共查询到19条相似文献,搜索用时 218 毫秒
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环境断裂研究进展 总被引:5,自引:2,他引:3
本文介绍了环境断裂近年来的研究进展.第一部分是功能材料的环境断裂.研究发现,铁电陶瓷如PZT和Ba-TiO3在有水或无水环境中,应力能使压痕裂纹发生滞后扩展(即存在应力腐蚀).恒电场能引起铁电陶瓷的畴变,不协调畴变会产生内应力,电场和应力场对环境断裂存在耦合作用,因此,恒电场下环境断裂的本质是内应力引起的环境断裂;对磁致伸缩材料如(ThDy)Fe2,应力和磁场均能引起畴变,卸载压痕裂纹在湿空气中的滞后扩展以及恒磁场引起的滞后畴变及滞后开裂均能发生.第二部分是关于氢压裂纹(白点)的再认识.氢压裂纹形核前是一个内壁光滑的空腔,微裂纹从空腔壁产生,而后连接形成白点.白点断口和含白点试样的断口概念不同,对车轮钢,前者为准解理的穿晶断裂,和氢致滞后开裂断口相同,但后者则依赖断裂方式和试样厚度.钢中白点除了产生二次裂纹外,对各种断口形貌均没有影响.车轮钢的滞后断裂由原子氢引起,与白点无关. 相似文献
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发动机燃油供油导管断裂失效分析 总被引:3,自引:1,他引:3
某型发动机连续发生两起由于与主输油圈连接的U形燃油供油导管在连接处断裂引起的空中漏油故障.对断裂导管的安装位置、结构特点及装配情况进行了检查,对同型发动机进行了开车试验,对导管断口进行了分析.结果表明,两根导管的断裂性质相同,均为起始应力较大的高周疲劳断裂,疲劳裂纹起始于U形导管内侧或外侧的焊缝部位.U形导管装配应力大是导致导管疲劳裂纹早期萌生的主要原因,高压燃油冲击和脉动引起的弯曲应力对裂纹的萌生也有一定的影响,导管焊缝处存在的焊接缺陷对裂纹的萌生具有促进作用. 相似文献
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φ 846 mm轮箍发生崩裂,为确定轮箍失效原因,对其进行解剖检验分析.低倍酸洗后发现轮缘表面有多条热裂纹.金相检验可知其表面存在马氏体组织.断裂起源于轮缘表面的热裂纹,为典型的疲劳断口.结果表明:轮箍崩裂由轮缘处热裂纹引起.轮缘处热裂纹的产生与其使用、路况等因素有关. 相似文献
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利用金相显微镜和扫描电镜对汽车防倾杆断裂件进行了检测,结合防倾杆的制造工艺分析了断裂原因,并提出了针对性的预防措施。试验结果表明:失效防倾杆是脆性断裂,断裂是由于该件在装配前存在原始裂纹。断裂件金相组织以回火屈氏体为主,其横截面呈阶梯状,其中裂纹起源区域存在氧化脱碳现象。断裂件在成形过程中产生的微裂纹是失效的主要原因,微裂纹在淬火过程中发生扩展。 相似文献
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针对直升机杆端关节轴承杆端体多次出现断裂故障进行失效分析,通过断口宏微观观察、材质检测、能谱分析、裂纹源周围特征观察以及疲劳试验件断口分析等,结合对未装机国产件和进口件杆端体内壁加工表面观察对比,分析出故障件的断裂性质为疲劳断裂,断裂起源于杆端体内壁与轴承外圈的微动磨损处,故障件发生微动磨损的原因与杆端内壁表面加工方式不合理有关。为深入查找原因,对改进工艺后的同一型号国产件通过不同装配方式进行疲劳试验性能分析和疲劳断裂件失效分析,得出采用温差装配改进后的轴承可最大程度的降低发生疲劳断裂的风险。 相似文献
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飞机发动机引气预冷系统导管固定卡箍服役后发生断裂,通过外观观察、断口宏微观观察、金相组织检查、硬度试验、化学成分分析等方法对卡箍断裂原因进行了综合分析,结果表明:断裂卡箍为高周疲劳断裂;导管设计布局在发动机舱,断裂卡箍处位于导管安装有波纹管端附近,在发动机运转中产生振动,如果卡带与支架装配过程中装配应力过大,会导致外表面边角处应力较大,同时在振动应力作用下,在外表面边角应力集中处形成裂纹并扩展,降低支架的边缘和卡带表面处的应力集中,消除卡带边缘的残余应力,可有效防止卡箍的疲劳断裂。 相似文献
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重点从轴承的化学成分、显微组织等方面检查轴承的制造质量。结合断口分析和装配使用方法,对轴承损坏原因进行了分析。结果表明,轴承内圈上存在原始裂纹,工作过程中受力不均,转动过程中温度升高,性能下降。内圈首先断裂,引起滚动体变形和外圈断裂。 相似文献
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A ZrC-20 vol% SiC based ceramic matrix composite containing 10 vol% graphite flake was fabricated by hot press sintering. The thermal shock resistance of the materials was investigated through the water-quench method and subsequent three-point bend testing of flexural strength diminution. The ZrC-20 vol% SiC composite containing 10 vol% graphite flake exhibited higher critical temperature difference and higher residual ratio of strength compared with that of ZrC-20 vol% SiC composite. It is the main reason that addition of the graphite flake provides a weak interface into the material which acts to deflect propagating cracks, and the bridging of the cracks occurred. Meanwhile, a laminar structure of the graphite flake would relax the interface stress by sliding of interlayers and provide favorable sites for the dissipation of energy associated with crack growth during fracture. 相似文献
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Wang ZhiWu Zhanjun Shi Guodong 《International Journal of Refractory Metals and Hard Materials》2011,29(3):351-355
A ZrB2 ceramic containing 25 vol.% graphite flake (ZrB2-graphite) ceramic was fabricated by hot-pressing at 1950 °C. It was shown that the fracture toughness was significantly improved due to the addition of graphite flake whereas the flexure strength and hardness were slightly reduced. The increase in fracture toughness was attributed to the presence of soft graphite flake and weaker interface bonding. The decrease in the flexural strength was due to the increase in weakening factors such as the weaker bonding within the ZrB2-graphite ceramic and lower load transfer since the lower mechanical property of the graphite flake as well as graphite flakes acted as flaws in the ZrB2-graphite ceramic. The thermal shock resistance was significantly improved and the improvement mechanism in thermal shock resistance was analyzed by Griffith fracture criterion and finite element analysis. 相似文献
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The mechanical behavior of a ternary Sn-15In-2.8Ag ball-grid array assembly was evaluated at ambient and elevated temperatures.
The maximum stress of the Sn-15In-2.8Ag ball-grid array assembly decreased as the temperatures increased and the strain rates
decreased. An irregular brittle NiSnIn intermetallic layer formed at the SnInAg/Au/Ni/Cu interface, resulting in decreased
bond strength of the joints. The Arrhenius diagram of the Sn-15In-2.8Ag ball-grid array assembly at a constant stress of 16 MPa
consists of two straight lines intersecting at 50 °C, which indicates that two kinds of creep mechanism controlled the Sn-15In-2.8Ag
ball-grid array assembly deformation. The AuIn2 intermetallics and grain boundaries acted as the location for nucleation of the creep voids, which induced reduction of the
solder’s cross-sectional area and led the Sn-15In-2.8Ag ball-grid array assembly to fail rapidly with a transgranular creep
fracture. 相似文献
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基于三维实体造型软件Pro/Engineer,介绍了虚拟装配技术在应力断料夹具装配中的应用,使夹具工艺装备进一步柔性化,更适合现代化的制造需求。 相似文献
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某企业一60Si2Mn阶梯长轴经锻造及粗加工后在调质淬火阶段发生爆裂.本文对爆裂断口、组织及爆裂形成机理进行了分析,分析表明,淬火残留内应力是产生爆裂的主要原因,原材料缺陷和大锻件心部疏松空洞及夹杂物偏聚是引起爆裂的另一主要原因.根据分析结果,提出了降低心部残留应力和减少心部疏松空洞、夹杂物偏聚等工艺措施. 相似文献