共查询到20条相似文献,搜索用时 31 毫秒
1.
《Solid-State Circuits, IEEE Journal of》1979,14(2):221-239
Recent advances of GaAs integrated circuit fabrication technology have made possible the demonstration of ultrahigh performance GaAs digital ICs with up to 64 gate MSI circuit complexities and with gate areas and power dissipations sufficiently low to make VLSI circuits achievable. The authors evaluate, based on the current state of GaAs IC technology and the fundamental device physics involved, the prospects of achieving an ultrahigh-speed VLSI GaAs IC technology. GaAs IC fabrication and logic circuit approaches is reviewed. The experimental performance results are compared for the leading GaAs logic circuit approaches, both for simple ring oscillators and for more complex sequential logic circuits. 相似文献
2.
设计并模拟分析了光纤通信用超高速单电源 Ga As判决再生电路 ,采用非掺 SI Ga As衬底直接离子注入、1μm耗尽型 Ga As MESFET、平面电路工艺研制出单片 Ga As判决再生电路。实验测试结果表明 ,该电路可对输入信号进行正确的“0”、“1”判决 ,并经时钟抽样后 ,输出正确的数字信号 ,传输速率可达 2 .8Gbit/s,可用于覆盖 2 .5Gbit/s系列光通信系统 相似文献
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《Electron Devices, IEEE Transactions on》1979,26(4):299-317
Recent advances in the state of GaAs integrated circuit fabrication technology have made possible the demonstration of ultrahigh performance (tau_{d} sim 100 ps) GaAs digital IC's with up to 64 gate MSI circuit complexities and with gate areas and power dissipations sufficiently low to make VLSI circuits achievable. It is the purpose of this paper to evaluate, based on the current state of GaAs IC technology and the fundamental device physics involved, the prospects of achieving an ultrahigh-speed VLSI GaAs IC technology. The paper includes a performance comparison analysis of Si and GaAs FET's and switching circuits which indicates that, for equivalent speed-power product operation, GaAs IC's should be about six times faster than Si IC's. The state of the art in GaAs IC fabrication and logic circuit approaches is reviewed, with particular emphasis on those approaches which are LSI/VLSI compatible in power and density. The experimental performance results are compared for the leading GaAs logic circuit approaches, both for simple ring oscillators and for more complex sequential logic circuits (which have demonstrated equivalent gate delays as low astau_{d} = 110 ps). 相似文献
5.
Si衬底上外延GaAs材料是微电子学研究的重要课题之一,本文介绍了以大直径的GaAs/Si材料取代GaAs衬底的工艺技术,对Ge元素在GaAs/Si集成电路中的分布影响进行了俄联电子能谱分析研究,并确定了该技术在大规模集成电路中的应用价值。 相似文献
6.
AlGaAs/GaAs HBT的低频噪声 总被引:2,自引:1,他引:1
测试了AlGaAs/GaAsHBT的低频噪声,并将测试结果分解为1/f噪声、G-R噪声和白噪声,阐述了它们的产生机理,在此基础上建立了AlGaAs/GaAsHBT输入噪声电压的等效电路模型,该模型有助于AlGaAs/GaAsHBT电路的CAD。 相似文献
7.
《Microwave Theory and Techniques》1980,28(5):459-466
In this paper, a method is presented which provides the electrode capacitance matrix for GaAs FET's. The method incorporates a Green's function, valid for conductors printed on or embedded in a grounded substrate, with the moment method technique. Although calculations for various geometries of printed conductors are considered, emphasis is placed on the computation of self- and mutual-capacitances for the source, gate, drain equivalent circuit of a GaAs FET. As an example, the speed power characteristics of a depletion-rnode GaAs FET inverter circuit are examined, as a function of device width, pad and gate length. 相似文献
8.
《Microwave Theory and Techniques》1979,27(5):394-399
A Ioad-pull technique utilizing a new method of determining tuner Y parameters is proposed for huge-signal characterization of microwave power transistors. Large-signal input-output transfer characteristics of an active circuit containing a GaAs FET and an input matching circuit are measured by inserting a microstrip tuner between the active circuit output drain terminal and the 50-Omega load. The microstrip-tuner Y parameters are determined by comparing the dc bias-dependent small-signal S parameter S/sub 22/ of the active circuit and that of the circuit which contains the active circuit and microstrip tuner. The reflection coefficient presented to the active circuit output drain terminal is derived from tuner Y parameters. Optimal load impedances for output power, obtained with this new Ioad-pull technique, are used to design X-band GaAs FET power amplifiers. An 11-GHz power amplifier with a 3000-mu m gate-width FET chip delivers 1-W microwave power output with 4-dB gain in the 500-MHz band. 相似文献
9.
A switched capacitor filter implemented with 5 mu m GaAs IGFET switches and GaAs MESFET operational amplifiers is presented. The circuit is clocked at 25 MHz. By scaling to 1 mu m IGFETs, a switching speed of about 625 MHz should be attainable. Use of GaAs IGFET switches is shown to greatly reduce power consumption and complexity of the circuit. The low frequency switching instability of the GaAs IGFET is shown to be of no consequence in this application.<> 相似文献
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研制了X波段的InGaP/GaAs HBT单级MMIC功率放大器,该电路采用自行开发的GaAs HBT自对准工艺技术制作.电路偏置于AB类,小信号S参数测试在8~8.5GHz范围内,线性增益为8~9dB,输入驻波比小于2,输出驻波比小于3,优化集电极偏置后,线性增益为9~10dB.在8.5GHz进行连续波功率测试,在优化的负载阻抗条件下,P1dB输出功率为29.4dBm,相应增益7.2dB,相应PAE〉40%,电路的饱和输出功率Psat为30dBm. 相似文献
11.
《Solid-State Circuits, IEEE Journal of》1974,9(5):269-276
The feasibility of using GaAs metal-semiconductor field-effect transistors (GaAs MESFET's) in fast switching and high-speed digital integrated circuit applications is demonstrated. GaAs MESFET's with 1-/spl mu/m gate length are shown to have a current-gain-bandwidth product f/SUB T/ equal to 15 GHz. These devices exhibit a 15 ps internal delay in a large-signal switching test. A simple logic circuit consisting of MESFET's and Schottky diodes was monolithically integrated on a semiinsulating GaAs substrate. This logic circuit exhibits a propagation delay of 60 ps with no output load, and 105 ps when its output is loaded by three similar logic gates. A useful bandwidth of approximately 3 GHz is observed. 相似文献
12.
《Microwave Theory and Techniques》1982,30(7):1027-1033
GaAs monolithic IC design and fabrication techniques suitable for baseband pulse amplification have been developed. The developed GaAs monolithic amplifier has a two-stage construction using two source-grounded FET's. To reduce input VSWR without serious noise-figure degradation, an inter-gate-drain negative feedback circuit was adopted. An interstage circuit is a dc-coupled circuit consisting of an appropriate impedance transmission line. Gate voltage for the second-stage FET is self-biased. The amplifier has 13.5-dB gain over the 3-dB bandwidth from below 500 MHz to 2.8 GHz. Less than 6-dB (7-dB) noise figure was obtained from 700 MHz to 2.2 GHz (150 MHz to 3 GHz). Input VSWR is less than 1.5 相似文献
13.
《Electron Devices, IEEE Transactions on》1982,29(7):1123-1129
GaAs monolithic IC design and fabrication techniques suitable for baseband pulse amplification have been developed. The developed GaAs monolithic amplifier has a two-stage construction using two source-grounded FET's. To reduce input VSWR without serious noise-figure degradation, an inter-gate-drain negative feedback circuit was adopted. An interstage circuit is a dc-coupled circuit consisting of an appropriate impedance transmission line. Gate voltage for the second-stage FET is self-biased. The amplifier has 13.5-dB gain over the 3-dB bandwidth from below 500 kHz to 2.8 GHz. Less than 6-dB (7-dB) noise figure was obtained from 700 MHz to 2.2 GHz (150 MHz to 3 GHz). Input VSWR is less than 1.5 相似文献
14.
给出了对DCFL电路单元的研究,包括电路设计和用先进的P埋层自对准栅工艺制作电路的实验结果。表明它可以适用于大规模GaAsDCFL电路的设计和制造。 相似文献
15.
《Reliability, IEEE Transactions on》1999,48(3):215-223
Earlier results have shown that GaAs devices do not exhibit appreciable degradation up to a radiation dose of nearly 108 rad (GaAs). The results of this work suggest that GaAs devices and circuits are sensitive to radiation exposure at dose levels below 108 rad(GaAs). Degradation was observed in E-MESFET and D-MESFET parameters and in circuit performance for devices which were designed and fabricated in a 1.2 μm GaAs process, when exposed to varying doses of 1.49 keV X-rays in the range 40-65 Mrad (GaAs). The degradation is attributed to the change in the properties of the MESFET channel region, caused by the transport of the atomic hydrogen from the passivation layer to the channel. A compensation circuit, based on the observed behavior of radiation effects on GaAs devices, has been designed to improve the radiation insensitivity of GaAs (E/D) based circuits under SPICE (Simulation Program with IC Emphasis) simulated conditions. Its usefulness is demonstrated through a DCFL inverter circuit up to nearly 108 rad (GaAs) dose level. The results of this work can be used in the design of complex-function radiation-insensitive DCFL based circuits 相似文献
16.
A switched capacitor DC-to-DC negative converter fabricated in GaAs MESFET technology is introduced in this paper. The converter has an oscillator that runs at 250 kHz, and requires two external capacitors, 0.1 and 1 μF. The converter runs off a wide range of supply voltage, 2 to 10 V, and has a typical output impedance of 75 Ω. A typical open circuit voltage conversion efficiency of 99.6% is achieved. The circuit can be integrated with other GaAs circuits to provide an on-chip negative supply. Measured, simulated and analytical results are introduced in this paper 相似文献
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Matsunaga N. Yamamoto M. Hatta Y. Masuda H. 《Electron Devices, IEEE Transactions on》2003,50(5):1194-1199
This paper describes an improved device model of GaAs MESFETs and heterojunction FETs for the design and analysis of analog integrated circuits. The proposed device model provides a new expression for the current and the capacitance of the device,which gives excellent agreements with experimental data for all regions of device operation. For the expression of the low frequency anomalies of GaAs devices, an improved technique with an equivalent circuit are presented to model the frequency dispersion of the transconductance and the drain conductance of the device, which give a good agreement with the experimental data of both the frequency dispersion and the lag effect of the device. The new device model proposed here clearly provides a superior prediction of the performance of GaAs analog integrated circuit. 相似文献
19.
A wide-bandwidth GaAs MESFET operational amplifier is reported, with a 65-dB DC gain and a 20-GHz gain-bandwidth product at 500 MHz. The circuit uses a variety of local feedback techniques to enhance the overall gain. The use of an undoped GaAs buffer, grown at a relatively low temperature (≈300°C), eliminates backgating and light sensitivity. The circuit was fabricated in an 80-GHz f T MESFET process, with 0.2-μm electron-beam defined gates. The high levels of 1/f noise, MESFET frequency-dependent output conductance, and large offset voltage standard deviation limit the application of the circuit to moderate precision applications 相似文献
20.
Fardi H.Z. Winston D.W. Hayes R.E. Hanna M.C. 《Electron Devices, IEEE Transactions on》2000,47(5):915-921
The energy balance equations coupled with drift diffusion transport equations in heterojunction semiconductor devices are solved modeling hot electron effects in single quantum well p-i-n photodiodes. The transports across the heterojunction boundary and through quantum wells are modeled by thermionic emission theory. The simulation and experimental current-voltage characteristics of a single p-i-n GaAs/Al xGa1-xAs quantum well agree over a wide range of current and voltage, The GaAs/AlxGa1-xAs p-i-n structures with multi quantum wells are simulated and the dark current voltage characteristics, short circuit current, and open circuit voltage results are compared with the available experimental data, In agreement with the experimental data, simulated results show that by adding GaAs quantum wells to the conventional cell made of wider bandgap Alx Ga1-xAs, short circuit current is improved, but there is a loss of the voltage of the host cell, In the limit of radiative recombination, the maximum power point of an Al0.35Ga0.65As/GaAs p-i-n photodiode with 30-quantum-well periods is higher than the maximum power point of similar conventional bulk p-i-n cells made out of either host Al0.35Ga0.65As or bulk GaAs material 相似文献