线性化AlGaN/GaN HEMT费米能级与二维电子气密度关系的解析模型

通过化简复杂非线性的费米能级EF与二维电子气密度ns关系,并利用化简后函数的一阶泰勒多项式建立了线性化AlGaN/GaN HEMT中EF与ns关系的解析模型。该模型可以根据二维电子气密度ns的范围及温度计算EF与ns非线性关系之线性近似的参数斜率a和截距EF0。计算结果表明,所述模型的线性EF-ns计算结果对非线性精确解近似效果较好,且基于该模型计算的ns-VG曲线与实验数据符合良好。     

AlN钝化层对AlGaN/GaN异质结及其高温特性的影响

主要研究了A1N钝化介质层对AlGaN/GaN异质结势垒层应力的修改以及应力的变化对二维电子气高温输运性质的影响.研究结果表明:AlN介质层会对AlGaN势垒层产生附加的平面压应变;AlN和传统的si3N4钝化介质都能减轻AlGaN势垒层在高温下的应变弛豫,但AlN介质层效果更明显.和传统的Si,N4钝化介质相比较,AlN钝化层不仅会显著增加AlGaN/GaN异质结二维电子气密度度,还会明显提高二维电子气迁移率,同时,AlN钝化后二维电子气密度的温度稳定性也更好.因此,对AlGaN/GaN异质结器件来说,AIN是一种有潜力的钝化介质.     

考虑自热效应的AlGaN/GaN高电子迁移率晶体管建模与仿真

基于电荷控制模型,分析了极化,载流子迁移率,饱和电子漂移速度,导带断续,掺杂浓度,沟道温度等与自然效应的关系,并考虑了寄生电阻对自热效应的影响,建立了模拟AlGaN/GaN高电子迁移率晶体管直流I-V特性的解析模型。通过与试验值的对比,该模型具有较高的精度,并且计算过程简单,可以用来指导器件结构和电路的设计。     

极化效应对AlN/GaN共振隧穿二极管电流特性的影响

本文采用半经验紧束缚能带理论,通过自洽计算薛定谔方程和泊松方程研究了AlN/GaN共振隧穿二极管中极化效应对电流的影响.结果发现,极化效应导致电流曲线发生不对称性,并影响电流的共振电压位置,这与实验报道的结果相一致.并且随着极化电荷的增加,在一定的偏压条件下,只能观测到一个子能级隧穿或者根本没有负微分电阻现象发生.     

AlGaN／GaN异质结2DEG载流子输运

本言语采用雷－丁平衡方程理论,考虑杂质散射、声学波形变势散射、声学波压电散射、极化光学波散射等散射机制,计算了ＡｌＧａＮ／ＧａＮ异质结二维电子气（２ＤＥＧ）在０－３００Ｋ温度范围内的低场迁率以及电子漂移速度和电子温度随外加电场的变化关系,同时本文计算了有隔离层的调制掺杂异质结构（ＭＤＨ）中低温下（Ｔ＝４Ｋ）低场迁移率随隔离层厚度的变化关系。计算结果表明在低温下ＡｌＧａＮ／ＧａＮ异质结构的低场迁移率     

改进的AlGaN/GaN HEMT小信号参数提取算法

制作了截止频率ft和最高震荡频率fmax分别为46.2和107.8 GHz的AlGaN/GaN高电子迁移率晶体管,并针对该器件建立了包含微分电阻Rfd和Rfs在内的18元件小信号等效电路模型;在传统的冷场条件提取器件寄生参数的基础上,通过对不同栅压偏置下冷场Z参数进行线性插值运算,可消除沟道分布电阻和栅极泄漏电流对寄生电阻的影响;再利用热场S参数对寄生参数部分进行去嵌,可提取得到本征参数。分析表明,此模型和算法提高了模型拟合精度,S参数的仿真结果与测试数据在200MHz到40GHz的频率范围内均符合很好,误差不到2%。     

III-Nitrides growth and AlGaN/GaN heterostructures on ferroelectric materials

The growth of III-nitrides on the ferroelectric materials lithium niobate (LN) and lithium tantalate (LT) via molecular beam epitaxy (MBE) using rf plasma source has been investigated. We have found that gallium nitride (GaN) epitaxial layers have a crystalline relationship with lithium niobate (tantalate) as follows: (0 0 0 1) GaN || (0 0 0 1) LN (LT) with [10−10] GaN || [11−20] LN (LT). The surface stability of LN and LT substrates has been monitored by in situ spectroscopic ellipsometry in the vacuum chamber. Three different temperature zones have been discerned; surface degas and loss of OH group (100–350 °C); surface segregation/accumulation of Li and O-species (400–700 °C); surface evaporation of O-species and Li desorption (over 750 °C). However, LT shows only surface degassing in the range of 100–800 °C. Therefore, congruent LN substrates were chemically unstable at the growth temperature of 550–650 °C, and therefore developed an additional phase of Li-deficient lithium niobate (LiNb₃O₈) along with lithium niobate (LiNbO₃), confirmed by X-ray diffraction. On the other hand, LT showed better chemical stability at these temperatures, with no additional phase development. The structural quality of GaN epitaxial layers has shown slight improvement on LT substrates over LN substrates, according to X-ray diffraction. Herein, we demonstrate AlGaN/GaN heterostructure devices on ferroelectric materials that will allow future development of multifunctional electrical and optical applications.     

AlGaN/GaN HEMTs passivated by Cat-CVD SiN Film

We demonstrate the excellent performance of a 140 W AlGaN/GaN HEMT in the C-band, which is passivated by a Cat-CVD SiN film. The interface trap density of the AlGaN surface passivated by Cat-CVD film after NH₃ treatment is 3 × 10¹² cm^− 2, which is the smallest of investigated deposition techniques. The lowest interface trap density achieved by the Cat-CVD technique makes it possible to operate the AlGaN/GaN HEMT in the C-band. We clarify that the Cat-CVD technique is necessary for developing future amplifiers.     

调制掺杂ZnMgO/ZnO异质结构中的二维电子气

基于调制掺杂的ZnMgO/ZnO异质结构模型,通过自洽求解一维泊松-薛定谔方程,研究了掺杂浓度、空间层厚度对ZnMgO/ZnO异质界面处二维电子气(2DEG)的分布、面密度等性质的影响。结果表明:ZnO沟道中的二维电子气主要来源于极化效应诱生的电子和掺杂层转移的电子,通过改变掺杂浓度和空间层厚度可以有效地调控异质结中的二维电子气。采取的研究方法和所得结果可以为ZnO基异质结构及相关器件的构筑提供基础。     

Impact of SF6 plasma treatment on performance of AlGaN/GaN HEMT

Selective plasma treatment of an AlGaN/GaN heterostructure in the RF discharge of the electronegative SF₆ gas was studied. Shallow recess-gate etching of AlGaN (∼5 nm) was performed in CCl₄ plasma through a photoresist mask. Subsequently, recess-gate etching followed in situ by SF₆ plasma. The plasma treatment provides the following advantages in the technology of AlGaN/GaN high-electron mobility transistors (HEMT): It (1) simplifies their technology; (2) ensures sufficient selectivity; and (3) enables the technologist to set the threshold voltage of the HEMTs controllably. At the same time, the treatment can (1) provide the AlGaN/GaN heterostructure with surface passivation; (2) modify the 2DEG in any area of a HEMT channel; and (3) make it possible to convert a HEMT operation from depletion mode to enhancement mode. The treatment also improved significantly the DC and RF parameters of HEMTs studied.     

AlGaN/GaN HEMT氢气传感器不同温度下响应特性的研究

本文制作了栅极为金属Pt的AlGaN/GaN HEMT结构的氢气传感器。当外加偏压V_GS=-2.5 V时,研究了传感器在不同温度(25-150℃)下对不同氢气浓度(25-900 ppm)的响应特性。研究结果表明:当温度为25℃、氢气浓度为25 ppm时,器件响应的灵敏度为65.9%;随着氢气浓度从25增加到900 ppm后,器件灵敏度增加了14%,器件灵敏度与浓度的对数呈线性关系。当温度在25-150℃的区间内,传感器响应的灵敏度随着温度升高而降低,在室温25℃时其响应最佳。此外,通过修正Langmuir吸附等温线建立了传感器响应的理论模型,将实验数据通过理论模型进行拟合,分析了温度对传感器响应的影响。本工作研究的氢气传感器具有优异的响应特性,它可应用于室温氢气检测,具有极高的应用潜力。     

ZnMgO/ZnO异质结构中极化对二维电子气的影响

基于 ZnMgO/ZnO 异质结构模型,从压电极化对应变弛豫度的依赖关系出发,通过自洽求解一维泊松-薛定谔方程,研究了 ZnMgO 势垒层的厚度、Mg 组分和应变弛豫度对 ZnMgO/ZnO 异质界面处二维电子气(2DEG)的分布、面密度等性质的影响,并结合极化和能带偏移对计算结果进行了分析讨论。结果表明通过改变 Mg 组分和应变弛豫度可以调节异质界面两边的极化强度不连续性,进而有效地调控异质结中的二维电子气。     

RF-MBE生长AlGaN/GaN二维电子气材料

用射频等离子体辅助分子束外延技术 (RF -MBE)在C面蓝宝石衬底上外延了高质量的GaN膜以及AlGaN/GaN极化感应二维电子气材料 .所外延的GaN膜室温背景电子浓度为 2× 10 17cm-3 ,相应的电子迁移率为 177cm2 /Vs;GaN (0 0 0 2 )X射线衍射摇摆曲线半高宽 (FWHM)为 6arcmin .;AlGaN/GaN极化感应二维电子气材料的室温电子迁移率为 730cm2 /Vs ,相应的电子气面密度为 7.6× 10 12 cm-2 ;用此二维电子气材料制作的异质结场效应晶体管 (HFET)室温跨导达 5 0mS/mm (栅长 1微米 ) ,截止频率达 13 .2 5GHz(栅长 0 .5微米 ) ,可在 30 0℃下工作     

Effects of double passivation for optimize DC properties in gamma-gate AlGaN/GaN high electron mobility transistor by plasma enhanced chemical vapor deposition

Two different materials for double passivation layers have been implemented to an AlGaN/GaN high electron mobility transistor on Si (111) substrate and the improved DC properties are demonstrated. Si₃N₄ and SiO₂ passivation materials are deposited on the gamma gate upper and bottom layers by plasma enhanced chemical vapor deposition. The gamma shape gate can be made by selectively accurate Si₃N₄ or SiO₂ first passivation dry etching with wet etching. The second passivation on gamma gate effectively increases the DC properties. The effects of DC properties of Si₃N₄ or SiO₂ single passivation and Si₃N₄/Si₃N₄ or SiO₂/SiO₂ double passivations are compared. The Si₃N₄/Si₃N₄ double passivation shows the maximum saturation current density and the peak extrinsic transconductance which increases up to 72% and 18%, respectively, more than Si₃N₄ single passivation and also up to 18% and 5% than SiO₂/SiO₂ double passivation.     

Structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm Si (111) by ammonia molecular beam epitaxy

The structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm diameter Si (111) substrate by ammonia molecular beam epitaxy have been reported. High resolution X-ray diffraction, micro-Raman spectroscopy, transmission electron microscopy and secondary ion mass spectroscopy have been used to study the influence of AlN thickness and AlGaN growth temperature on the quality of GaN. GaN grown on thicker AlN showed reduced dislocation density and lesser tensile strain. Three-dimensional growth regime was observed for GaN grown at lower AlGaN growth temperature while higher AlGaN growth temperature resulted in two-dimensional growth mode. The dislocation bending and looping at the AlGaN/AlN interface was found to have significant influence on the dislocation density and strain in the GaN layer. The evolution and interaction of threading dislocations play a major role in determining the quality and the strain states of GaN.     

Temperature dependent microwave performance of AlGaN/GaN high-electron-mobility transistors on high-resistivity silicon substrate

The influence of temperature (− 50 °C to + 200 °C) was studied on the DC and microwave characteristics of AlGaN/GaN high-electron-mobility transistors (HEMTs) on high resistivity Si substrate for the first time. The AlGaN/GaN HEMTs exhibited a current-gain cut-off frequency (f_T) of 11.8 GHz and maximum frequency of oscillation (f_max) of 27.5 GHz. When compared to room temperature values, about 4% and 10% increase in f_T and f_max and 23% and 39.5% decrease in f_T and f_max were observed when measured at − 50 °C and 200 °C, respectively. The improvement of I_D, g_mf_T, and f_max at − 50 °C is due to the enhancement of 2DEG mobility and effective electron velocity. The anomalous drain current reduction in the I-V curves were observed at low voltage region at the temperature ≤ 10 °C but disappeared when the temperature reached ≥ 25 °C. A positive threshold voltage (V_th) shift was observed from − 50 °C to 200 °C. The positive shift of V_th is due to the occurrence of trapping effects in the devices. The drain leakage current decreases with activation energies of 0.028 eV and 0.068 eV. This decrease of leakage current with the increase of temperature is due to the shallow acceptor initiated impact ionization.     

Surface acoustic wave excitation on SF6 plasma-treated AlGaN/GaN heterostructure

In this work, we introduce a new modified approach to the formation of interdigital transducer (IDT) structures on an AlGaN/GaN heterostructure. The approach is based on a shallow recess-gate plasma etching of the AlGaN barrier layer in combination with “in-situ” SF₆ surface plasma treatment applied selectively under the Schottky gate fingers of IDTs. It enables one to modify the two-dimensional electron gas (2DEG) density and the surface field distribution in the region of the IDTs, as is needed for the excitation of a surface acoustic wave (SAW). The measured transfer characteristics of the plasma-treated SAW structures revealed the excitation of SAW at zero bias voltage due to fully depleted 2DEG in the region of the IDTs. High external bias voltages are not necessary for SAW excitation. SIMS depth distribution profiles of F atoms were measured to discuss the impact of SF₆ plasma treatment on the performance of the AlGaN/GaN-based IDTs.     

AlN/SiO2纳米多层膜的超硬效应与高温抗氧化性

采用反应磁控溅射法制备了一系列不同SiO2层厚的AlN/SiO2纳米多层膜,利用X射线衍射仪,高分辨透射电子显微镜、扫描电子显微镜和微力学探针表征了多层膜的微结构和力学性能,研究了多层膜微结构与力学性能随SiO2层厚的变化,考察了AIN/SiO2纳米多层膜的高温抗氧化性.结果表明,受AlN层晶体结构的模板作用,溅射条件下以非晶态存在的SiO2层在厚度<0.6nm时被强制晶化为与AIN相同的六方结构赝晶体,并与AlN形成共格外延生长结构,多层膜相应产生硬度升高的超硬效应. SiO2随自身层厚的进一步增加又转变为以非晶态生长,致使多层膜的外延生长结构受到破坏,其硬度也随之降低.高温退火研究表明,高硬度的AIN/SiO2纳米多层膜的抗氧化温度为800℃,与AlN单层膜相当. SiO2层的加入尽管能使多层膜获得较高硬度,但是并不能提高其抗氧化温度.