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1.
An analog front-end LSI for 1200/2400 full-duplex modems which conform to CCITT V.22. and Bell 212A is described. The chip includes A/D and D/A converters, bandlimiting filters, delay equalizers, AGC circuit, tone generator, multipurpose low-pass filter, and voltage reference generator. The chip is fabricated by a 5-/spl mu/m CMOS process, and chip size is 6.50 mm/spl times/6.37 mm. The circuit operates from +5.0-V and -5.0-V power supplies. Typical power consumption is 100 mW.  相似文献   

2.
A complete two-chip solution comprised of an analog front end (AFE) and a general-purpose microcontroller (/spl mu/C) for a full-duplex 2400-b/s modem is discussed. The /spl mu/C performs all the necessary digital signal processing algorithms for modem signals along with providing software for modem control and the widely used AT command set. The AFE chip incorporates a ROM-based transmitter, 51 orders of filtering for channel selection, an automatic pain control circuit, and many other complex analog signal processing functions employing 65 op-amps on a 53000-mil/SUP 2/ die area with 150-mW power in a CMOS process. Design details on some of the functional blocks of the AFE are presented.  相似文献   

3.
An analog front end for the 2400-b/s v.22bis modem has been implemented in a 3-μm CMOS process. A high level of integration in the front end results in a low-cost, high-performance modem system. A mix of analog switched-capacitor and digital circuits is used throughout the chip. Some of the major functional blocks are a modulator, tone generator, band-split filters, programmable receive gain stage, 8-bit ADC (analog-to-digital converters), bandgap voltage reference, and special signal detectors. Features are included to support a number of lower-speed, split-band modem standards. The chip occupies 59000 mils 2 and dissipates 200 mW. System and circuit aspects of the design are discussed; measured performance of the IC and of the complete modem system are given  相似文献   

4.
An integrated transceiver for broadband wireline networks is presented. The transceiver includes a receive data path, a transmit data path, and auxiliary functions including serial port interface, clock and reference generation blocks, and voltage regulator control circuitry. The receive data path provides constant input impedance and is composed of two variable gain amplifier (VGA) blocks, a tuned analog 4-pole filter, a 12-b analog-to-digital converter (ADC) sampling at 32 MHz, and a digital high-pass filter. Filter tuning using switched-capacitor arrays occurs in the background, with no effect on signal reception. The transmit data path contains digital interpolation filters and a 12-b digital-to-analog converter (DAC) sampling at 128 MHz. The chip was implemented in double-poly triple-metal 0.35-μm CMOS technology. Measured performance for both receive and transmit data paths meets target specifications with no noticeable crosstalk  相似文献   

5.
A 14-bit, 40-MHz analog front end (AFE) for CCD scanners is analyzed and designed. The proposed system incorporates a digitally controlled wideband variable gain amplifier (VGA) with nearly 42 dB gain range, a correlated double sampler (CDS) with programmable gain functionality, a 14-bit analog-to-digital converter and a programmable timing core. To achieve the maximum dynamic range, the VGA proposed here can linearly amplify the input signal in a gain range from -1.08 to 41.06 dB in 6.02 dB step with a constant bandwidth. A novel CDS takes image information out of noise, and further amplifies the signal accurately in a gain range from 0 to 18 dB in 0.035 dB step. A 14-bit ADC is adopted to quantify the analog signal with optimization in power and linearity. An internal timing core can provide flexible timing for CCD arrays, CDS and ADC. The proposed AFE was fabricated in SMIC 0.18 μm CMOS process. The whole circuit occupied an active area of 2.8×4.8 mm2 and consumed 360 mW. When the frequency of input signal is 6.069 MHz, and the sampling frequency is 40 MHz, the signal to noise and distortion (SNDR) is 70.3 dB, the effective number of bits is 11.39 bit.  相似文献   

6.
7.
This paper describes a 4-state rate-1/2 analog convolutional decoder fabricated in 0.8-μm CMOS technology. Although analog implementations have been described in the literature, this decoder is the first to be reported realizing the add-compare-select section entirely with current-mode analog circuits. It operates at data rates up to 115 Mb/s (channel rate 230 Mb/s) and consumes 39 mW at that rate from a single 2.8-V power supply. At a rate of 100 Mb/s, the power consumption per trellis state is about 1/3 that of a comparable digital system. In addition, at 50 Mb/s (the only rate at which comparative data were available), the power consumption per trellis state is similarly about 1/3 that of the best competing analog realization (i.e., excluding, for example, PR4 detectors which use a simplified form of the Viterbi algorithm). The chip contains 3.7 K transistors of which less than 1 K are used in the analog part of the decoder. The die has a core area of 1 mm2, of which about 1/3 contains the analog section. The measured performance is close to that of an ideal Viterbi decoder with infinite quantization. In addition, a technique is described which extends the application of the circuits to decoders with a larger number of states. A typical example is a 64-state decoder for use in high-speed satellite communications  相似文献   

8.
A 1.8-V 15-bit 40-MSample/s CMOS pipelined analog-to-digital converter with 90-dB spurious-free dynamic range (SFDR) and 72-dB peak signal-to-noise ratio (SNR) over the full Nyquist band is presented. Its differential and integral nonlinearities are 0.25 LSB and 1.5 LSB, respectively, and its power consumption is 400 mW. This performance is enabled by digital background calibration of internal digital-to-analog converter (DAC) noise and interstage gain errors. The calibration achieves improvements of better than 12 dB in signal-to-noise plus distortion ratio and 20 dB in SFDR relative to the case where calibration is disabled. Other enabling features of the prototype integrated circuit (IC) include a low-latency, segmented, dynamic element-matching DAC, distributed passive input signal sampling, and asymmetric clocking to maximize the time available for the first-stage residue amplifier to settle. The IC is realized in a 0.18-/spl mu/m mixed-signal CMOS process and has a die size of 4mm/spl times/5 mm.  相似文献   

9.
A 1.5-V, 10-bit, 14.3-MS/s pipeline analog-to-digital converter was implemented in a 0.6 μm CMOS technology. Emphasis was placed on observing device reliability constraints at low voltage. MOS switches were implemented without low-threshold devices by using a bootstrapping technique that does not subject the devices to large terminal voltages. The converter achieved a peak signal-to-noise-and-distortion ratio of 58.5 dB, maximum differential nonlinearity of 11.5 least significant bit (LSB), maximum integral nonlinearity of 0.7 LSB, and a power consumption of 36 mW  相似文献   

10.
A pipelined, 13-bit, 250-ksample/s (ks/s), 5-V, analog-to-digital (A/D) converter has been designed and fabricated in a 3-μm, CMOS technology. Monotonicity is achieved using a reference-feedforward correction technique instead of (self-) calibration of trimming to minimize the overall cost. The prototype converter requires 3400 mil2, and consumes 15 mW  相似文献   

11.
This paper presents a pipelined analog-to-digital converter (ADC) operating from a 0.5-V supply voltage. The ADC uses true low-voltage design techniques that do not require any on-chip supply or clock voltage boosting. The switch OFF leakage in the sampling circuit is suppressed using a cascaded sampling technique. A front-end signal-path sample-and-hold amplifier (SHA) is avoided by using a coarse auxiliary sample and hold (S/H) for the sub-ADC and by synchronizing the sub-ADC and pipeline-stage sampling circuit. A 0.5-V operational transconductance amplifier (OTA) is presented that provides inter-stage amplification with an 8-bit performance for the pipelined ADC operating at 10 Ms/s. The chip was fabricated on a standard 90 nm CMOS technology and measures 1.2 mm times 1.2 mm. The prototype chip has eight identical stages and stage scaling was not used. It consumes 2.4 mW for 10-Ms/s operation. Measured peak SNDR is 48.1 dB and peak SFDR is 57.2 dB for a full-scale sinusoidal input. Maximal integral nonlinearity and differential nonlinearity are 1.19 and 0.55 LSB, respectively.  相似文献   

12.
A 1.8-V 10-Gb/s fully integrated CMOS optical receiver analog front-end   总被引:2,自引:0,他引:2  
A fully integrated 10-Gb/s optical receiver analog front-end (AFE) design that includes a transimpedance amplifier (TIA) and a limiting amplifier (LA) is demonstrated to require less chip area and is suitable for both low-cost and low-voltage applications. The AFE is fabricated using a 0.18-/spl mu/m CMOS technology. The tiny photo current received by the receiver AFE is amplified to a differential voltage swing of 400 mV/sub (pp)/. In order to avoid off-chip noise interference, the TIA and LA are dc-coupled on the chip instead of ac-coupled though a large external capacitor. The receiver front-end provides a conversion gain of up to 87 dB/spl Omega/ and -3dB bandwidth of 7.6 GHz. The measured sensitivity of the optical receiver is -12dBm at a bit-error rate of 10/sup -12/ with a 2/sup 31/-1 pseudorandom test pattern. Three-dimensional symmetric transformers are utilized in the AFE design for bandwidth enhancement. Operating under a 1.8-V supply, the power dissipation is 210 mW, and the chip size is 1028 /spl mu/m/spl times/1796 /spl mu/m.  相似文献   

13.
This paper presents an analog front end for a power line communication system,including a 12-bit3.2-MS/s energy-efficient successive approximation register analog-to-digital converter,a positive feedback programmable gain amplifier,a 9.8 ppm/°C bandgap reference and on-chip low-output voltage regulators.A two segment capacitive array structure(6 MSB 5 LSB) composed by split capacitors is designed for the SAR core to save area cost and release reference voltage accuracy requirements.Implemented in the GSMC 0.13 m 1.5 V/12 V dual-gate 4P6 M e-flash process,the analog front end occupies an area of 0.457 mm2 and consumes power of18.8 m W,in which 1.1 m W cost by the SAR ADC.Measured at 500 k Hz input,the spurious-free dynamic range and signal-to-noise plus distortion ratio of the ADC are 71.57 d B and 60.60 d B respectively,achieving a figure of merit of 350 f J/conversion-step.  相似文献   

14.
A 1-V, 8-bit pipelined ADC is realized using multi-phase switched-opamp (SO) technique. A novel loading-free architecture is proposed to reduce the capacitive loading and to improve the speed in low-voltage SO circuits. Employing the proposed loading-free pipelined ADC architecture together with double-sampling technique and a fast-wake-up dual-input-dual-output switchable opamp, the ADC achieves 100-MS/s conversion rate, which to our knowledge is the fastest ADC ever reported at 1-V supply using SO technique, with performance comparable to that of many high-voltage switched-capacitor (SC) ADCs. Implemented in a 0.18-mum CMOS process, the ADC obtains a peak SNR of 45.2 dB, SNDR of 41.5 dB, and SFDR of 52.6 dB. Measured DNL and INL are 0.5 LSB and 1.1 LSB, respectively. The chip dissipates only 30 mW from a 1-V supply  相似文献   

15.
A new high-voltage CMOS technology is described which can increase the operating voltage of these circuits to more than 200 V. This represents approximately an order of magnitude improvement over present-day commercially available CMOS devices. The technology is straightforward to implement and uses n-channel MOS transistors and high-voltage p-channel devices. As an example of the capability of the technology, a monolithic quad CMOS analog switch has been fabricated which can handle 200-V, 0.3-A analog signals, with a dynamic range in excess of 150 dB.  相似文献   

16.
A novel technique is presented for performing the analog multiplication in CMOS technology. The circuit handles a wide range of input voltages. The MSO version of Gilbert's six-transistor cell (GSTC) is the basis for this multiplier. A simple source-coupled pair is used to study the MOS GSTC. Then, a technique is introduced for linearizing the source-coupled circuit. This scheme is extended to the MOS GSTC. The voltage ranges are further increased by introducing the folded CMOS GSTC.  相似文献   

17.
This paper describes a 10-bit 30-MS/s subsampling pipelined analog-to-digital converter (ADC) that is implemented in a 0.18 mum CMOS process. The ADC adopts a power efficient amplifier sharing architecture in which additional switches are introduced to reduce the crosstalk between the two opamp-sharing successive stages. A new configuration is used in the first stage of the ADC to avoid using a dedicated sample-and-hold amplifier (SHA) circuit at the input and to avoid the matching requirement between the first multiplying digital-to-analog converter (MDAC) and flash input signal paths. A symmetrical gate-bootstrapping switch is used as the bottom-sampling switch in the first stage to enhance the sampling linearity. The measured differential and integral nonlinearities of the prototype are less than 0.57 least significant bit (LSB) and 0.8 LSB, respectively, at full sampling rate. The ADC exhibits higher than 9.1 effective number of bits (ENOB) for input frequencies up to 30 MHz, which is the twofold Nyquist rate (fs/2), at 30 MS/s. The ADC consumes 21.6 mW from a 1.8-V power supply and occupies 0.7 mm2, which also includes the bandgap and buffer amplifiers. The figure-of-merit (FOM) of this ADC is 0.26 pJ/step.  相似文献   

18.
A 5-GHz CMOS wireless LAN receiver front end   总被引:2,自引:0,他引:2  
This paper presents a 12.4-mW front end for a 5-GHz wireless LAN receiver fabricated in a 0.24-μm CMOS technology. It consists of a low-noise amplifier (LNA), mixers, and an automatically tuned third-order filter controlled by a low-power phase-locked loop. The filter attenuates the image signal by an additional 12 dB beyond what can be achieved by an image-reject architecture. The filter also reduces the noise contribution of the cascode devices in the LNA core. The LNA/filter combination has a noise figure of 4.8 dB, and the overall noise figure of the signal path is 5.2 dB. The overall IIP3 is -2 dBm  相似文献   

19.
A mixed analog/digital chip that forms the core of a medium-speed modem for use on the public switched telephone network is described. It meets CCITT and AT&T requirements for data transmission at 2400 and 1200 b/s, and the AT&T requirement for 300-b/s operation. The chip is implemented in a 1.75-μm analog CMOS process and occupies 32.4 mm 2. The device is powered by a single +5-V supply and consumes less than 115 mW. The architecture and circuit implementation are described, and experimental results are given  相似文献   

20.
A 10-bit 30-MS/s pipelined analog-to-digital converter (ADC) is presented.For the sake of lower power and area,the pipelined stages are scaled in current and area,and op amps are shared between the successive stages.The ADC is realized in the 0.13-tt,m 1-poly 8-copper mixed signal CMOS process operating at 1.2-V supply voltage.Design approaches are discussed to overcome the challenges associated with this choice of process and supply voltage,such as limited dynamic range,poor analog characteristic devices,the limited linearity of analog switches and the embedded sub-1-V bandgap voltage reference.Measured results show that the ADC achieves 55.1-dB signal-to-noise and distortion ratio,67.5-dB spurious free dynamic range and 19.2-mW power under conditions of 30 MSPS and 10.7-MHz input signal.The FoM is 0.33 pJ/step.The peak integral and differential nonlinearities are 1.13 LSB and 0.77 LSB,respectively.The ADC core area is 0.94 mm2.  相似文献   

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