5~6GHz自适应线性化偏置的InGaP/GaAs HBT功率放大器

针对高质量无线局域网的传输需求,设计了一款工作在5~6 GHz的宽带磷化镓铟/砷化镓异质结双极型晶体管(InGaP/GaAs HBT)功率放大器芯片。针对HBT晶体管自热效应产生的非线性和电流不稳定现象,采用自适应线性化偏置技术,有效地解决了上述问题。针对射频系统的功耗问题,设计了改进的射频功率检测电路,以实现射频系统的自动增益控制,降低功耗。通过InGaP/GaAs HBT单片微波集成电路(MMIC)技术实现该功率放大器芯片。仿真结果表明,功放芯片的小信号增益达到32 dB;1 dB压缩点功率为28.5 dBm@5.5 GHz,功率附加效率PAE超过32%@5.5 GHz;输出功率为20 dBm时,IMD3低于-32 dBc。     

Noise analysis of a photoreceiver using a P-I-N and GaAs HBT distributed amplifier combination

A noise analysis for a common-collector-cascode traveling wave HBT preamplifier is developed. The photoreceiver, consisting of a P-I-N and GaAs HBT MMIC distributed amplifier, was implemented using Nortel's f/sub T/=70 GHz GaAs HBT process, is the first to have a P-I-N mounted on the MMIC chip. The P-I-N preamplifier, having a measured bandwidth of 22 GHz, displayed a measured average equivalent input noise current density of 24 pA//spl radic/Hz. Good agreement was obtained between the predicted and measured noise performance.     

Linearised HBT MMIC power amplifier with partially RF coupled active bias circuit for W-CDMA portable terminals applications

A highly linear MMIC power amplifier for wideband code-division multiple-access (W-CDMA) portable terminals has been devised and implemented with a new integrated on-chip lineariser. The proposed lineariser, consisting of an InGaP/GaAs heterojunction bipolar transistor (HBT) active bias circuit partially coupled to RF input power together with a feedback capacitor, effectively improves gain compression with little insertion power loss and no additional die area. The optimised lineariser improves maximum output power (P1 dB) by 2 dB and adjacent channel leakage power ratio (ACLR) by 4 dB, and the implemented HBT MMIC power amplifier exhibits a P1 dB of 30 dBm, a power gain of 30 dB, a power added efficiency of 42% at the maximum output power under an operation voltage of 3.4 V, and an ACLR of -34 dBc at 27 dBm of output power.     

A DC-20-GHz InP HBT balanced analog multiplier for high-data-ratedirect-digital modulation and fiber-optic receiver applications

This paper reports on a dc-20-GHz InP heterojunction bipolar transistor (HBT) active mixer, which obtains the highest gain-bandwidth product (GBP) thus far reported for a direct-coupled analog mixer integrated circuit (IC). The InP HBT active mixer is based on the Gilbert transconductance multiplier cell and integrates RF, local oscillator, and IF amplifiers, High-speed 70-GHz f_T and 160-GHz f_max InP HBT devices along with microwave matching accounts for its record performance. Operated as a down-converter mixer, the monolithic microwave integrated circuit achieves an RF bandwidth (BW) from dc-20 GHz with 15.3-dB gain and benchmarks a factor of two improvement in GBP over state-of-the-art analog mixer ICs. Operated as an up-converter, direct-digital modulation of a 2.4-Gb/s 2³¹ -1 pseudorandom bit sequence (PRBS) onto a 20-GHz carrier frequency resulted in a carrier rejection of a 28 dB, clock suppression of 35 dBc, and less than a 50-ps demodulated eye phase jitter. The analog multiplier was also operated as a variable gain amplifier, which obtained 20-dB gain with a BW from dc-18 GHz, an third-order intercept of 12 dBm, and over 25 dB of dynamic range. A single-ended peak-to-peak output voltage of 600 mV was obtained with a ±35-mV 15 Gb/s 2⁵-1 PRES input demonstrating feasibility for OC-192 fiber-telecommunication data rates. The InP-based analog multiplier IC is an attractive building block for several wideband communications such as those employed in satellites, local multipoint distribution systems, high-speed local area networks, and fiber-optic links     

移动通信中的射频集成电路

介绍分析了在蜂窝和个人通信业务 (PCS)市场中适用于 RFIC的多种射频晶体管技术。Ga As HBT技术被作为介绍的基线 ,并且与目前已有的技术进行比较 ,得出对于射频应用 ,Ga AsHBT综合了 Si BJT和 Ga As FET两者优点的结论。文中还介绍了近年来国外 Ga As HBT MMIC,PHEMT MMIC和 In P HBT MMIC的研究进展情况。     

High Power SiGe X-Band (8～10GHz) Heterojunction Bipolar Transistors and Amplifiers

Limited by increased parasitics and thermal effects as device size increases,current commercial SiGe power HBTs are difficult to operate at X-band (8～12GHz) frequencies with adequate power added efficiencies at high power levels.We find that,by changing the heterostructure and doping profile of SiGe HBTs,their power gain can be significantly improved without resorting to substantial lateral scaling.Furthermore,employing a common-base configuration with a proper doping profile instead of a common-emitter configuration improves the power gain characteristics of SiGe HBTs,thus permitting these devices to be efficiently operated at X-band frequencies.In this paper,we report the results of SiGe power HBTs and MMIC power amplifiers operating at 8～10GHz.At 10GHz,a 22.5dBm (178mW) RF output power with a concurrent gain of 7.32dB is measured at the peak power-added efficiency of 20.0%,and a maximum RF output power of 24.0dBm (250mW) is achieved from a 20 emitter finger SiGe power HBT.The demonstration of a single-stage X-band medium-power linear MMIC power amplifier is also realized at 8GHz.Employing a 10-emitter finger SiGe HBT and on-chip input and output matching passive components,a linear gain of 9.7dB,a maximum output power of 23.4dBm,and peak power added efficiency of 16% are achieved from the power amplifier.The MMIC exhibits very low distortion with 3rd order intermodulation (IM) suppression C/I of -13dBc at an output power of 21.2dBm and over 20dBm 3rd order output intercept point (OIP3).     

High Power SiGe X-Band (8～10GHz) Heterojunction Bipolar Transistors and Amplifiers

Limited by increased parasitics and thermal effects as device size increases, current commercial SiGe power HBTs are difficult to operate at X-band (8～ 12GHz) frequencies with adequate power added efficiencies at high power levels. We find that, by changing the heterostructure and doping profile of SiGe HBTs, their power gain can be significantly improved without resorting to substantial lateral scaling. Furthermore, employing a common-base configuration with a proper doping profile instead of a common-emitter configuration improves the power gain characteristics of SiGe HBTs, thus permitting these devices to be efficiently operated at X-band frequencies. In this paper,we report the results of SiGe power HBTs and MMIC power amplifiers operating at 8～10GHz. At 10GHz,a 22.5dBm (178mW) RF output power with a concurrent gain of 7.32dB is measured at the peak power-added efficiency of 20.0%, and a maximum RF output power of 24.0dBm (250mW) is achieved from a 20 emitter finger SiGe power HBT. The demonstration of a single-stage X-band medium-power linear MMIC power amplifier is also realized at 8GHz. Employing a 10-emitter finger SiGe HBT and on-chip input and output matching passive components, a linear gain of 9.7dB,a maximum output power of 23.4dBm,and peak power added efficiency of 16% are achieved from the power amplifier. The MMIC exhibits very low distortion with 3rd order intermodulation (IM) suppression C/I of -13dBc at an output power of 21.2dBm and over 20dBm 3rd order output intercept point (OIP3).     

Fully Integrated Broadband CPW Left-Handed Metamaterials Based on GaAs Technology for RF/MMIC Applications

A fully integrated broadband coplanar waveguide left-handed metamaterial medium using GaAs technology for radio frequency/monolithic microwave integrated circuit (RF/MMIC) applications is reported and validated by the full wave simulation and measured results. The unit cell of the fabricated structures has a size of 0.09 mm². The left handedness of the integrated left-handed structure extends from 2.3 to 17.5 GHz. The compactness and broad left-handed operating bandwidth make the presented left-handed metamaterial be well incorporated with RF/MMIC applications.     

High Power SiGe X-Band (8～10GHz) Heterojunction Bipolar Transistors and Amplifiers

Limited by increased parasitics and thermal effects as device size increases, current commercial SiGe power HBTs are difficult to operate at X-band (8～ 12GHz) frequencies with adequate power added efficiencies at high power levels. We find that, by changing the heterostructure and doping profile of SiGe HBTs, their power gain can be significantly improved without resorting to substantial lateral scaling. Furthermore, employing a common-base configuration with a proper doping profile instead of a common-emitter configuration improves the power gain characteristics of SiGe HBTs, thus permitting these devices to be efficiently operated at X-band frequencies. In this paper,we report the results of SiGe power HBTs and MMIC power amplifiers operating at 8～10GHz. At 10GHz,a 22.5dBm (178mW) RF output power with a concurrent gain of 7.32dB is measured at the peak power-added efficiency of 20.0%, and a maximum RF output power of 24.0dBm (250mW) is achieved from a 20 emitter finger SiGe power HBT. The demonstration of a single-stage X-band medium-power linear MMIC power amplifier is also realized at 8GHz. Employing a 10-emitter finger SiGe HBT and on-chip input and output matching passive components, a linear gain of 9.7dB,a maximum output power of 23.4dBm,and peak power added efficiency of 16% are achieved from the power amplifier. The MMIC exhibits very low distortion with 3rd order intermodulation (IM) suppression C/I of -13dBc at an output power of 21.2dBm and over 20dBm 3rd order output intercept point (OIP3).     

A novel self-oscillating HEMT-HBT cascode VCO-mixer using an activetunable inductor

Here we describe a unique Ka-band self-oscillating HEMT-HBT cascode mixer design which integrates an active tunable resonator circuit. The VCO-mixer MMIC integrates GaAs HEMT's and HBT's using selective molecular beam epitaxy (MBE) technology. The HEMT-HBT cascode active mixer operates similarly to a dual-gate mixer. The HBT of the cascode is used to construct a VCO by presenting the base with an HEMT tunable active inductor. The VCO can be tuned from 28.5 to 29.3 GHz while providing ≈0 dBm of output power. Operated as an upconverter, the MMIC achieves 6-9 dB conversion loss over a 31-39 GHz output frequency band. Using these active approaches, both VCO and mixer functions were integrated into a compact 1.44×0.76 mm² chip area. The active RF integrated circuit (IC) techniques presented here have direct implications to future high complexity millimeter-wave monolithic integrated circuits (MIMICs) for ultrahigh-speed clock recovery and digital radio applications     

High-Performance 94-GHz Single-Balanced Diode Mixer Using Disk-Shaped GaAs Schottky Diodes

We present a high-performance 94-GHz single-balanced monolithic millimeter-wave integrated-circuit (MMIC) mixer using the disk-shaped GaAs Schottky diodes grown on an n/$hbox{n}+$ epitaxial structure. Due to the superior characteristics of the GaAs diodes with high diode-to-diode uniformity, the mixer shows a conversion loss of 5.5 dB at 94 GHz, a 1-dB compression point $(P_{1 hbox{-}{rm dB}})$ of 5 dBm, and high local-oscillator to radio-frequency isolation above 30 dB in an RF frequency range of 91–97 GHz. To our knowledge, the fabricated mixer shows the best performance in terms of conversion loss at 94 GHz and $P_{1 hbox{-}{rm dB}}$ among the W-band MMIC mixers without amplifier circuits.      

5.2/5.7-GHz 48-dB Image Rejection GaInP/GaAs HBT Weaver Down-Converter Using LO Frequency Quadrupler

A GaInP/GaAs heterojunction bipolar transistor (HBT) down-converter using the Weaver architecture is demonstrated in this paper. The Weaver system is a double-conversion image rejection heterodyne system which requires no bandpass filters in the signal path and no quadrature networks. The Weaver down-converter has the image rejection ratios of 48 dB and 44 dB when the RF frequency is 5.2 GHz and 5.7 GHz, respectively. A new frequency quadrupler is employed in the down-converter to generate the local oscillator (LO) signals. The frequency quadrupler is designed to minimize the phase error when generating LO signals and thus the image rejection performance is improved. A diagrammatic explanation using the complex mixing technique to analyze the image rejection mechanism of the Weaver architecture is developed in this paper. From our analysis, the image rejection can be further improved by making the LO₁ and LO₂ signals coherent     

Linearised InGaP/GaAs HBT MMIC power amplifier with active biascircuit for W-CDMA application

A high linearity InGaP/GaAs heterojunction bipolar transistor (HBT) monolithic microwave integrated circuit (MMIC) power amplifier is demonstrated using a new structure for a bias circuit for wideband-code division multiple access (W-CDMA) application. A one shunt capacitor is added to a novel active bias circuit and acts as a lineariser improving input P_{1 dB} of 16 dB and phase distortion of 5.1° for the hybrid phase shift keying (HPSK) modulated signal at the 28 dBm output power; the lineariser showing no significant increase of signal loss and chip area. The two-stage HBT MMIC amplifier exhibits a power-added efficiency (PAE) of 37%, a linear power gain of 24.5 dB, and an output power of 28 dBm with an adjacent channel power ratio (ACPR) of -45 dBc, under a 3 V operation voltage     

A single-chip GaAs MMIC image-rejection front-end for digitalEuropean cordless telecommunications

An active image-rejection filter is presented in this paper, which applies actively coupled passive resonators. The filter has very low noise and high insertion gain, which may eliminate the use of a low-noise amplifier (LNA) in front-end applications. The GaAs monolithic-microwave integrated-circuit (MMIC) chip area is 3.3 mm² . The filter has 12-dB insertion gain, 45-dB image rejection, 6.2-dB noise figure, and dissipates 4.3 mA from a 3-V supply. An MMIC mixer is also presented. The mixer applies two single-gate MESFETs on a 2.2-mm² GaAs substrate. The mixer has 2.5-dB conversion gain and better than 8-dB single-sideband (SSB) noise figure with a current dissipation of 3.5 mA applying a single 5-V supply. The mixer exhibits very good local oscillator (LO)/RF and LO/IF isolation of better than 30 and 17 dB, respectively, Finally, the entire front-end, including the LNA, image rejection filter, and mixer functions is realized on a 5.7-mm ² GaAs substrate. The front-end has a conversion gain of 15 dB and an image rejection of more than 53 dB with 0-dBm LO power. The SSB noise figure is better than 6.4 dB, The total power dissipation of the front-end is 33 mW. The MMIC's are applicable as a single-block LNA and image-rejection filter, mixer, and single-block front-end in digital European cordless telecommunications. With minor modifications, the MMIC's can be applied in other wireless communication systems working around 2 GHz, e.g., GSM-1800 and GSM-1900     

A 44-GHz-high IP3 InP HBT MMIC amplifier for low DC powermillimeter-wave receiver applications

This paper reports on what is believed to be the highest IP3/P_dc power linearity figure of merit achieved from a monolithic microwave integrated circuit (MMIC) amplifier at millimeter-wave frequencies. The 44 GHz amplifier is based on an InP heterojunction bipolar transistor (HBT) technology with f_T's and f_max's of 70 and 200 GHz, respectively. The 44-GHz amplifier design consists of four prematched 1×l0μm² four-finger (40-μm²) heterojunction bipolar transistor (HBT) cells combined in parallel using a compact λ/8 four-way microstrip combiner. Over a 44-50-GHz frequency band, the amplifier obtains a gain of 5.5-6 dB and a peak gain of 6.8-7.6 dB under optimum gain bias. At a low bias current of 48 mA and a total dc power of 120 mW, the amplifier obtains a peak IP3 of 34 dBm, which corresponds to an IP3/P_dc power ratio of 21:1, a factor of two better than previous state-of-the-art MMIC's reported in this frequency range. By employing a thin, lightly doped HBT collector epitaxy design tailored for lower voltage and higher IP3, a record IP3/P_dc, power ratio of 42.4:1 was also obtained and is believed to be the highest reported for an MMIC amplifier of any technology. The new high-linearity HBT's have strong implications for millimeter-wave receiver as well as low-voltage wireless applications     

A novel monolithic HBT-p-i-n-HEMT integrated circuit with HBTactive feedback and p-i-n diode variable gain control

We report the world's first functional MMIC circuit integrating HBT's, HEMT's, and vertical p-i-n diodes on a single III-V substrate. The 1-10 GHz variable gain amplifier monolithically integrates HEMT, HBT, and vertical p-i-n diode devices has been fabricated using selective MBE and a merged processing technology. The VGA offers low-noise figure, wideband gain performance, and good gain flatness over a wide gain control range. A noise figure below 4 dB was achieved using a HEMT transistor for the amplifier stage and a wide bandwidth of 10 GHz. A nominal gain of 10 dB was achieved by incorporating HBT active feedback techniques and 12 dB of gain control range was obtained using a vertical p-i-n diode as a varistor, all integrated into a compact 1.5×0.76 mm² MMIC. The capability of monolithically integrating HBT's, HEMT's, and p-i-n's in a merged process will stimulate the development of new monolithic circuit techniques for achieving optimal performance as well as provide a foundation for high performance mixed-mode multifunctional MMIC chips     

Performance optimizing on multi-function MMIC design

Integration of GaAs BiFET (bipolar-FET) devices to obtain the optimum performance for multiple functions of MMIC design has been achieved. In this study, heterojunction bipolar transistors (HBTs), enhancement mode pseudomorphic HEMTs (E-pHEMTs), and depletion mode pHEMTs are developed for potential applications, including the integration of HBT power amplifier circuitry with pHEMT-based bias control, logic, RF switch, and low-noise amplifier circuitries. Critical processes including gate photolithography and gate recess control are presented and discussed in detail. The enhancement-depletion modes of pHEMT, HBT electrical performance, and uniformity are investigated comprehensively. In addition, power amplifiers and high power switches based on BiFET technology are investigated.     

GaAs HBT wideband matrix distributed and Darlington feedbackamplifiers to 24 GHz

The designs and performances of a 2-24 GHz distributed matrix amplifier and 1-20 GHz 2-stage Darlington coupled amplifier based on an advanced HBT MBE profile that increases the bandwidth response of the distributed and Darlington amplifiers by providing lower base-emitter and collector-base capacitances are presented. The matrix amplifier has a 9.5 dB nominal gain and a 3-dB bandwidth to 24 GHz. This result benchmarks the highest bandwidth reported for an HBT distributed amplifier. The input and output VSWRs are less than 1.5:1 and 2.0:1, respectively. The total power consumed is less than 60 mW. The chip size measures 2.5×2.6 mm². The 2-stage Darlington amplifier has 7 dB gain and 3-dB bandwidth beyond 20 GHz. The input and output VSWRs are less than 1.5:1 and 2.3:1, respectively. This amplifier consumes 380 mW of power and has a chip size of 1.66×1.05 mm²      

Monolithic 10 GHz TDR/TDT analyser with novel architecture

A simple and low-cost time-domain reflectometer using two pulse generators and a high bandwidth sample and hold amplifier is presented. The design has been achieved using an MMIC commercial foundry process from OMMIC (pHEMT f_t=100 GHz). The bandwidth of the sampler is more than 10 GHz and the minimum pulse width generated is less than 50 ps. The total active area is less than 3 mm²     

A Compact 6.5-W PHEMT MMIC Power Amplifier for Ku-Band Applications

A compact 6.5-W AlGaAs/InGaAs/GaAs PHEMT monolithic microwave integrated circuit (MMIC) power amplifier (PA) for Ku-band applications is proposed. This two-stage amplifier with chip size of 8.554mm² (3.64mmtimes2.35mm) is designed to fully match 50-Omega input and output impedance. Under 8V and 2000mA dc bias condition, the PA deliver 38.1dBm (6.5W) saturated output power, 10.5-dB small signal gain and peak power added efficiency of 24.6% from 13.6 to 14.2GHz. This MMIC also achieved the best power densities (760mW/mm²) at Ku band reported to date