A read disturbance free differential read SRAM cell for low power and reliable cache in embedded processor

Energy consumption and data stability are vital requirement of cache in embedded processor. SRAM is a natural choice for cache memory owing to their speed and energy efficiency. Noise insertion to the SRAM cell during read is a serious problem which reduces its stability. A read disturbance free differential SRAM cell consisting of seven transistors is proposed here which increases cell stability along with maintaining the most desirable differential read technique for faster read. The read SNM of the proposed cell is 154%, 31% and 58% large than that of the conventional 6T-SRAM cell and 2 other 7T-SRAM cells [5,6] compared here. Various factors such as short circuit current reduction, use of single write access transistor, partial bit line swing etc. reduces the overall energy consumption of the proposed cell by 41% compared to 6T-SRAM cell. The proposed cell is also compared with an eight transistor based read disturbance free SRAM cell. The cell delay of the proposed cell is around 55% lesser than that of the 8T-SRAM cell. Besides CMOS the performance achievement of the proposed 7T-SRAM cell is also validated at miniaturized dimension of 20 nm using FinFET based predictive technology model library.     

Circuit and microarchitectural techniques for reducing cache leakage power

On-chip caches represent a sizable fraction of the total power consumption of microprocessors. As feature sizes shrink, the dominant component of this power consumption will be leakage. However, during a fixed period of time, the activity in a data cache is only centered on a small subset of the lines. This behavior can be exploited to cut the leakage power of large data caches by putting the cold cache lines into a state preserving, low-power drowsey mode. In this paper, we investigate policies and circuit techniques for implementing drowsy data caches. We show that with simple microarchitectural techniques, about 80%-90% of the data cache lines can be maintained in a drowsy state without affecting performance by more than 0.6%, even though moving lines into and out of a drowsy state incurs a slight performance loss. According to our projections, in a 70-nm complementary metal-oxide-semiconductor process, drowsy data caches will be able to reduce the total leakage energy consumed in the caches by 60%-75%. In addition, we extend the drowsy cache concept to reduce leakage power of instruction caches without significant impact on execution time. Our results show that data and instruction caches require different control strategies for efficient execution. In order to enable drowsy instruction caches, we propose a technique called cache subbank prediction, which is used to selectively wake up only the necessary parts of the instruction cache, while allowing most of the cache to stay in a low-leakage drowsy mode. This prediction technique reduces the negative performance impact by 78% compared with the no-prediction policy. Our technique works well even with small predictor sizes and enables a 75% reduction of leakage energy in a 32-kB instruction cache.     

Robust TFET SRAM cell for ultra-low power IoT applications

Design of ultra-low power SRAM with robust operation for Internet of Thing (IoT) sensor node is a new challenge. In this work, a novel 9T TFET based SRAM bit cell is proposed. The analysis and simulation results demonstrate that the proposed cell eliminates read disturb issue and outperforms the state-of-the-art 9T TFET bit cell in terms of static and dynamic write performance. The presented circuit topology incorporates power cut-off and write ‘0’ only technique to enhance the write performance. The proposed cell exhibits 1.15× higher write margin (WM), 25% lower write delay, consumes 73% (57%) lower write (average) energy, 7% smaller standby leakage power measured at V_DD = 0.3 V. The proposed cell also shows significant improvement in the read/write performance as compared with existing 7T and 8T TFET cells. Our proposed cell also eliminates half-select disturb issue to make it suitable for bit-interleaving architecture that is a must for enhanced soft error immunity.     

RTD/HFET low standby power SRAM gain cell

A 50-nW standby power compound semiconductor tunneling-based static random access memory SRAM (TSRAM) cell is demonstrated by combining ultralow current-density resonant-tunneling diodes (RTDs) and heterostructure field-effect transistors (HFETs) in one integrated process on an InP substrate. This power represents over two orders of magnitude improvement over previous III-V static memory cells. By increasing the number of vertically integrated RTD's we obtain a 100 nW tri-state memory cell. The cell concept applies to any material system in which low current-density negative differential resistance devices are available     

抗DPA攻击的功耗平衡SRAM设计

A power balance static random-access memory(SRAM) for resistance to differential power analysis(DPA) is proposed. In the proposed design, the switch power consumption and short-circuit power consumption are balanced by discharging and pre-charging the key nodes of the output circuit and adding an additional shortcircuit current path. Thus, the power consumption is constant in every read cycle. As a result, the DPA-resistant ability of the SRAM is improved. In 65 nm CMOS technology, the power balance SRAM is fully custom designed with a layout area of 5863.6 μm~2.The post-simulation results show that the normalized energy deviation(NED) and normalized standard deviation(NSD) are 0.099% and 0.04%, respectively. Compared to existing power balance circuits, the power balance ability of the proposed SRAM has improved 53%.     

A mechanism for asymmetric data writing failure

As dynamic random access memory (DRAM) technology develops further, it is more difficult to sustain a sufficient sensing margin to detect weak cell data. Therefore, a high data writing performance is necessary in order to guarantee the data sensing margin. In this paper, an analysis of the phenomenon of an asymmetric data writing failure (ADWF) is presented, taking account of a bit line sense amplifier (BLSA) offset, and the failure mechanism has been studied through the use of measurement analysis.     

Analysis of dual-VT SRAM cells with full-swingsingle-ended bit line sensing for on-chip cache

This paper compares different high-V_T and dual-V_T design choices for a large on-chip cache with single-ended sensing in a 0.13 μm technology generation. The analysis shows that the best design is the one using a dual-V_T cell, with minimum channel length pass transistors, and low-V_T peripheral circuits. This dual-V_T circuit provides 20% performance gain with only 1.3× larger active leakage power, and 2.4% larger cell area compared to the best design using high-V_T cells with nonminimum channel length pass transistors     

Analysis and design of low power SRAM cell using independent gate FinFET

Scaling of bulk MOSFET faces great challenges in nanoscale integration technology by producing short channel effect which leads to increased leakage. FinFET has become the most promising substitute to bulk CMOS technology because of reducing short channel effect. Dual-gate FinFET can be designed either by shorting gates on either side for better performance or both gates can be controlled independently to reduce the leakage and hence power consumption. A six transistor SRAM cell based on independent-gate FinFET technology is described in this paper for simultaneously reducing the active and standby mode power consumption. A work is focused on the independent gate FinFET technology as this mode provides less power consumption, less area consumption and low delay as compared to other modes. Leakage current and power consumption in independent gate FinFET is compared with tied gate or shorted gate FinFET SRAM cell. Moreover, delay has been estimated in presented SRAM cells. Further, leakage reduction technique is applied to independent gate FinFET 6T SRAM cell.     

A low power high speed MTJ based non-volatile SRAM cell for energy harvesting based IoT applications

Powering billions of devices is one of the most challenging barrier in achieving the future vision of IoT. Most of the sensor nodes for IoT based systems depend on battery as their power source and therefore fail to meet the design goals of lifetime power supply, cost, reliable sensing and transmission. Energy harvesting has the potential to supplant batteries and thus prevents frequent battery replacement. However, energy autonomous systems suffer from sudden power variations due to change in external natural sources and results in loss of data. The memory system is a main component which can improve or decrease performance dramatically. The latest versions of many computing system use chip multiprocessor (CMP) with on-chip cache memory organized as array of SRAM cell. In this paper, we outline the challenges involved with the efficient power supply causing power outage in energy autonomous/self-powered systems. Also, various techniques both at circuit level and system level are discussed which ensures reliable operation of IoT device during power failure. We review the emerging non-volatile memories and explore the possibility of integrating STT-MTJ as prospective candidate for low power solution to energy harvesting based IoT applications. An ultra-low power hybrid NV-SRAM cell is designed by integrating MTJ in the conventional 6T SRAM cell. The proposed LP8T2MTJ NV-SRAM cell is then analyzed using multiple key performance parameters including read/write energies, backup/restore energies, access times and noise margins. The proposed LP8T2MTJ cell is compared to conventional 6T SRAM counterpart indicating similar read and write performance. Also, comparison with the existing MTJ based NV-SRAM cells show 51–78% reduction in backup energy and 42–70% reduction in restore energy.     

Quantitative analysis and optimization techniques for on-chip cache leakage power

On-chip L1 and L2 caches represent a sizeable fraction of the total power consumption of microprocessors. In nanometer-scale technology, the subthreshold leakage power is becoming one of the dominant total power consumption components of those caches. In this study, we present optimization techniques to reduce the subthreshold leakage power of on-chip caches assuming that there are multiple threshold voltages, V/sub T/'s, available. First, we show a cache leakage optimization technique that examines the tradeoff between access time and subthreshold leakage power by assigning distinct V/sub T/'s to each of the four main cache components-address bus drivers, data bus drivers, decoders, and static random access memory (SRAM) cell arrays with sense amplifiers. Second, we show optimization techniques to reduce the leakage power of L1 and L2 on-chip caches without affecting the average memory access time. The key results are: 1) two additional high V/sub T/'s are enough to minimize leakage in a single cache-3 V/sub T/'s if we include a nominal low V/sub T/ for microprocessor core logic; 2) if L1 size is fixed, increasing L2 size can result in much lower leakage without reducing average memory access time; 3) if L2 size is fixed, reducing L1 size may result in lower leakage without loss of the average memory access time for the SPEC2K benchmarks; and 4) smaller L1 and larger L2 caches than are typical in today's processors result in significant leakage and dynamic power reduction without affecting the average memory access time.     

Low power test architecture for dynamic read destructive fault detection in SRAM

Dynamic Read Destructive Fault (dRDF) is the outcome of resistive open defects in the core cells of static random-access memories (SRAMs). The sensitisation of dRDF involves either performing multiple read operations or creation of number of read equivalent stress (RES), on the core cell under test. Though the creation of RES is preferred over the performing multiple read operation on the core cell, cell dissipates more power during RES than during the read or write operation. This paper focuses on the reduction in power dissipation by optimisation of number of RESs, which are required to sensitise the dRDF during test mode of operation of SRAM. The novel pre-charge architecture has been proposed in order to reduce the power dissipation by limiting the number of RESs to an optimised number of two. The proposed low power architecture is simulated and analysed which shows reduction in power dissipation by reducing the number of RESs up to 18.18%.     

A new asymmetric 6T SRAM cell with a write assist technique in 65 nm CMOS technology

A new asymmetric 6T-SRAM cell design is presented for low-voltage low-power operation under process variations. The write margin of the proposed cell is improved by the use of a new write-assist technique. Simulation results in 65 nm technology show that the proposed cell achieves the same RSNM as the asymmetric 5T-SRAM cell and 77% higher RSNM than the standard 6T-SRAM cell while it is able to perform write operation without any write assist at V_DD=1 V. Monte Carlo simulations for an 8 Kb SRAM (256×32) array indicate that the scalability of operating supply voltage of the proposed cell can be improved by 10% and 21% compared to asymmetric 5T- and standard 6T-SRAM cells; 21% and 53% lower leakage power consumption, respectively. The proposed 6T-SRAM cell design achieves 9% and 19% lower cell area overhead compared with asymmetric 5T- and standard 6T-SRAM cells, respectively. Considering the area overhead for the write assist, replica column and the replica column driver of 2.6%, the overall area reduction in die area is 6.3% and 16.3% as compared with array designs with asymmetric 5T- and standard 6T-SRAM cells.     

A read-static-noise-margin-free SRAM cell for low-VDD and high-speed applications

To help overcome limits to the speed of conventional SRAMs, we have developed a read-static-noise-margin-free SRAM cell. It consists of seven transistors, several of which are low-Vth nMOS transistors used to achieve both low-VDD and high-speed operations. For the same speed, the area of our proposed SRAM is 23% smaller than that of a conventional SRAM. Further, we have fabricated a 64-kb SRAM macro using 90-nm CMOS technology and have obtained with it a minimum VDD of 440 mV and a 20-ns access time with a 0.5-V supply.     

An SRAM cell with nonvolatile memory for programmable logicapplications

A memory cell has been developed and fabricated that during normal operation acts as an SRAM cell. The state of the cell can be “saved,” and at power up, the cell can be put back into that state     

A bipolar load CMOS SRAM cell for embedded applications

This paper presents a new SRAM cell concept which offers cell scaling without requiring complicated, specialized processing technology. The proposed cell utilizes a bipolar transistor in an open-base (base is floating) configuration as a simple means of realizing a high impedance load element. The Bipolar Transistor Load (BTL) is designed such that its open base current (the holding current) is always large enough to compensate for the NMOS pull-down transistor leakage current. The load holding current and the pull-down transistor leakage current are based on the same physical mechanism, namely thermal generation, as a result the load exhibits current tracking properties over varying process and temperature conditions. The cell size is 72 μm² with typical 0.8 μm design rules, which is about a 60% reduction as compared to a standard 6-T full CMOS cell. The operating properties of the BTL cell were studied analytically and characterized experimentally. The BTL SRAM module can be easily integrated as part of any CMOS process with minimal additional processing steps     

A low-power and robust quaternary SRAM cell for nanoelectronics

This paper presents an efficient and low-power quaternary static random-access memory (SRAM) cell based on a new quaternary inverter. For implementation, carbon nanotube field-effect transistors (CNTFETs) are used. Stacked CNTFETs are appropriately used in the proposed design to achieve a considerably low static power dissipation. The proposed SRAM has a more significant static noise margin due to its single quaternary digit line, and it is appropriate for MVL SRAM design as there are more than two stable states. The simulation results using Synopsys HSPICE with 32 nm Stanford comprehensive CNTFET model demonstrate the correct and robust operation of the proposed designs even in the presence of major process variations. In addition, the proposed SRAM cell is applied in a 4?×?4 SRAM array structure to demonstrate the efficiency of the proposed SRAM. The results indicate that the proposed design significantly lowers the power consumption and provides comparable static noise margins compared to the other state-of-the-art CNTFET-based circuits.

     

Design of replica bit line control circuit to optimize power for SRAM

A design of a replica bit line control circuit to optimize power for SRAM is proposed. The proposed design overcomes the limitations of the traditional replica bit line control circuit, which cannot shut off the word line in time. In the novel design, the delay of word line enable and disable paths are balanced. Thus, the word line can be opened and shut off in time. Moreover, the chip select signal is decomposed, which prevents feedback oscillations caused by the replica bit line and the replica word line. As a result, the switch power caused by unnecessary discharging of the bit line is reduced. A 2-kb SRAM is fully custom designed in an SMIC 65-nm CMOS process. The traditional replica bit line control circuit and the new replica bit line control circuit are used in the designed SRAM, and their performances are compared with each other. The experimental results show that at a supply voltage of 1.2 V, the switch power consumption of the memory array can be reduced by 53.7%.     

Low power options for 32 nm always-on SRAM architecture

The SRAM 6T bit-cell suffers many limitations in advanced technology nodes among which variability effects. Various alternatives have been experimented and the paper focuses on the 5T-Portless bit-cell. Read and write operations are operated by varying voltage conditions. Literature regarding 32 nm CMOS for Portless SRAM has been reviewed and improvements are presented. The bit-cells are arranged in matrix to permit a current-mode read operation as opposed to voltage-based sensing techniques. Thus safety and stability of the bit-cell operation is established without constraints on memory periphery. The current-mode operation enables a significant gain in dynamic power consumption beneficial to always-on memories. The paper presents different existing solutions to limit the power consumption and their limitations in thin CMOS technologies. The portless bit-cell is presented as a low power architecture alternative to 6T-SRAM. A matrix test-chip is currently under fabrication in bulk CMOS 32 nm.     

Micro-operation cache: a power aware frontend for variable instruction length ISA

Modern computer architectures that support variable length instruction set architectures (ISA), such as the Intel's IA-32, distinguish between the architectural level of presentation and the micro-architectural representations of the instructions. At the micro-architectural level, instructions are represented by fixed-length micro-operations termed uops, and complex instructions are broken into sequence of uops. The fetch and decode operations in such architectures are extremely complicated and power hungry, especially if they aim to handle several variable length instructions per cycle. This paper suggests caching uop sequences from decoded instructions in a special structure, termed uop cache (UC), and use this fix-length decoded format when possible. Doing so enables reduction in the processor's power and energy consumption while not compromising performance. We will show that a moderately-sized UC can eliminate about 75% instruction decodes across a broad range of benchmarks and over 90% in multimedia applications and high-power tests. For existing Intel P6 family processors, the eliminated work may save about 10% of the full-chip power consumption. While the new proposed technique can be used to save power without degrading performance, we can also use it to improve processor performance when power is constrained.     

一种嵌入式处理器Cache的可在线配置和低功耗设计

本文提出了一种基于"组拼合"技术的嵌入式片上高速缓存(Cache)在线可配置结构.在线可配置Cache可以针对不同的应用,配置Cache的组关联等参数,从而在保持应用性能基本不变的前提下,有效降低Cache的动态功耗.其中水平组拼合方式与Gated-Vdd技术配合使用,不仅可以有效降低动态功耗,而且可以降低超深亚微米工艺中不断凸现的静态漏电功耗.将该结构应用于32-bit嵌入式处理器CK510中,PowerStone测试基准中的一组应用测试表明,组拼合可在线配置Cache结构可以显著降低处理器功耗.