宽带GaAsFET微波单片集成单刀双掷开关

本文报道了一种采用串、并联ＦＥＴｓ结构的ＧａＡｓＭＭＩＣ单刀双掷开关。芯片尺寸为０．９７＊１．２３ｍｍ．在ＤＣ－１０ＧＨＺ频率范围内，插入损耗小于２．２ｄＢ，隔离度大于３２ｄＢ，反射损耗大于１２ｄＢ，并关时间小于１ｎｓ，在５ＧＨＺ下的功率处理能力大于２０ｄＢｍ。此开关具有极低的直流功率耗散。     

带GaAs TTL电平驱动器的SPDT开关的模拟和性能

介绍了一种带ＧａＡｓＴＴＬ电平驱动器及单刀双掷（ＳＰＤＴ）开关的设计、模拟和测试结果。驱动器的设计采用了开关输入稳压负载,建立了所用器件的大信号模型,对电路进行了模拟分析和优化,模拟和测试结果吻合较好,开关时间达到５ｎｓ,插入损耗小于１．０ｄＢ,隔离度大于６０ｄＢ。     

C波段单片有源环行器

报道了一种源耦合反馈单片有源环行器的研究结果、该单片电路采用实测ＦＥＴ的Ｓ参数进行微波ＣＡＤ优化设计，内部包含有３个３００μｍ栅宽的ＦＥＴ，芯片面积１．７ｍｍ×１．９ｍｍ。采用ＧａＡｓ的离子注入平面工艺，芯片电路具有良好的均匀性、一致性。在３．５～４．５ＧＨｚ内，电路插入损耗约７．５ｄＢ，隔离度为２１～２６ｄＢ，驻波比基本小于２。     

100dB高隔离无反射固态开关

ＡｍｅｒｉｃａｎＭｉｃｘｒｏｗａｖｅ推出了ＳＷＭ-６０００-１ＤＴＵ-ＧＢ高隔离度无反射ＳＰＳＴ固态开关,该开关的隔离度高达１００ｄＢ,开关速度极快,为２０ｎｓ,在１０ＭＨｚ～２ＧＨｚ的频带内,插入损耗为３ｄＢ,最大驻波比为２,工作电流和电压分别为±１０ｍＡ和±５ＶＤＣ,采用ＥＣＬ逻辑控制（兼容ＴＴＬ）,大小为３８１×３８１×１０２ｍｍ,具有可移动式ＳＭＡ连接器。100dB高隔离无反射固态开关     

Ka波段AlGaAs/InGaAs低噪声PHEMT异质材料结构的计算机优化与实验结果

讨论了毫米波低噪声ＰＨＥＭＴ的设计要点，藕助Ｓｃｈｒｏｅｄｉｎｇｅｒ／Ｐｏｉｓｓｏｎ方程及器件方程，进行了Ｋａ波段ＡｌＧａ／ＩｎＧａＡｓ低噪声ＰＨＥＭＴ用异质层数值计算及ＣＡＤ优化，确定出分子束外延ＭＢＥ时诸层的最佳组分、浓度、与厚度、上述优化分析的结果用于器件的实验研制，取得了３４．４ＧＨｚ下噪声系数（ＮＦ）１．９２ｄＢ、相关增益Ｇａ６．５ｄＢ的国内最好结果。     

AlGaAs／InGaAs功率PHEMT用异质材料的计算机优化与器件实验结果

借助一新的工艺模拟与异质器件模型用ＣＡＤ软件──ＰＯＳＥＳ（Ｐｏｉｓｓｏｎ－ＳｃｈｒｏｅｄｉｎｇｅｒＥｑｕａｔｉｏｎＳｏｌｖｅｒ），对以ＡｌＧａＡｓ／ＩｎＧａＡｓ异质结为基础的多种功率ＰＨＥＭＴ异质层结构系统（传统、单层与双层平面掺杂）进行了模拟与比较，确定出优化的双平面掺杂ＡｌＧａＡｓ／ＩｎＧａＡｓ功率ＰＨＥＭＴ异质结构参数，并结合器件几何结构参数的设定进行器件直流与微波特性的计算，用于指导材料生长与器件制造。采用常规的ＨＥＭＴ工艺进行ＡｌＧａＡｓ／ＩｎＧａＡｓ功率ＰＨＥＭＴ的实验研制。对栅长０．８μｍ、总栅宽１．６ｍｍ单胞器件的初步测试结果为：ＩＤｓｓ２５０～４５０ｍＡ／ｍｍ；ｇｍ０２５０～３２０ｍＳ／ｍｍ；Ｖｐ－２．０－２．５Ｖ；ＢＶＤＳ５～１２Ｖ。７ＧＨｚ下可获得最大１．６２Ｗ（功率密度１．０Ｗ／ｍｍ）的功率输出；最大功率附加效率（ＰＡＥ）达４７％。     

InP基HEMT制作的全集成D波段单片振荡－倍频链

本文报道了Ｄ波段单片振荡－倍频链的设计、ＭＭＩＣ制作及测试。该电路用亚微米（０．１μｍ）ＩｎＡｌＡｓ／ＩｎＧａＡｓＨＥＭＴ制造，且芯片上有稳定偏压电路，一个集成的Ｅ场探针书信号直接辐射入波导。检测到振荡信号的频率范围为１３０．５ＧＨｚ至１３２．８ＧＨｚ，输入功率为—１２ｄＢｍ，设计的ＨＥＭＴ小栅宽为４５μｍ。这是首次报道的用ＩｎＰ基ＨＥＭＴ制作的Ｄ波段单片振荡－倍频链。     

InP基HEMT制作的全集成D波段单片振荡—倍频链

本文报道了Ｄ波段单片振荡－倍频链的设计、ＭＭＩＣ制作及测试。该电路用亚微米（０．１μｍ）ＩｎＡｌＡｓ／ＩｎＧａＡｓＨＥＭＴ制造，且芯片上有稳定偏压电路，一个集成的Ｅ场探针将信号直接辐射入波导。检测到振荡信号的频率范围为１３０．５ＧＨｚ至１３２．８ＧＨｚ，输入功率为－１２ｄＢｍ，设计的ＨＥＭＴ小栅宽为４５μｍ。这是首次报道的用ＩｎＰ基ＨＥＭＴ制作的Ｄ波段单片振荡－倍频链。     

Ka波段功率PHEMT的设计与研制

报道了Ｋａ 波段功率ＰＨＥＭＴ的设计和研制结果。利用双平面掺杂的ＡｌＧａＡｓ／ＩｎＧａＡｓＰＨＥＭＴ材料,采用０．２ μｍ 的Ｔ型栅及槽型通孔接地技术,研制的功率ＰＨＥＭＴ的初步测试结果为：Ｉｄｓｓ：３６５ ｍ Ａ／ｍ ｍ ;ｇｍ ０：３２０ ｍ Ｓ／ｍ ｍ ;Ｖｐ：－ １．０～－ ２．０ Ｖ。总栅宽为７５０ μｍ 的功率器件在频率为３３ ＧＨｚ时,输出功率大于２８０ ｍ Ｗ,功率密度达到３８０ ｍ Ｗ／ｍ ｍ ,增益大于６ ｄＢ。     

反射型GaAs光控微波开关

对反射型ＧａＡｓ光控微波开关的结构、实验系统和特性参量进行了研究。实验测出该微波开关的插入损耗低于１ｄＢ，隔离度达到３０ｄＢ。用５０ｎｓ光脉冲照射开关，其开关速度小于１０ｎｓ。     

基于GaAs PIN二极管的宽带大功率单片单刀双掷开关

GaAs PIN二极管具有开态电阻小、截止频率高以及功率容量大的特点,采用GaAs PIN二极管制作的开关插入损耗较小、隔离度较高、并且功率的线性较好。基于河北半导体研究所GaAs PIN工艺制造了一款单刀双掷开关芯片。该开关采用单级并联结构。通过微波在片测试,在小信号条件下,6～18 GHz范围内插入损耗小于1.45 dB、隔离度大于28 dB,输入输出反射损耗小于7.5 dB。把开关装入夹具中进行功率特性测试,在连续波输入功率37 dBm,12 GHz条件下测试输出功率仅压缩0.5 dB,具有非常好的功率特性。在4英寸(100 mm)晶圆上开关的成品率较高,具有非常好的工程应用前景。     

8～20GHz GaAs pin二极管单片单刀双掷开关

基于中国科学院微电子研究所的GaAs pin二极管工艺,设计、制作并测试了一种单片单刀双掷开关.在8～20GHz频段内,开关正向导通时的插人损耗最小值为1.5dB,输入和输出端的同波损耗大于10dB;开关关断状态的隔离度最大值为32dB.开关的支路采用串联-并联-并联的结构,其中的GaAs pin二极管基区厚为2.5μm.在1.3V的偏置电压下,正向导通的串联二极管工作电流为     

A high-performance 40-85 GHz MMIC SPDT switch using FET-integrated transmission line structure

A compact ultra-broadband distributed SPDT switch has been developed using GaAs PHEMTs. An FET-integrated transmission line structure, where the source pad of the shunt FET has been integrated into the signal line while the drain has been grounded to a via-hole with minimum parasitic inductance, has been proposed to extend the operating bandwidth of the distributed switches. SPDT and SPST switches using this structure have been fabricated using a commercial GaAs PHEMT foundry. The SPDT switch showed low insertion loss (<2 dB) and good isolation (>30 dB) over an octave bandwidth from 40 to 85 GHz. At 77 GHz, the SPDT switch showed extremely low insertion loss of 1.4 dB and high isolation of 38 dB. The chip size was as small as 1.45/spl times/1.0 mm/sup 2/. To the best of our knowledge, this is among the best performance ever reported for an octave-band SPDT switch at this frequency range. SPST switch also showed the excellent performance with the insertion loss of 0.4 dB and isolation of 34 dB at 60 GHz.     

一种X波段GaAs单片单刀双掷开关

采用0.2μmGaAsPHEMT工艺设计了一种X波段单刀双掷开关单片集成电路。在片测试结果为8～11GHz范围内,隔离度>30dB,在中心频率9.5GHz能够达到45dB,插损<1.2dB。芯片结构非常简单紧凑,仅用了两个并联的PHEMT管。     

Monolithic 2-18 GHz low loss, on-chip biased PIN diode switches

Two state-of-the-art monolithic GaAs PIN diode switches have been designed, fabricated and tested. These single-pole double-throw (SPDT) switches exhibit insertion losses of 1.15±0.15 dB over a 2-18 GHz band, which is an unprecedented performance in loss and flatness for monolithic wideband switches incorporating on-chip bias networks. Isolation and return loss are greater than 43 dB and 12 dB, respectively, and the input port power handling is 23 dBm at 1-dB insertion loss compression. These performance characteristics were measured at a nominal bias setting of -8 V, which corresponds to 3.7 mA of series diode bias current and a total dc power consumption of 55 mW. The input power at the third-order interception is 40 dBm. The switches can handle up to 31 dBm (1.25 W) at a higher bias of -18 V and 9.3 mA     

Integrated Amplifier Circuits for 60 GHz Broadband Telecommunication

Wide frequency bandwidth has been internationally allocated for unlicensed operation around the oxygen absorption frequency at 60 GHz. A power amplifier and a low noise amplifier are presented as building blocks for a T/R-unit at this frequency. The fabrication technology was a commercially available 0.15 m gallium arsenide (GaAs) process featuring pseudomorphic high electron mobility transistors (PHEMT). Using on-wafer tests, we measured a gain of 13.4 dB and a +17 dBm output compression point for the power amplifier at 60 GHz centre frequency when the MMIC was biased to 3 volts V_dd. At the same frequency, the low noise amplifier exhibited 24 dB of gain with a 3.5 dB noise figure. The AM/AM and AM/PM characteristics of the power amplifier chip were obtained from the large-signal S-parameter measurement data. Furthermore, the power amplifier was assembled in a split block package, which had a WR-15 waveguide interface in input and output. The measured results show a 12.5 dB small-signal gain and better than 8 dB return losses in input and output for the packaged power amplifier.     

X波段GaN收发前端芯片设计

本文设计了一款基于0.25 um氮化镓PHEMT工艺的8.5-10.5GHz MMIC收发前端芯片,该收发前端由一个功率放大器和一个单刀双掷开关组成.经仿真优化后,在工艺线上进行了流片,并载片测试了其性能参数.测试结果显示,发射路的功率放大器饱和输出功率大于33dBm,功率附加效率39%.接收路开关插入损耗0.6dB,开关隔离度大于37dB.     

SPDT GaAs Switches With Copper Metallized Interconnects

Copper metallized AlGaAs/InGaAs pseudomorphic high-electron-mobility transistor (PHEMT) single-pole-double-throw (SPDT) switches utilizing platinum (Pt, 70nm) as the diffusion barrier is reported for the first time. In comparison with the Au metallized switches, the Cu metallized SPDT switches exhibited comparable performance with insertion loss of less than 0.5dB, isolation larger than 35dB and the input power for one dB compression (input P_1dB ) of 27dBm at 2.5GHz. These switches were annealed at 250deg for 20h for thermal stability test and showed no degradation of the dc characteristics after the annealing. Also, after 144h of high temperature storage life (HTSL) environment test, these switches still remained excellent and reliable radio frequency (RF) characteristics. It is successfully demonstrated for the first time that the copper metallization using Pt as the diffusion barrier could be applied to the GaAs monolithic microwave integrated circuits switch fabrication with good RF performance and reliability     

A novel loss compensation technique analysis and design for 60 GHz CMOS SPDT switch

A novel loss compensation technique for a series-shunt single-pole double-throw (SPDT) switch is presented operating in the 60 GHz. The feed-forward compensation network which is composed of an NMOS, a couple capacitance and a shunt inductance can reduce the impact of the feed forward capacitance to reduce the insertion loss and improve the isolation of the SPDT switch. The measured insertion loss and isolation characteristics of the switch somewhat deviating from the 60 GHz are analyzed revealing that the inaccuracy of the MOS model can greatly degrade the performance of the switch. The switch is implemented in TSMC 90-nm CMOS process and exhibits an isolation of above 27 dB at transmitter mode, and the insertion loss of 1.8-3 dB at 30-65 GHz by layout simulation. The measured insertion loss is 2.45 dB at 52 GHz and keeps<4 dB at 30-64 GHz. The measured isolation is better than 25 dB at 30-64 GHz and the measured return loss is better than 10 dB at 30-65 GHz. A measured input 1 dB gain compression point of the switch is 13 dBm at 52 GHz and 15 dBm at 60 GHz. The simulated switching speed with rise time and fall time are 720 and 520 ps, respectively. The active chip size of the proposed switch is 0.5×0.95 mm².     

1.0μm栅长GaAs基MHEMT器件及SPDT开关MMIC

利用MBE外延材料和接触式光学光刻方式,成功制备出1.0μm栅长GaAs基MHEMT器件,分别蒸发Pt/Ti/Pt/Au和Ti/Pt/Au作为栅电极金属.获得了优越的DC和RF性能,Pt/Ti/Pt/Au和Ti/Pt/Au MHEMT器件的gm为502(503)mS/mm,JDss为382(530)mA/mm,VT为0.1(-0.5)V,fT和fmax分别为13.4(14.8),17.0(17.5)GHz.利用单片集成增强/耗尽型GaAs基MHEMT器件制备出九阶环型振荡器,直流电压为1.2V时,振荡频率达到777.6MHz,门延迟时间为71.4ps.利用Ti/Pt/Au MHEMT器件设计并制备出了DC-100Hz单刀双掷(SPDT)关MMIC,其插入损耗、隔离度、输入输出回波损耗分别优于2.93,23.34和20dB.