Enhanced thermal conductivity and dielectric properties of Al/β-SiCw/PVDF composites

Polymeric composites with high thermal conductivity, high dielectric permittivity but low dissipation factor have wide important applications in electronic and electrical industry. In this study, three phases composites consisting of poly(vinylidene fluoride) (PVDF), Al nanoparticles and β-silicon carbide whiskers (β-SiC_w) were prepared. The thermal conductivity, morphological and dielectric properties of the composites were investigated. The results indicate that the addition of 12 vol% β-SiC_w not only improves the thermal conductivity of Al/PVDF from 1.57 to 2.1 W/m K, but also remarkably increases the dielectric constant from 46 to 330 at 100 Hz, whereas the dielectric loss of the composites still remain at relatively low levels similar to that of Al/PVDF at a wider frequency range from 10⁻¹ Hz to 10⁷ Hz. With further increasing the β-SiC_w loading to 20 vol%, the thermal conductivity and dielectric constant of the composites continue to increase, whereas both the dielectric loss and conductivity also rise rapidly.     

Dielectric properties and thermal conductivity of PVDF reinforced with three types of Zn particles

In this study, three types of Zinc (Zn) particles, i.e., the spherical Zn (s-Zn), flaky Zn (f-Zn), and metal–semiconductor Zn@ZnO core–shell structure, are incorporated in poly(vinylidene fluoride) (PVDF) to obtain high dielectric permittivity polymer. The morphological, dielectric properties and thermal conductivity of the composites are characterized. The results indicate that compared with the s-Zn/PVDF the Zn@ZnO/PVDF at lower filler loading exhibited obviously higher dielectric permittivity due to the duplex interfacial polarizations, and that the f-Zn/PVDF showed larger dielectric permittivity and thermal conductivity owing to f-Zn’s high aspect ratio facilitating the formation of bridges between themselves. Furthermore, the dissipation factors of the s-Zn/PVDF and Zn@ZnO/PVDF were still at low level owing to the presence of self-passivation layer or ZnO shell between Zn core and PVDF, leading to a high critical filler concentration, whereas, a noticeable variation in the dissipation factor for the f-Zn/PVDF is observed up to 12 vol.% f-Zn.     

Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging

Polymethyl methacrylate (PMMA) composites filled with Aluminum Nitride (AlN) were prepared by powder processing technique. The microstructures of the composites were investigated by scanning electron microscopy techniques. The effect of AlN filler content (0.1–0.7 volume fraction (vf)) on the thermal conductivity, relative permittivity, and dielectric loss were investigated. As the vf of AlN filler increased, the thermal conductivity of the specimens increased. The thermal conductivity and relative permittivity of AlN/PMMA composites with 0.7 vf AlN filler were improved to 1.87 W/(m K) and 4.4 (at 1 MHz), respectively. The experimental thermal conductivity and relative permittivity were compared with that from simulation model.     

Investigation of thermal conductivity and dielectric properties of LDPE-matrix composites filled with hybrid filler of hollow glass microspheres and nitride particles

The hybrid filler of hollow glass microspheres (HGM) and nitride particles was filled into low-density polyethylene (LDPE) matrix via powder mixing and then hot pressing technology to obtain the composites with higher thermal conductivity as well as lower dielectric constant (D_k) and loss (D_f). The effects of surface modification of nitride particles and HGMs as well as volume ratio between them on the thermal conductivity and dielectric properties at 1 MHz of the composites were first investigated. The results indicate that the surface modification of the filler has a beneficial effect on thermal conductivity and dielectric properties of the composites due to the good interfacial adhesion between the filler and matrix. An optimal volume ratio of nitride particles to HGMs of 1:1 is determined on the basis of overall performance of the composites. The thermal conductivity as well as dielectric properties at 1 MHz and microwave frequency of the composites made from surface-modified fillers with the optimal nitride to HGM volume ratio were investigated as a function of the total volume fraction of hybrid filler. It is found that the thermal conductivity increases with filler volume fraction, and it is mainly related to the type of nitride particle other than HGM. The D_k values at 1 MHz and microwave frequency show an increasing trend with filler volume fraction and depend largely on the types of both nitride particles and HGMs. The D_f values at 1 MHz or quality factor (Q × f) at microwave frequency show an increasing or decreasing trend with filler volume fraction and also depend on the types of both nitride particle and HGM. Finally, optimal type of HGM and nitride particles as well as corresponding thermal conductivity and dielectric properties is obtained. SEM observations show that the hybrid filler particles are agglomerated around the LDPE matrix particles, and within the agglomerates the smaller-sized nitride particles in the hybrid filler can easily form thermally conductive networks to make the composites with high thermal conductivity. At the same time, the increase of the value D_k of the composites is restricted due to the presence of HGMs.     

Enhancement of dielectric and electrical properties in BT/SiC/PVDF three-phase composite through microstructure tailoring

A polymer composite with high dielectric permittivity was prepared by embedding silicon carbide (SiC) whisker with an average diameter of 500 nm–1 μm in poly(vinylidene fluoride) (PVDF). However, the high dielectric loss and electrical conductivity of the two-phase composite prohibits its potential applications. Barium titanate (BT) particles with average diameter of 100 nm and 1 μm were incorporated as a third phase to fabricate a three-phase composite. The morphology structure, dielectric and electrical properties before and after the addition of BT particles were investigated. The three-phase composite exhibits largely suppressed dielectric loss and electrical conductivity without sacrificing the high dielectric permittivity, which was extremely hard to be realized for two-phase composite. It is also found that the nano-size BT is more favorable in achieving high dielectric permittivity than the micro-size BT, where their dielectric loss and electrical conductivity are similar. Furthermore, electric modulus analysis confirms the largely suppressed electron conduction process which results in the enhanced dielectric and electrical properties in three-phase composite.     

Preparation and properties of hollow glass microsphere-filled epoxy-matrix composites

Hollow glass microsphere (HGM)–filled epoxy composites, with filler content ranging from 0 to 51.3 vol.%, were prepared in order to modify the dielectric properties of the epoxy. The results showed that the dielectric constant (D_k) and dielectric loss (D_f) of the composites decreased simultaneously with increasing HGM content, which was critical for the provision of superior high-frequency device performance. Other properties of the composite, such as the coefficient of thermal expansion (CTE) and the glass transition temperature (T_g), were also improved. The improvement in these properties was related to strong interaction between the HGM and epoxy, which was indicated by the formation of an interphase between the HGM and epoxy-matrix. It was unsatisfactory in this study that the thermal conductivity of the composites also decreased with HGM content. In order to obtain relatively high thermal conductivity and a low dielectric constant simultaneously, this paper suggests further adding other filler.     

Electrical properties of short sisal fiber reinforced polyester composites fabricated by resin transfer molding

The electrical properties of sisal fiber reinforced polyester composites fabricated by resin transfer molding (RTM) have been studied with special reference to fiber loading, frequency and temperature. The dielectric constant (ε′), loss factor (ε″), dissipation factor (tan δ) and conductivity increases with fiber content for the entire range of frequencies. The values are high for the composites having fiber content of 50 vol.%. This increment is high at low frequencies, low at medium frequencies, and very small at high frequencies. The volume resistivity varies with fiber loading at lower frequency and merges together at higher frequency. When temperature increases the dielectric constant values increases followed by a decrease after the glass transition temperature. This variation depends upon the fiber content. Finally an attempt is made to correlate the experimental value of the dielectric constant with theoretical predictions.     

Comparison of the thermal properties between composites reinforced by raw and amino-functionalized carbon materials

Carbon materials, such as graphite oxides, carbon nanotubes and graphenes, have exceptional thermal conductivity, which render them excellent candidates as fillers in advanced thermal interface materials for high density electronics. In this paper, these carbon materials were functionalized with 4,4′-diaminodiphenyl sulphone (DDS), to enhance the bonding between the carbon materials and the resin matrix. Their visibly different properties were investigated. It seems that DDS-functionalization can obviously improve the interfacial heat transfer between the carbon materials and the epoxy matrix. The thermal conductivity enhancement of D-Graphene composites (0.493 W/m K) was about 30% higher than that of D-MWNTs composites (0.387 W/m K) at 0.5 vol.% loading. The different effects among EGO, D-EGO, MWNTs, D-MWNTs and D-Graphene in polymer composites were also discussed. It was demonstrated that DDS-functionalized carbon materials had an obvious effect on the thermal performances of composite materials and were more effective in thermal conductivity enhancement.     

Effects of Ag particles on sintering and electrical properties of ZnO-based varistor

ZnO-based varistors containing Ag particles (abbreviated as Z-Ag) were prepared using the conventional solid-state reaction method. The sintering and electrical properties of Z-Ag composites show that the composites can be achieved at a lower sintering temperature (920 °C) relative to that of a commercial ZnO-based varistor. The composites possess non-ohmic behavior analogous to that of the ZnO-based varistor, and the nonlinear voltage can be easily controlled by the content of Ag particles in the ceramic matrix. Meanwhile, the dielectric constant and dissipation factor indicate that the composites have enhanced dielectric properties at room temperature with increasing content of Ag particles, especially at frequencies of 0.5-30 kHz. The mechanisms involved are discussed.     

Electrical and dielectric properties of polypropylene nanocomposites based on carbon nanotubes and barium titanate nanoparticles

Functional polypropylene (PP) nanocomposites were prepared by melt compounding with multiwalled carbon nanotubes (MWNT) as the electrically conductive component and barium titanate (BT) spherical nanoparticles as the ferroelectric component. To make PP electrically conductive, more than 3 wt.% MWNT is required. Surface modification of either MWNT or BT with titanate coupling agent further improves the electrical conductivity of the PP/MWNT/BT ternary nanocomposites. Interestingly, by modifying both MWNT and BT, 2 wt.% MWNT are sufficient to make the ternary nanocomposite electrically conductive. In addition, the incorporation of MWNT greatly increases the dielectric permittivity of PP/BT nanocomposites. However, to retain a low dielectric loss, the MWNT loading should be slightly less than the percolation threshold of the nanocomposites. The improved electrical conductivity and dielectric properties make the ternary nanocomposites attractive in practical applications.     

Effect of processing technique on the transport and mechanical properties of graphite nanoplatelet/rubbery epoxy composites for thermal interface applications

Graphite nanoplatelet (GNP)/rubbery epoxy composites were fabricated by mechanical mixer (MM) and dual asymmetric centrifuge speed mixer (SM). The properties of the GNP/rubbery epoxy were compared with GNP/glassy epoxy composites. The thermal conductivity of GNP/rubbery epoxy composite (25 wt.% GNP, particle size 15 μm) reached 2.35 W m⁻¹ K⁻¹ compared to 0.1795 W m⁻¹ K⁻¹ for rubbery epoxy. Compared with GNP/rubbery epoxy composite, at 20 wt.%, GNP/glassy epoxy composite has a slightly lower thermal conductivity but an electrical conductivity that is 3 orders of magnitude higher. The viscosity of rubbery epoxy is 4 times lower than that of glassy epoxy and thus allows higher loading. The thermal and electrical conductivities of composites produced by MM are slightly higher than those produced by SM due to greater shearing of GNPs in MM, which results in better dispersed GNPs. Compression and hardness testing showed that GNPs increase the compressive strength of rubbery epoxy ∼2 times without significantly affecting the compressive strain and hardness. The GNP/glassy epoxy composites are 40 times stiffer than the GNP/rubbery epoxy composites. GNP/rubbery epoxy composites with their high thermal conductivity, low electrical conductivity, low viscosity before curing and high conformability are promising thermal interface materials.     

Effect of coating on the microstructure and thermal conductivities of diamond-Cu composites prepared by powder metallurgy

Diamond-Cu composites from the direct combination of diamond and Cu show low thermal conductivities due to weak interface and high thermal resistance as a result of chemical incompatibility. In this paper, a new method is proposed to strengthen interfacial binding between diamond and Cu by coating strong carbide-forming elements, e.g., Ti or Cr on the surface of the diamond through vacuum micro-deposition. Interfacial thermal resistance of diamond-Cu composites is greatly decreased when diamond particles are coated by a Cr or Ti layer of a certain thickness before combining with Cu. Thermal conductivity is also increased several times. Cr coating can reduce more effectively interface thermal resistance between diamond and Cu than Ti coating. Moreover, it has a smaller negative impact on the thermal conductivity of the Cu matrix, resulting in higher thermal conductivity of Cr-coated diamond-Cu composites. Through the vacuum micro-deposition technology, Cr on the diamond particle surface is present in the form Cr₇C₃ near diamond and a pure Cr outer layer at 2:1. The optimum thickness is within 0.6-0.9 μm; at this depth, the thermal conductivities of 70 vol% diamond-Cu composites can be increased four times and reach as high as 657 W/m K. In this work, an original theoretical model is proposed to estimate the thermal conductivities of composite materials with an interlayer of a certain thickness. The predicted values from this model are in good agreement with the experimental values.     

Tailoring of thermal and dielectric properties of LDPE-matrix composites by the volume fraction,density, and surface modification of hollow glass microsphere filler

Hollow glass microsphere (HGM) filled low-density polyethylene (LDPE) composites were prepared, and the effects of density, content, and surface modification of HGM on the thermal and dielectric properties of the composites were investigated. It is found that the thermal conductivity of the composites decreases with increasing HGM content or decreasing HGM density. At the same HGM content and density, the composites filled with suitable amount of silane coupling agent (KH570) modified HGM exhibit higher thermal conductivity than unmodified-HGM filled composites. The dielectric constant at 1 MHz of the composites also decreases with increasing HGM content or decreasing HGM density, but their dielectric loss increases with increasing HGM content or increasing HGM density. By modifying the surface of HGM with suitable amount of KH570, the dielectric constant and loss at 1 MHz of the composites can be decreased at the same time. The results of microwave dielectric properties of the composites indicate that the dielectric constant decreases with increasing HGM content or decreasing HGM density, the quality factor (Q × f) decreases with increasing HGM content or increasing HGM density, but both dielectric constant and quality factor are slightly affected by the surface modification of HGM. Due to lower intrinsic thermal conductivity and dielectric constant but higher dielectric loss of HGM than LDPE, the thermal conductivity and dielectric properties of the composites can be controlled with adding HGM and varying its volume fraction. The surface modification of HGM improves the interface contact between HGM and LDPE in the composites, which is confirmed by the SEM observation, and thus the heat conduction and dielectric properties at low frequency are improved. Based on calculated thermal conductivity and dielectric constant of HGM, the experimental trends of thermal conductivity and dielectric constant at 1 MHz of the composites are analyzed by using different models, including typical models for particles-filled composites and special models developed for hollow microsphere filled composites. The results from suitable models show close correlation with the experimental values.     

Nanocomposites based on MWCNT and styrene–butadiene–styrene block copolymers: Effect of the preparation method on dispersion and polymer–filler interactions

Composites of Kraton-D® 1102 BT (a styrene–butadiene–styrene block copolymer) and multi-walled carbon nanotubes (MWCNTs) were prepared by melt mixing. The composites were characterized by electrical conductivity measurements (Coleman’s method), mechanical properties (DMA and stress–strain tests), thermal stability (thermogravimetry) and morphology of dispersion (SEM). Finally, the resulting composites were compared with those made by the solution casting method. The results showed a strong influence of the preparation methodology on the final properties of the composites due to changes in morphology. Composites prepared by casting showed a higher electrical conductivity than extruded ones; the composites with 6 wt.% of MWCNT prepared by extrusion presented conductivity of the same order of magnitude as the composite with 1 wt.% of MWCNT prepared by casting – 10⁻³ to 10⁻⁴ S cm⁻¹. However, the extruded samples presented better mechanical properties than the casting ones.     

TiO2-nanorod decorated carbon nanotubes for high-permittivity and low-dielectric-loss polystyrene composites

Polymer composites with high permittivity and low dielectric loss are highly desirable in electronic and electrical industry. Adding conductive fillers could significantly increase the permittivity of a polymer. However, polymer composites containing conductive fillers often exhibit very high dielectric loss due to their large electrical conduction or leakage currents. In this work, by engineering TiO₂-nanorod-decorated multi-walled carbon nanotubes (TD-CNTs), polystyrene (PS) composite with high permittivity and low dielectric loss have been successfully prepared. The composite containing of 17.2 vol.% TD-CNTs has a permittivity of 37 at 1 kHz, which is 13.7 times higher than that of the pure PS (2.7), while the dielectric loss still remains at a low value below 0.11. The dielectric properties of the composites are closely related to the length of CNTs and the loading level of TiO₂-nanorods on the CNT surfaces.     

Thermo-physical properties and TEM analysis of silver based MMCs utilizing metallized multiwall-carbon nanotubes

Metal matrix composites with embedded multiwall-carbon nanotubes (MWNT) are attractive because MWNTs exhibit high intrinsic thermal conductivity. Thus to improve the thermal conductivity of a metal matrix, silver matrix composites with MWNT were prepared by “chemical” mixing, different active elements were introduced enhancing the bonding between inclusions and matrix. The evolution of the thermal conductivity and the coefficient of thermal expansion CTE as a function of the MWNT concentration and the presence of active elements cobalt, molybdenum or nickel in the silver matrix in Ag–X/MWNT composites are presented. A transition from weak to strong matrix/MWNT bonding is observed by adding active elements, the latter leading concomitantly to an increase in thermal conductivity and a decrease in CTE. The thermal conductivity was found to increase by up to 10% for a composition of 0.2 wt.% MWNT and cobalt as active element and a 6% decrease in CTE compared to a pure silver reference.     

Structure–property relationships in isotactic polypropylene/multi-walled carbon nanotubes nanocomposites

In this work, the influence of multi-walled carbon nanotubes (MWCNT) on electrical, thermal and mechanical properties of CNT reinforced isotactic polypropylene (iPP) nanocomposites is studied. The composites were obtained by diluting a masterbatch of 20 wt.% MWCNT with a low viscous iPP, using melt mixing. The morphology of the prepared samples was examined through SEM, Raman and XRD measurements. The effect of MWCNT addition on the thermal transitions of the iPP was investigated by differential scanning calorimetry (DSC) measurements. Significant changes are reported in the crystallization behavior of the matrix on addition of carbon nanotubes: increase of the degree of crystallinity, as well as appearance of a new crystallization peak (owing to trans-crystallinity). Dynamic mechanical analysis (DMA) studies revealed an enhancement of the storage modulus, in the glassy state, up to 86%. Furthermore, broadband dielectric relaxation spectroscopy (DRS) was employed to study the electrical and dielectric properties of the nanocomposites. The electrical percolation threshold was calculated 0.6–0.7 vol.% MWCNT from both dc conductivity and dielectric constant values. This value is lower than previous mentioned ones in literature in similar systems. In conclusion, this works provides a simple and quick way for the preparation of PP/MWCNT nanocomposites with low electrical percolation threshold and significantly enhanced mechanical properties.     

Structure and properties of highly oriented polyoxymethylene/multi-walled carbon nanotube composites produced by hot stretching

Highly-oriented polyoxymethylene (POM)/multi-walled carbon nanotube (MWCNT) composites were fabricated through solid hot stretching technology. With the draw ratio as high as 900%, the oriented composites exhibited much improved thermal conductivity and mechanical properties along the stretching direction compared with that of the isotropic samples before drawing. The thermal conductivity of the composite with 11.6 vol.% MWCNTs can reach as high as 1.2 W/m K after drawing. Microstructure observation demonstrated that the POM matrix had an ordered fibrillar bundle structure and MWCNTs in the composite tended to align parallel to the stretching direction. Wide-angle X-ray diffraction results showed that the crystal axis of the POM matrix was preferentially oriented perpendicular to the draw direction, while MWCNTs were preferentially oriented parallel to the draw direction. The strong interaction between the POM matrix and the MWCNTs hindered the orientation movement of molecules of POM, but induced the orientation movement of MWCNTs.     

Fabrication, thermal, and dielectric properties of self-passivated Al/epoxy nanocomposites

The current paper reports the effects of an epoxide-functionalized, silane surface-treated, self-passivated aluminum (Al) nanoparticles on the glass transition, morphology, thermal conductivity, dielectric properties of an epoxy composite. The surface modification of the Al nanoparticles improved the dispersion of the filler, as well as the glass transition temperature, thermal conductivity, and dielectric properties of the epoxy composites. The epoxy/Al nanocomposites showed a dielectric constant transition concentration. The dielectric constant and dissipation factor increased when the Al particle loading exceeded the critical content but gradually decreased with the frequency. The epoxy nanocomposites containing 15 % by weight Al nanoparticles have a high thermal conductivity and a high dielectric constant but a low dissipation factor. The enhancements in the thermal and dielectric properties of the epoxy nanocomposites show potential for future engineering applications.     

Electrical and thermal property enhancement of fiber-reinforced polymer laminate composites through controlled implementation of multi-walled carbon nanotubes

Aligned carbon nanotubes (CNTs) are implemented into alumina-fiber reinforced laminates, and enhanced mass-specific thermal and electrical conductivities are observed. Electrical conductivity enhancement is useful for electrostatic discharge and sensing applications, and is used here for both electromagnetic interference (EMI) shielding and deicing. CNTs were grown directly on individual fibers in woven cloth plies, and maintained their alignment during the polymer (epoxy) infiltration used to create laminates. Using multiple complementary methods, non-isotropic electrical and thermal conductivities of these hybrid composites were thoroughly characterized as a function of CNT volume/mass fraction. DC and AC electrical conductivity measurements demonstrate high electrical conductivity of >100 S/m (at 3% volume fraction, ∼1.5% weight fraction, of CNTs) that can be used for multifunctional applications such as de-icing and electromagnetic shielding. The thermal conductivity enhancement (∼1 W/m K) suggests that carbon-fiber based laminates can significantly benefit from aligned CNTs. Application of such new nano-engineered, multi-scale, multi-functional CNT composites can be extended to system health monitoring with electrical or thermal resistance change induced by damage, fire-resistant structures among other multifunctional attributes.