蓝宝石衬底上输出功率密度为4.69W/mm的InAlN/GaN HEMT

We report high performance InAlN/GaN HEMTs grown on sapphire substrates. The lattice-matched InAlN/GaN HEMT sample showed a high 2DEG mobility of 1210 cm²/(V·s) under a sheet density of 2.6 × 10¹³ cm^-2. Large signal load-pull measurements for a (2 × 100 μm) × 0.25 μm device have been conducted with a drain voltage of 24 V at 10 GHz. The presented results confirm the high performances reachable by InAlN-based technology with an output power density of 4.69 W/mm, a linear gain of 11.8 dB and a peak power-added efficiency of 48%. This is the first report of high performance InAlN/GaN HEMTs in mainland China.     

A 4.69-W/mm output power density InAIN/GaN HEMT grown on sapphire substrate

We report high performance InAlN/GaN HEMTs grown on sapphire substrates.The lattice-matched InAlN/GaN HEMT sample showed a high 2DEG mobility of 1210 cm2/(V.s)under a sheet density of 2.6 ×1013 cm-2.Large signal load-pull measurements for a(2 × 100 μm)× 0.25 μm device have been conducted with a drain voltage of 24 V at 10 GHz.The presented results confirm the high performances reachable by InAlN-based technology with an output power density of 4.69 W/mm,a linear gain of 11.8 dB and a peak power-added efficiency of 48％.This is the first report of high performance InA1N/GaN HEMTs in mainland China.     

A Ku-band 3.4 W/mm power AlGaN/GaN HEMT on a sapphire substrate

This Daper describes the first domestic Ku-band power AlGaN/GaN HEMT fabricated on a sapphire substrate.The device with a gate width of 0.5 mm and a gate length of 0.35 μm has exhibited an extrinsic current gain cutoff frequency of 20 GHz and an extrinsic maximum frequency of oscillation of 75 GHz.Under V_(DS)=30 V, CW operating conditions at 14 GHz,the device exhibits a linear gain of 10.4 dB and a 3-dB-gain-compressed output power of 1.4 W with a Dower added efficiency of 41%.Under pulse operating conditions,the linear gain is 12.8 dB and the 3-dB-compressed output power is 1.7 W The power density reaches 3.4 W/mm.     

基于蓝宝石衬底的Ku波段3.4W/mm功率AlGaN/GaN HEMT

本文报道了国内第一个基于蓝宝石衬底的ku波段AlGaN/GaN HEMT。器件总栅宽0.5mm,栅长0.35um。漏压30V下器件的ft为20GHz,fmax为75GHz。在漏压30V、连续波测试条件下,器件在14GHz的线性增益为10.4dB,3dB增益压缩的输出功率为1.4W,附加效率41%。在脉冲测试条件下,线性增益12.8dB,3dB增益压缩的输出功率为1.7W,功率密度达到3.4W/mm。     

电流增益截止频率为236GHz的InAIN/GaN高频HEMT

研制了高电流增益截止频率(fT)的InAlN/GaN高电子迁移率晶体管(HEMT).采用金属有机化学气相沉积(MOCVD)再生长n+GaN非合金欧姆接触工艺将器件源漏间距缩小至600 nm,降低了源、漏寄生电阻,有利于改善器件的寄生效应;使用低压化学气相沉积(LPCVD)生长SiN作为栅下介质,降低了InAlN/GaN HEMT栅漏电;利用电子束光刻实现了栅长为50 nm的T型栅.此外,还讨论了寄生效应对器件fT的影响.测试结果表明,器件的栅漏电为3.8 μA/mm,饱和电流密度为2.5 A/mm,fT达到236 GHz.延时分析表明,器件的寄生延时为0.13 ps,在总延时中所占的比例为19％,优于合金欧姆接触工艺的结果.     

氟处理增强型InAlN/GaN HEMT直流和射频特性分析

报道了使用氟处理的方法制备的InAlN/GaN 增强型器件。 器件的阈值电压为0.86V。 在VGS=0 V ,VDS=5 V下得到器件跨导为0mS, 表现出了完全的关态特性。氟处理之后器件的栅漏电得到了降低。0.3μm栅长器件的电流截至频率（fT）与最大振荡频率(fMAX)分别为29.4GHz和36.7GHz。建立了器件的小信号模型用来描述器件本征与寄生参量。     

InAlN/AlN/GaN HEMT电学特性仿真与分析

研究了一种新型GaN基HEMT结构,即InAlN/AlN/GaN异质结层结构,并对其直流特性以及频率特性进行了仿真。通过理论分析,结合TCAD软件,与常规AlGaN/AlN/GaNHEMT进行对比。对栅长为1μm的器件进行仿真,结果表明,器件的最大跨导为450mS/mm,最大电流密度为2A/mm,电流增益截止频率fT=15GHz,最高振荡频率fmax=35GHz。     

AlGaN/GaN HEMT器件的研制

介绍了AlGaN/GaNHEMT器件的研制及室温下器件特性的测试.漏源欧姆接触采用Ti/Al/Pt/Au ,肖特基结金属为Pt/Au .器件栅长为1μm ,获得的最大跨导为12 0mS/mm ,最大的漏源饱和电流密度为0 95A/mm .     

11.2 W/mm power density AlGaN/GaN high electron-mobility transistors on a GaN substrate

In this letter, high power density AlGaN/GaN high electron-mobility transistors (HEMTs) on a freestanding GaN substrate are reported. An asymmetric Γ-shaped 500-nm gate with a field plate of 650 nm is introduced to improve microwave power performance. The breakdown voltage (BV) is increased to more than 200 V for the fabricated device with gate-to-source and gate-to-drain distances of 1.08 and 2.92 μm. A record continuous-wave power density of 11.2 W/mm@10 GHz is realized with a drain bias of 70 V. The maximum oscillation frequency (f_max) and unity current gain cut-off frequency (f_t) of the AlGaN/GaN HEMTs exceed 30 and 20 GHz, respectively. The results demonstrate the potential of AlGaN/GaN HEMTs on free-standing GaN substrates for microwave power applications.     

一个Ku波段高功率密度AlGaN/GaN HEMTs单片集成功率放大器

本文报道了一款工作于Ku波段的高功率密度单片集成功率放大器。该放大器采用金属有机化学气相淀积技术在2英寸半绝缘 4H-SiC衬底上生长0.2um AlGaN/GaN HEMTs工艺制作而成。在10%占空比的脉冲偏置Vds=25V,Vgs=-4V条件下,该单片放大器在12-14GHz频率范围内得到最大输出功率38dBm(6.3W),最高PAE 24.2%和线性增益6.4到7.5dB。以这种功率水平而论,该放大器的功率密度超过5W/mm。     

A Ku-band high power density AlGaN/GaN HEMT monolithic power amplifier

A high power density monolithic power amplifier operated at Ku band is presented utilizing a 0.3μm AlGaN/GaN HEMT production process on a 2-inch diameter semi-insulating（SI） 4H-SiC substrate by MOCVD. Over the 12-14 GHz frequency range,the single chip amplifier demonstrates a maximum power of 38 dBm（6.3 W）, a peak power added efficiency（PAE） of 24.2%and linear gain of 6.4 to 7.5 dB under a 10%duty pulse condition when operated at V_ds = 25 V and V_gs = -4 V.At these power levels,the amplifier exhibits a power density in excess of 5 W/mm.     

InAlN/AlN/GaN HEMT器件特性研究

通过利用MOCVD生长的高质量蓝宝石衬底InAlN/AlN/GaN异质结材料,获得了高的二维电子气面密度,其值为1.65×10<'13>cm<'-2>.通过该结构制备了0.15 μm栅长InAlN/AIN/GaN HEMT器件,获得了相关的电学特性:最大电流密度为1.3A/mm,峰值跨导为260mS/ram,电流增益截...     

X波段高输出功率凹栅AIGaN／GaN HEMT

使用自主研制的SiC衬底GaNHEMT外延材料，研制出高输出功率A1GaN／GaNHEMT，优化了器件研制工艺，比接触电阻率小于1．0×10^-6Ω·cm^2，电流崩塌参量小于10％，击穿电压大于80V．小栅宽器件工作电压达到40V，频率为8GHz时输出功率密度大于10W／mm．栅宽为2mm单胞器件，工作电压为28V，频率为8GHz时，输出功率为12．3W，功率增益为4．9dB，功率附加效率为35％．四胞内匹配总栅宽为8mm器件，工作电压为27V时，频率为8GHz时，输出功率为33．8W，功率增益为6．3dB，功率附加效率为41．77％，单胞器件和内匹配器件输出功率为目前国内该器件输出功率的最高结果．     

X波段高输出功率凹栅AlGaN/GaN HEMT

使用自主研制的SiC衬底GaN HEMT外延材料,研制出高输出功率AlGaN/GaN HEMT,优化了器件研制工艺,比接触电阻率小于1.0×10-6Ω·cm2,电流崩塌参量小于10%,击穿电压大于80V.小栅宽器件工作电压达到40V,频率为8GHz时输出功率密度大于10W/mm.栅宽为2mm单胞器件,工作电压为28V,频率为8GHz时,输出功率为12.3W,功率增益为4.9dB,功率附加效率为35%.四胞内匹配总栅宽为8mm器件,工作电压为27V时,频率为8GHz时,输出功率为33.8W,功率增益为6.3dB,功率附加效率为41.77%,单胞器件和内匹配器件输出功率为目前国内该器件输出功率的最高结果.     

高性能1mm SiC基AlGaN/GaN功率HEMT研制

在6H-SiC衬底上,外延生长了AlGaN/GaN HEMT结构,设计并实现了高性能1mm AlGaN/GaN微波功率HEMT,外延材料利用金属有机物化学气相淀积技术生长.测试表明,该lmm栅宽器件栅长为0.8μm,输出电流密度达到1.16A/mm,跨导为241mS/mm,击穿电压＞80V,特征频率达到20GHz,最大振荡频率为28GHz.5.4GHz连续波测试下功率增益为14.2dB,输出功率达4.1W,脉冲条件测试下功率增益为14.4dB,输出功率为5.2W,两端口阻抗特性显示了在微波应用中的良好潜力.     

高性能1mm SiC基AlGaN/GaN功率HEMT研制

在6H-SiC衬底上,外延生长了AlGaN/GaN HEMT结构,设计并实现了高性能1mm AlGaN/GaN微波功率HEMT,外延材料利用金属有机物化学气相淀积技术生长.测试表明,该lmm栅宽器件栅长为0.8μm,输出电流密度达到1.16A/mm,跨导为241mS/mm,击穿电压＞80V,特征频率达到20GHz,最大振荡频率为28GHz.5.4GHz连续波测试下功率增益为14.2dB,输出功率达4.1W,脉冲条件测试下功率增益为14.4dB,输出功率为5.2W,两端口阻抗特性显示了在微波应用中的良好潜力.     

Si衬底上5.1W/mm功率密度的GaN HEMT

利用MOCVD技术在Si（111）衬底上生长了高质量的GaN HEMT材料,1μm厚GaN外延层XRD（002）摇摆曲线半高宽573″,（102）摇摆曲线半高宽668″。通过插入层技术实现2μm厚GaN HEMT材料无裂纹,室温二维电子气迁移率1350cm^2/（V.s）,方块电阻328Ω/□.1mm栅宽GaN微波功率器件饱和电流大于0.8A/mm,跨导大于250mS/mm,2GHz下最大连续波输出功率5.1W,增益9.1dB,附加效率达到35%。     

MOCVD方法在蓝宝石衬底上生长无应变InAlN/GaN异质结材料研究

In Al N/Ga N heterostructures were grown on sapphire substrates by low-pressure metal organic chemical vapor deposition.The influences of NH3 flux and growth temperature on the In composition and morphologies of the In Al N were investigated by X-ray diffraction and atomic force microscopy.It’s found that the In composition increases quickly with NH3 flux decrease.But it’s not sensitive to NH3 flux under higher flux.This suggests that lower NH3 flux induces a higher growth rate and an enhanced In incorporation.The In composition also increases with the growth temperatures decreasing,and the defects of the In Al N have close relation with In composition.Unstrained In Al N with In composition of 17% is obtained at NH3 flux of 500 sccm and growth temperature of790 °C.The In Al N/Ga N heterostructure high electron mobility transistor sample showed a high two-dimensional electron gas(2DEG) mobility of 1210 cm2/(V s) with the sheet density of 2.31013cm2 at room temperature.     

在蓝宝石图形衬底上生长低穿透性位错的GaN薄膜

使用MOCVD外延系统,采用3D-2D生长模式在圆锥图形蓝宝石衬底上生长GaN薄膜。研究发现3D-2D生长模式能够有效的减少GaN薄膜的穿透性位错,其中3D GaN层的生长条件是关键：低V/III比,低温和高生长压力。为了进一步减少TD,3D GaN层的厚度应该与图形衬底上的图形高度接近。当3D GaN层生长结束时,3D GaN层把图形衬底的图形围在其中,具有倾斜的侧壁和（0001）向的上表面,而图形上基本没有沉积物。在接下来的2D生长过程里,GaN沿倾斜侧面快速生长,使得侧面上的穿透性位错产生弯曲,从而减少GaN薄膜的穿透性位错。经过对3D条件的优化,GaN薄膜的穿透性位错降低到1×108cm-2,XRD测试得到的（002）,（102）半宽分别达到211弧秒和219弧秒。     

14.2 W/mm internally-matched AlGaN/GaN HEMT for X-band applications

High-performance X-band AlGaN/GaN high electron mobility transistor (HEMT) has been achieved by Γ-gate process in combination with source-connected field plate. Both its Schottky breakdown voltage and pinch-off breakdown voltage are higher than 100 V. Beside, excellent superimposition of direct current (DC) I-V characteristics in different V_ds sweep range indicates that our GaN HEMT device is almost current collapse free. As a result, both outstanding breakdown characteristics and reduction of current collapse effect guarantee high microwave power performances. Based upon it, we have developed an internally-matched GaN HEMT amplifier with single chip of 2.5 mm gate periphery, which exhibits power density of 14.2 W/mm with 45.5 dBm (35.5 W) output power and a power added efficiency (PAE) of 48% under V_ds = 48 V pulse operating condition at 8 GHz. To the best of our knowledge, it is the highest power density at this power level.