不同压力下螯合剂浓度在碱性Cu CMP中的影响

We propose the action mechanism of Cu chemical mechanical planarization(CMP) in an alkaline solution.Meanwhile,the effect of abrasive mass fraction on the copper removal rate and within wafer non-uniformity(WIWNU) have been researched.In addition,we have also investigated the synergistic effect between the applied pressure and the FA/O chelating agent on the copper removal rate and WIWNU in the CMP process.Based on the experimental results,we chose several concentrations of the FA/O chelating agent,which added in the slurry can obtain a relatively high removal rate and a low WIWNU after polishing,to investigate the planarization performance of the copper slurry under different applied pressure conditions.The results demonstrate that the copper removal rate can reach 6125 °/min when the abrasive concentration is 3 wt.%.From the planarization experimental results,we can see that the residual step height is 562 ° after excessive copper of the wafer surface is eliminated.It denotes that a good polishing result is acquired when the FA/O chelating agent concentration and applied pressure are fixed at 3 vol% and 1 psi,respectively.All the results set forth here are very valuable for the research and development of alkaline slurry.     

大分子螯合剂在低压力低磨料条件下铜膜的化学机械抛光中的应用

The mechanism of the FA/O chelating agent in the process of chemical mechanical polishing （CMP） is introduced. CMP is carried on a φ300 mm copper film. The higher polishing rate and lower surface roughness are acquired due to the action of an FA/O chelating agent with an extremely strong chelating ability under the condition of low pressure and low abrasive concentration during the CMP process. According to the results of several kinds of additive interaction curves when the pressure is 13.78 kPa, flow rate is 150 mL/min, and the rotating speed is 55/60 rpm, it can be demonstrated that the FA/O chelating agent plays important role during the CMP process.     

Electrochemical investigation of copper chemical mechanical planarization in alkaline slurry without an inhibitor

This work investigates the static corrosion and removal rates of copper as functions of H202 and FA/OIIconcentration, and uses DC electrochemical measurements such as open circuit potential （OCP）, Tafel ana- lysis, as well as cyclic voltammetry （CV） to study HaOa and FA/OIIdependent surface reactions of Cu coupon electrode in alkaline slurry without an inhibitor. An atomic force microscopy （AFM） technique is also used to measure the surface roughness and surface morphology of copper in static corrosion and polishing conditions. It is shown that 0.5 vol.% H202 should be the primary choice to achieve high material removal rate. The electro- chemical results reveal that the addition of FA/O II can dissolve partial oxide film to accelerate the electrochemical anodic reactions and make the oxide layer porous, so that the structurally weak oxide film can be easily removed by mechanical abrasion. The variation of surface roughness and morphology of copper under static conditions is consistent with and provides further support for the reaction mechanisms proposed in the context of DC electro- chemical measurements. In addition, in the presence of H202, 3 vol.% FA/O II may be significantly effective from a surface roughness perspective to obtain a relatively flat copper surface in chemical mechanical planarization （CMP） process.     

碱性阻挡层CMP后铜布线粗糙度的影响机理分析

The surface roughness seriously affects the performance of devices after barrier CMP. Due to the high surface roughness of copper line, the local resistance of a device will be high when working, then the copper line will overheat prompting the generation of electro-migration and the circuit will lose efficacy. Reducing the surface roughness of the copper line in barrier CMP is still an important research topic. The main factors influencing the surface roughness of copper line in alkaline barrier slurry are analyzed in the paper. Aimed at influencing the law on the surface roughness of copper line, using a new type of alkaline barrier slurry with a different p H of the chelating agent and changing the content of non-ionic surfactant, we then analyze the influencing law both on the surface roughness of copper line, and the influence mechanism. The experimental results show that with a chelating agent with a low p H value in the barrier slurry, the surface roughness of the copper line is 1.03 nm and it is the lowest in all of the barrier slurries, and with the increase of non-ionic surfactant concentration, the surface roughness of copper line is reduced to 0.43 nm, meeting the demand of further development of integrated circuits.     

Effect of 1,2,4-triazole on galvanic corrosion between cobalt and copper in CMP based alkaline slurry

Cobalt has become a new type of barrier material with its unique advantages since the copper-interconnects in the great-large scale integrated circuits (GLSI) into 10 nm and below technical nodes,but cobalt and copper have severe galvanic corrosion during chemical-mechanical flattening.The effect of 1,2,4-triazole on Co/Cu galvanic corrosion in alkaline slurry and the control of rate selectivity of copper and cobalt were investigated in this work.The results of electrochemical experiments and polishing experiments had indicated that a certain concentration of 1,2,4-triazole could form a layer of insoluble and dense passive film on the surface of cobalt and copper,which reduced the corrosion potential difference between cobalt and copper.Meantime,the removal rate of cobalt and copper could be effectively controlled according to demand during the CMP process.When the study optimized slurry was composed of 0.5 wt％ colloidal silica,0.1％vol.hydrogen peroxide,0.05 wt％ FA/O,345 ppm 1,2,4-triazole,cobalt had higher corrosion potential than copper and the galvanic corrosion could be reduced effectively when the corrosion potential difference between them decreased to 1 mV and the galvanic corrosion current density reached 0.02 nA/cm2.Meanwhile,the removal rate of Co was 62.396 nrn/min,the removal rate of Cu was 47.328 nm/min,so that the removal rate ratio of cobalt and copper was 1.32:1,which was a good amendment to the dishing pits.The contact potential corrosion of Co/Cu was very weak,which could be better for meeting the requirements of the barrier CMP.     

新型碱性精抛液对300mm铜膜全局平坦化的影响

The copper removal rate and uniformity of two types copper slurries were investigated, which was performed on the 300 mm chemical mechanical planarization （CMP） platform. The experiment results illustrate that the removal rate of the two slurries is nearly the same. Slurry A is mainly composed ofa FA/OI1 type chelating agent and the uniformity reaches to 88.32%. While the uniformity of slurry B is 96.68%, which is mainly composed of a FA/OV type chelating agent. This phenomenon demonstrates that under the same process conditions, the uniformity of different slurries is vastly different. The CMP performance was evaluated in terms of the dishing and erosion values. In this paper, the relationship between the uniformity and the planarization was deeply analyzed, which is mainly based on the endpoint detection mechanism. The experiment results reveal that the slurry with good uniformity has low dishing and erosion. The slurry with bad uniformity, by contract, increases Cu dishing significantly and causes copper loss in the recessed region. Therefore, the following conclusions are drawn： slurry B can improve the wafer leveling efficiently and minimize the resistance and current density along the line, which is helpful to improve the device yield and product reliability. This investigation provides a guide to improve the uniformity and achieve the global and local planarization. It is very significant to meet the requirements for 22 nm technology nodes and control the dishing and erosion efficiently.     

A new cleaning process combining non-ionic surfactant with diamond film electrochemical oxidation for polished silicon wafers

This paper presents a new cleaning process for particle and organic contaminants on polished silicon wafer surfaces.It combines a non-ionic surfactant with boron-doped diamond(BDD) film anode electrochemical oxidation. The non-ionic surfactant is used to remove particles on the polished wafer's surface,because it can form a protective film on the surface,which makes particles easy to remove.The effects of particle removal comparative experiments were observed by metallographic microscopy,which showed tha...     

The stability of a novel weakly alkaline slurry of copper interconnection CMP for GLSI

Chemical mechanical polishing (CMP) is one of the important machining procedures of multilayered copper interconnection for GLSI,meanwhile polishing slurry is a critical factor for realizing the high polishing performance such as high planarization efficiency,low surface roughness.The effect of slurry components such as abrasive (colloidal silica),complexing agent (glycine),inhibitor (BTA) and oxidizing agent (H2O2) on the stability of the novel weakly alkaline slurry of copper interconnection CMP for GLSI was investigated in this paper.First,the synergistic and competitive relationship of them in a peroxide-based weakly alkaline slurry during the copper CMP process was studied and the stability mechanism was put forward.Then 1 wt％ colloidal silica,2.5 wt％ glycine,200 ppm BTA,20 mL/L H2O2 had been selected as the appropriate concentration to prepare copper slurry,and using such slurry the copper blanket wafer was polished.From the variations of copper removal rate,root-mean square roughness (Sq) value with the setting time,it indicates that the working-life of the novel weakly alkaline slurry can reach more than 7 days,which satisfies the requirement of microelectronics further development.     

基于SiO2溶胶的稳定性的Cu/SiO2催化体系在化学机械抛光中的应用研究

There is a lot ofhydroxyl on the surface ofnano SiO2 sol used as an abrasive in the chemical mechanical planarization （CMP） process, and the chemical reaction activity of the hydroxyl is very strong due to the nano effect. In addition to providing a mechanical polishing effect, SiO2 sol is also directly involved in the chemical reaction. The stability of SiO2 sol was characterized through particle size distribution, zeta potential, viscosity, surface charge and other parameters in order to ensure that the chemical reaction rate in the CMP process, and the surface state of the copper film after CMP was not affected by the SiO2 sol. Polarization curves and corrosion potential of different concentrations of SiO2 sol showed that trace SiO2 sol can effectively weaken the passivation film thickness. In other words, SiO2 sol accelerated the decomposition rate of passive film. It was confirmed that the SiO2 sol as reactant had been involved in the CMP process of copper film as reactant by the effect of trace SiO2 sol on the removal rate of copper film in the CMP process under different conditions. In the CMP process, a small amount of SiO2 sol can drastically alter the chemical reaction rate of the copper film, therefore, the possibility that Cu/SiO2 as a catalytic system catalytically accelerated the chemical reaction in the CMP process was proposed. According to the van＇t Hoff isotherm formula and the characteristics of a catalyst which only changes the chemical reaction rate without changing the total reaction standard Gibbs free energy, factors affecting the Cu/SiO2 catalytic reaction were derived from the decomposition rate of Cu （OH）2 and the pH value of the system, and then it was concluded that the CuSiO3 as intermediates of Cu/SiO2 catalytic reaction accelerated the chemical reaction rate in the CMP process. It was confirmed that the Cu/SiO2 catalytic system generated the intermediate of the catalytic reaction （CuSiO3） in the CMP process through the removal rate of copper film, infrared spectrum and AFM diagrams in different pH conditions. FinalLy it is concluded that the SiO2 sol used in the experiment possesses stable performance; in the CMP process it is directly involved in the chemical reaction by creating the intermediate of the catalytic reaction （CuSiO3） whose yield is proportional to the pH value, which accelerates the removal of copper film.     

Investigation of aluminum gate CMP in a novel alkaline solution

Beyond 45 nm, due to the superior CMP performance requirements with the metal gate of aluminum in the advanced CMOS process, a novel alkaline slurry for an aluminum gate CMP with poly-amine alkali slurry is investigated. The aluminum gate CMP under alkaline conditions has two steps:stock polishing and fine polishing. A controllable removal rate, the uniformity of aluminum gate and low corrosion are the key challenges for the alkaline polishing slurry of the aluminum gate CMP. This work utilizes the complexation-soluble function of FA/O Ⅱ and the preference adsorption mechanism of FA/O Ⅰ nonionic surfactant to improve the uniformity of the surface chemistry function with the electrochemical corrosion research, such as OCP-TIME curves, Tafel curves and AC impedance. The result is that the stock polishing slurry (with SiO₂ abrasive) contains 1 wt.% H₂O₂ ,0.5 wt.% FA/O Ⅱ and 1.0 wt.% FA/O Ⅰ nonionic surfactant. For a fine polishing process, 1.5 wt.% H₂O₂ , 0.4 wt.% FA/O Ⅱ and 2.0 wt.% FA/O Ⅰ nonionic surfactant are added. The polishing experiments show that the removal rates are 3000±50 Å/min and 1600±60 Å/min, respectively. The surface roughnesses are 2.05±0.128 nm and 1.59±0.081 nm, respectively. A combination of the functions of FA/O Ⅱ and FA/O Ⅰ nonionic surfactant obtains a controllable removal rate and a better surface roughness in alkaline solution.     

溶液法可控生长氧化铜阵列及其场发射性能研究

One-dimensional CuO nanostructure arrays have been synthesized on Cu foil by a low-temperature wet chemical process. Different CuO nanostrnctures including nanorods with facet heads, nanorods with needle-like tips and nanotubes are shaped simply by varying the concentration of oxidant. Field emission measurements show that CuO nanorods with needle-like tips are of superior performance than other shapes, having a turn-on field of 3.5 V/μm and a field enhancement factor of 2107. The good field emission performance is assigned to the sharp tips contributing to the high field enhancement effect and to the moderate density reducing the field screening effect.     

Ranking Potential Reply-Providers in Community Question Answering System

Community Question Answering （CQA） websites have greatly facilitated users＇ lives, with an increasing number of people seeking help and exchanging ideas on the Internet. This newlymerged community features two characteristics： social relations and an ask-reply mechanism. As users＇ behaviours and social statuses play a more important role in CQA services than traditional answer retrieving websites, researchers＇ concerns have shifted from the need to passively find existing answers to actively seeking potential reply providers that may give answers in the near future. We analyse datasets derived from an online CQA system named ＂Quora＂, and observed that compared with traditional question answering services, users tend to contribute replies rather than questions for help in the CQA system. Inspired by the findings, we seek ways to evaluate the users＇ ability to offer prompt and reliable help, taking into account activity, authority and social reputation char- acteristics. We propose a hybrid method that is based on a Question-User network and social network using optimised PageRank algorithm. Experimental results show the efficiency of the proposed method for ranking potential answer-providers.     

一个全差分可编程的多通道神经信号记录芯片

A multi-channel,fully differential programmable chip for neural recording application is presented.The integrated circuit incorporates eight neural recording amplifiers with tunable bandwidth and gain,eight 4thorder Bessel switch capacitor filters,an 8-to-1 analog time-division multiplexer,a fully differential successive approximation register analog-to-digital converter(SAR ADC),and a serial peripheral interface for communication.The neural recording amplifier presents a programmable gain from 53 dB to 68 dB,a tunable low cut-off frequency from 0.1 Hz to 300 Hz,and 3.77 μVrms input-referred noise over a 5 kHz bandwidth.The SAR ADC digitizes signals at maximum sampling rate of 20 kS/s per channel and achieves an ENOB of 7.4.The integrated circuit is designed and fabricated in 0.18-μm CMOS mix-signal process.We successfully performed a multi-channel in-vivo recording experiment from a rat cortex using the neural recording chip.     

A power-efficient 12-bit analog-to-digital converter with a novel constant-resistance CMOS input sampling switch

Apower-efficient 12-bit40-MS/spipelineanalog-to-digitalconverter（ADC）implementedina0.13 μm CMOS technology is presented. A novel CMOS bootstrapping switch, which offers a constant on-resistance over the entire input signal range, is used at the sample-and-hold front-end to enhance the dynamic performance of the pipelined ADC. By implementing with 2.5-bit-per-stage and a simplified amplifier sharing architecture between two successive pipeline stages, a very competitive power consumption and small die area can be achieved. Meanwhile, the substrate-biasing-effect attenuated T-type switches are introduced to reduce the crosstalk between the two op- amp sharing successive stages. Moreover, a two-stage gain boosted recycling folded cascode （RFC） amplifier with hybrid frequency compensation is developed to further reduce the power consumption and maintain the ADC＇s performance simultaneously. The measured results imply that the ADC achieves a spurious-free dynamic range （SFDR） of 75.7 dB and a signal-to-noise-plus-distortion ratio （SNDR） of 62.74 dB with a 4.3 MHz input signal; the SNDR maintains over 58.25 dB for input signals up to 19.3MHz. The measured differential nonlinearity （DNL） and integral nonlinearity （INL） are -0.43 to ＋0.48 LSB and -1.62 to ＋ 1.89 LSB respectively. The prototype ADC consumes 28.4 mW under a 1.2-V nominal power supply and 40 MHz sampling rate, transferring to a figure- of-merit （FOM） of 0.63 pJ per conversion-step.     

一种应用于GNSS接收机的低噪声和低杂散频率综合器

A low phase noise and low spur phase locked loop （PLL） frequency synthesizer for use in global navigation satellite system （GNSS） receivers is proposed. To get a low spur, the symmetrical structure of the phase frequency detector （PFD） produces four control signals, which can reach the charge pump （CP） simultaneously, and an improved CP is realized to minimize the charge sharing and the charge injection and make the current matched. Additionally, the delay is controllable owing to the programmable PFD, so the dead zone of the CP can be eliminated. The output frequency of the VCO can be adjusted continuously and precisely by using a programmable LC-TANK. The phase noise of the VCO is lowered by using appropriate MOS sizes. The proposed PLL frequency synthesizer is fabricated in a 0.18 μm mixed-signal CMOS process. The measured phase noise at 1 MHz offset from the center frequency is -127.65 dBc/Hz and the reference spur is -73.58 dBc.     

Low power high gain gain-controlled LNA and mixer for GNSS receivers Wei Binbin(魏斌斌)1, Jiang Jinguang(江金光)1,2,3*

A low power high gain gain-controlled LNA ＋ mixer for GNSS receivers is reported. The high gain LNA is realized with a current source load. Its gain-controlled ability is achieved using a programmable bias circuit. Taking advantage of the high gain LNA, a high noise figure passive mixer is adopted. With the passive mixer, low power consumption and high voltage gain of the LNA ＋ mixer are achieved. To fully investigate the performance of this circuit, comparisons between a conventional LNA ＋ mixer, a previous low power LNA ＋ mixer, and the proposed LNA ＋ mixer are presented. The circuit is implemented in 0.18 #m mixed-signal CMOS technology. A 3.8 dB noise figure, an overall 45 dB converge gain and a 10 dB controlled gain range of the two stages are measured. The chip occupies 0.24 mm2 and consumes 2 mA current under 1.8 V supply.     

一种应用于GPS接收机的高线性度SiGe HBT低噪声放大器

A high linearity 1.575 GHz SiGe：HBT low noise amplifier （LNA） for global positioning system applications is described. The bipolar cascoded with an MOSFET LNA was fabricated in a commercial 0.18 μm SiGe BiCMOS process, A resistor bias feed circuit with a feedback resistor was designed for the LNA input transistor to improve its intermodulation and compression performance. The packaged chip tested on board has displayed a noise figure of 1. I 1 dB, a power gain of 18 dB, an output 1 dB compression point of ＋7.8 dBm and an input third-order intercept point of ＋1.8 dBm. The chip occupies a 500 × 560μm^2 area and consumes 3.6 mA from a 2.85 V power supply.     

一种基于低中频接收相位选择发射结构的工作在2.4GHz面向WPAN应用的超低功耗收发机

This paper presents a 2.4 GHz CMOS transceiver for the wireless personal area network （WPAN） inte- grated in 0.18/zm CMOS technology. This transceiver adopts a low-IF receiver, a MUX based transmitter and a fast-setting fractional-N frequency synthesizer. For achieving low cost and low power consumption, an inductor- less receiver front-end, an adaptive analog baseband, a low power MUX and a current-reused phase-locked loop （PLL） have been proposed in this work. Measured results show that the receiver achieves-8 dBrn of lIP3 and 31 dB of image rejection. The transmitter delivers 0 dBm output power at a data rate of 2 Mbps. The current consumption is 7.2 mA in the receiving mode and 6.9 mA in the transmitting mode, respectively.