基底温度对直流磁控溅射ITO透明导电薄膜性能的影响

用直流磁控溅射法制备透明导电锡掺杂氧化铟(ITO)薄膜,靶材为ITO陶瓷靶,组分为m(In2O3):m(SnO2)=9:1.运用分光光度计,四探针测试仪研究了基底温度对薄膜透过率、电阻率的影响,并用X射线衍射(XRD)仪对薄膜进行结构分析.计算了晶面间距和晶粒尺寸,分析了薄膜的力学性质.实验结果表明,在实验设备条件下,直流磁控溅射ITO陶瓷靶制备ITO薄膜时,适当的基底温度(200℃)能在保证薄膜85%以上高可见光透过率下,获得最低的电阻率,即基底温度有个最佳值.薄膜的结晶度随着基底温度的提高而提高.     

Enhancement of Oxidation Resistance and Electrical Properties of Indium-Doped Copper Thin Films

Copper thin films with high conductivity and good resistance to electromigration can be used in advanced electronic devices. However, the poor corrosion resistance of copper must be overcome. This work elucidates the possibility of using a self-forming passivation layer to prevent copper oxidation in lightly indium-doped copper thin films deposited directly on glass substrates and annealed under various oxygen atmospheres. The resistivity of the studied film declined gradually as the film was annealed at an elevated temperature because of the grain growth of the Cu film and the precipitation of indium from the In-doped Cu thin film, as revealed by X-ray diffraction, four-point probe measurements, and transmission electron microscopy. A copper film with high indium content exhibited superior passivation when the film was annealed in an oxygen-rich ambient, but it exhibited high resistivity because of its high indium content. The electrical and passivation properties demonstrated that indium is a promising alloying element for use in copper films for future metallization structures and thin-film transistors.     

铝膜沉积温度对铝诱导结晶化多晶硅薄膜性能的影响

以超白玻璃为衬底,采用热丝化学气相沉积法沉积初始非晶硅膜,经自然氧化形成二氧化硅层,最后利用磁控溅射 法在不同衬底温度下沉积铝膜,制备了glass/Si/SiO/Al叠层结构并对其进行铝诱导晶化形成多晶硅薄膜.用X射线衍射,光学显微镜和拉曼光谱对样品进行了分析.结果表明,铝诱导晶化制备的多晶硅薄膜的晶粒大小随着铝膜沉积...     

PLD法制备ITO导电薄膜及其性能

为了研制可用于高温环境下进行应变测量的应变层,采用脉冲激光沉积(PLD)法在陶瓷基底上制备了氧化铟锡(ITO)薄膜.研究了PLD法中不同基底温度对ITO薄膜显微结构、电学性能以及阻温特性的影响.采用X射线衍射仪(XRD)测试了薄膜的晶体结构,通过四点探针测量法测得薄膜的薄层电阻,采用场发射扫描电子显微镜(FESEM)对...     

绒面AZO最新研究进展及应用

掺铝氧化锌(AZO)透明导电膜作为一种光电性能优异的透明导电膜(TCO)受到研究人员的广泛关注,并被认为是当前大规模使用的传统铟锡氧化物(ITO)的替换材料。绒面AZO薄膜因其电阻率低、高透过率且具有良好的陷光效果,可以提高太阳能电池的光电转换效率,而被认为是太阳能电池前电极的理想材料。综述了绒面AZO透明导电膜的制备方法和性能研究现状,并针对AZO的国内外研究状况提出了今后的发展趋势和研究方向。     

Laser Direct Writing of Conductive Silver Film on Polyimide Surface from Decomposition of Organometallic Ink

Laser direct writing of organometallic ink to manufacture silver films was investigated by using a continuous-wave, Yb-doped fiber laser beam at a wavelength of 1071 nm. The organometallic ink consisted of an organometallic silver complex and a carrier vehicle, which was prepared by reaction of silver oxide with ammonium carbamates in methanol. The organometallic silver decomposed at a laser power of 0.1 W. The electrical resistivity values of silver conductors that were fabricated at a laser power of 0.5 W were about four times that of bulk silver. The morphology and electrical properties of the silver film were observed to be controllable as a function of laser processing parameters. The fabricated silver film exhibited excellent adherence to the polyimide substrate surface according to evaluation using the peel-off testing method.     

Preparation and characteristics of Nb-doped indium tin oxide thin films by RF magnetron sputtering

Niobium-doped indium tin oxide(ITO:Nb)thin films are fabricated on glass substrates by radio frequency(RF)magnetron sputtering at different temperatures.Structural,electrical and optical properties of the films are investigated using X-ray diffraction(XRD),atomic force microscopy(AFM),ultraviolet-visible(UV-VIS)spectroscopy and electrical measurements.XRD patterns show that the preferential orientation of polycrystalline structure changes from(400)to(222)crystal plane,and the crystallite size increases with the increase of substrate temperature.AFM analyses reveal that the film is very smooth at low temperature.The root mean square(RMS)roughness and the average roughness are 2.16 nm and 1.64 nm,respectively.The obtained lowest resistivity of the films is 1.2×10-4?.cm,and the resistivity decreases with the increase of substrate temperature.The highest Hall mobility and carrier concentration are 16.5 cm2/V.s and 1.88×1021 cm-3,respectively.Band gap energy of the films depends on substrate temperature,which is varied from 3.49 eV to 3.63 eV.     

Effects of substrate temperature on electrical and structural properties of copper thin films

This paper addresses the effects of substrate temperature on electrical and structural properties of dc magnetron sputter-deposited copper (Cu) thin films on p-type silicon. Copper films of 80 and 500 nm were deposited from Cu target in argon ambient gas pressure of 3.6 mTorr at different substrate temperatures ranging from room temperature to 250 °C. The electrical and structural properties of the Cu films were investigated by four-point probe and atomic force microscopy. Results from our experiment show that the increase in substrate temperature generally promotes the grain growth of the Cu films of both thicknesses. The RMS roughness as well as the lateral feature size increase with the substrate temperature, which is associated with the increase in the grain size. On the other hand, the resistivity for 80 nm Cu film decreases to less than 5 μΩ-cm at the substrate temperature of 100 °C, and further increase in the substrate temperature has not significantly decreased the film resistivity. For the 500 nm Cu films, the increase in the grain size with the substrate temperature does not conform to the film resistivity for these Cu films, which show no significant change over the substrate temperature range. Possible mechanisms of substrate-temperature-dependent microstructure formation of these Cu films are discussed in this paper, which explain the interrelationship of grain growth and film resistivity with elevated substrate temperature.     

Properties of the Mo Back Contact for the Formation of a Thin-Film Photovoltaic Absorber

A Taguchi experimental design was used to find which deposition parameter has the most dominant effect on the electrical resistivity of molybdenum (Mo) films. Based on the most important parameter, the Mo films were further characterized by structural, electrical, and adhesive methods. Then, a copper indium gallium selenide (CIGS) thin film was fabricated by a two-stage process on the obtained Mo layer. The results show that working pressure had a dominant effect on electrical resistivity. The Mo films deposited at 1 mTorr and 2 mTorr exhibited compressive strain and dense polycrystalline microstructure, whereas those deposited at 3 mTorr and 4 mTorr exhibited tensile strain and an elongated grain with open boundaries. A Mo film with open porous structure, tensile strain, and lower resistivity was suitable for the formation of CIGS films. After selenization at 560°C, a single-phase chalcopyrite CIGS film with a layer of MoSe₂ at the Mo/CIGS interface was obtained.     

Effect of substrate temperature on the properties of deep ultraviolet transparent conductive ITO/Ga2O3 films

正ITO/Ga_2O_3 bi-layer films were deposited on quartz glass substrates by magnetron sputtering.The effect of substrate temperature on the structure,surface morphology,optical and electrical properties of ITO/Ga_2O_3 films was investigated by an X-ray diffractometer,a scanning electron microscope,a double beam spectrophotometer and the Hall system,respectively.The structural characteristics showed a dependence on substrate temperature. The resistivity of the films varied from 6.71×10~(-3) to 1.91×10~3Ω·cm as the substrate temperature increased from 100 to 350℃.ITO(22 nm)/Ga_2O_3(50 nm) films deposited at 300℃exhibited a low sheet resistance of 373.3Ω/□and high deep ultraviolet transmittance of 78.97%at the wavelength of 300 nm.     

Comparative study of electrically conductive thick films with and without glass

An air-fireable, glass-free, electrically conductive thick-film material (96.6% Ag, 1.38% Cu, 0.28% Al, 0.35% Ti, and 1.39% Sn by weight) and a conventional glass-containing, electrically conductive thick-film materials (96.6% Ag and 3.4% glass frit by weight), both on alumina substrates, were studied by electrical, mechanical, thermal, and microscopic methods. The volume electrical resistivity of the glass-free thick film (2.5×10⁻⁶ Ω·cm, 30-μm thick) is lower than that of the glass-containing thick film (3.9×10⁻⁶ Ω·cm, 19-μm thick), with each film processed at its optimum firing temperature. The optimum firing temperature is 930°C and 850°C for glass-free and glass-containing thick films, respectively, as indicated by the criteria of low resistivity and high scratch resistance. The glass-free thick film has a higher scratch resistance than the glass-containing thick film, both fired at their respective optimum temperatures, suggesting that the former has higher bond strength to the alumina substrate. The formation process of the glass-free and glass-containing thick films is similar. The process involves solid-state diffusion of silver, which results in a silver network and grain boundaries. However, the sintering of silver particulates in the glass-containing thick film is enhanced by the viscous flow of glass.     

On the electrical resistivity and chemical etching of TiSi2 thin films sputtered from a composite target

The electrical resistivity of TiSi₂ thin films sputtered onto an oxidised Si substrate using a composite alloy target is studied. It is found that the as-deposited films show high resistivity. Annealing the films at an elevated temperature leads to a significant fall in the resistivity. An optimum sheet resistance of 2om tq⁻¹ is obtained after annealing at 800°C for 30 min in argon ambient. The effect of annealing temperature on resistivity is studied. The sheet resistance is also found to be affected by the magnitude of the substrate bias during film deposition. The data are given. The patterning of TiSi₂ thin films by wet chemical etching for device applications is described.     

多孔硅衬底上ZnS薄膜的PLD制备和表征

在电化学阳极氧化法制备的多孔硅（porous silicon,PS）衬底上用脉冲激光沉积法（pulsed laser deposition,PLD）在250℃和350℃下生长ZnS薄膜。XRD图样显示,制备的ZnS薄膜沿β—ZnS（111）方向择优生长,较高的生长温度下,衍射峰强度较大。SEM结果表明,250℃生长的Z...     

Investigation of techniques for minimizing resistivity of thin metallic films at submillimeter wavelengths

Experimental investigations of the substrate deposition temperature and annealing temperature influence on aluminum films deposited on diamond substrates were conducted. Tests were performed at direct current and at 101.55 GHz. Minimum resistivity levels, near theoretical predictions, occurred for deposition temperatures in the range of 50–160°C and for peak annealing temperatures of 100–120°C. Both colder and hotter substrate temperatures resulted in larger resistivity levels.     

Microstructures and electrical properties of SrRuO3 thin films on LaAIO3 substrates

Conductive SrRuO₃ thin films have been deposited using pulsed laser deposition on LaA10₃ substrates at different substrate temperatures. Structural and microstructural properties of the SrRuO₃/LaAlO₃ system have been studied using x-ray diffraction, scanning electron microscopy, and scanning tunneling microscopy. Electrical properties of SrRuO₃ thin films have been measured. It was found that the film deposited at 250°C is amorphous, showing semiconductor-like temperature dependence of electrical conductivity. The film deposited at 425°C is crystalline with very fine grain size (100∼200?), showing both metallic and semiconductor-like temperature dependence of electrical conductivity in different temperature regions. The film deposited at 775°C shows a resistivity of 280 μΩ.cm at room temperature and a residual resistivity ratio of 8.4. Optimized deposition conditions to grow SrRuO₃ thin films on LaA10₃ substrates have been found. Possible engineering applications of SrRuO₃ thin films deposited at different temperatures are discussed. Bulk and surface electronic structures of SrRuO₃ are calculated using a semi-empirical valence electron linear combination of atomic orbitals approach. The theoretical calculation results are employed to understand the electrical properties of SrRuO₃ thin films.     

Ohmic contacts for GaAs devices

Contact alloys were developed for use on a wide variety of GaAs devices such as high temperature transistors and Gunn oscillators. The alloys are composed of silver, indium and germanium for n-type GaAs and of silver, indium and zinc for p-type GaAs. Fabrication steps that require temperatures of up to 770°K for already contacted devices can be performed. GaAs transistors can be operated over a range from 20 to 770°K using Ag-In-Ge contacts for emitter and collector and Ag-In-Zn contacts for the base. Gunn oscillators have been built for the frequency range between 13 and 26 GHz with efficiencies as high as 3 percent at 15.8 GHz and as high as 1 percent at 25 GHz in continuous wave operation. A simple technique was developed to evaluate the specific contact resistance on thin epitaxial layers. Specific contact resistance is well below 10⁻⁴ ω-cm² on 0.1 ω-cm or lower resistivity p- or n-type GaAs. The highest value was 1 × 10⁻³ ω-cm² measured on 0.6–2.6 ω-cm n-type GaAs.     

玻璃衬底上RF磁控溅射CIGS薄膜的研究

采用射频磁控溅射的工艺,在玻璃衬底上制备得到了铜铟镓硒(CIGS)薄膜。讨论了衬底温度、溅射气压、退火与否对CIGS薄膜与衬底结合力、显微形貌、晶化程度及电阻率的影响。通过能谱(EDS)测试证明了溅射的CIGS薄膜Ga组分比符合高效吸收层的要求,通过X射线衍射(XRD)与扫描电子显微镜(SEM)测试,证明了衬底加热溅射、溅射后450℃空气退火可以有效提高CIGS薄膜与衬底的结合并提高晶化程度。通过四探针法电阻率测试证明了低气压条件下溅射、溅射后退火可以有效降低CIGS的电阻率,通过透射光谱分析证明了CIGS薄膜对可见光有高吸收效率,适合作为太阳电池的高效吸收层。     

Photoelectric properties of ITO thin films deposited by DC magnetron sputtering

As anti-reflecting thin films and transparent electrodes of solar cells,indium tin oxide（ITO） thin films were prepared on glass substrates by DC magnetron sputtering process.The main sputtering conditions were sputtering power,substrate temperature and work pressure.The influence of the above sputtering conditions on the transmittance and conductivity of the deposited ITO films was investigated.The experimental results show that, the transmittance and the resistivity decrease as the sputtering power increases from 30 to 90 W.When the substrate temperature increases from 25 to 150℃,the transmittance increases slightly whereas the resistivity decreases.As the work pressure increases from 0.4 to 2.0 Pa,the transmittance decreases and the resistivity increases.When the sputtering power,substrate temperature and work pressure are 30 W,150℃,0.4 Pa respectively,the ITO thin films exhibit good electrical and optical properties,with resistivity below 10^-4Ω·cm and the transmittance in the visible wave band beyond 80%.Therefore,the ITO thin films are suitable as transparent electrodes of solar cells.     

AZO透明导电薄膜的制备

采用射频磁控溅射法在玻璃衬底上制备了ZnO:Al(AZO)透明导电薄膜,并借助XRD、SEM等表征方法,研究了溅射功率和衬底温度对薄膜结构、表面形貌及光电特性的影响。结果表明,制备薄膜的最佳溅射功率和衬底温度分别为180 W、200℃,在此条件下制备的AZO薄膜具有明显的c轴(002)择优取向,其最低方块电阻为18/□,在可见光范围内的平均透光率超过91%,且透明导电性能优于目前平板显示器的要求,有望取代现在市场上的主流氧化铟锡(ITO)薄膜。     

Effect of thickness on optoelectrical properties of Nb-doped indium tin oxide thin films deposited by RF magnetron sputtering

Niobium-doped indium tin oxide （ITO:Nb） thin films are prepared on glass substrates with various film thicknesses by radio frequency （RF） magnetron sputtering from one piece of ceramic target material. The effects of thickness （60-360 nm） on the structural, electrical and optical properties of ITO: Nb films are investigated by means of X-ray diffraction （XRD）, ultraviolet （UV）-visible spectroscopy, and electrical measurements. XRD patterns show the highly oriented （400） direction. The lowest resistivity of the films without any heat treatment is 3.1×10^-4 Ω·cm^-1, and the resistivity decreases with the increase of substrate temperature. The highest Hall mobility and carrier concentration are 17.6 N·S and 1.36×10²¹ cm^-3, respectively. Band gap energy of the films depends on substrate temperature, which varies from 3.48 eV to 3.62 eV.