共查询到18条相似文献,搜索用时 123 毫秒
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采用0.5 μm GaAs PHEMT工艺,研制了一种PIN光探测器和分布放大器单片集成850 nm光接收机前端. 探测器光敏面直径为30 μm,电容为0.25 pF,10 V反向偏压下的暗电流小于20 nA.分布放大器-3 dB带宽接近20 GHz,跨阻增益约46 dBΩ;在50 MHz~16 GHz范围内,输入、输出电压驻波比均小于2;噪声系数在3.03~6.50 dB之间.单片集成光接收机前端在1.0和2.5 Gb/s非归零(NRZ)伪随机二进制序列(PRBS)调制的光信号下得到较为清晰的输出眼图. 相似文献
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采用0.5μm GaAs PHEMT工艺研制出了一种单片集成850nm光接收机前端,它包括金属-半导体-金属(MSM)光探测器和分布放大器.探测器光敏面积为50μm×50μm,电容为0.17pF,4V偏压下的暗电流小于17nA.分布放大器-3dB带宽接近20GHz,跨阻增益约46dBΩ;在50MHz~16GHz范围内,输入、输出电压驻波比均小于2;噪声系数在3.03~6.5 dB之间.光接收机前端在输入2.5和5Gb/s非归零伪随机二进制序列调制的光信号下,得到较为清晰的输出眼图. 相似文献
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采用0.5μm GaAs PHEMT工艺研制出了一种单片集成850nm光接收机前端,它包括金属-半导体-金属(MSM)光探测器和分布放大器.探测器光敏面积为50μm×50μm,电容为0.17pF,4V偏压下的暗电流小于17nA.分布放大器-3dB带宽接近20GHz,跨阻增益约46dBΩ;在50MHz~16GHz范围内,输入、输出电压驻波比均小于2;噪声系数在3.03~6.5 dB之间.光接收机前端在输入2.5和5Gb/s非归零伪随机二进制序列调制的光信号下,得到较为清晰的输出眼图. 相似文献
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实现了一种可用于单片集成光接收机前端的GaAs基InP/InGaAs HBT。借助超薄低温InP缓冲层在GaAs衬底上生长出了高质量的InP外延层。在此基础上,只利用超薄低温InP缓冲层技术就在半绝缘GaAs衬底上成功制备出了InP/InGaAsHBT,器件的电流截止频率达到4.4GHz,开启电压0.4V,反向击穿电压大于4V,直流放大倍数约为20。该HBT器件和GaAs基长波长、可调谐InP光探测器单片集成为实现适用于WDM光纤通信系统的高性能、集成化光接收机前端提供了一种新的解决方法。 相似文献
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简要分析了光接收机分布式前置放大器所具有的宽带优势,研制出了一种利用南京电子器件研究所0.5μm标准GaAs PHEMT工艺实现的10 Gb/s分布式前置放大器。该前置放大器采用损耗补偿技术,由七个共源共栅级联的单元组成,测试结果表明,该分布式前置放大器可以工作在10 Gb/s速率上。 相似文献
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Jongdeog Kim Quan Le Munseob Lee Hark Yoo Dong‐Soo Lee Chang‐Soo Park 《ETRI Journal》2009,31(5):622-624
This letter presents a compact 2.5 Gb/s burst‐mode receiver using the first reported monolithic amplifier IC developed with 0.25 …m SiGe BiCMOS technology. With optimum avalanche photodiode gain, the receiver module can obtain a fast response, high sensitivity and wide dynamic range, satisfying the overhead timing and various power specifications for a 2.5 Gb/s next‐generation passive optical network (PON), as well as a legacy 1.25 Gb/s PON in the upstream. 相似文献
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Yung M. Jensen J. Walden R. Rodwell M. Raghavan G. Elliott K. Stanchina W. 《Solid-State Circuits, IEEE Journal of》1999,34(2):219-227
This paper presents two highly integrated receiver circuits fabricated in InP heterojunction bipolar transistor (HBT) technology operating at up to 2.5 and 7.5 Gb/s, respectively. The first IC is a generic digital receiver circuit with CMOS-compatible outputs. It integrates monolithically an automatic-gain-control amplifier, a digital clock and data recovery circuit, and a 1:8 demultiplexer, and consumes an extremely low 340 mW of power at 3.3 V, including output buffers. It can realize a full optical receiver when connected to a photo detector/preamplifier front end. The second circuit is a complete multirate optical receiver application-specific integrated circuit (ASIC) that integrates a photodiode, a transimpedance amplifier, a limiting amplifier, a digital clock and data recovery circuit, a 1:10 demultiplexer, and the asynchronous-transfer-mode-compatible word synchronization logic. It is the most functionally complex InP HBT optoelectronic integrated circuit reported to date. A custom package has also been developed for this ASIC 相似文献
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A monolithic GaAs optical receiver which includes a photodetector and preamplifier was designed and fabricated using a common 1.0-μm GaAs MESFET technology. The optical receiver operates at the data rate of 1 Gb/s. The transimpedance value can be continuously tuned from 1 to 10 kΩ. The metal-semiconductor-metal photodiode shows a 35% efficiency. Several design factors are considered to achieve high-bandwidth and low-noise operation. An array of the integrated receivers can be compactly implemented in a single chip for high-speed interconnection networks and photonic signal processing 相似文献
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Nasserbakht G.N. Adkisson J.W. Wooley B.A. Harris J.S. Jr. Kamins T.I. 《Solid-State Circuits, IEEE Journal of》1993,28(6):622-630
The authors describe a monolithic technology for integrating GaAs with Si bipolar devices and demonstrate that such integration can provide improved system performance without degrading individual devices. The technology has been used to implement a 1-GHz GaAs/Si optical receiver with an equivalent input noise current density of less than 3 pA/√Hz for midband operation, and less than 4.5 pA/√Hz at 1 GHz. In this receiver an interdigitated GaAs metal-semiconductor-metal (MSM) photodetector is combined with a transimpedance preamplifier fabricated in silicon bipolar technology. The measured dark current of the GaAs/Si photodetector is 7 nA. The measured pulse response of an experimental integrated receiver is less than 550 ps FWHM. The integrated front end provides a wideband, low-noise optical receiver for use in local optical interconnections and demonstrates the successful application of integrated GaAs-on-Si technology to optoelectronics 相似文献
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A 10 Gb/s OEIC (optoelectronic integrated circuit) optical receiver front-end has been studied and fab ricated based on the φ-76 mm GaAs PHEMT process; this is the first time that a limiting amplifier (LA) has been designed and realized using depletion mode PHEMT. An OEIC optical receiver front-end mode composed of an MSM photodiode and a current mode transimpedance amplifier (TIA) has been established and optimized by simu lation software ATLAS. The photodiode has a bandwidth of 10 GHz, a capacitance of 3 fF/μm and a photosensitive area of 50×50 μm~2. The whole chip has an area of 1511×666 μm~2. The LA bandwidth is expanded by spiral inductance which has been simulated by software HFSS. The chip area is 1950×1910μm~2 and the measured results demonstrate an input dynamic range of 34 dB (10-500 mVpp) with constant output swing of 500 tnVpp. 相似文献
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The monolithic integrated ion of a p-i-n photodiode and a high-electron mobility transistor (HEMT) amplifier on an InP substrate by organometallic vapor-phase epitaxy is discussed. The receiver operated with up to 1.6 Gb/s nonreturn-to-zero optical signals. The responsivity was 1 kV/W and the minimum optical power at a bit error rate of 10-9 was -24 dBm for 400 Mb/s nonreturn-to-zero optical signals 相似文献
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van Waasen S. Umbach A. Auer U. Bach H.-G. Bertenburg R.M. Janssen G. Mekonnen G.G. Passenberg W. Reuter R. Schlaak W. Schramm C. Unterborsch G. Wolfram P. Tegude F.-J. 《Solid-State Circuits, IEEE Journal of》1997,32(9):1394-1401
A monolithic integrated photoreceiver for 1.55-μm wavelength has been designed for operation in a 20-Gb/s synchronous digital hierarchy system (SDH/SONET), based on a new integration concept. The optoelectronic integrated circuit (OEIC) receiver combines a waveguide-integrated PIN-photodiode and a traveling wave amplifier in coplanar waveguide layout with four InAlAs/InGaAs/InP-HFETs (0.7-μm gate length). The receiver demonstrates a bandwidth of 27 GHz with a low frequency transimpedance of 40 dBΩ. This is, to our knowledge, the highest bandwidth ever reported for a monolithic integrated photoreceiver on InP. Furthermore, a receiver sensitivity of -12 dBm in the fiber (20 Gb/s, BER=10-9) and an overall optical input dynamic range of 27 dB is achieved. Optical time domain multiplex (TDM) system experiments of the receiver packaged in a module show an excellently shaped eye pattern for 20 Gb/s and an overall sensitivity of -30.5 dBm (BER=10-9) [including erbium doped fiber amplifiers (EDFA)] 相似文献
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To date, photonic integration has seen only limited use in a few optical interface applications. The recently adopted IEEE draft standards for 40 Gb/s and 100 Gb/s Ethernet single-mode fiber local area network applications will change this situation. Although first generation implementations will use discrete components based on existing technologies, long-term requirements for significant reduction in cost, size, and power of 40 Gb/s and 100 Gb/s transceivers will lead to a broad demand for photonic integration. Both hybrid planar lightguide circuit and monolithic photonic integrated circuit are feasible approaches that meet the requirements of the new IEEE standards. 相似文献