0．6VCMOS轨至轨运算放大器

为适应低压低功耗设计的应用,设计了一种超低电源电压的轨至轨CMOS运算放大器。采用N沟道差分对和共模电平偏移的P沟道差分对来实现轨至轨信号输入．。当输入信号的共模电平处于中间时,P沟道差分对的输入共模电平会由共模电平偏移电路降低,以使得P沟道差分对工作。采用对称运算放大器结构,并结合电平偏移电路来构成互补输入差分对。采用0．13μm的CMOS工艺制程,在0．6V电源电压下,HSpice模拟结果表明,带10pF电容负载时,运算放大器能实现轨至轨输入,其性能为：功耗390μw,直流增益60dB,单位增益带宽22MHz,相位裕度80°。     

一种齐纳二极管控制式轨对轨CMOS运算放大器

采用0.6μm CMOS工艺,设计了一种齐纳二极管控制式轨对轨运算放大器.该运放采用了3.3V单电源供电,其输入共模范围和输出信号摆幅接近于地和电源电压,即所谓输入和输出电压范围轨对轨.该运放的小信号增益为82dB,单位增益带宽为12.34MHz,相位裕度为68°.由于电路简单,工作稳定,输入输出线性动态范围宽,非常适合于SOC芯片内集成.文中主要讨论该轨对轨运算放大器的原理,性能及设计方法,并进行了模拟仿真.     

一种恒跨导高增益轨到轨运算放大器

基于TSMC 0.18 μm CMOS工艺,设计了一种新颖的恒跨导高增益轨到轨运算放大器。输入级仅由NMOS管差分对构成,采用电平移位及两路复用选择器控制技术,在轨到轨共模输入范围内实现了输入级恒跨导。中间级采用折叠式共源共栅放大器结构,运算放大器能获得高增益。输出级采用前馈型AB类推挽放大器,实现轨到轨全摆幅输出。利用密勒补偿技术进行频率补偿,运算放大器工作稳定。仿真结果表明,在1.8 V电源电压下,该运算放大器的直流开环增益为129.3 dB,单位增益带宽为7.22 MHz,相位裕度为60.1°,整个轨到轨共模输入范围内跨导的变化率为1.44%。     

基于单差分对输入级的新型轨到轨运算放大器设计

本文基于CMOS工艺设计了一种新型的轨到轨集成运算放大器。对比分析传统轨到轨输入级设计的优劣,该运放选择采用单差分对输入级结构,使用耗尽型NMOS管作为输入对管,利用耗尽型NMOS管的体效应以及对输入级电路结构的优化,实现轨到轨输入,以AB类输出级结构实现轨到轨输出。经过Cadence仿真验证,工作在5 V单电源供电下,共模输入电压范围可以实现满轨0～5 V,增益高达141.1 dB,带宽1.7 MHz,相位裕度55.4°,具有较低的输入失调电压264μV、输入偏置电流9 pA。整体电路实现了近乎满轨的轨到轨的输出电压摆幅,达到轨到轨运算放大器的设计要求。     

一种轨至轨输入的低压低功耗运放的设计

本文采用0.35μm的CMOS标准工艺,设计了一种轨至轨输入,静态功耗150μW,相位增益86dB,单位增益带宽2.3MHz的低压低功耗运算放大器。该运放在共模输入电平下有着几乎恒定的跨导,使频率补偿更容易实现,可应用于VLSI库单元及其相关技术领域。     

一种低噪声轨对轨输入CMOS运算放大器的设计

提出一种新颖的运算放大器电路结构,该电路基于同沟道MOSFET轨对轨输入设计技术,采用弱反型动态阈值MOS(DTMOS)晶体管作为输入差动对同时获得了很好的噪声性能和轨对轨输入共模范围.这些性能的获得仅仅是以增加很小的电路复杂性为代价的,而且没有增加静态功耗.该电路采用0.18μm CMOS工艺设计,仿真结果表明,在1.8V的电源电压下提供78dB的直流开环增益和38kHz的-3dB带宽,输入参考噪声电压大约5.4nV/(Hz)～(1/2).整个输入共模范围内,跨导基本恒定,浮动误差小于5%.     

恒跨导轨对轨CMOS运算放大器的设计

为了提高运算放大器对电源电压的利用率,基于GSMC 0.18 μm CMOS工艺模型,设计了一种高增益恒跨导轨对轨CMOS运算放大器。该运算放大器的输入级采用了互补差分对,并通过3倍电流镜法保证输入级总跨导在整个共模输入范围内恒定;为了获得较大的增益和输出摆幅,中间级采用了折叠式共源共栅结构;输出级采用了AB类输出控制电路,使输出摆幅基本实现了轨对轨。在3.3 V供电电压以及1.6 V输入电压下,该放大器的直流增益为126 dB,单位增益带宽为50 MHz,相位裕度为65°。电路结构简单,易于调试,可大大缩减设计周期和成本。     

一种轨到轨高速CMOS滞回比较器

本文介绍了一种预放大-锁存CMOS滞回比较器,在输入级采用轨到轨结构,使用一种新颖的电流求和电路,大大降低了输入级传输时延.器件采用sMIC0.18μm标准CMOS工艺库,在Cadence Spectre环境下仿真,结果表明:此较器的工作频率达到250MHz以上,静态工作电流为257μA,上升时延为1.94ns,下降时延为1.81ns,低频增益为89dB.     

一种采用共栅频率补偿的轨到轨输入/输出放大器

提出了一种采用共栅频率补偿的轨到轨输入/输出放大器,与传统的Miller补偿相比,该放大器不仅可以消除相平面右边的低频零点,减少频率补偿所需要的电容,还可获得较高的单位增益带宽.所提出的放大器通过CSMC 0.6μm CMOS数模混合工艺进行了仿真设计和流片测试:当供电电压为5V,偏置电流为20μA,负载电容为10pF时,其功耗为1.34mW,单位增益带宽为25MHz;当该放大器作为缓冲器,供电电压为3V,负载电容为150pF,输入2.66 Vpp10kHz正弦信号时,总谐波失真THD为-51.6dB.     

一种低失调CMOS轨到轨运算放大器研究

基于CMOS工艺设计了一款轨到轨运算放大器,整体电路包括偏置电路、输入级、输出级以及ESD保护电路。电路中的输入级使用了一种全新的架构,通过一对耗尽型NMOS管作为输入管,实现轨到轨输入,同时在输入级采用了共源共栅结构,能够提供较高的共模输入范围和增益;在输出级,为了得到满摆幅输出而采用了AB类输出级;同时ESD保护电路采用传统的GGMOS电路,耐压大于2 kV。经过仿真后可知,电路的输入偏置电流为150 fA,在负载为100 kΩ的情况下,输出最高和最低电压可达距电源轨和地轨的20 mV范围内,当电源电压为5 V时能获得80 dB的CMRR和120 dB的增益,相位裕度约为50°,单位增益带宽约为1.5 MHz。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first