电镀技术、工艺、设备及废水处理

拉链链齿排的电镀方法及其装置;基片的电镀装置和电镀方法以及电解处理方法及其装置;利用纳米钻石的防止腐蚀的电镀方法;Zn—Ni—RE电镀层及其电镀方法与电解液;铜电镀薄膜方法;端子及其电镀方法;超声增强电镀设备和方法;电镀设备导电系统构造;一种电镀滚筒;圆盘电镀装置;金属线电镀装置;电镀装置、电镀方法和半导体器件的制造方法;……     

回收污水热能时污水对铜管腐蚀的影响研究

采用静态旋转挂片试验法,研究了污水中Cl-、氨氮和COD对HSn70-1A铜腐蚀行为的影响。结果表明,随着Cl-、氨氮和COD质量浓度的增大,铜的腐蚀率也增加。通过对试验数据进行方差分析,指出在试验水质条件下,Cl-和COD的质量浓度对铜腐蚀的影响不显著,而氨氮是影响铜腐蚀的主要因素。     

硅通孔化学机械平坦化中铜去除的电化学与选择性研究

利用极化曲线测量法研究了甘氨酸和过氧化氢浓度及pH对硅通孔(TSV)化学机械平坦化(CMP)中铜腐蚀的影响。结果表明:甘氨酸对铜的腐蚀随其浓度增大而增强;随着过氧化氢浓度增大,铜腐蚀电位逐渐增大;在p H为10时铜的腐蚀效果最佳。CMP实验表明,在不同浓度的甘氨酸和过氧化氢之下,抛光速率可调,达1.9~5.8μm/min,铜表面粗糙度为5~29 nm,铜钽去除速率比为20~50。     

铜铝过渡线夹钎焊接头腐蚀过程中性能退化研究

针对电力输变电领域常使用的铜铝过渡线夹钎焊接头易腐蚀的问题,系统研究铜铝过渡线夹钎焊接头位置的腐蚀行为,采用盐雾腐蚀试验作为加速试验,从抗剪切强度和腐蚀接头的断面形貌等方面,考察了铜铝过渡线夹钎焊接头的性能退化行为,并对接头残余强度（抗剪切强度）进行了初步测算。结果表明：随着腐蚀时间的延长,接头强度依次降低;焊接接头残余强度在不同焊接电流条件下的变化趋势较为接近。本文将对铜铝过渡线夹钎焊接头的防腐具有指导意义。     

餐具催干剂中柠檬酸的应用对铜的腐蚀性研究

餐具催干剂在洗碗机机洗餐具中有着快速干燥餐具表面且不留"水痕"等作用。本文研究了洗碗机催干剂中柠檬酸的添加对金属铜材料的腐蚀状况,主要考察了时间和配方体系中柠檬酸含量的变化对铜腐蚀量的影响,同时尝试添加合适的铜腐蚀抑制剂对铜材料进行有效的防腐保护。     

火力发电厂循环水系统存在的问题和解决措施

介绍了目前国内火电厂循环水系统常用的软化处理法、加酸 水质稳定剂处理、弱酸阳离子交换 水质稳定剂联合处理等几种水处理方法，分析了各种方法的优缺点。阐述了高硬度、高碱度循环水系统存在的结垢问题、铜腐蚀问题和碳钢腐蚀问题。介绍了铜腐蚀的主要形态如黄铜脱锌腐蚀、电偶腐蚀等，分析了引起铜腐蚀的主要原因如高含盐量的影响、Cl^-的影响以及由阻垢剂本身引起的光亮腐蚀，最后针对存在的结垢和腐蚀问题提出了相应的解决措施。     

亚硫酸二甲酯对铜腐蚀性能的研究

重点研究铜在不同pH值的亚硫酸二甲酯水解溶液中的腐蚀性能。首先将铜片按标准制样进行预处理,然后制备亚硫酸二甲酯水解溶液进行浸泡试验,最后通过扫描电镜(SEM)、能谱仪(EDS)等获取其宏微观的腐蚀形貌、腐蚀区域的元素组成,对其在不同pH值的水解溶液中的腐蚀性能进一步分析研究。得出以下结论:亚硫酸二甲酯水解后的产物是硫酸盐和甲醇;铜在碱性水解溶液中腐蚀以点蚀和局部腐蚀为主且与S元素无关,在中性水解溶液中腐蚀面积大,以裂缝腐蚀为主且受S元素影响;随着的碱性的增加,铜的耐蚀性能降低,腐蚀速率加快,在中性溶液中的腐蚀速率最快,腐蚀率可达到了11.65%,且铜的耐蚀性能随着浸泡时间增长有所提高。     

新型耐碱腐蚀合金铸铁的研制

本试验设计了一系列变化镍含量的Ni-Cr耐碱腐蚀合金铸铁和变化铜含量的Ni-CrCu耐碱腐蚀合金铸铁。采用光学显微镜观察合金铸铁的显微组织,用失重法测定合金铸铁在动态、高温、高浓度烧碱腐蚀溶液中的腐蚀速率,借助扫描电镜观察材料的腐蚀产物形貌并通过能谱仪进行微区元素含量分析。研究镍、铜合金元素对铸铁中石墨形态、显微组织的影响规律及其对耐碱腐蚀性能的作用规律,对比各合金铸铁的腐蚀速率,寻找镍铜当量,研制出新型铜代镍型合金铸铁,从而降低合金铸铁的成本。试验结果表明：在镍达到一定含量的基础上Ni-Cr合金铸铁中加入适量的铜,合金铸铁的耐碱腐蚀性能提高,且铜的镍当量为0.429。     

冷喷涂Cu-Cu_2O涂层防污机理研究——机理讨论

总结了冷喷涂Cu-Cu2O涂层在不同溶解氧、盐度、温度及流速海水中的铜渗出率,继续讨论涂层的防污机理。本文认为铜的腐蚀或氧化亚铜(膜)的溶解,释放出可溶性铜离子或亚铜离子,在其表面形成富含溶解态铜离子或亚铜离子的水层从而毒杀靠近的海生物,这是铜、铜合金以及以氧化亚铜为防污剂的涂料产生防污功效的原因。冷喷涂Cu-Cu2O涂层的铜渗出机制为:铜与氧化亚铜形成腐蚀微电池,其中铜作为阳极,氧化亚铜作为阴极促进铜阳极的溶解。铜的电化学溶解通过增加表面CuCl-2浓度和降低氧化亚铜附近Cl-浓度的方式抑制了氧化亚铜的溶解。由于氧化亚铜颗粒和铜表面的氧化亚铜膜结构不同,后者溶解速率大于前者,整个涂层的减薄过程由铜的腐蚀控制。     

单层石墨烯制备及其耐腐蚀特性实验研究

采用低压气相化学沉积方法在铜基底表面制备了单层石墨烯,微观表征了其单层特性;然后通过电化学分析方法研究了单层石墨烯/铜的耐腐蚀特性,量化分析了其抗腐蚀能力。研究结果表明,单层石墨烯能够有效地抑制铜在电解液中的氧化还原反应而自身不会损坏,但如果石墨烯生长不完整或存在缺陷则相应部位的铜会被腐蚀。石墨烯/铜比裸铜的腐蚀电位提高了20 m V,电流密度降低了近1个数量级,其腐蚀阻抗模值较裸铜提高了1个数量级。研究表明,单层石墨烯能很好地将铜基底与电解液隔离,有效增强了铜的抗腐蚀能力。     

Characterization of an acrylic polymer under hygrothermal aging as an optically clear adhesive for touch screen panels

Optically clear adhesives (OCAs) are key components of touch screen panels (TSPs). It is important that OCAs do not affect the transparent electrodes in TSPs because OCAs are contacted to the transparent electrodes. Therefore, N-vinyl caprolactam (NVC) was incorporated in the composition of an acrylic pressure sensitive adhesive (PSA) with excluding an acidic component to maintain the cohesion for OCA preparation. With increasing amounts of NVC, the tack and peel strength of UV-cured PSA increased, but high amounts of NVC led to decreased peel strength. The UV-cured PSA films were placed in a high temperature and humidity chamber for 8 weeks to investigate the durability and corrosion property under hygrothermal conditions. In this study, the corrosion test method using copper foil was suggested as a simple and economical method and was used to evaluate the effect of NVC on the corrosion property of PSA. This method helped identify suitable OCAs that do not have corrosive property. PSA films containing more than 20 wt% of NVC promoted the corrosion of copper foil under hygrothermal aging conditions. The caprolactam ring was opened by moisture, and the PSA structure morphed into a polar structure during the aging process. This change caused a glass transition shift, an increase in the storage modulus at the rubbery plateau, and an increase in peel strength. The surface free energy of the PSA films also increased due to the increase in the polar property. However, high amounts of NVC caused a decrease in the peel strength after 8 weeks of aging because of increased molecular interactions.     

铝电缆镀铜电流密度的快速监测系统设计

在铝电缆表面镀铜工艺中,电流监测系统采用有线传输的方式,监测速度较慢、实时性不高。设计了一种用于铝电缆镀铜电流密度的快速监测系统,阐述了铝电缆电镀铜机理,选用铝片进行实验,利用测量镀层厚度和镀层耐腐蚀性评定方法,进行电流密度对镀层耐蚀性的影响、电流密度与镀层厚度的关系实验,确定电流密度的监测范围。在此基础上,依据系统需求设计总体结构,介绍了主控芯片、电流传感器电路和无线通信芯片,最后进行了软件代码设计。结果表明,所设计的监测系统精度高、监测速度快,可有效利用资源。     

Copper anode corrosion affects power generation in microbial fuel cells

Non‐corrosive, carbon‐based materials are usually used as anodes in microbial fuel cells (MFCs). In some cases, however, metals have been used that can corrode (e.g. copper) or that are corrosion resistant (e.g. stainless steel, SS). Corrosion could increase current through galvanic (abiotic) current production or by increasing exposed surface area, or decrease current due to generation of toxic products from corrosion. In order to directly examine the effects of using corrodible metal anodes, MFCs with Cu were compared with reactors using SS and carbon cloth anodes. MFCs with Cu anodes initially showed high current generation similar to abiotic controls, but subsequently they produced little power (2 mW m^‐2). Higher power was produced with microbes using SS (12 mW m^‐2) or carbon cloth (880 mW m^‐2) anodes, with no power generated by abiotic controls. These results demonstrate that copper is an unsuitable anode material, due to corrosion and likely copper toxicity to microorganisms. © 2013 Society of Chemical Industry     

Corrosion of cyanide copper deposits on zinc diecastings in acid solutions

The corrosion potential and morphology of copper films deposited from a cyanide solution on zinc diecast were studied in acid solutions similar to those employed in industry for the deposition of a second copper layer. Open circuit potential measurements and gravimetric methods were employed to determine the influence of the copper electrodeposition variables on the corrosion potential. The influence of variables such as the presence or absence of additives, the current density and the copper or cyanide concentrations were studied. The corrosion potential decreased with increasing copper film thickness. Less protection was obtained when a thin copper layer was electrodeposited from a solution without additives. Higher protection for the same thickness was obtained from a solution with high cyanide content. This result is related to the strong interaction between cyanides and the metal surface during the electrodeposition. A smooth surface structure was observed by SEM under these conditions.     

Application of electrochemical noise to evaluate outdoor atmospheric corrosion of copper after relatively short exposure periods

This study focused on the application of electrochemical noise to assess the protection level of corrosion products formed on copper during relatively short exposure time in different outdoor atmospheres. Electrochemical noise, cathodic reduction measurements and gravimetric (mass loss) analysis were applied to copper samples exposed at urban and rural/industrial areas in Cuba for 4 months. Measurements of Electrochemical current noise indicated that the poorest protective corrosion products were formed on samples exposed to atmospheres with high concentration of H₂S which agreed with the corrosion rate determined by mass loss and electrochemical chronopotentiometry (cathodic reduction). The electrochemical noise methodology proposed in this work showed acceptable and reproducible results by using an electrochemical cell in which the electrolyte was formed by a distilled-water wetted cloth in contact with the compounds present on a corroded metallic surface. This methodology indicated that the corrosion protection level of the corrosion products formed on copper is related to the corrosivity of the atmosphere.     

Development of a galvanic sensor system for detecting the corrosion damage of the steel embedded in concrete structures: Part 1. Laboratory tests to correlate galvanic current with actual damage

The correlation between sensor output and corrosion rate of reinforcing steel was evaluated by laboratory electrochemical tests in saturated Ca(OH)₂ with 3.5 wt.% NaCl. In this paper, two types of electrochemical probes were developed: galvanic cells containing of steel/copper and steel/stainless steel couples. The corrosion behavior in saturated Ca(OH)₂ solution with and without 3.5 wt.% NaCl addition for the different electrodes was investigated by potentiodynamic test. Weight loss measurement and galvanic corrosion test were conducted to obtain the corrosion rate of reinforcing steel and the charge of sensor in saturated Ca(OH)₂ solution with 3.5 wt.% NaCl addition, respectively.

The results of the potentiodynamic test indicated the possibility of detecting an ingress point of chlorides by measuring the galvanic current. In galvanic corrosion tests, the galvanic current of steel/copper couple was higher than that of steel/stainless steel couple, i.e., the steel/copper sensor is more suitable for high resistance environment. The steel/stainless sensor showed a better linear correlation than the steel/copper sensor. Through the relationship between the sensor system output and the weight loss (mg/cm²) of steel, real corrosion damage of the steel embedded in concrete can be detected.     

The electrochemistry of nitrate-amide melts: Reactions of nickel and copper in nitrate-amide melts

Copper and nickel may be electrodeposited from their ions in solution in nitrate-amide melts at room temperature. In the ammonium nitrate-acetamide-urea melt at 23°C, the reduction to the metal competes with the corrosion reaction at low rates and with the reduction of the ammonium and nitrate ions of the melt at high current densities. Two distinct types of nickel complexes are found in solution. The nickel complex formed by the corrosion reaction is bound by at least one ammonia ligand. Nickel complexes formed by dissolving the halide in the melt show evidence of coordination by less strongly bounding ligands, probably by amides. Similarly, the visible spectra of copper chloride in solution suggest that the cupric ions are coordinated primarily by amides. The copper corrosion reaction produces a complex with a spectra distinctly different from that of cupric chloride in solution. The shift in absorption maxima suggests that the copper complex formed by the corrosion reaction has at least one ammonia ligand in the coordination sphere.     

Electrochemical behaviour of iron and copper in a culture solution for Spirulina platensis

Cyclic voltammograms of iron and copper electrodes were run in sodium hydroxide, carbonate–bicarbonate buffer and culture media for Spirulina platensis at 30°C. Potentiostatic steady state polarisation curves for both electrode surfaces in these electrolytes were performed in the presence and the absence of S. platensis at fixed temperature. Corrosion potential and corrosion current density values of iron and copper were obtained graphically from these curves. In all cases, the largest corrosion current density corresponded to the maximum biogenerated-oxygen concentrations, that is, illuminated culture media containing S. platensis. Corrosion potentials of iron electrodes shifted to positive values for increasing corrosion rates, whereas constant corrosion potentials were obtained for copper electrodes independently of the electrolyte.     

铜基片静态气液界面腐蚀规律的实验

气液两相界面腐蚀广泛存在于日常工业中。因气液相界面存在不稳定特性,迄今对于相界面处腐蚀的研究多针对不断变化的界面位置附近,分析一段时间内的累积腐蚀效果。本文向液相内注入一定体积的气泡,维持气液界面在金属铜壁面的稳定以及气液相界面和液相主体浓度近似恒定;在含不同Cl^-浓度的溶液中,通过电化学方法对比有无相界面的腐蚀规律,并根据数据深入分析相界面处的腐蚀机理。结果表明：引入气液界面导致铜试样腐蚀电位升高、腐蚀电流增大,腐蚀更严重;气液界面处由于引入微观界面能差腐蚀、宏观氧浓差电池腐蚀的作用显著增大了试样的腐蚀电流,使得在整个溶液浓度范围内含界面的铜腐蚀电流均高于不含界面的腐蚀电流,同时在铜表面留下清晰的界面腐蚀线;通过对界面腐蚀电流的剥离,包含液相主体腐蚀部分时无论有无界面的铜腐蚀速率均随Cl^-浓度的升高呈现先增大后减小的趋势,而去除液相部分影响的单独界面腐蚀电流则随Cl^-浓度升高而增大。