环氧导电胶黏剂发展前景广阔

作为一种既能有效胶接各种材料又具有导电性能的胶黏剂，导电型胶黏剂正随着电子组装技术微型化、高密度化方向发展以及集成度的不断提高；同时，铅锡焊料式印刷线路板和表面组装技术因高含铅而受到限制，更为导电胶黏剂提供了广阔的发展前景。     

微电子封装用导电胶的研究进展

随着现代科学技术的高速发展,电子产品向小型化、便携化和集成化方向发展。导电胶作为一种"无铅、绿色和环境友好"的新型材料取代传统的Pb/Sn材料,已成为电子工业组装材料的主流。简述了微电子封装用导电胶的组成和分类、研究进展和可靠性评估,提出了导电胶在微电子封装中的技术问题,并对其发展趋势和发展前景作了展望。     

铜粉导电胶研制成功

近些年来,导电胶粘剂在微电子封装、组装行业中得到了广泛应用,目前仍以添加型导电胶占据主导地位。在各种导电胶中金粉导电胶性能最佳,但价格昂贵,应用受限;银粉导电胶效果很好,不过存在着电迁移等弊端,价也很高;铜粉导电胶的导电性能基本接近银粉导电胶,价格便宜,却因铜粉极易氧化而影响导电性能。东北大学材料与冶金学院采用硅烷偶联剂（KH-550）对铜粉进行改性处理,提高了其在导电胶中的分散性、使用过程中的抗氧化性和粘接强度。还将甲醛作为还原剂加入到树脂中,     

金导电胶

金导电胶是适应电子元器件向小型化和高可靠性发展的需要的新材料。本文介绍金导电胶的基本组成、导电机理、可靠性等方面的研究。     

各向异性导电胶的研究与应用现状

随着微电子工业的发展,导电胶替代传统的锡铅焊料已经成为一种发展趋势,本文介绍了各向异性导电胶(ACA)的组成和分类、3种导电机理及国内外导电胶的研究现状和发展方向,特别是在各向异性导电胶填料表面功能化处理方面的研究现状和在液晶显示屏(LCD)、发光二极管(LED)组装应用上的进展。     

导电胶粘剂的现状与进展

导电胶作为无铅材料的一种,是连接材料Pb/Sn合金的理想替代品。文章介绍了导电胶的组成、导电机理、现状、应用以及发展前景。     

汉高推出新有机硅导电胶

随着汽车电气系统的结构、工作环境的日趋复杂,其中相关材料性能也必须得到相应提升,汽车传感器材料需要有个更强的抗震性、耐温性。汉高近日开发出一款全新的有机硅导电胶(ECA),能够应对复杂、恶劣的系统环境。ICP4000系列导电胶能够承受200℃的高温,此外能够承受强烈的振动。导电胶是一种固化或干燥后具有一定导电性能的胶粘剂,它通常以基体树脂和导电填料即导电粒子为主要组成成分,通过基体树脂的粘接作用把导电粒子结合在一起,形成导电通路,实现被粘材料的导电连接。由于导电胶的基体树脂是一种胶粘     

产品开发

<正>可溶性导电聚合物开发前景好导电高分子材料是一种应用前景广阔、高附加值的新型材料,但其缺点是难溶、刚性大等,因而使其应用受到限制。可溶性导电聚合物可解决其溶解性和改善其加工性问题。这类可溶性导电聚合物包括聚吡咯、聚噻吩、聚苯胺及聚乙炔等,其研发和应用前景良好。印刷电子用无颗粒型导电胶成研发热点导电油墨是印刷电子材料中的关键材料之一,应用非常广     

环氧导电银胶在LED上的应用现状

作为无铅材料的一种,环氧导电银胶广泛应用于电子元器件的封装,如用于LED固晶。文章介绍了LED封装用导电银胶的市场情况、目前所用导电胶的性能及应用前景和研发方向。     

微电子封装用各向异性导电胶的研究进展

随着现代科学技术的高速发展,电子仪器正在向小型化、微型化、高集成化方向迈进。各向异性导电胶作为一种新兴的绿色环保微电子封装互连材料,广泛应用于电子产品中。介绍了各向异性导电胶的组成、分类、结构特点和导电机理,以及影响它的粘接可靠性因素,如粘接工艺参数、导电颗粒的粒径分布、各向异性导电胶的弹性模量、环境干扰等,并对国内外最新文献报道的最新研制成果进行了综述。最后,对各向异性导电胶的发展前景作了展望。     

导电高分子材料制备及应用研究进展

在介绍导电高分子材料导电机理的基础上,对目前最常见的两种导电高分子材料的制备方法进行综述;重点讨论了含大型离域π键导电高分子材料、化学掺杂型共轭结构导电高分子材料和新型本征导电高分子材料等本征型导电高分子材料的制备方法,并研究了金属及其氧化物、碳系纳米材料、有机组分以及新型导电填料等对填充型导电高分子材料导电性能的影响...     

A Novel Electrically Conductive Adhesive for Use in Microelectronics and Microsystems by Ink Jet Technology

Ink jet is an accepted technology for dispensing small volumes of material (50–500 picolitres). Currently, traditional metal-filled conductive adhesives cannot be processed by ink jetting (owing to their relatively high viscosity and the size of filler material particles). The smallest droplet size achievable by traditional dispensing techniques is in the range of 150 μm, yielding proportionally larger adhesive dots on the substrate. Electrically conductive inks are available on the market with metal particles (gold or silver) <20 nm suspended in a solvent at 30–50 wt.%. After deposition, the solvent is eliminated and electrical conductivity is enabled by a high metal ratio in the residue. Some applications include a sintering step. These nano-filled inks do not offer an adhesive function. Work reported here presents materials with both functions, adhesive and conductive. This newly developed silver-filled adhesive has been applied successfully by piezo-ink jet and opens a new dimension in electrically conductive adhesives technology.

The present work demonstrates feasibility of an inkjettable, isotropically conductive adhesive in the form of a silver loaded resin with a two-step curing mechanism. In the first step, the adhesive is dispensed (jetted) and precured leaving a “dry” surface. The second step consists of assembly (wetting of the second part) and final curing.     

Development of Polyaniline/Epoxy Composite as a Prospective Solder Replacement Material

In this paper we present a novel application of a conducting polymer, polyaniline, as a conductive filler for the development of isotropically conductive adhesives. We have developed isotropically conductive adhesives using protonic acid-doped polyaniline as the conducting filler in an anhydride-cured epoxy system. Fundamental material characterization like DSC, TGA and SEM of the samples was conducted to study their properties. Conductivity of these materials was measured by the four probe method while impact properties were studied by lap shear and drop tests. Samples were aged at 85°C/～100% RH for more than 500 h and the effects of aging were studied. Conductivity value of 10^?3 S/cm was obtained at 25% PANI filler concentration. These results demonstrate the potential of such systems to function as isotropically conductive adhesives.     

Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review

The development of new polymer-based conductive adhesives with specific performances and improved conductivity are increasingly critical for thermally interface material (TIM). Epoxy resins have been widely used as a common interface material for conductive adhesives due to its well-known ability to accept wide range of fillers possibly derived from carbon, metallic or ceramic sources. These conductive fillers with high inherent thermal conductivity, together with a possibility to characterize and manipulate the system, leads to the production of thermally conductive adhesives with higher knowledge content for a number of electronics applications.     

导电胶的应用现状

介绍了导电胶的组成、导电机理及在各方面的应用,并对未来导电胶的发展作了展望。     

导电水凝胶的制备及应用研究进展

导电水凝胶是一类将亲水性基质和导电介质有机结合的新型水凝胶,具有较高的柔韧性、可调的力学性能和优异的电化学性能,在柔性电子设备等领域具有广阔的应用前景。本文综述了导电水凝胶材料的研究前沿和动态,介绍了导电水凝胶的分类及制备方法,讨论了导电水凝胶的结构设计与性能,重点阐述了导电水凝胶材料的应用研究进展,归纳了导电水凝胶材料面临的问题与挑战,并展望了导电水凝胶材料的发展趋势,指出采用天然可再生资源为原料开发具有高导电性、力学性能稳定、耐极端温度、生物相容性和生物可降解的导电水凝胶将成为下一步研究重点,同时优化柔性电子装置、提高器件输出稳定性也将成为重要的研究方向之一。导电水凝胶的制备及应用研究将促进柔性电子功能材料领域的快速发展。     

Electroconductive Adhesives: Comparison of Three Different Polymer Matrices. Epoxy, Polyimide and Silicone

Electrically conductive organic adhesives are used in the microelectronics manufacturing industry for the attachment of silicon dies. These adhesives are composite materials which owe their conductivity to the incorporation of silver flakes. Several polymers have been formulated into electrically-conductive adhesives to meet different applications in the microelectronics industry; these are an epoxy resin, a polyimide and a silicone polymer. The purpose of this paper is to examine properties of these die-bonding adhesives in order to determine the advantages or disadvantages of these materials. This study offers a comparison of hardening chemistry, chemical purity, processing, electrical, thermal, and mechanical properties of three conductive adhesives based on an epoxy, a polyimide and a silicone polymer. We discuss correlation of composite properties with the structure of each matrix. The results indicate that the choice of the matrix is dictated by the application for which the electronic grade conductive adhesive is to be used and the desired properties for best reliability and performance.