavelength GaN-based LEDs. The possible degradation mechanism is the diffusion of the Al atoms out from the p-type cladding layer and lowering of the cladding layer potential barrier as a result.     

硅基发光材料研究进展

阐述了等电子杂质、掺Er硅、硅基量子结构(包括量子阱、量子线和量子点)及多孔硅的发光机理,综述了90年代以来a-Si/SiO2、SiGe/Si等Si基异质结构材料的优异特性和诱人的应用前景,着重介绍了能带工程为Si基异质结构带来的新特性、新功能,重点介绍了硅基量子点的制备和发光机理,综述了半导体量子点材料的最新发展动态和发展趋势。     

面向彩色有机微显示的有机白光顶发射器件

以比铝、银等金属材料透光性更好的铜作为白光有机顶发射器件的顶电极,将其应用到基于Al底电极的蓝、黄互补色顶发射白光有机电致发光器件(TEWOLED),通过合理设计器件结构,制备出的器件具有较低的驱动电压和较高的效率,4V下亮度超过1 000cd/m2、功率效率达到28.5lm/W,效率滚降较小。我们利用p型电学掺杂结构和电子注入缓冲层结构分别解决了铝和铜电极功函数同空穴传输层的HOMO能级和电子传输层的LUMO能级不匹配问题,并通过TcTa光学覆盖层的调节作用使器件具有较好的光谱稳定性。基于Cu顶电极的TEWOLED与采用Al作为互连金属的CMOS工艺兼容,我们将该器件与硅基CMOS驱动电路结合,获得了SVGA白光有机微显示器件,为彩色有机发光微显示的实现奠定了基础。     

Red hot [light emitting diodes]

Light-emitting diodes are ubiquitous in today's high-tech world. But no matter what their application or color, their origin can be traced to the red LED created in 1962 by Nick Holonyak Jr., the winner of this year's IEEE Medal of Honor. The article describes Holonyak's career and the work which produced the first LED, and shows how his influence permeates the industry today.