直接敷铜Al2O3陶瓷基板的界面产物研究

直接敷铜Ａｌ２Ｏ３基板已被广泛应用于大功率场合。本文通过Ｃｕ箔表面预氧化生成Ｃｕ２Ｏ的方法引入氧,１０７０℃在Ｃｕ箔和Ａｌ２Ｏ３基板界面上所产生的Ｃｕ－Ｃｕ２Ｏ共晶液体促进了二者的牢固结合,流动氮气氛下保温１ｈ,观察到了明显的界面产物层。ＳＥＭ和ＸＲＤ的分析表明,界面产物相为ＣｕＡｌＯ２。     

AlOOH对Al2O3直接凝固注模成型的动电特性、流变性及凝固过程的影响

直接凝固注模成型（ＤＣＣ）是一种新的近净尺寸的陶瓷成型技术，但湿坯强度较低（与注凝成型和注射成型相比），为了提高Ａｌ２Ｏ３直接凝固成型后的坯体强度，在Ａｌ２Ｏ３－ＤＣＣ过程中ＡｌＯＯＨ，本文系统考察了Ａｌ２Ｏ３＋ＡｌＯＯＨ体系的电动特性、流变性及凝固过程，重点讨论了ＡｌＯＯＨ加入对体系凝固行为，如活性酶添加量、固化过程动力学的影响。     

燃烧合成AlN/ Y2O3陶瓷及致密化机理分析

采用ＳＨＳ工艺,在１００ＭＰａ的高压氮气下,制备了具有较高致密度的ＡｌＮ／Ｙ２Ｏ３陶瓷,结果显示,Ａｌ－Ｎ２－Ｙ２Ｏ３体系的ＳＨＳ过程中,当反应温度升至１７６０Ｃ时,Ｙ２Ｏ３与Ａｌ２Ｏ３形成共晶液相Ｙ３ＡＩ３Ｏ１２,发生液相烧结。随着Ｙ２Ｏ３含量的增加,上烧结作用增强２,产物致密度显著提高,抗弯强度及断裂韧性。Ａｌ－Ｎ２－Ｙ２Ｏ３主要发生在燃烧波蔓延方向,具有明显的方向性。     

硼酸铝晶须增强ZL109Al复合材料的界面反应性

采用挤压铸造法制取了硼酸铝晶须增强ＺＬ１０９复合材料。利用高温ＤＳＣ,ＸＲＤ和ＳＥＭ对复合材料界面反应进行了分析。研究表明,９ＡＩ２Ｏ３２Ｂ２Ｏ３Ｗ／ＺＬ１０９复合材料界面反应的发生取决于合金元素和复合材料经历的温度,Ｍｇ是影响界面反应的一个主要因素,其与硼酸铝晶须相互作用生成界面产物ＭｇＡｌＯ２,ＡＩ能够与晶须发生反应,Ｏ对界面反应起促进作用,而Ｃｕ,Ｎｉ则不参与界面反应,制约界面反应的另一主要     

AlOOH对Al2O3直接凝固注模成型坯体强度等性能影响

为了改善直接注模成型（ＤＣＣ）氧化铝的坯体性能，在Ａｌ２Ｏ３－ＤＣＣ过程中加入ＡｌＯＯＨ本文详细研究了Ａｌ２Ｏ３＋ＡｌＯＯＨ体系的湿坯性能，干燥行为及烧结致密化过程，结果表明，少量ＡｌＯＯＨ加入可显著提高Ａｌ２Ｏ３的湿坯抗压强度和弹性模量，当ＡｌＯＯＨ体积含量〈３．０％时对干燥过程没有影响，干燥坯体经无压烧结后可获得烧结密度达３．９７ｇ／ｃｍ＾３（９９．７％ＴＤ）。显微结构均匀的α－Ａｌ２Ｏ３相。     

CeO_2质点对Al_2O_3型氧化膜和膜／基体界面的原子结合能的影响EI

采用ＳＩＭＳ测定Ａｌ，Ｎｉ等二次离子的束流强度与阻止电压曲线新技术，研究了ＣｅＯ_２对１１００℃恒温氧化条件下形成的Ａｌ_２Ｏ_３型氧化膜和膜／基体界面处的原子结合能的影响，并结合添加ＣｅＯ_２增加了原子间结合能的实验结果，分析了ＣｅＯ_２影响Ａｌ_２Ｏ_３氧化膜生长动力学的微观机制。     

高频等离子体超声喷雾热解法制备CuO/Al2O3粉体

以硝酸盐水溶液为原料、高频感耦等离子体为加热源、超声雾化热解的方法制备ＣｕＯ／Ａｌ２Ｏ３粉体。研究发现，溶液浓度及等离子参数体条件对粉初始态的特性有很大影响，浓度越低，粉体越细。纯Ａｌ２Ｏ３粉为粒径在１μｍ左右的空心球或壳状碎片，ＣｕＯ粉由无定型海绵体与平均粒度为２０ｎｍ的超细粒子组成。混合溶液制得的粉体形貌随着Ｃｕ／Ａｌ原子比的变化而变化，ＣｕＯ与Ａｌ２Ｏ３熔点温度相差较大是导致粉体生成微观过程     

Al2O3和Y2O3包覆的SiC复合粒子制备

本文利用非均匀成核法,将Ａｌ（ＯＨ）３和Ｙ（ＯＨ）３均匀地包覆在ＳｉＣ粒子表面,制备出被覆Ａｌ２Ｏ３和Ｙ２Ｏ的ＳｉＣ复合粒子,包覆Ａｌ（ＯＨ）３的ＳｉＣ粒子,其等电点ＩＥＰ的ｐＨ＝３．４移至ｐＨ＝７．３,再用Ｙ（ＯＨ）３包覆表面被覆Ａｌ（ＯＨ）３的ＳｉＣ复合粒子后,其等电点ＩＥＰ又从ｐＨ＝７．３移至ｐＨ＝８．６ｄａｄｋ。     

14mol%Ce-TZP和Al2O3/Ce-TZP层状复合材料的研究

本文主要通过对含有１４ｍｏｌ％ＣｅＯ２的Ｃｅ－ＴＺＰ及不同结构参数的Ｃｅ－ＴＺＰ／Ａｌ２Ｏ３层状复合材料断裂韧性的测试，从力学和材料角度出发分析Ａｌ２Ｏ３层厚及Ａｌ２Ｏ３层中Ｃｅ－ＴＺＰ的含量对材料力学性能的影响。同时通过对ＫＩＣ试样断裂后断面及受力侧面的激光拉曼微区分析，来定性解释Ａｌ２Ｏ３层的引入对Ｃｅ－ＴＺＰ相变区开头及相变量的影响，从而揭示此类材料的增韧机制?     

晶内型Al2O3—SiC纳米复合陶瓷的制备

研究了沉淀法制备Ａｌ２Ｏ３－ＳｉＣ纳米复合陶瓷的工艺过程，利用Ａｌ２Ｏ３从γ相到α相的蠕虫状生长过程，使大部分纳米ＳｉＣ颗粒位于Ａｌ２Ｏ３晶粒内，用沉淀法制得的、含有５ｖｏｌ％ＳｉＣ的Ａｌ２Ｏ３－ＳｉＣ纳米复合陶瓷，其强度为４６７ＭＰａ，韧性为４．７ＭＰａ．ｍ＾１／２，与一般的Ａｌ２Ｏ３陶瓷相比有较大的提高，显示了沉淀法制备Ａｌ２Ｏ３－ＳｉＣ纳米复合陶瓷的优点。     

Effect of Sequence of Impregnation on the Structure and Catalytic Properties of Cu-Co-Al-Oxide System

Twelve samples of Co-Cu/AI2O3 were prepared by impregnating AI2O3 with cobalt salt followed by copper salt or vice versa. The composition of the prepared samples varied in the molar ratios 1:1, 1:2 and 1:3 with respect to CuO.CoO or CoO:CuO, while Al2O3 content was kept at about 13-15 mol. The prepared solids were calcined at different temperatures and the products were characterized by means of XRD-analysis. The catalytic activity of the calcined solids was tested in H2O2 decomposition. The XRD-analysis revealed that the sequence of impregnation affects much the structure of the samples. The loading of alumina with cobalt followed by copper salts produced sample with structure differs from that for sample firstly treated with copper followed by cobalt salts. XRD- analysis showed the formation of crystalline spinel Co1-x Cux AI2O4 with nearly the same crystal structure as CoAI2O4 even with high copper content. The examination of catalytic activity of these samples showed that catalysts with Co-loaded ov     

水热法制备CuAlO_2粉末

以CuO、Cu、Al2O3和NaOH粉末作为反应原料,通过水热法制备了CuAlO2粉末。用X射线衍射(XRD),扫描电子显微镜(SEM),X射线光电子能谱(XPS),红外光谱对产物进行表征。XRD和SEM分析结果表明,反应时间、反应温度对产物的结晶程度和晶粒大小有着重要的影响。随着反应时间的增加,样品晶粒的粒径增大,而且晶粒变得均匀。XPS分析结果表明,当反应温度达到360℃,反应时间为12小时,反应产物中只有CuAlO相。     

Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

The adhesion strength of Cu/Ni–Cr/polyimide flexible copper clad laminate (FCCL) was evaluated according to the composition ratio of the Ni–Cr layer and the thickness of the Cu electroplating layer, by using a 90° peel test. The changes in the morphology, chemical bond and adhesion property were characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The peel strength of the FCCL increased with increasing Cr content and increasing Cu electroplating layer thickness. This increasing FCCL peel strength was attributed to a lower C–N bond and higher C–O and carbonyl (C=O) bonds in the polyimide surface compared to the FCCL with a lower adhesion strength. The adhesion property of the FCCLs was significantly affected by the Ni:Cr ratio.     

基于高温熔凝法Al_2O_3/ZrO_2/YAG共晶陶瓷显微组织演变规律

作为超高温结构材料,共晶氧化物陶瓷的力学性能和显微组织密切相关。采用高温熔凝法制备Al_2O_3/ZrO_2/YAG共晶陶瓷体,研究熔体温度和结晶种子对凝固组织影响规律,运用经典形核机制和Jackson-Hunt共晶生长模型探讨了凝固组织的演变机理。研究表明,随着熔体温度升高(1750~2000℃),凝固体物相组成从α-Al_2O_3,c-ZrO_2和YAG转变为α-Al_2O_3,c-ZrO_2和亚稳相YAP。凝固组织依次经历:非共晶Al_2O_3/ZrO_2/YAG、不规则共晶Al_2O_3/ZrO_2/YAG、纳米纤维状共晶Al_2O_3/ZrO_2/YAG和复杂粗大的亚稳复合陶瓷Al_2O_3/ZrO_2/YAP。分析表明,凝固组织的演变源于异质晶核点不断钝化导致形核过冷度和凝固路径改变,所以合理选择熔体温度和结晶种子是共晶组织调控的关键。     

铸态Al-4. 5Cu/TiB2 复合材料组织和性能的研究

提出一种新型的原位反应合成工艺——熔体反应法, 以TiO₂、H₃BO₃、Na₃AlF6 和Al-Cu 合金为原材料, 采用熔体反应法制备了低成本的内生颗粒增强Al-4. 5Cu/TiB₂ 复合材料。TiB₂ 颗粒细小, 平均尺寸为0. 93 Lm, 均匀分布于基体之中, 与基体结合良好。当TiB₂ 的含量为10 vo l% 时, 复合材料的抗拉强度为416. 7M Pa, 屈服强度为316.9M Pa, 延伸率为3. 3%。      

Charge-trapping characteristics of Al2O3/Cu/Al2O3 nanolaminate structures prepared through atomic layer deposition

The nanolaminate Al2O3/Cu/Al2O3 structures were constructed on p-type Si (001) substrates using atomic layer deposition (ALD) process with the aim to fabricating nonvolatile charge-trap memories. Low temperature Cu thin layers were deposited through plasma-enhanced atomic layre depositon of Cu aminoalkoxide (Cu(dmamb)2) combined with hydrogen plasma and Al2O3 layers were prepared by thermal atomic layer deposition of trimethylaluminum (TMA) combined with H2O. Nonvolatile features were confirmed using capacitance-voltage (C-V) measurements. The copper film functions as a charge-trapping layer and the Al2O3 thin layers were employed as tunneling and control oxide layers. Line shapes and binding energies of Cu metal and the thin layer of 6 nm Cu in nanolaminate structures were observed in the X-ray photoelectron spectroscopy (XPS) and high resolution transmission electron microscopy (TEM) image. The V(FB) shift width of the Al2O3 (28 nm)/Cu (6 nm)/Al2O3 (4.2 nm)/Si laminate structure is found to be 4.75 V in voltage sweeping between -10 and +10 V, leading to the trap density of 1.68 x 10(18) cm(-3).     

影响内氧化生成Al2O3/Cu表面复合层厚度及组织的因素

采用真空条件,用CuO作氧化剂,在一定的温度下使Cu-Al合金内氧化,获得Al₂O₃/Cu表面复合材料。金相分析发现,在较低温度下内氧化,表面复合层中Al₂O₃颗粒晶界处多于晶内;在较高温度下内氧化,复合层中Al₂O₃颗粒呈弥散状分布;表面复合层厚度随Al含量的增加而减薄,显微硬度随Al含量的增加而升高。      

Studies on optical properties,thermal stability and electrical conductivity of copper alumina nanoparticles-reinforced Poly(pyrrole-co-indole) for optoelectronic devices

Journal of Materials Science: Materials in Electronics - This work focused on the effect of copper alumina (Cu–Al2O3) nanoparticles in poly(pyrrole-co-indole) (PPy-co-PIN) on optical...     

Al2O3 particle rounding in molten copper and Cu8wt%Al

We investigate processing-microstructure relationships in the production of Al₂O₃ particle reinforced copper composites by solidification processing. We show that during production of the composites by gas-pressure infiltration of packed Al₂O₃ particle preforms with liquid Cu or with liquid Cu8wt%Al at either 1,150 or 1,300 °C, capillarity-driven transport of alumina can cause rounding of the Al₂O₃ particles. We use quantitative metallography to show that the extent of particle rounding increases markedly with temperature and with the initial aluminum concentration in the melt. An analysis of the thermodynamics and kinetics governing the transport of alumina in contact with molten copper, considering both interfacial and volume diffusion, leads to propose two mechanisms for the rounding effect, namely (i) variations in the equilibrium concentration of oxygen in the melt as affected by the initial aluminum concentration, or (ii) segregation of aluminum to the interface with the ceramic.