Improvement of the performance of GaN-based LEDs grown on sapphire substrates patterned by wet and ICP etching

Sapphire substrates patterned by a selective chemical wet and an inductively coupled plasma (ICP) etching technique was proposed to improve the performance of GaN-based light-emitting diodes (LEDs). GaN-based LEDs were fabricated on sapphire substrates through metal organic chemical vapor deposition (MOCVD). The LEDs fabricated on the patterned substrates exhibit improved device performance compared with the conventional LED fabricated on planar substrates when growth and device fabricating conditions were the same. The light output powers of the LEDs fabricated on wet-patterned and ICP-patterned substrates were about 37% and 17% higher than that of LEDs on planar substrates at an injection current of 20 mA, respectively. The enhancement is attributable to the combination of the improvement of GaN-based epilayers quality and the improvement of the light extraction efficiency.     

Nitride-Based LEDs With Phosphoric Acid Etched Undercut Sidewalls

We propose a simple defect-selective wet etching method to form oblique sidewalls for GaN-based epitaxial layers with phosphoric acid. Using the same defect-selective wet etching, we also prepared GaN-based light-emitting diodes (LEDs) with undercut sidewalls. Compared with conventional LEDs with vertical sidewalls, it was found that output intensity of the LEDs prepared by defect-selective wet etching was 30% higher.      

AlGaN/GaN层叠结构插入层改善氮化镓基发光二极管抗静电性能研究

在GaN基发光二极管的uGaN与nGaN之间插入AlGaN/GaN层叠结构,增大了外延层的张应力,降低了外延层中的穿透位错密度,改善了外延材料的质量。对比了AlGaN/GaN层叠结构中不同Al组分对LED的抗静电能力的影响,含6.8%铝组分AlGaN/GaN层叠结构的LED人体模式抗静电能力提高到了6000V,合格率超过了95%。     

Improved ⅢI-nitrides based light-emitting diodes anti-electrostatic discharge capacity with an AlGaN/GaN stack insert layer

Through insertion of an AlGaN/GaN stack between the u-GaN and n-GaN of GaN-based light-emitting diodes (LEDs),the strain in the epilayer was increased,the dislocation density was reduced.GaN-based LEDs with different Al compositions were compared.6.8％ A1 composition in the stacks showed the highest electrostatic discharge (ESD) endurance ability at the human body mode up to 6000 V and the pass yield exceeded 95％.     

Improvement in the characteristics of GaN-based light-emitting diodes by inserting AlGaN-GaN short-period superlattices in GaN underlayers

We report the influence of short-period superlattice (SPSL)-inserted structures in the underlying undoped GaN on the characteristics of GaN-based light-emitting diodes (LEDs). The measurements of current-voltage (I-V) curves indicate that GaN-based LEDs having pseudomorphic Al/sub 0.3/Ga/sub 0.7/N(2 nm)-GaN(2 nm) SPSL-inserted structures exhibit improvements in device characteristics with the best LED being inserted with two sets of five-pair Al/sub 0.3/Ga/sub 0.7/N(2 nm)-GaN(2 nm) SPSL structure. Based upon the results of etch pit counts, double-crystal X-ray diffraction measurements and transmission electron microscopic observations of the GaN-based LEDs, it was found that the Al/sub 0.3/Ga/sub 0.7/N(2 nm)-GaN(2 nm) SPSL-inserted structures tended to serve as threading dislocation filters in the LEDs so that the improved I-V characteristics were achieved.     

在侧壁形成导热膜的GaN基发光二极管

研制了一种在侧壁形成导热膜的GaN基发光二极管(LED),其中导热层由氮氧化铝形成,导热层外再覆盖一保护层,保护层选自氧化物、氮化物或氟化物.对LED进行电流加速老化实验,分析输出功率随老化时间的变化关系,可以看到侧壁形成导热膜的GaN基LED的输出功率衰减缓慢.实验表明由于氮氧化铝膜具有良好的导热性,其可以有效地耗散发光部分产生的热量,因此在器件侧壁形成AlON导热膜可以改善GaN基LED的输出特性并提高器件的可靠性.     

Nano-Processing Techniques Applied in GaN-Based Light-Emitting Devices With Self-Assembly Ni Nano-Masks

We have developed a simple method to fabricate nanoscale masks by using self-assembly Ni clusters formed through a rapid thermal annealing (RTA) process. The density and dimensions of the Ni nano-masks could be precisely controlled. The nano-masks were successfully applied to GaN-based light-emitting diodes (LEDs) with nano-roughened surface, GaN nanorods, and GaN-based nanorod LEDs to enhance light output power or change structure properties. The GaN-based LED with nano-roughened surface by Ni nano-masks and excimer laser etching has increased 55% light output at 20 mA when compared to that without the nano-roughened process. The GaN nanorods fabricated by the Ni nano-masks and ICP-RIE dry etching showed 3.5 times over the as-grown sample in photoluminescence (PL) intensity. The GaN-based nanorod LEDs assisted by photo-enhanced chemical (PEC) wet oxidation process were also demonstrated. The electroluminescence (EL) intensity of the GaN-based nanorod LED with PEC was about 1.76 times that of the as-grown LED. The fabrication, structure properties, physical features, and the optical and electrical properties of the fabricated devices will be discussed.     

p-GaN与ITO欧姆接触的研究

针对GaN基发光二极管中p-GaN与透明导电薄膜ITO之间的接触进行研究,尝试找出透明导电层ITO的优化制程条件。将在不同氧流量、ITO厚度及退火温度下制备的透明电极ITO薄膜应用于GaN基发光二极管,来增加电流扩展,减小ITO与p-GaN欧姆接触电阻,降低LED工作电压及提高透过率、增强LED发光亮度。将ITO薄膜应用于218μm×363μm GaN基发光二极管LED,分析其在20 mA工作电流条件下正向电压和光输出功率的变化,在优化条件下制得的蓝光LED在直流电流20 mA下的正向电压3.23 V,光输出效率为23.25 mW。     

氮化镓基发光二极管的发光光谱和功率特性

用直流和脉冲电流的方法研究了氮化镓基紫色和蓝色发光二极管的发光光谱和功率特性.结果表明，紫色发光二极管的发光中心波长在直流情况下随电流的增加发生红移，在脉冲情况下随电流的增加发生蓝移；蓝色发光二极管的发光中心波长在直流和脉冲情况下都发生蓝移.两种发光二极管的功率在直流情况下会发生饱和，并随电流的进一步增加而急剧减小，以上现象可能是由于热效应和量子阱中的压电效应引起的.     

High Brightness GaN-Based Light-Emitting Diodes

This paper reviews our recent progress of GaN-based high brightness light-emitting diodes (LEDs). Firstly, by adopting chemical wet etching patterned sapphire substrates in GaN-based LEDs, not only could increase the extraction quantum efficiency, but also improve the internal quantum efficiency. Secondly, we present a high light-extraction 465-nm GaN-based vertical light-emitting diode structure with double diffuse surfaces. The external quantum efficiency was demonstrated to be about 40%. The high performance LED was achieved mainly due to the strong guided-light scattering efficiency while employing double diffuse surfaces     

Connecting plugs of high-powered GaN-based lighting-emitting diodes prepared by electroplating

We investigate the fabrication and the characteristics of a gallium nitride-based light-emitting diode (GaN-based LED) with a connecting plug. The connecting plug was prepared by electroplating, connecting the front and back side of the GaN-based LED via a through hole formed by a laser driller to improve the heat dissipation and the yield loss that was caused by the disconnection between the front and the back sides of the GaN-based LEDs because of the edge coverage effect. The junction temperature of the GaN-based LEDs with the connecting plug increased from 19 to 54 °C when the injection current was increased from 100 to 500 mA.     

Improvement of External Extraction Efficiency in GaN-Based LEDs by $ hbox{SiO}_{2}$ Nanosphere Lithography

A practical approach to fabricate textured GaN-based light-emitting diodes (LEDs) by nanosphere lithography is presented. By spin coating a monolayer of $hbox{SiO}_{2}$ nanoparticles as the mask, textured LEDs can be fabricated. Both textured p-GaN and textured indium tin oxide LEDs show significant improvement over conventional LEDs without damaging the electrical characteristics. The results show that the method is promising for manufacturing low-cost high-efficient GaN-based LEDs.      

GaN基蓝光LED关键技术进展

以高亮度GaN基蓝光LED为核心的半导体照明技术对照明领域带来了很大的冲击,并成为目前全球半导体领域研究和投资的热点。本文首先综述了GaN基材料的基本特性,分析了GaN基蓝光LED制程的关键技术如金属有机物气相外延,P型掺杂,欧姆接触,刻蚀工艺,芯片切割技术,介绍了目前各项技术的工艺现状,最后指出了需要改进的问题,展望了末来的研究方向。     

GaN基白光LED温度特性实验研究

实验研究了恒流驱动条件下,GaN基白光LED的正向电压、发光光谱和发光效率随环境温度的变化情况.结果表明,在输入电流恒定的情况下,随着温度的升高,结电压和发光强度与温度具有良好的线性关系,并且GaN基白光LED的发光颜色总是向蓝光漂移,而小电流驱动时比大电流驱动时蓝光漂移更明显.根据实验结果,分析了器件的最佳额定工作电流.

Abstract：

Under a constant driving current, the changes of the forward voltage, emission spectrum and luminous efficiency of GaN-based White LEDs with the ambient temperature are studied experimentally. It is found that the forward voltage and the luminous intensity depend on the temperature linearly with constant injection current, and luminous colors of GaN-based White LEDs always shift towards blue. And the blue shift with low driving current is more obvious than that with high driving current. According to the results, the best rated operating current of GaN-based white LEDs is discussed.     

DC Current-Induced Rollover of Illumination Efficiency of GaN-Based Power LEDs

Pulse drive currents were utilized to investigate dc current-induced rollover of illumination efficiency of GaN-based power light-emitting diodes (LEDs). By using the pulse drive currents, we can separate the effects that junction temperature and current injection have on dc current-induced rollover of illumination efficiency of GaN-based power LEDs. Comparing the measurement results obtained from pulse and dc drive currents, we verified that junction temperature and current injection were the major causes of dc current-induced rollover of illumination efficiency of power LEDs.     

Ohmic-Contact Technology for GaN-Based Light-Emitting Diodes: Role of P-Type Contact

GaN-based semiconductors are of great technological importance for the fabrication of optoelectronic devices, such as light-emitting diodes (LEDs) and laser diodes. The further improvement of LED performance can be achieved through the enhancement of external quantum efficiency. In this regard, high-quality p-type ohmic electrodes having low contact resistance and high transmittance (or reflectivity), along with thermal stability, must be developed because p-type ohmic contacts play a key role in the performance of LEDs. In this paper, we review recent advances in p-type ohmic-contact technology for GaN-based LEDs. A variety of methods for forming transparent and reflective ohmic contacts are introduced.     

Gallium-nitride-based materials for blue to ultravioletoptoelectronics devices

Breakthroughs in materials growth have enabled extremely high-efficiency blue and green GaN light emitting diodes (LEDs) to be achieved for the first time. Blue LEDs with external quantum efficiency exceeding 9% have enabled hybrid GaN/phosphor white lamp LEDs. GaN LEDs complete the primary color spectrum and have enabled bright and reliable full-color solid-state displays to be realized. Recently, room-temperature operation of continuous wave current-injection blue-violet lasers emitting at 417 nm has further increased the possible applications for GaN-based opto-electronic devices. In this paper, we review the key technologies for GaN-based materials and devices. Developments in the methods for thin-film deposition by metalorganic chemical vapor deposition and molecular beam epitaxy and resulting film properties are highlighted     

Improved light extraction efficiency of GaN-based light emitting diodes using one and two interfaces of ITO/ZnO layer texturing

Light extraction efficiency of GaN-based light emitting diodes (LEDs) has improved significantly by using ITO/ZnO layer texturing. We have deliberately designed and successfully fabricated GaN-based LEDs having one and two interfaces of ITO/ZnO layer texturing in the device structure. It was found that the light extraction efficiencies of one and two interfaces of ITO/ZnO-layer texturing LEDs were 22.29% and 35.54% at 20 mA of current injection, respectively. Creating the chances of multiple light scattering at more than one interface is playing a major role to enhance light output power of the device. The source of the enhanced light output power is also discussed.     

Enhanced output power of (indium) gallium nitride light emitting diodes by a transparent current spreading-film composed of a disordered network of indium tin oxide nanorods

A thin film consisting of a disordered nanorod network of indium tin oxide (ITO) and conventional ITO films are fabricated on gallium nitride (GaN) based-light emitting diodes (LEDs) by electron beam evaporation. The surface morphologies are observed by scanning electron microscopy (SEM). The disordered nanorod network of ITO is grown in vacuum without oxygen. It can be applied directly on the LED as the current spreading film unlike other nanorods which require growth on a conductive layer. The transmittance, current–voltage characteristic, and the dependence of light output power on current are measured for disordered nanorod network ITO LEDs and conventional ITO LEDs, respectively. The measurement results indicate that the nanorod network provides a significant improvement in the light output power of GaN-based LEDs. The influence of the structure of ITO films on the light output power of GaN-based LEDs is discussed.     

Improved light extraction efficiency and leakage characteristics in light-emitting diodes by nanorod arrays formed on hexagonal pits

We report the enhancement of light extraction efficiency (LEE) and electrical performance in GaN-based green light-emitting diodes (LEDs) using ZnO nanorods formed on the etched surface of p-GaN. Green LEDs with hybrid ZnO nanorod structures grown on the hexagonally etched topmost layer of the LEDs, show an improvement in electroluminescence intensity that is 3.5 times higher than LEDs without any other surface treatments. The improvement in LEE in LEDs with nanohybrid structures was confirmed by finite-difference time-domain simulation analysis. Besides LEE enhancement, the surface etching effects on the reduction of leakage current of fabricated LEDs were also investigated.