Synthesis and characterization of asymmetric bismaleimide oligomers with improved processability and thermal/mechanical properties

Novel asymmetric bismaleimide (BMI) oligomers with different molecular weights and dianhydrides were designed and synthesized by 3,4′‐oxydianiline (3,4′‐ODA), 2,3,3′,4′‐oxydiphthalic dianhydride (a‐ODPA), and 2,3,3′,4′‐biphenyltetracarboxylic dianhydride (a‐BPDA). The chemical structures of BMI oligomers were confirmed by Fourier transform infrared spectrometry (FTIR) and gel permeation chromatography (GPC). X‐ray diffraction (XRD) exhibited broad peaks, suggesting amorphous structures. Heat flow curves of oligomers measured by differential scanning calorimeter (DSC) displayed wide processing window due to low glass transition temperatures (T_g). BMI oligomers exhibited high solubility in common organic solvents. Particularly, the OD‐BMI‐1 oligomer exhibited excellent solubility of more than 50 wt% in DMAc solvent. T_g value and minimum complex viscosity of OD‐BMI‐1 oligomer were only 121 °C and 8.1 Pa · s, respectively. The cured BMI resins possess high thermal and thermal‐oxidative stability. The T_g and the temperature of 5% weight loss in nitrogen were above 256 and 449 °C, respectively, and the residual weight percentages at 800 °C were all >49%. Moreover, films made of BMI resins exhibited excellent mechanical properties flexibility, as confirmed by photograph and DMA results of films. The elongation at break of the prepared films was found to be high (almost >9.6%). POLYM. ENG. SCI., 59:2265–2272, 2019. © 2019 Society of Plastics Engineers     

Synthesis of a novel phosphorus‐containing dicyclopentadiene novolac hardener and its cured epoxy resin with improved thermal stability and flame retardancy

A novel phosphorus‐containing dicyclopentadiene novolac (DCPD‐DOPO) curing agent for epoxy resins, was prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and n‐butylated dicyclopentadiene phenolic resin (DCPD‐E). The chemical structure of the obtained DCPD‐DOPO was characterized with FTIR, ¹H NMR and ³¹P NMR, and its molecular weight was determined by gel permeation chromatography. The flame retardancy and thermal properties of diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with DCPD‐DOPO or the mixture of DCPD‐DOPO and bisphenol A‐formaldehyde Novolac resin 720 (NPEH720) were studied by limiting oxygen index (LOI), UL 94 vertical test and cone calorimeter (CCT), and differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. It is found that the DCPD‐DOPO cured epoxy resin possess a LOI value of 31.6% and achieves the UL 94 V‐0 rating, while its glass transition temperature (T_g) is a bit lower (133 °C). The T_g of epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 increases to 137 °C or above, and the UL 94 V‐0 rating can still be maintained although the LOI decreases slightly. The CCT test results demonstrated that the peak heat release rate and total heat release of the epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 decrease significantly compared with the values of the epoxy resin cured by NPEH720. Moreover, the curing reaction kinetics of the epoxy resin cured by DCPD‐DOPO, NPEH720 or their mixture was studied by DSC. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44599.     

Preparation and characterization of soluble bismaleimide‐triazine resins based on asymmetric bismaleimide

A series of bismaleimide‐triazine resins (EBT) were prepared from 2‐(4′‐maleimido)phenyl‐2‐(4′‐maleimidophenoxyl)phenylbutane (EBA‐BMI) and 2,2‐bis(4‐cyanatophenyl)propane (BADCy). The resins show attractive processability with good solubility in low boiling point solvents and wide processing temperature windows. Introduction of diallylbisphenol A (DBA) can decrease the curing temperature of EBT resins that the curing exothermic peak temperature shifted from 291 to 237 °C as the content of DBA increased from 0 to 20%. The curing condition influenced the thermal properties of the cured EBT resins. The glass transition temperature increased as the curing temperature and curing time increased. The cured EBT resins show high glass transition temperature up to 352 °C, high thermal stability with 5% weight loss temperature over 405 °C, low coefficient of thermal expansion about 45 to 52 ppm/°C, and high storage modulus up to 2.6 GPa at 250 °C. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44519.     

Synthesis and properties of silicon-containing bismaleimide resins

Two novel bismaleimide (BMI) monomers containing silicon atom in the structure, i.e., bis[4-(4-maleimidophenylcarbonyloxy)phenyl]dimethylsilane (BMI-SiE1) and bis[4-(4-maleimidophenyloxycarbonyl)phenyl]dimethylsilane (BMI-SiE2), were designed, synthesized, and polymerized with and without the use of diamine as comonomers to yield novel silicon-containing BMI resins. Both monomers obtained are readily soluble in organic solvents, such as chloroform and N, N-dimethylformamide. Differential scanning calorimetry and thermogravimetric analysis investigation of these two monomers indicated a high polymerization temperature (T_p > 240°C) and a good thermal and thermo-oxidative stability of cured BMI resins. The onset temperature for 5% weight loss was found to be above 450°C in nitrogen and above 400°C in the air. Polymerization of BMI-SiE1 and BMI-SiE2 with 4,4′-diaminodiphenylether (DPE) yielded a series of polyaspartimides that had good solubility and could be thermally cured at 250°C. TGA investigations of the cured diamine-modified BMI resins showed onset of degradation temperatures (T_ds) in the range of 344–360°C in nitrogen and 332–360°C in the air. Composites based on the cured diamine-modified BMI resins and glass cloth were prepared and characterized for their dynamic mechanical properties. All the composites showed high glass transition temperatures (e.g., >190°C) and high bending modulus in the range of 1000–2700 MPa. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Soluble asymmetric bismaleimide with low molten viscosity and its high glass transition temperature polymer

Three novel bismaleimide monomers (MBA‐BMI, EBA‐BMI, and PBA‐BMI) with unsymmetrical backbone and different pendant groups were synthesized using asymmetric diamine and maleic anhydride as the precursors. The prepared bismaleimide monomers show good solubility in common organic solvents such as acetone and tetrahydrofuran. The EBA‐BMI melt treated at 180 °C also shows low viscosity about 190–934 mPa s at the temperature range of 160–139 °C below its melting point (166 °C). In addition to the good processability, all three cured bismaleimides show high storage moduli at high temperatures (2.0 GPa at 400 °C), high glass transition temperatures over 400 °C, and good thermal stability with the 5% weight loss temperatures around 470 °C under nitrogen atmosphere. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43491.     

Investigation of novel polytriazole resins

2,4,6-Tri(4-propargyloxy-phenyl)pyridine(POPP) was made from 2,4,6-tri (4-hydroxyphenyl)pyridine(HPP) and propargyl bromide. The chemical structures of POPP and HPP were well characterized by means of FTIR, ¹H-NMR, ¹³C-NMR, and elemental analysis. Novel polytriazole resins (P-PTA resins) were prepared from POPP and azide compounds via 1, 3-dipolar cycloaddition reaction and characterized by solubility, FTIR, DSC, and TGA analyses. The P-PTA resins show good solubility in common solvents. The resins could be cured at 80 °C. The glass transition temperature (T_g) and the 5% weight loss temperature (T_d5) of the cured P-PTA-33 resin arrive at 310 and 365 °C in nitrogen atmosphere, respectively.     

One‐pot synthesis of hyperbranched poly(aryl ether ketone)s for the modification of bismaleimide resins

Hyperbranched poly(aryl ether ketone)s with hydroxyl end groups (HBP‐OH) and high degree of branching value (83%) were synthesized via an A₂ + B₃ approach. The polymerization conditions (e.g., polymerization temperature and time, monomer concentration, stoichiometric ratio of functional groups) were explored to avoid the gelation. Allyl‐terminated hyperbranched PAEKs (HBP‐AL) with low molecular weight (M_n = 3.4 × 10³) and narrow polydispersity (PDI = 1.65) were obtained via the etherification of HBP‐OH and it has been used for the modification of bismaleimide (BMI) resins. The prepolymers showed good processibilities with a viscosity below 0.6 Pa s at 110°C, though the viscosities slightly increased as the increase of HBP‐AL contents. The cured BMI resins showed high glass transition temperatures (T_g > 320°C) and good thermal stabilities (T_d > 400°C, both in nitrogen and air). It is inspiring to note that the incorporation of HBP‐AL into BMI matrix results in a significant enhancement of toughness without any noticeable loss in modulus, processibility, and T_g. POLYM. ENG. SCI., 54:1675–1685, 2014. © 2013 Society of Plastics Engineers     

Preparation and thermal properties of bismaleimide blends based on hydroxyphenyl maleimide

N‐(4‐hydroxyphenyl)maleimide was melt‐blended with the glycidyl ether of bisphenol‐A and various mole percentages of 4, 4′‐(diaminodiphenylsulfone) bismaleimide. The cure behaviour of the resins was evaluated by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The blends showed distinct reductions in the onset of cure (T_o) and peak exothermic (T_exo) temperatures. The blends cured at low temperatures exhibited glass transition temperatures (T_gs) higher than the cure temperatures. The cured blends showed high moduli, glass transition temperatures in excess of 250 °C and good thermal stabilities up to 400 °C. Copyright © 2005 Society of Chemical Industry     

Preparation and properties of bismaleimide resins of aromatic sulfone ether diamine

Aromatic sulfone ether diamine, bis[4-(4-aminophenoxy)phenyl]-sulfone (SED), was prepared by the nucleophilic aromatic substitution of 4,4′-dichlorodiphenylsulphone by p-aminophenolate. The reaction was conducted in the presence of excess potassium carbonate as a weak base, toluene as the dehydrating agent and N-methylpyrrolidone as the dipolar aprotic solvent. SED showed good solubility in common organic solvents, such as dioxan, tetrahydrofuran, butanone and acetone. SED was reacted with maleic anhydride to obtain aromatic sulfone ether bismaleimide, bis[4-(4-maleimidophenoxy)phenyl]-sulfone (SEM). The compounds were characterized by FTIR and ¹H NMR analysis. Furthermore, copolymer resins of SED with 4,4′-bismaleimidodiphenyl methane (BMI) and SEM were prepared. After curing, crosslinked resins with better thermal stability resulted. The temperature at maximum rate of weight loss (T_max) and the heat-resistant temperature index (T_i) in air were found to be 426°C, 208°C and 579°C, 221°C for BMI/SED and SEM/SED resins, respectively. Compared with the corresponding 4,4′-diaminodiphenyl methane (DDM) system, BMI/SED and SEM/SED showed a slight decrease in T_max and T_i SED-modified BMI/amine resin based glass cloth laminates for printed circuit boards showed higher mechanical properties than those of the corresponding unmodified system. With SED instead of the original amine component in 3–5% weight fraction, the tensile strength, flexural strength and impact strength of the laminates increased markedly. Meanwhile, the stripping strength and weld resistance were also improved by the addition of SED.     

Organic/inorganic hybrid bismaleimide resin with octa(aminophenyl)silsesquioxane

Octa(aminophenyl)silsesquioxane (OAPS) was prepared in two steps by the nitration of octaphenylsilsesquioxane (OPS) in fuming nitric acid to form octa(nitrophenyl)silsesquioxane (ONPS), followed by the mild reduction of ONPS with Pd/C as a catalyst. OPS, ONPS and OAPS were characterized by FTIR, ¹H NMR, and ²⁹Si NMR techniques. Modification of a bismaleimide (BMI) resin with OAPS and dipropargyl ether of bisphenol A (DPBPA) was investigated. The modified resins, OAPS/DPBPA/BMI, were characterized with DSC, FTIR and rheology analyses. The results showed that the modified resins have good processability. The DMA results indicated that the glass transition temperature (T_g) of the cured OAPS/DPBPA/BMI hybrid resins reached 350°C. The decomposition temperature (T_d5) of the cured resins decreased but the char yield (Y_c, 800°C) increased as the OAPS loading increased, especially in air. POLYM. ENG. SCI., 2008. © 2008 Society of Plastics Engineers     

Novel flame retardant thermosets from nitrogen‐containing and phosphorus‐containing epoxy resins cured with dicyandiamide

A novel phosphorus‐containing epoxy resin (EPN‐D) was prepared by addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and epoxy phenol‐ formaldehyde novolac resin (EPN). The reaction was monitored by epoxide equivalent weight (EEW) titration, and its structure was confirmed by FTIR and NMR spectra. Halogen‐free epoxy resins containing EPN‐D resin and a nitrogen‐containing epoxy resin (XT resin) were cured with dicyandiamide (DICY) to give new halogen‐free epoxy thermosets. Thermal properties of these thermosets were studied by differential scanning calorimeter (DSC), dynamic mechanical analysis (DMA), thermal mechanical analyzer (TMA) and thermal‐gravimetric analysis (TGA). They exhibited very high glass transition temperatures (T_gs, 139–175°C from DSC, 138–155°C from TMA and 159–193°C from DMA), high thermal stability with T_{d,5 wt %} over 300°C when the weight ratio of XT/EPN‐D is ≥1. The flame‐retardancy of these thermosets was evaluated by limiting oxygen index (LOI) and UL‐94 vertical test. The thermosets containing isocyanurate and DOPO moieties showed high LOI (32.7–43.7) and could achieve UL‐94 V‐0/V‐1 grade. Isocyanurate and DOPO moieties had an obvious synergistic effect on the improvement of the flame retardancy. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Preparation and characterization of maleimide-terminated poly(arylene ether sulfone) oligomers of various molecular weights

A new variation in the bismaleimide (BMI) resin family, maleimide-terminated poly(oxy-1,4-phenylene sulfonyl-1,4-phenylene) oligomers, has been synthesized. The preparation of oligomers (n = 1–12) is described in this study. The structure of these oligomers is characterized by FT-IR and NMR spectroscopy. These oligomers are light yellow to light gray powders that can be melted or dissolved in solvents. Their terminating group bismaleimide has relatively high reactivity. Therefore, these BMI resins can be cured at 250°C to form a crosslinked product. Since the backbone chain is poly(arylene ether sulfone), the cured polymers have high T_g's, which increased from 220°C to higher than 340°C as the number of repeating units n of the corresponding oligomers decreases.     

Biobased thermosetting resins composed of L‐lysine methyl ester and bismaleimide

Lysine methyl ester (LME), which was generated in situ by the reaction of lysine methyl ester dihydrochloride and triethylamine in dimethyl sulfoxide (DMSO), was prepolymerized with 4,4′‐bismaleimidodiphenylmethane (BMI) at 80°C for 2 h in DMSO. Then, the formed prepolymer was precipitated in water. The obtained LME/BMI prepolymers with molar ratios of 2:2, 2:3, and 2:4 were compression‐molded at a final temperature of 230°C for 2 h to produce cured lysine methyl ester/4,4′‐bismaleimidodiphenylmethane resins (cLBs; cLB22, cLB23, and cLB24, respectively). Fourier transform infrared (FTIR) analyses revealed that the Michael addition reaction of amino groups to the C?C bonds of the maleimide group occurred in addition to the homopolymerization of the maleimide group. The glass‐transition temperature (T_g) and 5% weight loss temperature (T₅) of the cured resin increased with increasing BMI feed content, and cLB24 showed the highest T_g (343°C) and T₅ (389°C). The flexural strengths (131–150 MPa) and moduli (3.0–3.6 GPa) of the cLBs were comparable to those of the conventionally cured resins of BMI and 4,4′‐diaminodiphenylmethane. Field emission scanning electron microscopy analysis revealed that there was no phase separation for all of the cured resins. Although cLB23 and cLB24 were not biodegradable, cLB22 had a biodegradability of 8.5% after 30 days in an aerobic aqueous medium containing activated sludge. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40379.     

Studies of phosphonate‐containing bismaleimide resins. I. Synthesis and characteristics of model compounds and polyaspartimides

Two phosphonate‐containing bismaleimide (BMI) [(4,4′‐bismaleimidophenyl)phosphonate] monomers with different melting temperatures and similar curing temperatures were synthesized by reacting N‐hydroxyphenylmaleimide with two kinds of dichloride‐terminated phosphonic monomers. The BMI monomers synthesized were identified with ¹H‐, ¹³C‐, and ³¹P‐nuclear magnetic resonance (NMR) spectroscopy and elemental analysis. The phosphonate‐containing BMI monomers react with a free‐radical initiator to prepare phosphonate‐containing BMI polymers and also with various aromatic diamines to prepare a series of polyaspartimides as reactive flame retardants. The polymerization degrees of polyaspartimides depend on the alkalinity and nucleophility of diamines as chain extenders. Differential scanning calorimetry (DSC) and thermogravimetry analysis (TGA) were used to study the thermal properties of the phosphonate‐containing BMI resins such as the melting temperature, curing temperature, glass transition temperature (T_g), and thermal resistance. All the phosphonate‐containing BMI resins, except the BMI polymers, have a T_g in the range of 210–256°C and show 5% weight loss temperatures (T_5%) of 329–434 and 310–388°C in air and nitrogen atmospheres, respectively. The higher heat resistance of cured BMI resin relative to the BMI polymer is due to its higher crosslinking density. Since the recrosslinking reactions of BMI polymers and polyaspartimides occur more easily in an oxidation environment, their thermal stabilities in air are higher than are those in nitrogen gas. In addition, the thermal decomposition properties of polyaspartimides depend on the structures and compositions of both the diamine segments and the BMI segments. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1919–1933, 2002     

Thermal behavior and properties of naphthalene containing bismaleimide–triazine resins

A series of bismaleimid·triazine (BT) resins were prepared from various dicyanate esters and 2,7-bis(4-maleimidophenoxy)naphthalene (BMPN), which contains a naphthalene group and an aryl ether linkage in the backbone. Their curing behaviors were characterized by differential scanning calorimetry. The exotherm temperature and polymerization reactivity were strongly affected by the chemical structure of the various dicyanate ester monomer. Thermal behaviors were investigated by thermogravimetric analyses and dynamic mechanical analyses. The glass transition temperatures (T_g) of these cured resins with bismaleimide/dicyanate ester at the 1/2 molar ratio were in the range of 250–322°C, and exhibited excellent thermal stability up to 400°C in nitrogen. These results provided a structure–properties relationship for the cured bismaleimid·triazine resins. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68: 1199–1207, 1998     

Studies of fluorine‐containing bismaleimide resins part I: Synthesis and characteristics of model compounds

A series of fluorine‐containing bismaleimide (FBMI) monomers are synthesized by a 3‐step reaction for using as the applications of low‐k materials. The synthesized FBMI monomers are characterized by the ¹H, ¹³C, ¹⁹F nuclear magnetic resonance (NMR) spectroscopy and element analysis. These FBMI monomers react with free radical initiator or self‐cure to prepare FBMI‐polymers. All the self‐curing FBMI resins have the glass transition temperatures (T_g) in the range of 128–141°C and show the 5% weight loss temperatures (T_5%) of 235–293°C in nitrogen atmosphere. The higher heat resistance of self‐curing FBMI resin relative to FBMI‐homopolymer is due to its higher crosslinking density. The FBMI resins exhibit improved dielectric properties as compared with commercial bismaleimide (BMI) resins with the dielectric constants (D_k) lower than 2.49, which is related to the low polarizability of the C? F bond and the large free volume of CF₃ groups in the polymers. Besides, the flame retardancy of all these FBMI resins could be enhanced via the introduction of Br‐atom. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Flexible all‐aromatic polyesterimide films with high glass transition temperatures

A series all‐aromatic poly(esterimide)s with different molar ratios of N‐(3′‐hydroxyphenyl)‐trimellitimide (IM) and 4‐hydroxybenzoic acid (HBA) (IM/HBA = 0.3/0.7 and 0.7/0.3) was prepared with the aim to design flexible high T_g films. Melt‐pressed films, either from high molecular weight polymer or cured phenylethynyl precursor oligomers, exhibit T_gs in the range of 200 °C to 242 °C and are brittle. After a thermal stretching procedure, the films became remarkably flexible and very easy to handle. In addition, the thermally stretched 3‐IM/7‐HBA and 7‐IM/3‐HBA films show tensile strengths of 108 MPa and 169 MPa, respectively. Thermal treatment increased the T_g of 3‐IM/7‐HBA from 205 °C to 248 °C, whereas the T_g of 7‐IM/3‐HBA increased from 230 °C to 260 °C. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 133, 44774.     

Nitrile functionalized benzoxazine/bismaleimide blends and their glass cloth reinforced laminates

A novel high‐performance resin blend composed of nitrile functionalized benzoxazine (CNBZ) and bismaleimide (4,4′‐bismaleimidodiphenyl methane) (BMI) was prepared via solvent method. Its curing behaviors, thermal properties, and mechanical properties were studied by differential scanning calorimetry (DSC), fourier transform infrared spectroscopy (FTIR), dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA), and universal testing machine, respectively. The results showed that the addition reaction between phenolic hydroxyl group and the double bond occurred except for the homopolymerization of CNBZ and BMI. When BMI content was more than 40%, the cured CNBZ/BMI blends exhibited higher glass transition temperatures (T_gs) than CNBZ and BMI homopolymers, which reached up to 334°C. Meanwhile, when BMI content was 40%, the tensile strength, flexural strength, and shearing strength reached up to 69, 235, and 12.9 MPa, respectively, which exhibited the comparable mechanical properties with BT resin. Furthermore, the glass cloth (GF) reinforced laminates based on these blends were prepared. The results showed that when BMI content was 40%, their tensile strength, flexural strength, and impact strength reached up to 334 MPa, 593 MPa, and 145 KJ m^?2, respectively. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 41072.     

Development of a DOPO‐containing melamine epoxy hardeners and its thermal and flame‐retardant properties of cured products

In this study, a novel Schiff base of melamine used as flame‐retardant curing agent for epoxy resins, was synthesized via condensation reaction of 4‐hydroxybenzaldehyde with melamine, followed by the addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphen‐anthrene 10‐oxide (DOPO) to the resulting imine linkage. The structure of DOPO‐containing melamine Schiff base (P‐MSB) was characterized by Fourier transformed infrared spectroscopy, ¹H‐nuclear magnetic resonance (¹H‐NMR) and ³¹P‐NMR. The compound (P‐MSB) was used as a reactive flame retardant in o‐cresol formaldehyde novolac epoxy resin (CNE) to prepare flame‐retardant epoxy resins for electronic application. The thermal and flame‐retardant properties of the epoxy resins cured by various equivalent ratios phenol formaldehyde novolac (PN) and P‐MSB were investigated by the nonisothermal differential scanning calorimetry, the thermogravimetric analysis, and limiting oxygen index test. The obtained results showed that the cured epoxy resins possessed high T_g (165°C) and good thermal stability (T_5%, 321°C). Moreover, the P‐MSB/CNE systems exhibited higher limiting oxygen index (35) and more char was maintained in P‐MSB/CNE systems than that in PN/CNE system and the effective synergism of phosphorus–nitrogen indicated their excellent flame retardancy. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Novel propargylether‐terminated monomers containing pyridine and phenyl pendent group: Synthesis,cure, and properties

Two novel propargylether‐terminated resins containing pyridine and bulky phenyl pendent group were prepared from propargyl bromide and different diphenols, and highly thermal stable polymers were obtained by the thermal cure of the monomers. The chemical structures of these novel monomers were well confirmed by FTIR, ¹H‐NMR and elemental analysis. Curing and thermal behavior of the resins were investigated using differential scanning calorimetry (DSC) and dynamic thermogravimetry in argon atmosphere. DSC curves of these two monomers showed a single endothermic peak corresponding to the conformation of chromene ring and homopolymerization of the chromene ring. The temperature at 5% weight loss (T_d5) was higher than 440°C under argon and the highest glass transition temperature (T_g) reached 362°C. The rheological behavior and solubility of the monomer were also investigated. The monomers showed excellent flow‐ability, broad processing window, and great solubility. These results showed that the two resins could be ideal candidates for high‐temperature resistant resins. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40469.