一种X波段五位数字移相器的研究与设计

介绍了数字移相器的基本原理及设计方法。在ADS仿真环境下,基于GaAs HJ—FET开关器件,设计仿真了一种X波段五位数字移相器,大大降低了移相器的后期制作成本。利用矢量网络分析仪对制作的实物进行了测试,结果表明：在12—12．5GHz频段内,移相器的最大插损小于9．5dB,均方根相位误差在3°以内。     

数字移相器的ADS设计与仿真

介绍了四位数字移相器的原理、电路设计过程及优化仿真方法。利用射频仿真软件ADS(Advanced Design System)构建了PIN二极管的正反偏模型,讨论了运用ADS的灵敏度分析模块辅助优化移相器关键参数的方法,并基于该方法设计出了一种X波段四位数字移相器,其工作频率为9.5~10.5 GHz,相位误差<2°,各级联位输入回波损耗<15 dB,插入损耗<2.5 dB。     

X波段GaAs单片五位数字移相器

设计并制作了X波段五位GaAs MMIC(微波单片集成电路)数字移相器,采用MESFET作为开关元件,五个移相位线性级联布置。在9～10GHz的频率范围内,用HP-8510网络分析仪测试得到的微波性能表明:移相器的插入损耗为(7.2±1)dB,RMS(均方根)相位误差小于5°,回波损耗优于-13dB。     

X波段GaN五位数字移相器MMIC的设计

采用0.5μm GaN HEMT工艺设计了X波段五位数字移相器的单片微波集成电路(MMIC),描述了移相器的设计过程,并进行了版图电磁仿真。该移相器采用高低通滤波器型网络和加载线型结构。利用电路匹配技术设计移相器电路的开关结构,将GaN器件的插入损耗从14 dB降至1 dB。版图仿真结果表明,在9.2 GHz~10.2 GHz频带范围内,均方根移相误差小于3.5°,插入损耗典型值为17.4 dB,回波损耗小于-12 dB,版图尺寸为5.0 mm×4.7 mm。     

低损耗单片五位PIN二极管移相器

业已证明,利用PIN二极管开关元件制造的一种新型五位移相器电路的插入损耗比可买到的大多数传统移相器的都要低。预计这种新型移相器在X波段的插损小于3.0dB,在20％的频带中,VSWR<1.6∶1。已经制造出单片电路,并进行了测试分析。这里介绍的实验结果表明,这些性能指标是可以达到的。     

基于SP4T开关的4位MEMS开关线式移相器设计

设计了一款4位MEMS开关线式移相器,由SP4TMEMS开关和微带传输线构成,工作于X波段。单刀四掷(single pole 4throw,SP4T)开关用于切换两条不同电长度的信号通道,即参考相位通道和延迟相位通道。每个SP4T开关包含4个悬臂梁接触式RF MEMS串联开关。介绍了4位MEMS开关线式移相器的总体设计,并给出了其关键部件SP4T开关和相位延迟线的设计细节。采用ADS软件仿真分析了器件的电气性能。仿真分析得到:SP4T开关在中心频率10GHz处的回波损耗为-36dB,插入损耗约为0.18dB;移相器各相位的回波损耗均低于-15dB,插入损耗为-0.8～-0.4dB。这种射频MEMS移相器具有小型化、低功耗和高隔离度的优点。     

一种基于0.18μm SiGe BiCMOS工艺的X/Ku波段数字有源移相器

提出了一种用于X/Ku波段相控阵天线系统、带数字控制电路的4位有源移相器。该移相器采用两个相位正交的输入信号的相位内插技术来合成所需要的相位。基于JAZZ 0.18μm SiGe BiCMOS工艺技术,采用Cadence Spectre RF,对电路系统进行仿真分析。仿真结果为:S11小于-10dB,S22小于-11dB,S12小于-90dB,在12GHz处,所有4位相位状态的电压增益范围都是20.80~23.57dB,在整个频段内,电压增益误差的RMS小于1.1dB,噪声系数为2.82~4.45dB。在7~18GHz内,相位误差的RMS小于4°。     

一种基于0.18 μm SiGe BiCMOS工艺的X/Ku波段数字有源移相器

提出了一种用于X/Ku波段相控阵天线系统、带数字控制电路的4位有源移相器。该移相器采用两个相位正交的输入信号的相位内插技术来合成所需要的相位。基于JAZZ 0.18 μm SiGe BiCMOS工艺技术,采用Cadence Spectre RF,对电路系统进行仿真分析。仿真结果为:S₁₁小于-10 dB,S₂₂小于-11 dB,S₁₂小于-90 dB,在12 GHz处,所有4位相位状态的电压增益范围都是20.80～23.57 dB,在整个频段内,电压增益误差的RMS小于1.1 dB,噪声系数为2.82～4.45 dB。在7～18 GHz内,相位误差的RMS小于4°。     

X波段4bit MMIC数字移相器的设计与实现

基于WIN 0.25 μm GaAs赝配高电子迁移率晶体管(PHEMT)工艺,设计并制备了一款X波段4 bit单片微波集成电路(MMIC)数字移相器.22.5°和45°移相单元采用开关滤波型拓扑结构,90°和180°移相单元采用高低通滤波型拓扑结构.对拓扑结构工作原理进行分析,并采用ADS2014软件完成电路的电磁仿真及优化.测试结果表明,该4 bit MMIC数字移相器获得了优良的宽带性能,且与仿真结果吻合良好.在8～ 13 GHz频带内,移相器的均方根(RMS)相位精度误差小于6.5°,插入损耗优于-6.8 dB,RMS插入损耗波动低于0.5 dB,输入回波损耗优于-13 dB,输出回波损耗优于-9.5 dB.该4 bit MMIC数字移相器在相对带宽为47％的X频段内性能优良,适用于有源相控阵雷达等通信系统中.     

11.25°毫米波数字移相器的设计

设计了一种Ka波段11.25°数字移相器。采用一前一后加载支线的方式,在Ka波段内研制出11.25°数字移相器。该移相器在30～31GHz工作频带内,驻波比小于1.65,插入损耗小于3dB,固定相移11.25°,相位精度达到±3°。     

Design and performance of a new digital phase shifter at X-band

A new digital phase shifter design at X-band is presented. The phase shifter operates based on converting a microstrip line to a rectangular waveguide and thus achieving the phase shift by changing the wave propagation constant through the medium. As a proof of principle, a 3-b phase shifter has been designed and constructed using PIN diode switches. An average insertion loss of 1.95 dB and phase shift error of less than 4/spl deg/ at 10.6 GHz are achieved.     

X波段GaN基小相位移相器设计

基于0.25 μm GaN HEMT工艺,设计并制作了X波段11.25°和22.5°的小相位移相器单片微波集成电路(MMIC),两个移相器单元均采用低通开关滤波型拓扑结构.最终芯片面积分别为0.9 mm× 1.05 mm和0.95 mm× 1.05 mm.芯片测试结果表明,两个小相位移相器性能良好,且测试结果与仿真结果吻合.在8 ～ 12 GHz频带内,11.25°和22.5°移相器电路的相移精度小于2.8°,输入回波损耗分别优于-15和-12 dB,插入损耗值分别小于1和1.5 dB,幅度波动分别小于0.8和1.3 dB.两个移相器电路的1 dB压缩点输入功率均大于36 dBm,其功率容限优于GaAs HEMT设计的移相器.结果表明,所设计的移相器具有优异的相移精度以及良好的功率性能,可广泛应用于高精度和大功率的雷达系统中.     

A 2-bit miniature X-band MEMS phase shifter

The design and performance of a compact low-loss X-band true-time-delay (TTD) MEMS phase shifter fabricated on 8-mil GaAs substrate is described. A semi-lumped approach using microstrip transmission lines and metal-insulator-metal (MIM) capacitors is employed for the delay lines in order to both reduce circuit size as well as avoid the high insertion loss found in typical miniaturized designs. The 2-bit phase shifter achieved an average insertion loss of -0.70 dB at 9.45 GHz, and an associated phase accuracy of /spl plusmn/1.3/spl deg/. It occupies an area of only 5 mm/sup 2/, which is 44% the area of the smallest known X-band MEMS phase shifter . The phase shifter operates over 6-14 GHz with a return loss of better than -14 dB.     

An X-band 22.5°/45° digital phase shifter based on switched filter networks

The design approach and performance of a 22.5°/45°digital phase shifter based on a switched filter network for X-band phased arrays are described. Both the MMIC phase shifters are fabricated employing a 0.25μm gate GaAs pHEMT process and share in the same chip size of 0.82×1.06 mm². The measurement results of the proposed phase shifters over the whole operating frequency range show that the phase shift error is less than 22.5°±2.5°, 45°±3.5°, which shows an excellent agreement with the simulated performance, the insertion loss is within the range of 0.9-1.2 dB for the 22.5°phase shifter and 0.9-1.4 dB for the 45°phase shifter, and the input/output return loss is better than -12.5 and -11 dB respectively. They also achieve the similar P_1dB continuous wave power handing capability of 24.8 dBm at 10 GHz. The phase shifters show a good phase shift error, insertion loss and return loss in the X-band (40%), which can be employed into the wide bandwidth multi-bit digital phase shifter.     

Single PIN diode X-band phase shifter

A new design of microstrip phase shifter is described which uses only one PIN diode per bit of phase shift. Results are presented for a representative device which show good agreement between experimental and theoretical results at X-band. In particular, the device has been shown to yield a useful 20% bandwidth centred on 10 GHz.     

Fin-line Pin diode BPSK and QPSK modulators

A low insertion lose fin-line PIN diode phase shifter is presented. 90° and 180° phase shifters are realized respectively. Phase error less than 5° and bandwidth 3 GHz at Ka band are achieved. The insertion loss is better than 0.5dB. The BPSK and QPSK modulators consisting of this phase shifter and fin-line coupler are also given. The circuits and results are given.     

RF MEMS phase shifters based on PCB MEMS technology

An X-band main-line type loaded line RF MEMS phase shifter fabricated using printed circuit based MEMS technology is reported. The phase shifter provides a phase shift of 31.6/spl deg/ with a minimum insertion loss of 0.56 dB at 9 GHz for an applied DC bias voltage of 40 V. These phase shifters are suitable for monolithic integration with low-cost phased arrays on Teflon or Polyimide such as low dielectric constant substrates.