共查询到19条相似文献,搜索用时 140 毫秒
1.
用于倒装芯片的晶片凸点制作工艺研究 总被引:1,自引:0,他引:1
倒装芯片在电子封装互连中占有越来越多的份额,是一种必然的发展趋势,所以对倒装芯片技术的研究变得非常重要。倒装芯片凸点的形成是其工艺过程的关键。现有的凸点制作方法主要有蒸镀焊料凸点、电镀凸点、微球装配方法、焊料转送、在没有UBM的铅焊盘上做金球凸点、使用金做晶片上的凸点、使用镍一金做晶片的凸点等。每种方法都各有其优缺点,适用于不同的工艺要求。介绍了芯片倒装焊基本的焊球类型、制作方法及各自的特点,总结了凸点制作应注意的问题。 相似文献
2.
3.
随着射频集成电路向小型化、高集成方向发展,基于金凸点热超声键合的芯片倒装封装因凸点尺寸小、高频性能优越成为主流技术之一。以GaAs芯片上倒装Si芯片的互连金凸点为研究对象,通过有限元仿真方法,分析了温度和剪切力作用下不同高度金凸点的等效应力,得到金凸点的最优高度值。通过正交试验,研究键合工艺参数(压力、保持时间、超声功率、温度)对金凸点高度和键合强度的影响规律。通过可靠性试验,验证了工艺优化后倒装焊结构的可靠性。结果表明:键合工艺参数对凸点高度的影响排序为压力>超声功率>温度>保持时间,对剪切力的影响排序为压力>超声功率>保持时间>温度。 相似文献
4.
5.
6.
随着电子产品对小型、轻量、薄型、高性能的需求越来越迫切,使得倒装芯片技术得到了更加广泛的应用,而凸点的形成正是倒装焊接技术中的关键。本文介绍了用电镀法制作Sn/Pb凸点的基本方法,并对其中的厚胶光刻、UBM层溅射、电镀等关键工艺中应该注意的问题进行了描述。 相似文献
7.
8.
本文简要报道芯片倒装焊技术中IC芯片金属凸点的一种制作方法;在芯片铝电极上制作了不同薄膜金属化结构的金、铜凸点并对其物理性能界面作了初步分析。 相似文献
9.
10.
11.
12.
Joachim Kloeser Katrin Heinricht Erik Jung Liane Lauter Andreas Ostmann Rolf Aschenbrenner Herbert Reichl 《Microelectronics Reliability》2000,40(3):696
Area array packages (flip chip, CSP (Chip scale packages) and BGA) require the formation of bumps for the board assembly. Since the established bumping methods need expensive equipment and/or are limited by the throughput, minimal pitch and yield, the industry is currently searching for new and lower cost bumping approaches. The experimental work of stencil printing to create solder bumps for flip chip devices is described in detail in this article. In the first part of this article, a low cost wafer bumping process for flip chip applications will be studied in particular. The process is based on an electroless nickel under bump metallization and solder bumping by stencil printing. The experimental results for this technology will be presented, and the limits concerning pitch, stencil design, reproducibility and bump height will be discussed in detail. In the second part, a comparison of measured standard deviations of bump heights as well as the quality demands for ultrafine pitch flip chip assembly are shown. 相似文献
13.
焊球植球是一种最具潜力的低成本倒装芯片凸块制作工艺.采用焊球植球工艺制作的晶圆级芯片尺寸封装芯片的凸块与芯片表面连接的可靠性问题是此类封装技术研究的重点.为此,参考JEDEC关于电子封装相关标准,建立了检验由焊球植球工艺生产的晶圆级芯片尺寸封装芯片凸块与芯片连接及凸块本身是否可靠的可靠性测试方法与判断标准.由焊球植球工艺生产的晶圆级芯片尺寸封装芯片,分别采用高温存储、热循环和多次回流进行试验,然后利用扫描电子显微镜检查芯片上凸块剖面的凸块下金属层分布和测试凸块推力大小来验证凸块的可靠性.试验数据表明焊球植球工艺生产的晶圆级芯片尺寸封装芯片具有高的封装连接可靠性. 相似文献
14.
Joachim Kloeser Paradiso Coskina Rolf Aschenbrenner Herbert Reichl 《Microelectronics Reliability》2002,42(3):391-398
Area array packages (flip chip, CSP and BGA) require the formation of bumps for the board assembly. Since the established bumping methods need expensive equipment or are limited by the throughput, minimal pitch and yield the industry is currently searching for new and lower cost bumping approaches. In this paper the experimental work of stencil printing to create solder bumps for flip chip and wafer level CSP (CSP-WL) is described in detail.This paper is divided into two parts. In the first part of the paper a low cost wafer bumping process for flip chip applications will be studied in particular. The process is based on an electroless Nickel under bump metallization and solder bumping by stencil printing. The experimental results for this technology will be presented and the limits concerning pitch, reproducibility and bump height will be discussed in detail. The second part of the paper is focused on solder paste printing for wafer-level CSPs. In order to achieve large bumps an optimized printing method will be presented. Additionally advanced stencil design will be shown and the achieved results will be compared with conventional methods. 相似文献
15.
16.
Vincent Fiori Komi-Atchou EwuameSébastien Gallois-Garreignot Hervé JaouenClément Tavernier 《Microelectronics Reliability》2014
Thanks to finite elements simulation and dedicated post-processing routines, this paper explores stress induced mobility changes over three major bumping processes. A numerical comparative analysis over the assembly generations is carried out. In order to do so, models are built for solder flip chip, copper pillar flip chip and micro-copper pillar bumping. Design recommendations for MOSFET placement to include in conception tools are provided, which allow to ensure adherence to product specifications while technologies advance. 相似文献
17.
Kwang‐Seong Choi Sun‐Woo Chu Jong‐Jin Lee Ki‐Jun Sung Hyun‐Cheol Bae Byeong‐Ok Lim Jong‐Tae Moon Yong‐Sung Eom 《ETRI Journal》2011,33(4):637-640
A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder‐on‐pad technology of the fine‐pitch flip‐chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 µm in one direction. 相似文献
18.
Oppermann H. Kalicki R. Anhoeck S. Kallmayer C. Klein M. Aschenbrenner R. Reichl H. 《Electronics Packaging Manufacturing, IEEE Transactions on》2002,25(3):210-216
The choice of solder joint metallurgy is a key issue especially for the reliability of flip-chip assemblies. Besides the metallurgical systems already widely used and well understood, new materials are emerging as solderable under bump metallization (UBM). For single chip bumping Pd stud bumps form a solid core under the solder layer. These hard core solder bumps are an adequate solution if single dies are available only and the chosen assembly technology is flip chip soldering. The scope of this paper is to summarize the results from aging of lead/tin solder bumps on palladium. The growth of intermetallic and its impact on the mechanical reliability are investigated. 相似文献
19.
Consuelo Tangpuz Elsie A.Cabahug 《电子工业专用设备》2006,35(5):36-40
在倒装芯片应用中生长晶圆焊凸的工艺中对于间距较小(即小于150μm)、具有数个尺寸为150μm的焊凸,倒装前的焊锡涂敷好坏对产品的良率和可靠性起着重要作用。因为,如果涂敷的焊锡体积不均匀,就经不起涂敷过程中为确保涂敷在引线框上焊锡的完整和体积一致性而引入的强制视像系统检查,从而降低产出率。这就是一些组装工艺正设法减少或取消这些限制的原因。另一方面,采用直接熔化焊凸的方法来形成焊点是一种速度较快的工艺,但在保证回流处理后的离板高度方面有缺点,导致在温度和功率循环测试中的表现较差。介绍的采用铜接线柱焊凸(SolderBumponCopperStud;SBC)法解决了这些问题;对于那些需要倒装的组装工艺而言,这是可保障其制造性较佳的解决方案。介绍采用铜接线柱焊凸(SBC)工艺在附着在倒装芯片上的金属基片和焊凸之间形成焊点的新方法,利用铜接线柱焊凸技术再配合晶圆级的焊锡丝印工艺在半导体上预先形成焊凸。这是替代电镀焊凸工艺一种别具成本效益的方法。 相似文献