纸基RFID标签天线印刷工艺参数的优化试验

材料与制作工艺造成的成本过高是RFID标签普及化应用的障碍。应用导电银浆与丝网印刷技术,可以解决RFID标签的低成本化问题。本文以丝网印刷技术在纸基材上印刷导电银浆而制作出RFID标签天线,研究了丝网印刷天线的工艺参数,讨论了工艺参数对制作RFID标签性能的影响,并通过优化试验对刮板施加给网版的压力,印刷速度,导电银浆固化温度与时间等制作工艺参数进行优化,得出最佳工艺参数,并制作出满足电阻特性的RFID标签天线。     

卷到卷丝网印刷RFID天线的工艺优化研究

采用卷到卷全自动丝网印刷机,在纸基材上印刷导电银浆制作RFID(电子标签)天线。通过正交优化实验研究了刮板与网版的承印角度、刮板压力、刮板移动速度和固化温度等四个可控因素对天线印刷工艺稳定性的影响。利用金相显微镜观察了导电银浆线路的表面效果与切片效果。优化结果得到最佳工艺参数,制作出满足电阻要求的RFID天线。     

柔性银包铜基导电线路的制备与性能

针对导电银浆价格高、导电铜浆易氧化等问题,采用银包铜粉作为导电填料,聚氨酯改性丙烯酸树脂为树脂基体,通过丝网印刷在聚酰亚胺薄膜上印制导电线路,并用热固化的方式进行固化,从而获得导电性能优良的柔性银包铜基导电线路。结果表明:当银包铜粉的含量为65%(质量分数)时,制备的导电胶各项性能达到最佳值,满足丝印要求,平均膜厚为29.25μm,固化后得到的导电膜电阻率达到最低值1.06×10~(-3)Ω·cm。     

文献与摘要（NO．19）

Novel Materiais for Printing Solderable Silver Circuits用于印制可焊接银电路的新颖材料 印制板常规制造方法是蚀刻铜箔的减去法,而如薄膜开关等是用厚膜膏经丝网印刷电路图形的加成法,这可避免许多废物产生。本文介绍一种新研究成功的银浆油墨(银导电膏),直接印刷于聚酰亚胺基材加工成挠性印制板,比常规蚀刻法工艺省去许多工序,也减少三废,新银导电膏材料制得的挠性板进行性能试验,在耐高温性、可焊性、电路与基板结合力、电路阻值稳定性等部符合要求。     

电子网版印刷技术中的银质碳质导电油墨

银质导电油墨有人简称为银浆或银油，碳质导电油墨亦有人简称为碳浆或碳油，在下面我们都会正规地称它们为银质导电油墨或碳质导电油墨。银质导电油墨和碳质导电油墨在电子行业、微电子行业及电子信息等行业的应用越来越广泛，例如有大家十分熟悉的采用网版印刷碳质导电油墨或导电聚合物等形成电阻是埋入电阻多层印刷电路板（MLB）的制造方法之一。     

低温共烧陶瓷内电极用导电银浆烧结匹配性能

采用优化后的玻璃粉配制成导电银浆,与MgSiO3-CaSiO3生瓷片共烧后形成导电厚膜,探讨了不同玻璃粉配方对所制厚膜的微观结构、热学性能、附着力、线膨胀系数和导电性能的影响,研究了导电银浆与基片低温共烧的匹配性能。结果表明,SiO2-Al2O3-B2O3-CaO-Li2O系玻璃粉配制的导电银浆低温共烧后获得的导电厚膜平滑、均匀、致密;随着该系玻璃粉中Li2O含量的增加,导电银浆的线胀系数逐渐降低;Li2O的质量分数为6%时,该浆料线胀系数最低,为18.482×10–6℃–1;Li2O的质量分数为2%时,导电厚膜与基片的线膨胀匹配性良好,导电性能最好,方阻为3.02 m?/□。     

电子网版印刷技术中的银质碳质导电油墨

一、迅速崛起的电子网版印刷业 银质导电油墨有人简称为银浆或银油,碳质导电油墨亦有人简称为碳浆或碳油,在下面我们都会正规地称它们为银质导电油墨或碳质导电油墨。银质导电油墨和碳质导电油墨在电子行业、微电子行业及电子信息等行业的应用越来越广泛,例如采用网版印刷碳质导电油墨或导电聚合物等形成电阻是埋入电阻多层印刷电路板（MLB）的制造方法之一;而内埋形MLB正是走向21世纪的先进安装技术中的重要课题之一,     

丝网印刷银浆的银层断裂（裂缝）的防治与对策

在制造薄膜开关电路层或RFID标签天线层时,银层（导线）的银（碳）浆通常是用丝网印刷来完成的。在丝网印刷银浆中,银层产生断裂（裂缝）是常见的故障之一,它严重影响产品的质量,甚至成为废品。因此,在电路导线的银浆丝网印刷中要引起重视。文章主要分析探讨银浆丝网印刷中产生导线断裂（裂缝）的原因和防治对策。     

导电银浆流变特性对丝网印刷填孔质量的影响

金属化通孔工艺是低温共烧陶瓷微波元件加工过程中的关键技术，直接影响着元件内部不同层之间电气连接的可靠性。对于采用丝网印刷实现填孔的方式而言，影响通孔填充质量的因素除网版、印刷工艺参数之外，很大程度上取决于导电银浆的特性。从导电银浆流变特性出发，分析了电子浆料触变性、黏度对浆料印刷填孔质量的影响。研究表明较好触变性和适当黏度的导电银浆能够明显提高印刷填孔质量，通孔填充饱满，烧结后金属化通柱无凹陷或凸起和孔洞。这一研究结果可有效指导低温共烧陶瓷薄膜丝网印刷金属化通孔的质量改善。     

丝网印刷光伏电池正面电极银浆的流变学研究

高效光伏电池要求正银电极"细栅密植",要获得栅线细和形貌好的正面电极,对导电银浆的要求是易过网、流平性好和高宽比大,即对浆料的流变学性能有特殊要求.印刷是一个动态过程,故传统的测试参数黏度和触变指数不能完全应用于对浆料印刷的指导.主要探讨导电银浆的流变学性能与实际印刷的关系,开发了简单的实验测量模式,通过对几种商业浆料的对比测试,发现该方法行之有效.同时,利用复杂模量和相位角可解释浆料的印刷和高效评价浆料的印刷性能.     

喷墨打印在液晶用彩色滤光片制造中的应用

彩色滤光片是液晶显示器件的重要组件,为了降低生产成本并提高显示性能,新型彩色滤光片制造技术的研发成为热点。喷墨打印具有快速、精准、材料利用率高等一系列优点,成为替代传统颜料分散法的新一代彩色滤光片制备技术。文章介绍了喷墨打印的基本原理,比较了喷墨打印成膜与传统涂布成膜的优缺点,分析了喷墨法制备彩色滤光片的技术关键,并根据目前的产业现状提出了努力方向。     

High Power Conversion Efficiency of 13.61% for 1 cm2 Flexible Polymer Solar Cells Based on Patternable and Mass-Producible Gravure-Printed Silver Nanowire Electrodes

With the aim of developing high-performance flexible polymer solar cells, the preparation of flexible transparent electrodes (FTEs) via a high-throughput gravure printing process is reported. By varying the blend ratio of the mixture solvent and the concentration of the silver nanowire (AgNW) inks, the surface tension, volatilization rate, and viscosity of the AgNW ink can be tuned to meet the requirements of gravure printing process. Following this method, uniformly printed AgNW films are prepared. Highly conductive FTEs with a sheet resistance of 10.8 Ω sq⁻¹ and a high transparency of 95.4% (excluded substrate) are achieved, which are comparable to those of indium tin oxide electrode. In comparison with the spin-coating process, the gravure printing process exhibits advantages of the ease of large-area fabrication and improved uniformity, which are attributed to better ink droplet distribution over the substrate. 0.04 cm² polymer solar cells based on gravure-printed AgNW electrodes with PM6:Y6 as the photoactive layer show the highest power conversion efficiency (PCE) of 15.28% with an average PCE of 14.75 ± 0.35%. Owing to the good uniformity of the gravure-printed AgNW electrode, the highest PCE of 13.61% is achieved for 1 cm² polymer solar cells based on the gravure-printed FTEs.     

变温LPCVD沉积氮化硅薄膜的均匀性优化

以低压化学气相沉积(LPCVD)热壁立式炉为实验平台,由二氯硅烷和氨通过LPCVD工艺合成氮化硅薄膜,利用降温成膜提高氮化硅薄膜的膜厚均匀度.基于气体碰撞理论建立了氮化硅薄膜沉积速率与反应气体浓度的关系式.分析比较了LPCVD炉内不同升温速率沉积氮化硅薄膜的表面性能.发现在变温沉积阶段,选择合适的降温速率是实现薄膜沉积...     

Experimental analysis and optimization of a photo resist coating process for photolithography in wafer fabrication

This investigation is applied the Taguchi method and combination the analysis of variance (ANOVA) to the photo resist (PR) coating process for photolithography in wafer manufacturing. Plans of experiments via nine experimental runs are based on the orthogonal arrays. In this study, the thickness mean and the uniformity of thickness of the PR are adopted as the quality targets of the PR coating process. This partial factorial design of the Taguchi method provides an economical and systematic method for determining the applicable process parameters. Furthermore, the ANOVA prediction of the thickness mean and the uniformity of thickness for the PR has been applied in terms of the PR temperature, chamber humidity, spinning rate, and dispensation rate by means of the designs of experiments (DOE) method. The PR temperature and the chamber humidity are found to be the most significant factors in both the thickness mean and the uniformity of thickness for a PR coating process. Finally, the sensitivity study of optimum process parameters was also discussed.     

利用水平热壁CVD法生长的3C-SiC/Si的均匀性

利用新改进的水平低压热壁CVD设备,改变生长时的压力和H2流速,在50mm的Si(100)和(111)衬底上获得了3C-SiC外延膜,并对外延膜的结构均匀性、电学均匀性和厚度均匀性进行了分析.X射线衍射图中出现了强的3C-SiC的特征峰,其中3C-SiC的(200)和(111)峰的半高宽分别为0.41°和0.21°.3C-SiC外延膜方块电阻的均匀性最好可达2.15%.厚度均匀性可达±5.7%(σ/mean值).     

Studying the uniformity of the surface resistance of Ti, Al, Ni, Cr, and Au metal films on silicon

Nanosized Ti, Al, Ni, Cr, and Au films were deposited onto KEF-20 (100)-oriented silicon plates with a diameter of 100 mm using the method of thermal evaporation in a vacuum. The value and uniformity of the distribution of the specific electrical resistance of the metal films were estimated by measuring their thickness and surface electrical resistance via the four-probe method. The specific electrical resistance of such films was shown to be considerably higher than for bulk materials. The observed increase in the surface resistance at the edges of the film was due to both the decrease in the thickness of the film and the increase in the specific electrical resistance of the material of the film. The proved regimes were used to obtain metal layers on gallium nitride substrates.     

Intelligent control of via formation by photosensitive BCB forMCM-L/D applications

Via formation is a critical process sequence in multichip module (MCM) manufacturing, as it greatly impacts yield, density, and reliability. To achieve low-cost manufacturing, modeling, optimization, and control of via formation are crucial. In this paper, a model-based supervisory control algorithm is developed and applied to reduce undesirable behavior resulting from various process disturbances. A series of designed experiments are used to characterize the via formation workcell (which consists of the spin coat, soft bake, expose, develop, cure, and plasma descum unit process steps). The output characteristics considered are film thickness, uniformity, film retention, and via yield. Sequential neural network process models are used for system identification, and hybrid genetic algorithms are applied to synthesize process recipes. Computer simulation results show excellent control of output response shift and drift, resulting in a reduction of process variation. The performance limits of the supervisory control system are investigated based on these simulation results. The control algorithm is verified experimentally, and the results show 82.6, 64.4, and 17.3% improvements in maintaining target via yield, film thickness, and film uniformity, respectively, as compared to open loop operation     

The characterization of electrically conductive silver ink patterns on flexible substrates

Electrically conductive silver ink patterns were produced by the screen printing method. Paper, fabrics and plastics were used as the substrate materials. The electrical properties of the samples were characterized by sheet resistance measurement as a function of curing temperature and curing time. The mechanical properties of the samples were characterized by cross hatch adhesion test, bending test and tensile test. Depending on the process parameters and materials, the sheet resistance of the printed conductive patterns varied between 0.04 Ω/□ and 0.13 Ω/□. The curing temperature appeared to have a significant effect on the sheet resistance. In all cases sheet resistance decreased as a function of curing temperature. Adhesion between the substrates and the conductive patterns appeared to be good. The result of the bending test indicated that the resistivity of the silver ink patterns increased as a function of the bending cycle process. The results of the tensile and electrical tests showed that with the screen printing method it is possible to produce highly stretchable electrically conductive patterns for practical applications.     

Polymer Inverter Fabricated by Inkjet Printing and Realized by Transistors Arrays on Flexible Substrates

We have fabricated organic thin-film transistors (OTFTs) and implemented inverters on flexible substrates using polythiophene (PHT) as the semiconductor and polyvinylphenol (PVP) as the gate dielectric. The semiconductor was defined by inkjet printing. The poor consistency of the printing process has affected the uniformity of inkjet-printed OTFTs enormously. We also proposed a method to increase the yield by incorporating a pre-testing step during circuit fabrication. We designed and fabricated a basic unit of circuits called a thin-film transistor (TFT) array. These devices were then connected to each other to form a gate via printed nano-silver. To verify the implementation flow, we designed and measured bootstrap inverters and ring oscillator composed of them. The five-stage ring oscillator has been fabricated and oscillated at the frequency, 60 Hz, when the supply voltage is 40 V      

利用镀液组成改善镀层厚度均匀性

概述了利用CuSO4镀液组成控制PCB的贯通孔镀层均匀性和导通孔填充镀层均匀性。