石墨表面镀铜对石墨—铜复合材料强度影响的研究

石墨与铜的界面结合及石墨在基体中的分布方式是影响石墨－铜基复合材料抗弯强度的重要因素。本文用镀铜石墨粉制备石墨－铜复合材料,并测定了材料的抗弯强度,对断口进行扫描分析。结果表明,石墨经镀铜处理后,使得石墨－铜复合材料抗弯曲强度显著提高。     

二硫化钼含量对铜-镀铜石墨复合材料性能的影响

用传统的粉末冶金方法制备了二硫化钼-铜-镀铜石墨及二硫化钼-铜-石墨复合材料,对其电阻率、抗弯强度、硬度和耐磨性进行了测试,并用金相显微镜和SEM观察了该复合材料的显微组织和磨面形貌,分析了二硫化钼含量对这两种复合材料的组织与性能的影响,结果表明,随着二硫化钼含量的增加,铜-镀铜石墨复合材料的电阻率略微增高,抗弯强度和硬度值提高;二硫化钼-铜-镀铜石墨复合材料的各项性能指标均优于二硫化钼-铜-石墨复合材料的性能指标;在磨损实验中二硫化钼的加入增强了两种材料的机械磨损的耐磨性.     

SPS制备铜/镀铜石墨复合材料的组织和性能

采用放电等离子烧结(SPS)制备不同镀铜石墨含量的铜/镀铜石墨复合材料。研究了镀铜石墨含量对复合材料微观组织、密度、导电率、孔隙率和显微硬度的影响。结果表明,随着镀铜石墨含量的增加,铜基体的组织变得细小、均匀。复合材料的密度与镀铜石墨含量满足公式ρ=-0.1506wt%+8.894。当镀铜石墨含量由0wt%增大12wt%,复合材料的导电率由96.4%IACS降低至58.0%IACS,孔隙率从0.1%升高至8.8%。少量的镀铜石墨具有细晶强化作用,能提高复合材料的硬度。当镀铜石墨含量超过4 wt%,复合材料的硬度开始下降,当镀铜石墨含量达到一定值时,复合材料的硬度甚至低于纯铜材料的硬度。     

镀铜导电陶瓷颗粒Ti3SiC2对铜-石墨复合材料性能的影响

采用超声波化学镀覆技术在导电陶瓷颗粒表面,可获得均匀、连续的镀铜层.用粉末冶金法将镀铜Ti3SiC2与铜、石墨制备成镀铜Ti3SiC2-铜-石墨复合材料,用金相显微镜和扫描电子显微镜观察和分析了复合材料的显微组织和断口形貌,并测试了它们的电阻率、硬度和抗弯强度.结果表明:随镀铜Ti3SiC2含量的增加镀铜Ti3SiC2-铜-石墨复合材料的导电性、硬度和抗弯强度显著提高,并且各项性能明显优于不镀铜Ti3SiC2-铜-石墨复合材料.     

含镀铜石墨颗粒铜基复合材料研究

采用化学镀铜工艺在石墨颗粒表面镀上一层金属铜,通过粉末冶金方法制备了铜/石墨复合材料,研究了石墨颗粒表面铜镀层在不同处理温度下的球化问题和改善复合材料界面结合的作用效果.结果表明,石墨颗粒表面铜镀层有利于改善铜基石墨复合材料的界面结合,使复合材料力学性能提高;处理温度较高时,表面铜镀层有熔融球化的趋势,当复合材料烧结温度超过石墨镀铜层的完全球化温度时,镀铜石墨粉改善界面结合的效果逐渐降低,直至消失.     

石墨表面镀铜对铁基粉末复合材料摩擦性能影响的研究

石墨与铜的界面结合及石墨在基体中的分布方式,是影响铁基粉末复合材料摩擦性能的重要因素。用镀铜石墨制备铁基粉末复合材料,并测定了材料的摩擦系数、磨损性能。结果表明石墨经镀铜处理后,使复合材料的摩擦系数有所降低,磨损性能提高20%～30%。     

二硫化钼-铜-镀铜石墨复合材料的载流磨损性能研究

采用粉末冶金方法制备了不同二硫化钼质量分数的二硫化钼-铜-镀铜石墨（A组）复合材料和二硫化钼-铜-石墨（B组）复合材料,在自制的磨损试验装置上考察两组复合材料机械磨损和载流磨损性能。结果表明,加入2％（质量分数）的二硫化钼,可使两类复合材料在机械磨损和载流磨损的磨损量减小j并且二硫化钼一铜一镀铜石墨复合材料在机械磨损和载流磨损时,磨损量均比二硫化钼-铜-石墨复合材料小,耐磨性好;在载流磨损条件下,两组复合材料的磨损量比其机械磨损量大,且正刷磨损量比负刷磨损量大。     

“镀铜石墨粉及铜/石墨复合材料”项目通过鉴定

四川省自贡市一新材料项目，于日前通过国家技术鉴定。自贡市科学技术局组织国内的专家，对四川理工学院完成的“镀铜石墨粉及铜／石墨复合材料（高性能碳刷）”项目进行了技术鉴定，鉴定委员会认为：该项目采用化学置换镀方法，提出了二次镀铜新工艺，获得了抗氧化性能好、镀覆比高、结合强度高的镀铜石墨粉。采用原位合成改性酚醛树脂的方法，     

石墨镀铜对石墨-银复合材料性能的影响

石墨与银的界面结合及石墨在基体中的分布方式是影响石墨-银复合材料性能的重要因素,本文用镀铜石墨粉制备镀铜石墨-银复合材料。通过金相、扫描电镜分析和物理性能测试等手段,对由镀铜石墨粉制备成的复合材料的组织、性能进行研究。结果表明,在粒度细小的石墨粉表面能够均匀地包覆金属铜,在压制压力、烧结温度合适的条件下,制成的复合材料,组织均匀,致密性好,石墨在银基体中弥散分布,金属银能够形成细小的三维网状结构。这种组织形态使复合材料的导电性及强度明显提高。     

石墨镀铜对石墨-银复合材料性能的影响

石墨与银的界面结合及石墨在基体中的分布方式是影响石墨-银复合材料性能的重要因素,本文用镀铜石墨粉制备镀铜石墨-银复合材料.通过金相、扫描电镜分析和物理性能测试等手段,对由镀铜石墨粉制备成的复合材料的组织、性能进行研究.结果表明,在粒度细小的石墨粉表面能够均匀地包覆金属铜,在压制压力、烧结温度合适的条件下,制成的复合材料,组织均匀,致密性好,石墨在银基体中弥散分布,金属银能够形成细小的三维网状结构.这种组织形态使复合材料的导电性及强度明显提高.     

304不锈钢复合电镀镍-膨胀石墨导热性能

通过一种简单而经济的电镀方法在304不锈钢表面制备镍-膨胀石墨复合材料,并对其导热性能进行研究。通过扫描电子显微镜(SEM)、拉曼光谱(Raman)、X射线衍射(XRD)和能谱仪(EDS)对镀层的显微形貌及结构进行表征,通过激光粒度分布仪对膨胀石墨的粒径进行测定,通过激光导热仪测定复合镀层的导热系数。结果表明:膨胀石墨呈片状结构,缺陷少且复合镀前后缺陷基本不变。复合镀层中膨胀石墨的原子数分数为5.98%,且均匀分布。镍-膨胀石墨/304不锈钢的导热系数为16.02 W/(m·K),相比于镍/304不锈钢和304不锈钢,其导热系数分别提高了9.7%和23.8%。膨胀石墨与304不锈钢表面及镍镀层接触良好,构成了良好的导热通道,提高了镍镀层的导热性能。     

Some potential applications for intercalation compounds of graphite with high electrical conductivity

Intercalation compounds of graphite of the acceptor type have potential engineering applications because of their attractive electrical conductivity properties. Two kinds of applications are considered in this paper. The first concerns a composite, formed by enclosing an intercalation compound synthesized from high quality crystalline graphite in a matrix of copper. With this form of composite it is found that there are both intrinsic and extrinsic advantages pertaining to the use of a material that has a conductivity higher than and a density lower than that of copper. The second form is a composite compound of intercalated graphite fibers contained in a matrix of epoxy. Extraordinary advantages in this case result from the fact that while intercalation of the fibers produces an order of magnitude increase in their electrical conductivity, when these fibers are incorporated into an epoxy matrix, the composite conductivity is increased by two orders of magnitude over its pristine fiber counterpart. It is projected that these desirable electrical conductivity characteristics portend large scale uses for the acceptor compounds of graphite as substitutes for the present standard conductors, and as a way of upgrading the performance of carbon/graphite materials.     

Electric Conductivity and Dielectric Dispersion of Polyvinylchloride–Graphite Composites

The dielectric properties of polyvinylchloride–graphite composites in a wide range of temperatures (20–150°C) and frequencies (25–10⁶ Hz) have been described and analyzed. Polyvinylchloride–graphite composites have been synthesized in accordance with powder technology by hot pressing in a hydraulic press and subsequent rapid cooling in a water–ice mixture (quenching mode). The dielectric permeability and electric conductivity of the polyvinylchloride–graphite composite system obey the power law of the percolation theory. The percolation threshold of these composites is ~6.35 vol % of graphite. At a certain concentration of graphite, polyvinylchloride–graphite composites exhibit high dielectric permeability, significant losses, and high dc and ac electric conductivity. With anincrease in the applied-field frequency, the permeability decreases, while theelectric conductivity, conversely, increases. It has been shown that the main mechanism of electric conductivity in polyvinylchloride–graphite insulators is barrier hopping; according to this mechanism, electrons hop over states localized in the vicinity of the Fermi level. In addition, the temperature and frequency dispersions of ε' and tanδ have been discussed; the specific features of the dispersion curves have been revealed.     

Tribological Analysis of Copper-Coated Graphite Particle-Reinforced A359 Al/5 wt.% SiC Composites

Copper-coated graphite particles can be mass-produced by the cementation process using simple equipment. Graphite particulates that were coated with electroless copper and 5 wt.% SiC particulates were introduced into an aluminum alloy by compocasting to make A359 Al/5 wt.% SiC(p) composite that contained 2, 4, 6, and 8 wt.% graphite particulate composite. The effects of SiC particles, quantity of graphite particles, normal loading, sliding speed and wear debris on the coefficient of friction, and the wear rate were investigated. The results thus obtained indicate that the wear properties were improved by adding small amounts of SiC and graphite particles into the A359 Al alloy. The coefficient of friction of the A359 Al/5 wt.% SiC(p) composite that contained 6.0 wt.% graphite particulates was reduced to 0.246 and the amount of graphite film that was released on the worn surface increased with the graphite particulate content. The coefficient of friction and the wear rate were insensitive to the variation in the sliding speed and normal loading.     

导电陶瓷Ti3SiC2-Cu-C复合材料的制备与性能研究

用粉末冶金法制备了一定含量的镀铜和不镀铜Ti3SiC2-Cu-C复合材料,以及Cu-C复合材料,对它们的物理和力学性能进行了测试,并在滑动速度为10m/s,载荷为4.9N的干摩擦条件下进行了36h磨损试验,结果表明:镀铜Ti3SiC2-Cu-C复合材料的导电性、硬度、抗弯强度和耐磨性优于不镀铜Ti3SiC2-Cu-C复合材料和Cu-C复合材料。     

新型Cu/Pd复合电触点材料

研究制备Cu/Pd2 5、Cu/Pd30 、Cu/Pd40 和Cu/Pd60 (wt% )复合材料并测量它们的力学及电学性能 ,利用金相显微镜和扫描电镜观察了复合材料的组织结构 ,对不同Pd含量的Cu/Pd复合材料的性能进行比较。这类新型Cu/Pd复合材料显示出优异的可加工性、适中的硬度和非常高的电导率 ,是目前世界上最好的直流触点材料之一。     

Spark Plasma Sintering of Ultrafine YSZ Reinforced Cu Matrix Functionally Graded Composite

Copper matrix composites have received more attentions as possible candidate for thermal and electrical conductive materials to be used in electrical contact applications. In this study, five-layered Cu/YSZ(yttria-stabilized zirconia) functionally graded material(FGM) and copper matrix composite specimens containing 3 and 5 vol% YSZ particles plus pure Cu specimen were synthesized using powder metallurgy(PM) route and spark plasma sintering(SPS)consolidation process. The microstructural and some physical, mechanical features of all specimens were characterized.Microscopic examinations showed that ultrafine YSZ particles were distributed in the copper matrix almost homogeneously. An appropriate interface was observed at each layer of FGM. The density measurement indicated that the graded structure of the composite could be well densified after the SPS process. The microhardness values of various layers of Cu/YSZ FGM specimen were gradually altered from 56.3(pure copper side) to 75.2 HV(Cu-5 vol% YSZ side). The increase of YSZ content resulted in a decrease in electrical conductivity. Additionally, thermal conductivity of Cu/YSZ FGM specimen [308.0 W/(m K)] was determined to be higher than that of the Cu-5 vol% YSZ composite specimen [260.7 W/(m K)]. Accordingly, it can be concluded that the Cu/YSZ FGM can be a good candidate for the electrical applications, like sliding electrical contacts, where different material characteristics in the same component are required.     

混杂增强(CNTs+TiB2)/Cu复合材料制备与性能

本文以碳纳米管（CNTs）和TiB2颗粒作为增强相,首先利用球磨、表面吸附和热压烧结相结合技术制备具有层叠结构的CNTs/Cu复合材料,改善了CNTs在铜基复合材料中易团聚问题。CNTs/Cu复合材料的致密度和导电率随CNTs含量增加而降低,抗拉强度和伸长率随CNTs含量增加先升高后降低,当含量为0.1 wt.%时综合性能最优,致密度、导电率和抗拉强度分别为97.57%、91.2 %IACS和252 MPa。而球磨后热压烧结的1 wt.% TiB2/Cu复合材料致密度、导电率和抗拉强度分别为97.61%、58.3 %IACS和436 MPa。在此基础上,将TiB2颗粒原位引入到具有层叠结构的CNTs/Cu复合材料,制备获得混杂增强(CNTs+TiB2)/Cu复合材料。相比单一CNTs（或TiB2）增强铜基复合材料,(CNTs+TiB2)/Cu复合材料的强度提升显著。其中,(0.1 wt.% CNTs+1 wt.% TiB2)/Cu复合材料的导电率和抗拉强度分别为56.4 %IACS和531 MPa,相比1 wt.% TiB2/Cu,其导电率仅降低3.3%,而抗拉强度则升高21.8%。这主要归因于片层间CNTs可起承担和传递载荷作用,同时片层间弥散分布的TiB2颗粒可以钉扎位错,两种强化机制共同作用使(CNTs+TiB2)/Cu复合材料的抗拉强度显著提升。