高精度子孔径拼接中参考面误差的去除方法

基于最小二乘拟合的传统干涉子孔径拼接方法实现了小口径干涉仪对大口径光学元件的检测,然而在子孔径测试过程中,由于干涉仪上的参考面存在面形误差,将使获得的各子孔径的面形数据偏离真实值,所以在进行高精度面形测量时,获得参考面的面形误差并将其补偿掉是非常必要的。因此,提出了一种在拼接过程中用Zernike项对子孔径间重叠区域数据进行拟合的方法来求得参考面面形。首先在传统的目标函数上加入一系列Zernike项表征待求参考面,然后按照最小二乘法对函数进行求解得到各项系数,从而得到拟合的参考面。对平面和球面分别进行了子孔径拼接实验,拟合得到的参考面面形与QED拼接干涉仪计算得到的参考面面形的PV值偏差小于5nm,RMS值偏差小于0.2nm,拼接后的重叠区域不匹配误差值小于10nm。实验结果表明,在子孔径拼接过程中可以补偿参考面误差而得到更真实的拼接面形。     

高精度平面子孔径拼接算法研究

对平面子孔径拼接累积误差的理论分析及数值仿真表明,参考镜面形的拼接重叠区域的局部斜率差和直流偏差是产生累积误差的原因。为了提高大口径平面光学元件子孔径拼接检测精度,提出一种简单有效的可以减小子孔径拼接测量累积误差的方法,该方法采用第4项和第6项泽尼克像差拟合一个假设的准参考镜面形,再从每个子孔径测量结果中减去,最后拼接合成全口径面形。对450mm×60mm的平面镜进行了8个子孔径的拼接检测,去除准参考镜面形前后,拼接测量结果与Zygo公司24英寸(600mm)口径干涉仪检测结果的偏差峰谷(PV)值从λ/7减小至λ/100。所拟合的准参考镜面形误差为0.02λ(PV值),与标准镜的面形误差为同一量级,其对每个子孔径测量结果的影响可以忽略。实验结果表明,本文方法能够有效控制拼接累积误差,提高拼接检测精度。     

一种降低平面子孔径拼接累积误差的方法

干涉仪参考镜面形离焦误差难以精确标定,是导致拼接累积效应、制约平面子孔径拼接系统检测精度的主要因素。推导了参考镜离焦与拼接累积误差、拼接次数间的定量表达式,基于该表达式在拼接过程中标定并去除参考镜离焦误差,降低拼接累积误差。对450 mm×60 mm的平面镜进行了8个子孔径的拼接检测,与大口径干涉仪检测结果比对,去除参考面离焦误差前后拼接测量误差峰谷(PV)值从λ/10减小至λ/30,有效提高了拼接测量精度。结合绝对检验技术标定参考镜高阶面形误差,验证了离焦是引起拼接误差累积的主要因素,消除参考镜高阶面形误差并不能显著提高拼接检测精度。     

平面子孔径拼接干涉测量精度分析

如何提高子孔径拼接干涉测量精度是子孔径拼接系统的关键问题。针对一维平面子孔径拼接系统,分别采用两两拼接算法和误差均化拼接算法,进行拼接位移台定位误差、参考面面形误差和随机噪声对拼接精度影响的数值仿真与分析。仿真结果表明,对于平面拼接系统,参考面高阶误差、随机噪声对拼接精度影响较小,高阶误差的影响略大于随机噪声的影响;参考面低阶误差(二阶项误差)在拼接过程中会累积放大,是平面拼接干涉测量的主要误差来源,误差均化拼接算法不能有效控制参考面低阶误差的拼接累积误差;两两拼接算法与误差均化拼接算法得到基本相同的拼接结果。对450mm×60mm的平面镜进行了15个子孔径的拼接测量,去除参考面低阶误差面形前后,拼接结果与大口径干涉仪的测量结果偏差从λ/3[峰谷值(PV),λ=632.8nm]减小至λ/45(PV)。     

子孔径拼接干涉检测中机械定位误差的补偿

为减少子孔径拼接干涉检测中机械精度引起的定 位误差对检测结果造成的影响,在一般的调整误差 拼接算法上加入机械定位误差的补偿项,建立了补偿机械误差的综合优化方法。针对参考 面未知的拼接 干涉检测,研究了应用极大似然估计法拟合出用Zernike多项式表示参考面面形分布的方法 ,在除去参考面 面形后采用补偿机械误差的算法拼接。模拟对比实验表明,在相同的机械精度下,机械误 差补偿算法得 到的全口径相位差异分布均方根(RMS)值减少到近一般调整误差 拼接法的1/6,机械误差补偿算法拼接精度高于一般 调整误差拼接法。在搭建的拼接检测装置上检测口径为280mm的平面 镜,与大口径干涉仪检测的全口径相位差异分布的峰谷(PV)值为 0.099λ,R MS值为0.006λ,验证了综合优化方法在重构 参考面面形基础上能有效补偿机械定位误差。     

基于Matlab和VC混合编程的三面互检程序设计

研究了光学平面绝对检验的干涉测量方法:三面互检法。该方法需要三个被测平面,两两组合测量,就能够得到被测平面在通过其中心两个垂直方向的线轮廓数据。根据Matlab和VC混合编程思想,设计了带界面的三面互检计算软件,能够对任何一台干涉仪所采集到的实验数据进行快速计算,并进行了实验验证,得到了所测干涉仪参考平晶的绝对面形,相对于Zygo软件计算误差为3%。     

大口径凸非球面反射镜子孔径拼接检测

为了获得大口径凸非球面反射镜全口径的面形,提出了利用子孔径拼接检测大口径凸非球面的新方法。利用干涉仪标准球面波前依次干涉测定大口径镜面上各个区域的相位分布,通过子孔径拼接算法即可求解得到镜面全口径面形信息。对该方法的基本原理和实现步骤进行了分析和研究,建立了大口径拼接检测算法的数学模型,设计并研制了大口径反射镜拼接检验装置。结合实例对一口径为260 mm 的碳化硅凸非球面反射镜进行了9 个子孔径的拼接干涉测量,并将拼接检测结果与全口径面形测量结果进行对比,两种方法测量面形PV 值和RMS 值的偏差分别为0.043和0.021（=632.8 nm）。     

基于迭代梯度算法的子孔径拼接检测技术研究

为了解决粗大调整误差下大口径光学平面镜的子孔径拼接检测问题,基于迭代梯度算法,建立了一套合理的拼接算法和数学模型,同时编制了拼接程序。结合工程实例,利用Φ600mm干涉仪实现了对Φ800mm平面镜的拼接测量。检测中,基于靶标对各子孔径实现对准,拼接所得面形光滑连续无狭缝。实验结果表明,利用迭代梯度算法可以高精度地完成粗大调整误差下大口径平面镜的拼接检测。     

基于最大似然估计算法的子孔径拼接检测技术

大口径平面镜作为光学系统的重要组成部分, 其面形精度对系统成像具有重要影响。子孔径拼接检测作为大口径光学平面反射镜检测的常用手段, 子孔径拼接算法是该技术的核心。研究了平面子孔径拼接算法, 基于最大似然估计与正交化Zernike多项式拟合建立了一套合理的拼接算法与数学模型, 基于该算法模型可以有效实现对大口径平面镜的拼接检测, 同时编写了相应的拼接程序, 并利用100 mm干涉仪对120 mm的平面镜进行了拼接检测, 给出了拼接检测与全口径检测的对比结果, 对比结果表明: 拼接所得全孔径相位分布与全口径检测结果的RMS值偏差分别为0.002, 验证了算法的可靠性与准确性。     

基于结构函数的子孔径拼接算法研究

为了更好地评价大口径反射光学元件在不同尺度下的起伏情况,提出了一种基于结构函数的子孔径拼接算法.首先,对于算法的基本原理与步骤进行了描述,从理论分析的角度对于计算误差的特性进行了分析;之后针对口径为1.23 m的大型反射镜面形数据,应用文中所提出的方法,利用结构函数进行子孔径拼接并对于其误差特性进行了检验,验证了所提出方法的可行性.最后,将该方法应用于30 m望远镜三镜(TMT M3)的面形仿真数据,得到了其在不同评价尺度下的起伏情况.文中的工作对于TMT M3 的最后完成有着重要的意义,并且对于与TMT M3 类似的大口径平面镜面形评价有着一定指导价值.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.