热熔压敏胶的研究进展

介绍了热熔压敏胶的特点,综述了热塑性弹性体热熔压敏胶、丙烯酸酯类热熔压敏胶、有机硅类热熔压敏胶、无定型聚烯烃类热熔压敏胶、橡胶基热熔压敏胶的国内外研究进展,并对其各自优缺点进行了分析。最后对热熔压敏胶的发展方向进行了展望。     

热熔压敏胶的开发应用

概述了热熔压敏胶的发展历史及现状,介绍了热熔压敏胶的研究、应用及最新研究进展。     

热熔压敏胶的发展动向及其应用

全面介绍了热熔压敏胶及其制品在国内外的发展概况、热熔压敏胶生产设备种类和特点以及压敏胶制品在各行业的应用。     

热塑性弹性体型热熔压敏胶的研究进展

介绍了热熔压敏胶用热塑性弹性体以及增粘树脂的特点、作用以及研究进展,并对热熔压敏胶的发展方向以及应用前景进行了展望。     

丙烯酸酯压敏胶的研究进展

概述了近年来各种丙烯酸酯类PSA(压敏胶)的研究进展,重点介绍了乳液型、溶剂型、热熔型和辐射固化型丙烯酸酯类PSA的制备工艺及应用性能。最后对丙烯酸酯类PSA的发展方向进行了展望。     

无溶剂型热熔压敏胶的制备及影响因素研究

本文阐述了苯乙烯-异戊二烯嵌段共聚物(SIS)在热熔压敏胶的应用,列举了热熔压敏胶所需原料组分,并展开对热熔压敏胶的影响因素作了进一步研究,探讨了着不同嵌段结构、增粘树脂选型及加入量、环烷油加入量及SIS加入量对热熔压敏胶性能的影响。     

UV光固化压敏胶的制备方法及研究进展

综述了UV光固化压敏胶主要组成、固化机理,介绍了UV光固化聚丙烯酸酯压敏胶、UV光固化聚氨酯压敏胶、UV光固化聚酯类压敏胶及UV光固化热熔压敏胶的制备方法和研究进展,同时对UV光固化压敏胶的发展前景进行了展望。     

石油树脂在热熔压敏胶中的应用

综述了石油树脂在热熔压敏胶中的应用,特别是在以SIS、SBS型HMPSA中的应用,最后指出了石油树脂今后在热熔压敏胶中应用的研究方向。     

同向双螺杆挤出机在连续生产热熔压敏胶中的应用

主要介绍了采用同向双螺杆挤出机生产热熔压敏胶技术特点和技术应用;分析了连续生产热熔压敏胶的过程中影响产品质量的关键点和影响因素。相比传统的反应釜式生产工艺,因其具有突出的优势,是今后连续生产热熔压敏胶的研究热点。     

SIS、SEBS在热熔压敏胶中的应用

介绍了国产SIS性能及应用特点以及常用用增粘树脂、增塑剂的性能及应用特点;考查了复合增粘树脂、复合增塑剂对SIS热熔压敏胶性能的影响;研究了SEBS在热熔压敏中的应用,提供了SEBS热熔压敏胶基础配方。     

两嵌段SI对SiS及其热熔压敏胶性能的影咱

研究了两嵌段SI对SIS及其热熔压敏胶性能的影响。结果表明,SI含量增加,SIS的拉伸强度降低,熔体流动速率（MFR）增大,其热熔压敏胶初粘性增大、持粘性减小,180°剥离强度先增大后减小,熔融黏度和软化点降低。两嵌段SI分子质量增加,SIS的MFR降低,其热熔压敏胶的熔融黏度和软化点增大。两嵌段SI嵌段比增加,SIS的硬度增大、MFR降低,其热熔压敏胶的初粘性减小,熔融黏度和软化点增大。     

耐低温SBS热熔压敏胶的研制与应用

以长链高级脂肪酸(H18)、松香和甘油为原料,合成了低软化点、低酸值、低黏度和高透明性的H18改性松香甘油酯;然后以此作为SBS(苯乙烯-丁二烯-苯乙烯热塑性弹性体)基热熔压敏胶(HMPSA)的增黏树脂,探讨了H18改性松香甘油酯含量对HMPSA性能的影响。结果表明:当w(H18改性松香甘油酯)=10%时,HMPSA的环形初粘力、180°剥离强度相对最大,比未改性体系分别增加了54.81%、35.29%;适量的H18改性松香甘油酯可有效降低HMPSA的玻璃化转变温度(T_g)、提高HMPSA的耐寒性。     

基材及其特性对热熔压敏胶粘接性能的影响

从热熔压敏胶(HMPSA)的配方、施胶工艺和透气底膜的特性角度,分析了卫生用品用HMPSA失黏的原因;通过测试HMPSA的初始剥离力、模拟使用剥离力和老化后剥离力等性能,研究了不同基材及其特性对HMPSA的耐老化性和粘接性能等影响。研究结果表明:HMPSA与底膜的稳定性是引起HMPSA失黏的最主要因素;透气底膜中的填料及其含量,对HMPSA的失黏影响很大;老化前后HMPSA与标准棉布的初始剥离力变化越大,表明HMPSA中低相对分子质量的助剂向底膜迁移的现象越严重、HMPSA的粘接性能越不稳定且越易发生失黏现象。     

标签用热塑性弹性体SDS热熔压敏胶性能的探讨

为改善热熔压敏胶黏制品一不干胶标签的黏附性能,并进一步降低生产成本,研究了以苯乙烯系热塑性弹性体SDS（包括SBS、SIS）为基本树脂合成的热熔压敏胶的性能,并讨论了增黏树脂及软化剂的种类和用量对标签用热熔压敏胶性能的影响。结果显示,在以SIS为主体材料的热熔压敏胶中,添加价格较低的SBS,当其配比在15／85～25／75之间,热熔压敏胶的性能有所提高;而增黏树脂及软化剂的优化,对胶黏剂的综合性能有着不可忽视的作用。     

国产SIS热熔压敏胶的研制

以国产SIS为主体原料 ,配合增粘树脂、增塑剂、软化剂、防老剂等研制出SIS热熔压敏胶。讨论了各组分对性能的影响 ,并对它的粘接性能进行了测试。实验结果证明 ,国产SIS性能良好 ,完全可以替代进口料用于生产热熔压敏胶     

Study on Adhesion Properties of a Hot-Melt Pressure-Sensitive Adhesive Based on Epoxidized Styrene–Isoprene-Styrene Triblock Copolymers (ESIS) for Transdermal Drug Delivery Systems

Pressure sensitive adhesives are a critical component in transdermal drug delivery systems (TDDS). In this study, styrene-isoprene-styrene triblock copolymers (SIS) was epoxidized with peroxyformic acid generated in situ. The hot-melt pressure sensitive adhesive (HMPSA) of ESIS with hydrogenated rosin, epoxidized soybean oil, and antioxidant was prepared. The structure and properties of ESIS were characterized with infrared spectroscopy and dynamic mechanical analysis (DMA). Water content and water vapor transmission rate on ESIS membranes were determined. The adhesion properties of HMPSA of ESIS were investigated. The experimental results showed that the HMPSA of ESIS was superior to traditional HMPSA of SIS in 180°peel strength when the substrates were polar materials, such as PVC and steel.     

SIS热熔压敏胶抗热氧老化研究

采用正交试验设计法对SIS热熔压敏胶的各种原料进行优选,通过对剥离强度、初黏力等重要性能的考察,确定了制备SIS热熔压敏胶的主体材料,找到了制备SIS热熔压敏胶的最佳配方为：SIS：矿物油：PIB：C5石油树脂=100：60：60：140。重点研究了SIS热熔压敏胶的热氧老化问题,通过改变抗氧剂种类、用量及老化时间来研究抗氧体系对SIS热熔压敏胶性能的影响。最终确定了最佳抗氧剂配方为：氧化锌：SIS-1105：环烷油-4010：PIB：C5石油树脂（C-100W）：偶联剂：2246：168=80：100：60：60;140：5：0．5：0．5。     

SBS热熔压敏胶的研制

本文概述了ＳＢＳ热熔压敏胶的应用和发展状况。详细讨论了ＳＢＳ树脂，增粘剂，增剂等添加剂及配方的选择。对该胶进行了性能试验，最后以ＳＢＳ热熔压的合理制备工艺和配方。     

苯乙烯-异戊二烯嵌段聚合物热熔压敏胶性能影响因素探讨

用不同种类增粘树脂、不同牌号苯乙烯-异戊二烯嵌段聚合物(简称SIS)制备SIS热熔压敏胶,考察不同种类增粘树脂、不同牌号SIS及萜烯树脂含量对SIS热熔压敏胶性能的影响,结果表明:萜烯树脂是改性SIS热熔压敏胶适宜的增粘树脂,当萜烯树脂在SIS热熔压敏胶中含量达50%时,SIS热熔压敏胶性能较佳,随不同牌号SIS中两嵌段SI含量的增加,SIS热熔压敏胶的剥离强度有所增加,持粘力有所下降。     

Viscoelastic and adhesive properties of polystyrene-hydrogenated (3,4-polyisoprene and 1,4-polyisoprene)-polystyrene and polymethyl methacrylate-polybutyl acrylate-polymethyl methacrylate-based HMPSA

In the current study, hot melt pressure sensitive adhesives (HMPSA) were prepared by blending polystyrene-hydrogenated (3,4-polyisoprene and 1,4-polyisoprene)-polystyrene (HYBRAR7311), polymethyl methacrylate-polybutyl acrylate-polymethyl methacrylate (LA2250), tackifier, and other additives in an internal mixer. The compatibility of LA2250, HYBRAR7311, and glycerol rosin ester was investigated on the basis of transparency, differential scanning calorimeter, and scanning electron microscope. The results indicated that glycerol rosin ester was compatible with HYBRAR7311 and LA2250, while HYBRAR7311 was only partly compatible with LA2250. Besides, styrene-ethylene-butene-styrene block copolymers grafted MALEIC ANLYDRIDE was used as compatibilizer added into HMPSA. Although it increased the compatibility and shear strength yet the tack and peel strength were sharply decreased. Simple variable method was used to study the effect of main components on the tack, peel strength, and shear strength of HMPSA. The relationship between adhesive properties and viscoelastic properties of HMPSA was studied via dynamic mechanical analysis. The investigation showed that the smaller storage modulus at low frequency (0.01–0.1?1/s), the larger the tack. Peel strength was found proportional to G′′(f₁)/G′(f₂)(f₁?=?32.03?1/s, f₂?=?0.07?1/s). Similarly, the effect of this blend on damping performance and substrate on peel strength of HMPSA was investigated which was found excellent in this case. The peel strength of polypropylene was larger when HYBRAR7311 content was more than LA2250. However, the peel strength of polycarbonate and polyethylene glycol terephthalate was larger when LA2250 content was more than HYBRAR7311. Furthermore, the mechanical properties of HYBRAR7311/LA2250 HMPSA were found to be superior to the one-polymer HMPSA.