真空退火Fe/Pt多层膜的结构和磁性

采用直流磁控溅射方法制备了Fe/Pt多层膜和FePt单层薄膜,并在不同温度下真空热处理得到了有序相L10-FePt薄膜.研究表明,Fe/Pt多层膜化可以降低FePt薄膜有序相的转变温度.[Fe(1.5nm)/Pt(1.5nm)]13薄膜在350℃热处理后,有序度已经增加到0.6,而且矫顽力达到了501kA/m.多层膜化促进有序化在较低的温度下进行,这主要是因为原子在多层膜界面扩散更快.     

真空退火Fe/Pt多层膜的结构和磁性

采用直流磁控溅射方法制备了Fe/Pt多层膜和FePt单层薄膜,并在不同温度下真空热处理得到了有序相L10-FePt薄膜.研究表明,Fe/Pt多层膜化可以降低FePt薄膜有序相的转变温度.[Fe(1.5nm)/Pt(1.5nm)]13薄膜在350℃热处理后,有序度已经增加到0.6,而且矫顽力达到了501kA/m.多层膜化促进有序化在较低的温度下进行,这主要是因为原子在多层膜界面扩散更快.     

磁控溅射法制备Ag/FePt/C/FePt薄膜的结构和磁性能

采用磁控溅射法,在自然氧化的Si(001)基片上沉积了Ag/FePt/C/FePt纳米薄膜,并分别在400,450,500,600℃下对薄膜样品进行了1h的退火热处理。利用X射线衍射仪和振动样品磁强计,对薄膜样品的结构和磁性进行了分析。结果表明,当热处理温度为450℃时,Ag/FePt/C/FePt薄膜中已形成了具有有序面心四方结构的L10-FePt。随着热处理温度的升高,薄膜样品的有序化程度提高,矫顽力Hc增强,晶粒尺寸变大。当热处理温度为600℃时,薄膜样品的平行膜面Hc为905.8kA·m-1,晶粒尺寸为23nm。     

FePt薄膜氧化的电子显微学表征

电子束蒸发沉淀法制备的Fe-Pt多层膜在N2氧气下经550℃退火可获得有序Llo-FePt相。截面样品形貌像表明退火600s的样品形成了双层结构，祥品选区电子衍射谱、X射线能谱及电子能量损失谱中O-K边吸收峰形状分析表明该样品的上层结构主要为尖晶石相Fe3O2的氧化产物，下层结构主要为有序Llo-FePt。由于Fe的选择性氧化造成FePt相的成分偏离设计要求，从而对FePt超薄膜的磁学性能产生很大影响。     

溅射法制备高取向Pt薄膜的工艺研究

采用射频磁控溅射工艺在SiO2／Si衬底上成功制备了适用于pZT铁电薄膜底电极的180nm厚、沿(111)晶向强烈取向的Pt薄膜。厚约50nm的Ti膜被用作过渡层，以增强Pt薄膜与衬底之间的黏着性。实验表明，在Pt薄膜的制备过程中，较高的衬底温度有利于薄膜晶化，促使Pt薄膜沿(111)晶向择优取向生长。而在薄膜沉积后加入适当的热处理工艺，能有效地提高Pt薄膜的择优取向性，同样可以得到沿(111)晶向强烈取向的Pt薄膜。原子力显微镜分析表明，制得的薄膜结构相对致密，结晶状况良好，晶粒尺寸约为50nm。     

铁电电容的电极结构

作为铁电电容的电极材料 ,铂是使用最为广泛的金属。在 PZT薄膜的上下两层分别用离子束溅射淀积厚度为 50 nm和 10 0 nm的 Pt。在铂层上按常规工艺需蒸发 1～ 2 μm的 Al作为布线金属。为避免在热处理过程中的固相反应 ,Al/ Pt之间还需嵌入阻挡金属。观察了 Si,Co,Ni,Ti和 Ti/ W合金膜的阻挡特性。实验证明一定组分的 Ti/ W合金膜能有效地抑制 Al/ Pt固相反应 ,获得较为理想的接触特性。     

Fe膜及磁场沉积对TbDy-Fe膜磁伸性能的影响

为了提高TbDv-Fe膜的低场磁敏性,采用离子束溅射沉积(IBSD)法制备TbDy-Fe超磁致伸缩薄膜,分别研究了纯Fe膜与TbDy-Fe单层膜、TbDy-Fe/Fe耦合多层膜的复合及磁场下溅射沉积对TbDy-Fe膜磁致伸缩性能的影响;用振动样品磁强计(VSM)测试薄膜磁滞回线,用电容位移测量仪测试薄膜悬臂梁自由端偏转量,并计算出磁致伸缩系数λ.结果表明,由IBSD法制备的纯Fe膜、TbDy-Fe单层膜、TbDy-Fe/Fe复合膜的易磁化轴均平行于膜面,TbDy-Fe/Fe复合膜在低场下的磁化强度与磁导率均高于TbDy-Fe单层膜(在100 kA/m时,TbDy-Fe/Fe复合膜的磁化强度比TbDy-Fe单层膜高173%).纯Fe膜分别与TbDy-Fe单层膜、TbDy-Fe/Fe耦合多层膜进行复合均可提高薄膜磁致伸缩性能;磁场下溅射沉积所得180 nm纯Fe膜 640 nmTbDy-Fe/Fe耦合多层膜,由于在其膜面内短轴方向产生感生磁各向异性,从而使磁致伸缩性能得到进一步的提高,在150 kA/m的磁场下它的λ值可达到650×10-6.     

Si衬底上采用溅射Fe/Si纳米多层结构制备β-FeSi2薄膜

采用磁控溅射的方法在Si衬底上生长Fe/Si多层膜,退火后形成了硅化物薄膜。利用X射线衍射(XRD)、Raman光谱、原子力显微镜(AFM)研究了Fe/Si膜厚比和退火温度对薄膜结构特性的影响。研究表明,当Fe/Si膜厚比为1/2,预先在衬底上沉积Fe缓冲层,退火温度为750℃,形成的硅化物为β-FeSi2,晶粒的平均尺寸大约为50nm,且分布得比较均匀。如果Fe/Si厚度比为1/1或3/10时,形成的硅化物为ε-FeSi。随着退火温度的升高,Fe/Si之间的相互扩散逐渐增强,当退火温度为1 000℃时,形成了富硅的二硅化物的高温相α-FeSi2。     

低温沉积ZnO薄膜的压敏特性及其热处理影响

采用GDARE法在较低温度下,通过一次和多次沉积制备单层及多层ZnO薄膜.AFM和XRD分析表明,薄膜具有以ZnO(002)晶面取向为主的多晶结构,多层膜的晶粒尺寸增大.经200～300℃退火热处理,薄膜呈现出良好的低压压敏特性.经200℃退火热处理后,多层ZnO薄膜的非线性系数达到61.54,压敏电压20.10V.在一定范围内升高热处理温度,可明显降低压敏电压.分析了不同膜层及热处理温度对ZnO薄膜压敏特性的影响机理.     

低温沉积ZnO薄膜的压敏特性及其热处理影响

采用GDARE法在较低温度下,通过一次和多次沉积制备单层及多层ZnO薄膜.AFM和XRD分析表明,薄膜具有以ZnO(002)晶面取向为主的多晶结构,多层膜的晶粒尺寸增大.经200～300℃退火热处理,薄膜呈现出良好的低压压敏特性.经200℃退火热处理后,多层ZnO薄膜的非线性系数达到61.54,压敏电压20.10V.在一定范围内升高热处理温度,可明显降低压敏电压.分析了不同膜层及热处理温度对ZnO薄膜压敏特性的影响机理.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks