Matrix resins based on bismaleimide–1,2-polybutadienes

Improved thermally stable matrix resins have been obtained by the incorporation of 1,2-polybutadiene in 4,4′-bismaleimidodiphenylmethane. The thermal curing was performed at 185–195°C for 2.5 h and at 230–235°C for 45 min to give tough crosslinked polymers. The thermal curing reaction was monitered using FT-IR and differential scanning calorimetry. Thermogravimetric analysis of the cured resins have shown improved thermal stability up to 490–480°C both in air and nitrogen atmospheres. The char yield obtained in nitrogen at 800°C was in the range of 50–49%. Graphite cloth laminates were prepared and tested. The laminates showed improved tensile strength over to parent bismaleimide. 1,2-Polybutadiene was hydrogenated using 10% palladized-charcoal. The resulting polymer was characterized by using IR and ¹H-NMR, which showed reduction of 15% pendent vinyl double bonds.     

Studies on crosslinking and thermal behavior of phthalonitrile end‐capped imide monomer in presence of aromatic amines

This paper describes the synthesis and characterization of a bisphthalonitrile monomer having an imide linkage prepared by reacting 4,4′‐(hexafluoroisopropylidene) diphthalic anhydride with 4‐(4‐aminophenoxy) phthalonitrile. The structure of the monomer was confirmed by Fourier transform infrared, ¹H‐NMR, and ¹³C‐NMR spectroscopy. The curing behavior of bisphthalonitrile monomer was investigated in the absence or presence of different diamines using differential scanning calorimetry. Diamines 4,4′‐diaminodiphenyl ether (DDE) and 4,4′‐diaminodiphenylsulfone (DDS) were used to investigate the effect of the structure of diamines on the curing behavior of bisphthalonitrile monomer. An exothermic transition due to curing was observed in the DSC scan, and the curing temperature was found to be dependent on the nucleophilicity of the amine. DDE was found to be more reactive than DDS. The thermal stability of the cured resins was evaluated using thermogravimetry in nitrogen atmosphere. All of the cured samples were stable up to 400 °C and leave behind 62% char residue at 800 °C, which was found to be dependent on the structure of the diamine used for curing as well as on the curing conditions. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46151.     

Effect of isomerization on thermal behaviour of bisitaconimides

The effect of isomerization of N,N′‐bisitaconimido‐4,4′‐diphenyl ether to the corresponding biscitraconimide on the curing characteristics and thermal stability of cured resins is described. Resins having bisitaconimide:biscitraconimide ratios of 23:77–93:7 were prepared by reacting 4,4′‐diaminodiphenyl ether with itaconic anhydride in solvents of different polarities and under different reaction conditions. Resins containing a higher proportion of citraconimide had a lower melting point (191 vs 208 °C). The curing exotherm was observed immediately after melting in all the resins and exothermic peak temperature reduced with increase in citraconimide content. Resins having a higher proportion of citraconimide on isothermal curing (200 °C, 2 h) and subsequent heating in nitrogen atmosphere degraded at a slightly lower temperature. However, the char yield at 800 °C did not show any systematic dependence on citraconimide content. © 2002 Society of Chemical Industry     

Multifunctional epoxy resins

The curing behavior of epoxy resins prepared by reacting epichlorohydrin with 4,4′-diaminodiphenyl methane (DADPM)/4,4′-diaminodiphenyl ether (DADPE) or 4,4′-diaminodiphenyl sulfone (DDS) was investigated using DDS and tris-(m-aminophenyl)phosphine oxide (TAP) as curing agents. A broad exothermic transition with two maxima were observed in the temperature range of 100–315°C when TAP was used as the curing agent. The effect of varying DDS concentration on curing behavior of epoxy resin was also investigated. Peak exotherm temperature (T_exo) decreased with increasing concentration of DDS, whereas heat of curing (ΔH) increased with an increase in amine concentration up to an optimum value and then decreased. Thermal stability of the resins, cured isothermally at 200°C for 3 h, was investigated using thermogravimetric analysis in a nitrogen atmosphere. Glass fiber-reinforced multifunctional epoxy resin laminates were fabricated and the mechanical properties were evaluated. © 1993 John Wiley & Sons, Inc.     

Synthesis and properties of 1,3,4-oxadiazole-containing high-performance bismaleimide resins

Two novel bismaleimide (BMI) monomers containing 1,3,4-oxadiazole, i.e., 5-tert-butyl-1,3-di[5-(4-maleimidophenyl)-1,3,4-oxadiazole-2-yl]benzene (Buoxd) and 4,4′-[5-(4-maleimidophenyl)-1,3,4-oxadiazole-2-yl]diphenyldimethylsilane (Sioxd), were designed, synthesized and copolymerized with 4,4′-bismaleimidodiphenylmethane (BMDM) to yield a new series of high-performance bismaleimide resins. Both monomers obtained are readily soluble in common organic solvents, such as dichloromethane and chloroform, enabling an easy solution processing. The thermal properties of the two monomers were carefully studied by the differential scanning calorimetry (DSC), optical microscopy and thermogravimetric analysis (TGA, simultaneous DSC). The BMI resins based on a mixture of Buoxd (or Sioxd) and BMDM in a weight ratio of 10% were prepared. DSC investigations showed that the thermal curing of the BMI resins could be accomplished at a lower temperature than the thermal curing temperatures of Buoxd and Sioxd, and the thermal processing window, i.e., the temperature range between the melting transition and thermal curing process, was over 26 °C. The thermal properties and thermal mechanical properties of the resulting BMI resins were investigated by DSC, thermogravimetric analysis (TGA) and dynamic mechanical analysis (DMA). No glass transition temperature was found in the range of 50–350 °C, and very good thermal stability (T_d > 490 °C in nitrogen) and high thermo-oxidative stability (T_d > 460 °C in air) were revealed. Composites composed of the above BMI resins and glass cloth were also prepared, which showed high bending modulus (>1.6 GPa) at a very high temperature (e.g., 400 °C).     

Synthesis and properties of silicon-containing bismaleimide resins

Two novel bismaleimide (BMI) monomers containing silicon atom in the structure, i.e., bis[4-(4-maleimidophenylcarbonyloxy)phenyl]dimethylsilane (BMI-SiE1) and bis[4-(4-maleimidophenyloxycarbonyl)phenyl]dimethylsilane (BMI-SiE2), were designed, synthesized, and polymerized with and without the use of diamine as comonomers to yield novel silicon-containing BMI resins. Both monomers obtained are readily soluble in organic solvents, such as chloroform and N, N-dimethylformamide. Differential scanning calorimetry and thermogravimetric analysis investigation of these two monomers indicated a high polymerization temperature (T_p > 240°C) and a good thermal and thermo-oxidative stability of cured BMI resins. The onset temperature for 5% weight loss was found to be above 450°C in nitrogen and above 400°C in the air. Polymerization of BMI-SiE1 and BMI-SiE2 with 4,4′-diaminodiphenylether (DPE) yielded a series of polyaspartimides that had good solubility and could be thermally cured at 250°C. TGA investigations of the cured diamine-modified BMI resins showed onset of degradation temperatures (T_ds) in the range of 344–360°C in nitrogen and 332–360°C in the air. Composites based on the cured diamine-modified BMI resins and glass cloth were prepared and characterized for their dynamic mechanical properties. All the composites showed high glass transition temperatures (e.g., >190°C) and high bending modulus in the range of 1000–2700 MPa. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Epoxy resins from dinaphthols

Epoxy resins were prepared from di-α-naphthol(4,4′-dihydroxy-1,1′-dinaphthyl) and di-β-naphthol(2,2′-dihydroxy-1,1′-dinaphthyl). The resins consisted mainly of the reaction product of 1 mole of dinaphthol with 2 moles of epichlorhydrin. They contained chlorine, however, and were correspondingly deficient in diepoxide functionality. The resins from di-α-naphthol were crystalline, had m.p. 200°C., and were not miscible with conventional curing agents. Di-β-naphthol gave resins with softening points in the range 50–70°C., which cured with diethylenetriamine or the anhydrides of dibasic acids, giving hard but brittle products. The brittleness was not removed by curing with plasticizing curing agents, such as tetrapropenyl succinic anhydride. The cured di-β-naphthol-based resins had thermal stabilities similar to analogous epoxy resins based on bisphenol A.     

Preparation and characterization of soluble bismaleimide‐triazine resins based on asymmetric bismaleimide

A series of bismaleimide‐triazine resins (EBT) were prepared from 2‐(4′‐maleimido)phenyl‐2‐(4′‐maleimidophenoxyl)phenylbutane (EBA‐BMI) and 2,2‐bis(4‐cyanatophenyl)propane (BADCy). The resins show attractive processability with good solubility in low boiling point solvents and wide processing temperature windows. Introduction of diallylbisphenol A (DBA) can decrease the curing temperature of EBT resins that the curing exothermic peak temperature shifted from 291 to 237 °C as the content of DBA increased from 0 to 20%. The curing condition influenced the thermal properties of the cured EBT resins. The glass transition temperature increased as the curing temperature and curing time increased. The cured EBT resins show high glass transition temperature up to 352 °C, high thermal stability with 5% weight loss temperature over 405 °C, low coefficient of thermal expansion about 45 to 52 ppm/°C, and high storage modulus up to 2.6 GPa at 250 °C. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44519.     

Synthesis of novolac‐type phenolic resins using glucose as the substitute for formaldehyde

Novel Novolac type phenolic resins were prepared using glucose as the substitute for toxic formaldehyde (a carcinogenic chemical). The resins were synthesized with varying molar ratios of phenol to glucose, catalyzed by strong acid (such as sulfuric acid) at 120–150°C. Analysis of the resins using gel permeation chromatography (GPC) and proton nuclear magnetic resonance (¹H‐NMR) showed that they were broadly distributed oligomers derived from the Fridel‐Crafts condensation of phenol and glucose. Using hexamethylenetetramine (HMTA) as the curing agent, the phenol‐glucose resins could be thermally cured and exhibited exothermic peaks at 130–180°C, typical of thermosetting phenolic resins. The cured resins showed satisfactory thermal stability, e.g., they started to decompose at >280°C with residual carbon yields of above 58% at 600°C. Based on the thermal properties, phenol‐glucose resin with a molar ratio of 1 : 0.5 is promising as it could be cured at a lower temperature (147°C) and exhibited a satisfactorily good thermal stability: it started to decompose at >300°C with a residual carbon yield of >64% at 600°C. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Curing of epoxy resin using imide‐amines

The curing behavior of diglycidyl ether of bisphenol‐A (DGEBA) was investigated by differential scanning calorimetry, using varying molar ratios of imide‐amines and 4,4′‐diaminodiphenyl sulfone (DDS). The imide‐amines were prepared by reacting 1 mol of pyromellitic dianhydride (P) with excess (2.5 mol) of 4,4′‐diaminodiphenyl ether (E), 4,4′‐diaminodiphenyl methane (M), or 4,4′‐diaminodiphenyl sulfone (S) and designated as PE, PM, PS. Structural characterization was done using FTIR, ¹H NMR, ¹³C NMR spectroscopic techniques and elemental analysis. The mixture of imide‐amines and DDS at ratio of 0 : 1, 0.25 : 0.75, 0.5 : 0.5, 0.75 : 0.25, and 1 : 0 were used to investigate the curing behavior of DGEBA. The multiple heating rate method (5, 10, 15, and 20°C/min) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide‐amine, and also on the ratio of imide‐amine : DDS used. Activation energy was highest in case of epoxy cured using a mixture of DDS : imide‐amine of a ratio of 0.75 : 0.25. Thermal stability of the isothermally cured resins was also evaluated in a nitrogen atmosphere using dynamic thermogravimetry. The char yield was highest in case of resins cured using mixture of DDS : PS (0.25 : 0.75; EPS‐3), DDS : PM (0.25 : 0.75; EPM‐3), and DDS : PE (0.75 : 0.25; EPE‐1). © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3502–3510, 2006     

Syntheses,structure, reactivity,and thermal properties of epoxy–imide resin cured by phosphorylated triamine

A new phosphorylated epoxy–imide polymer was obtained using diimide–diepoxide (DIDE) cured with tris(3-aminophenyl)phosphine oxide (TAPO). In addition, compositions of the synthesized diimide diepoxide (DIDE), Epon 828, and DEN 438 with common curing agents, e.g., 4,4′-diaminodiphenyl ether (DDE) and 4,4′-diaminodiphenylsulfone (DDS), were compared as to curing reactivity and heat and flame retardation with that of tris(3-aminophenyl)phosphine oxide. The reactivities of those curing agent toward the three kinds of epoxy resins, as measured by differential scanning calorimetry (DSC), were in the order DDE > TAPO > DDS. Through thermal gravimetric analysis (TGA), the thermal and flame resistances of epoxy were confirmed in this study as capable of being significantly improved through introduction of imide and phosphorus groups into the epoxide structure. © 1996 John Wiley & Sons, Inc.     

A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

A simple imide compound, 4‐amino‐phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4‐nitro‐phthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and ¹H‐NMR spectra. The thermal properties and dielectric constant (ε) of a phosphorus‐containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′‐diamino diphenyl methane (DDM) or 4,4′‐diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower ε than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

The properties of epoxy–imide resin cured by cyclic phosphine oxide diacid

A new phosphorylated epoxyimide polymer synthesized was obtained using diimide-diepoxide (DIDE) resin cured with the new curing agent, 10-phenylphenoxa-phosphine-3,8-dicarboxylic acid-10-oxide (PCAO). In addition, compositions of the synthesized diimide-diepoxide (DIDE), Epon 828, with common curing agents, e.g., 4,4′-diaminodiphenylether (DDE) and 4,4′-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity and heat, and flame retardation with that of (PCAO). The reactivities of those curing agents toward the two kinds of epoxy resins, as measured by differential scanning calorimetry (DSC), were in the following order: DDE> PCAO> DDS. Through evaluation of thermal gravimetric analysis (TGA), the thermal and flame resistances of epoxy polymers were confirmed in this study as capable of being significantly improved through introduction of imide and cyclic phosphine oxide group into the epoxide and curing agent structures. © 1996 John Wiley & Sons, Inc.     

Phosphorous‐containing epoxy resins from a novel synthesis route

The ? P(O)‐H in 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) was used as an active group to react with the carbonyl group in 4,4′‐dihydroxybenzophenone (DHBP) to result a novel phosphorous‐containing biphenol compound (DOPO‐2OH). Phosphorous‐containing epoxy resins were therefore obtained from reacting DOPO‐2OH with epichlorohydrin or with diglycidylether bisphenol A. The synthesized compounds were characterized with FTIR, ¹H and ³¹P NMR, elemental analysis, and epoxide equivalent weight titration to demonstrate the their chemical structures. Cured epoxy resins were prepared via thermal curing the epoxy resins with various curing agents. Thermal analysis results (differential scanning calorimetry and thermogravimetric analysis) revealed that these cured epoxy resins exhibited high glass transition temperatures and high thermal stability. High char yields at 700°C and high LOI (limited oxygen index) values were also found for the cured epoxy resins to imply that the resins were possessing high flame retardancy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1697–1701, 2002     

New epoxy resins. II. The preparation,characterization, and curing of epoxy resins and their copolymers

A polymer having high aromaticity and/or cyclic ring structures in the chain backbone usually gives high heat resistance and flame resistance. Five glycidyl ether-type epoxy resins are prepared from bisphenol A (DGEBA), 9,9-bis(4-hydroxyphenyl)fluorene (DGEBF), 3,6-dihydroxyspiro-[fluorene-9,9′-xanthane] (DGEFX), 10,10-bis(4-hydroxyphenyl) anthrone (DGEA), and 9,9,10,10-tetrakis(4-hydroxyphenyl)anthracene (TGETA) in order to study structure–thermal stability–flame resistance property relationships. In this study, trimethoxyboroxine (TMB) and diaminodiphenylsulfone (DDS) are employed as the curing agents. The char yield at 700°C under a nitrogen atmosphere and the glass transition temperature (T_g) for the uncured resins decrease according to the sequence TGETA > DGEFX > DGEA > DGEBF > DGEBA. The Tg values for these cured epoxy resins are DGEBA < DGEBF < DGEFX < DGEA. A T_g for the TGETA is not obtainable but would be expected to be the highest. The char yields at 700°C of these cured epoxy resins have the same trend as the uncured resins. DGEBF, DGEFX, DGEA, and TGETA added to the DGEBA system show increases in the char yield, T_g, and oxygen index with increasing concentration of these novel epoxy resins.     

Bis(3-aminophenyl)methyl phosphine oxide-based (methyl) nadicimide resins

Ten nadicimide/methyl nadicimide end-capped oligomeric resins were prepared by reacting endo-5-norbornene-2,3-dicarboxylic acid anhydride (methyl nadic anhydride), pyromellitic dianhydride (PMDA)/3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BTDA)/2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6F), and bis(3-aminophenyl) methyl phospine oxide (BAP) in glacial acetic acid/acetone. Structural characterization of the resins was done by elemental analysis, IR, and ¹H-NMR. Multistep decomposition was observed in the TG scan of uncured resins in a nitrogen atmosphere. Residual weight at 800°C depended on the structure and ranged between 25 and 51%. Isothermal curing of the resins was done at 300°C for 1 h in an air atmosphere. These cured resins were stable to 350 ± 30°C and decomposed in a single step above this temperature. The char yield of the resins increased on curing and was in the range 34–70%. © 1997 John Wiley & Sons, Inc. J Appl Polm Sci 65:861–869, 1997     

Preparation and properties of bismaleimide resins of aromatic sulfone ether diamine

Aromatic sulfone ether diamine, bis[4-(4-aminophenoxy)phenyl]-sulfone (SED), was prepared by the nucleophilic aromatic substitution of 4,4′-dichlorodiphenylsulphone by p-aminophenolate. The reaction was conducted in the presence of excess potassium carbonate as a weak base, toluene as the dehydrating agent and N-methylpyrrolidone as the dipolar aprotic solvent. SED showed good solubility in common organic solvents, such as dioxan, tetrahydrofuran, butanone and acetone. SED was reacted with maleic anhydride to obtain aromatic sulfone ether bismaleimide, bis[4-(4-maleimidophenoxy)phenyl]-sulfone (SEM). The compounds were characterized by FTIR and ¹H NMR analysis. Furthermore, copolymer resins of SED with 4,4′-bismaleimidodiphenyl methane (BMI) and SEM were prepared. After curing, crosslinked resins with better thermal stability resulted. The temperature at maximum rate of weight loss (T_max) and the heat-resistant temperature index (T_i) in air were found to be 426°C, 208°C and 579°C, 221°C for BMI/SED and SEM/SED resins, respectively. Compared with the corresponding 4,4′-diaminodiphenyl methane (DDM) system, BMI/SED and SEM/SED showed a slight decrease in T_max and T_i SED-modified BMI/amine resin based glass cloth laminates for printed circuit boards showed higher mechanical properties than those of the corresponding unmodified system. With SED instead of the original amine component in 3–5% weight fraction, the tensile strength, flexural strength and impact strength of the laminates increased markedly. Meanwhile, the stripping strength and weld resistance were also improved by the addition of SED.     

Improving the curing process and thermal stability of phthalonitrile resin via novel mixed curing agents

High curing temperature (including post‐curing temperature) and long curing time of phthalonitrile resins make them thermally stable but difficult to process. In this paper, novel mixed curing agents (CuCl/4,4′‐diaminodiphenylsulfone (DDS) and ZnCl₂/DDS) were firstly designed for solving these problems. Bisphenol‐based phthalonitrile monomer (BP‐Ph; melting point: 228–235 °C) was synthesized and used as the curing precursor. Differential scanning calorimetry results indicated that BP‐Ph cured with CuCl/DDS and ZnCl₂/DDS exhibited curing temperatures close to the melting point of BP‐Ph with curing ending temperatures of 225.4 and 287.1 °C, respectively. Rheologic investigations demonstrated obvious curing reactions of BP‐Ph occurred with the mixed curing agents at 220 °C. Thermogravimetric analysis showed that BP‐Ph cured by CuCl/DDS or ZnCl₂/DDS maintained 95% mass at 573 or 546 °C, respectively, at a post‐curing temperature of 350 °C for 2 h. Reasonable long‐term thermo‐oxidative stability was also demonstrated. When the post‐curing temperature decreased to 290 °C, char yield at 800 °C of BP‐Ph cured by CuCl/DDS was 77.0%, suggesting the curing procedure can be milder when using mixed curing agents. © 2017 Society of Chemical Industry     

Branched phenyl‐s‐triazine moieties to enhance thermal properties of phthalonitrile thermosets

Heat‐resistant materials have made tremendous progress in marine, aerospace and microelectronic fields. Herein, a new class of phthalonitrile resins, branched poly(biphenyl ether triphenyl‐s‐triazine) phthalonitriles, were successfully synthesized via a two‐step, one‐pot reaction, on the basis of 2,4,6‐tris(4‐fluorophenyl)‐1,3,5‐triazine and 4,4′‐biphenol. 4,4′‐Diaminodiphenylsulfone was employed to facilitate the curing reaction, and successful realization of curing behavior was concluded from rheological and differential scanning calorimetric studies, indicating the obtained resins possess favorable processability. The relationship between concentration of reactants and properties of the resins was systematically studied. After thermal curing, the E‐glass fiber‐reinforced composite, prepared with a concentration of reactants of 0.15 g mL^?1, shows an admirable glass transition temperature of 480 °C and commendable thermal stability with 5% weight loss temperature in nitrogen of 563 °C, suggesting that the improvement of the thermal properties stems from the branched structure and the phenyl‐s‐triazine units. © 2017 Society of Chemical Industry     

Synthesis and properties of polyimides derived from diamine monomer containing bi-benzimidazole unit

A new aromatic heterocyclic diamine monomer containing bi-benzimidazole unit, 2,2-bis(4′-aminophenyl)-5,5-bi-1H-benzimidazole, was synthesized from 2,2-bis(4′-nitrophenyl)-5,5-bi-1H-benzimidazole (BNPBBI) prepared via the reaction of 3,3′,4,4′-biphenyltetramine and p-nitrobenzaldehyde with a high yield. Their compositions and chemical structures containing polybenzimidazole backbone were characterized by FTIR, ¹H NMR and elemental analysis. A series of aromatic polyimides containing the heterocyclic moiety in the main chain were prepared by the reaction of BAPBBI with various aromatic dianhydrides of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 4,4′-oxydiphthalic anhydride or pyromellitic dianhydride. The polymers possess a high glass transition temperature of >415 °C and a good thermal stability up to 566 °C with a 5 % weight loss. The combination of polybenzimidazole and polyimide via introducing BAPBBI into the main chains provides the rigid structure, and macromolecular interactions are thus enhanced, resulting in the outstanding mechanical properties. These polyimides exhibit the strong tensile strength of 201 to 327 MPa, and the ultrahigh tensile moduli of 10.7 to 15.5 GPa without post stretching.