Letter: A new compensation pixel circuit with metal oxide thin‐film transistors for active‐matrix organic light‐emitting diode displays

This paper presents a novel compensation pixel circuit for active‐matrix organic light‐emitting diode displays, in which the coupling effect mask technology is developed to compensate the threshold voltage of driving thin‐film transistor whether it is positive or negative. Twenty discrete compensation pixel circuits have been fabricated by In‐Zn‐O thin‐film transistors process. It is measured that the non‐uniformity of the proposed pixel circuit is significantly reduced with an average value of 8.6%. Furthermore, the organic light‐emitting diode emission current remains constant during 6 h continuous operation, which also confirms the validity of the proposed pixel circuit.     

A new current‐mirror pixel circuit employing poly‐Si TFTs for active‐matrix organic light‐emitting‐diode displays

Abstract— A novel active‐matrix organic light‐emitting‐diode (AMOLED) display employing a new current‐mirror pixel circuit, which requires four‐poly‐Si TFTs and one‐capacitor and no additional signal lines, has been proposed and sucessfully fabricated. The experimental results show that a new current mirror can considerably compensate luminance non‐uniformity and scale down a data current more than a conventional current‐mirror circuit in order to reduce the pixel charging time and increase the minimum data current. Compared with a conventional two‐TFT pixel, the luminance non‐uniformity induced by the grain boundaries of poly‐Si TFTs can be decreased considerably from 41% to 9.1%.     

Inorganic light‐emitting diode displays using micro‐transfer printing

Large quantities of microscopic red, green, and blue light‐emitting diodes (LEDs) made of crystalline inorganic semiconductor materials micro‐transfer printed in large quantities onto rigid or flexible substrates form monochrome and color displays having a wide range of sizes and interesting properties. Transfer‐printed micro‐LED displays promise excellent environmental robustness, brightness, spatial resolution, and efficiency. Passive‐matrix and active‐matrix inorganic LED displays were constructed, operated, and their attributes measured. Tests demonstrate that inorganic micro‐LED displays have outstanding color, viewing angle, and transparency. Yield improvement techniques include redundancy, physical repair, and electronic correction. Micro‐transfer printing enables revolutionary manufacturing strategies in which microscale LEDs are first assembled into miniaturized micro‐system “light engines,” and then micro‐transfer printed and interconnected directly to metallized large‐format panels. This paper reviews micro‐transfer printing technology for micro‐LED displays.     

Modeling of threshold‐voltage‐shift dependency on drain bias in amorphous‐silicon thin‐film transistors in active‐matrix organic light‐emitting‐diode displays

Abstract— A theoretical model to interpret appearances of the threshold voltage shift in hydrogenated amorphous‐silicon (a‐Si:H) thin‐film transistors (TFTs) is developed to better understand the instability of a‐Si:H TFTs for the driving transistors in active‐matrix organic light‐emitting‐diode (AMOLED) displays. This model assumes that the defect creation at channel in a‐Si:H is proportional to the carrier concentration, leading to the defect density varying along the channel depending on the bias conditions. The model interprets a threshold‐voltage‐shift dependency on the drain‐stress bias. The model predicts the threshold voltage shift stressed under a given gate bias applying the drain saturation voltage is 66% of that with zero drain bias, and it even goes down to 50–60% of that when stressed by applying twice the drain saturation voltage.     

Active‐matrix organic light‐emitting diode displays with indium gallium zinc oxide thin‐film transistors and normal,inverted, and transparent organic light‐emitting diodes

Abstract— Active‐matrix organic light‐emitting diode (AMOLED) displays have gained wide attention and are expected to dominate the flat‐panel‐display industry in the near future. However, organic light‐emitting devices have stringent demands on the driving transistors due to their current‐driving characteristics. In recent years, the oxide‐semiconductor‐based thin‐film transistors (oxide TFTs) have also been widely investigated due to their various benefits. In this paper, the development and performance of oxide TFTs will be discussed. Specifically, effects of back‐channel interface conditions on these devices will be investigated. The performance and bias stress stability of the oxide TFTs were improved by inserting a SiO^x protection layer and an N²O plasma treatment on the back‐channel interface. On the other hand, considering the n‐type nature of oxide TFTs, 2.4‐in. AMOLED displays with oxide TFTs and both normal and inverted OLEDs were developed and their reliability was studied. Results of the checkerboard stimuli tests show that the inverted OLEDs indeed have some advantages due to their suitable driving schemes. In addition, a novel 2.4‐in. transparent AMOLED display with a high transparency of 45% and high resolution of 166 ppi was also demonstrated using all the transparent or semi‐transparent materials, based on oxide‐TFT technologies.     

Multioutputs single‐stage gate driver on array with wide temperature operable thin‐film‐transistor liquid‐crystal display for high resolution application

A hydrogenated amorphous silicon (a‐Si:H) thin‐film transistor (TFT) gate driver with multioutputs (eight outputs per stage) for high reliability, 10.7‐inch automotive display has been proposed. The driver circuit is composed of one SR controller, eight driving TFTs (one stage to eight outputs) with bridging TFTs. The SR controller, which starts up the driving TFTs, could also prevent the noise of gate line for nonworking period. The bridging TFT, using width decreasing which connects between the SR controller and the driving TFT, could produce the floating state which is beneficial to couple the gate voltage, improves the driving ability of output, and reaches consistent rising time in high temperature and low temperature environment. Moreover, 8‐phase clocks with 75% overlapping and dual‐side driving scheme are also used in the circuit design to ensure enough charging time and reduce the loading of each gate line. According to lifetime test results, the proposed gate driver of 720 stages pass the extreme temperature range test (90°C and ?40°C) for simulation, and operates stably over 800 hours at 90°C for measurement. Besides, this design is successfully demonstrated in a 10.7‐inch full HD (1080 × RGB×1920) TFT‐liquid‐crystal display (LCD) panel.     

Uniformity and bias‐temperature instability of bottom‐gate zinc oxide thin‐film transistors (ZnO TFTs)

Abstract— Short‐range uniformity and bias‐temperature (BT) instability of ZnO TFTs with SiO^x/SiN^x stacked gate insulators which have different surface treatments have been investigated. The short‐range uniformity of ZnO TFTs was drastically improved by N²O plasma treatment of the gate insulator. The variation in the gate voltage where a drain current of 1‐nA flows (Vgs at an Ids of 1 nA) was dramatically reduced from ±1.73 V to ±0.07 V by N²O plasma treatment of the gate insulator. It was clarified that the variations in the subthreshold characteristics of the ZnO TFTs could be reduced by N²O plasma treatment of the gate insulator due to a decrease in the variation of trap densities in deep energy levels from 0.9–2.0 × 10¹⁷ to 1.2–1.3×10¹⁷ cm^?3‐eV^?1. From the BT stress tests, a positive shift of Vgs at an Ids of 1 nA could be reduced by N²O plasma treatment of the gate insulator due to a decrease in the charge traps in the gate insulator. When the gate‐bias stress increases, state creation occured in the ZnO TFTs in addition to the charge trapping in the gate insulator. However, N²O plasma treatment of the gate insulator has little effect on the suppression of the state creation in ZnO TFTs under BT stress. The surface treatment of the gate insulator strongly affects the short‐range uniformity and the BT instability of Vth in the ZnO TFTs.     

Vt Compensated voltage‐data a‐Si TFT AMOLED pixel circuits

Abstract— Active‐matrix organic light‐emitting‐diode (AMOLED) displays are now entering the marketplace. The use of a thin‐film‐transistor (TFT) active matrix allows OLED displays to be larger in size, higher in resolutions and lower in power dissipation than is possible using a conventional passive matrix. A number of TFT active‐matrix pixel circuits have been developed for luminance control, while correcting for initial and electrically stressed TFT parameter variations. Previous circuits and driving methods are reviewed. A new driving method is presented in which the threshold‐voltage (V_t) compensation performance, along with various circuit improvements for amorphous‐silicon (a‐Si) TFT pixel circuits using voltage data, are discussed. This new driving method along with various circuit improvements is demonstrated in a state‐of‐the‐art 20‐in. a‐Si TFT AMOLED HDTV.     

a‐InGaZnO thin‐film transistors for AMOLEDs: Electrical stability and pixel‐circuit simulation

Abstract— Inverted‐staggered amorphous In‐Ga‐Zn‐O (a‐InGaZnO) thin‐film transistors (TFTs) were fabricated and characterized on glass substrates. The a‐InGaZnO TFTs exhibit adequate field‐effect mobilities, sharp subthreshold slopes, and very low off‐currents. The current temperature stress (CTS) on the a‐InGaZnO TFTs was performed, and the effect of stress temperature (TSTR), stress current (ISTR), and TFT biasing condition on their electrical stability was investigated. Finally, SPICE modelling for a‐InGaZnO TFTs was developed based on experimental data. Several active‐matrix organic light‐emitting‐display (AMOLED) pixel circuits were simulated, and the potential advantages of using a‐InGaZnO TFTs were discussed.     

Novel top‐gate zinc oxide thin‐film transistors (ZnO TFTs) for AMLCDs

Abstract— High‐performance top‐gate thin‐film transistors (TFTs) with a transparent zinc oxide (ZnO) channel have been developed. ZnO thin films used as active channels were deposited by rf magnetron sputtering. The electrical properties and thermal stability of the ZnO films are controlled by the deposition conditions. A gate insulator made of silicon nitride (SiN_x) was deposited on the ZnO films by conventional P‐CVD. A novel ZnO‐TFT process based on photolithography is proposed for AMLCDs. AMLCDs having an aperture ratio and pixel density comparable to those of a‐Si:H TFT‐LCDs are driven by ZnO TFTs using the same driving scheme of conventional AMLCDs.     

Characteristics and stability of improved re‐crystallized metal‐induced laterally crystallized polycrystalline‐silicon thin‐film transistors for display applications

Abstract— The performance of high‐temperature re‐crystallized (RC) metal‐induced laterally crystallized (MILC) polycrystalline‐silicon (poly‐Si) thin‐film transistors (TFT) have been improved by (1) patterning the active islands before MILC, (2) removing nickel‐containing residues using acid cleaning, (3) using heavily boron‐doped poly‐Si gates to achieve threshold voltage symmetry, and (4) double‐implanting n‐type source/drain junctions. A 30‐MHz driver circuit based on this improved technology was demonstrated. The reliability of optimized RC‐MILC poly‐Si TFTs has not been adversely affected by residual nickel‐containing contaminants in the TFT channel regions.     

Solution‐processed oxide thin‐film transistors using aluminum and nitrate precursors for low‐temperature annealing

Abstract— In this article, a solution process for oxide thin‐film transistors (TFTs) at low‐temperature annealing was investigated. Solution‐process engineering, including materials and precursors, plays an important role in oxide thin‐film deposition on large glass and flexible substrates at low temperature. Reactive material could reduce the alloy reaction temperature for a multicomponent oxide system. A volatile precursor could also reduce annealing temperature in the formation of metal‐oxide thin films. A solution process with reactive Al and a volatile nitrate precursor can demonstrates competitive oxide TFTs at 350°C.     

Solution‐processed oxide semiconductors for low‐cost and high‐performance thin‐film transistors and fabrication of organic light‐emitting‐diode displays

Abstract— High‐performance solution‐processed oxide‐semiconductor (OS) thin‐film transistors (TFTs) and their application to a TFT backplane for active‐matrix organic light‐emitting‐diode (AMOLED) displays are reported. For this work, bottom‐gated TFTs having spin‐coated amorphous In‐Zn‐O (IZO) active layers formed at 450°C have been fabricated. A mobility (μ) as high as 5.0 cm²/V‐sec, ?0.5 V of threshold voltage (VT), 0.7 V/dec of subthreshold swing (SS), and 6.9 × 10⁸ of on‐off current ratio were obtained by using an etch‐stopper (ES) structure TFT. TFTs exhibited uniform characteristics within 150 × 150‐mm² substrates. Based on these results, a 2.2‐in. AMOLED display driven by spin‐coated IZO TFTs have also been fabricated. In order to investigate operation instability, a negative‐bias‐temperature‐stress (NBTS) test was carried out at 60°C in ambient air. The IZO‐TFT showed ?2.5 V of threshold‐voltage shift (ΔVT) after 10,800 sec of stress time, comparable with the level (ΔVT = ?1.96 V) of conventional vacuum‐deposited a‐Si TFTs. Also, other issues regarding solution‐processed OS technology, including the instability, lowering process temperature, and printable devices are discussed.     

A design method for flicker‐free liquid crystal display panels based on indium‐gallium‐zinc‐oxide thin‐film transistors

This paper proposes a design method to reduce the flicker of liquid crystal display panels based on indium‐gallium‐zinc‐oxide (IGZO) thin‐film transistors (TFTs). The proposed design method employs a human factor model to convert the flicker measured at low frame frequency (F _FRAME) to a modification value of the measured flicker (MVMF ) having a frequency sensitivity of flicker, which can distinguish between no blinking and weak blinking. To investigate the causes and characteristics of flicker, the frequency component and increase factor of flicker are analyzed using the checkerboard and solid images. The increase factor in flicker is examined using IGZO TFTs with different antenna ratios (AR s) that cause the variation in threshold voltage of IGZO TFT. To verify the proposed design method, two test panels are implemented with asymmetric and symmetric AR s. The MVMF s of the 15 Hz component at a low F _FRAME of 30 Hz show that the solid image with a symmetric AR has an MVMF of ?62.9 dB, which is improved by 24.3 dB compared to that with an asymmetric AR . Therefore, the proposed method is applicable for a flicker‐free liquid crystal display panels at a low F _FRAME.     

Simple pixel circuits for high resolution and high image quality organic light emitting diode‐on‐silicon microdisplays with wide data voltage range

Two simple pixel circuits are proposed for high resolution and high image quality organic light‐emitting diode‐on‐silicon microdisplays. The proposed pixel circuits achieve high resolution due to simple pixel structure comprising three n‐type MOSFETs and one storage capacitor, which are integrated into a unit subpixel area of 3 × 9 µm² using a 90 nm CMOS process. The proposed pixel circuits improve image quality by compensating for the threshold voltage variation of the driving transistors and extending the data voltage range. To verify the performance of the proposed pixel circuits, the emission currents of 24 pixel circuits are measured. The measured emission current deviation error of the proposed pixel circuits A and B ranges from ?2.59% to +2.78%, and from ?1.86% to +1.84%, respectively, which are improved from the emission current deviation error of the conventional current‐source type pixel circuit when the threshold voltage variation is not compensated for, which ranges from ?14.87% to +14.67%. In addition, the data voltage ranges of the proposed pixel circuits A and B are 1.193 V and 1.792 V, respectively, which are 2.38 and 3.57 times wider than the data voltage range of the conventional current‐source type pixel circuit of 0.501 V.     

Performance of high‐efficiency AMOLED displays

Abstract— In this paper, the performance of active‐matrix‐driven small‐molecule OLED displays incorporating high‐efficiency electrophosphorescent dopants were analyzed. These enable triplet excitons to contribute to light emission and have led to pixel efficiencies of over 40 lm/W. By considering a conventional two TFT per pixel addressing scheme, we show how this OLED design enables the fabrication of very‐low‐power‐consumption displays (lower than AMLCDs). We simulate display performance and perform a trade‐off analysis comparing the power consumption of displays driven by both amorphous‐silicon and low‐temperature poly‐Si TFTs.     

An averaging pixel structure using microcrystalline‐silicon films prepared at high temperature for AMOLED displays

Abstract— A new voltage‐addressed pixel using a multiple drive distribution has been developed to improve, in a simple way, the brightness uniformity of active‐matrix organic light‐emitting‐diode (AMOLED) displays. Moreover, circuits were realized using microcrystalline‐silicon (μc‐Si) films prepared at 600°C using a standard low‐pressure CVD system. The developed p‐channel TFTs exhibit a field‐effect mobility close to 6 cm²/V‐sec. The experimental results show that the proposed spatial distribution of driving TFTs improves the uniformity of current levels, in contrast to the conventional two‐TFT pixel structure. Backplane performances have been compared using circuits based on μc‐Si and furnace‐annealed polysilicon materials. Finally, this technology has been used to make an AMOLED demonstration unit using a top‐emission OLED structure. Thus, by combining both an μc‐Si active‐layer and a current‐averaging driver, an unsophisticated solution is provided to solve the inter‐pixel non‐uniformity issue.     

Back‐channel‐etched thin‐film transistor using c‐axis‐aligned crystal In–Ga–Zn oxide

Our crystalline In–Ga–Zn oxide (IGZO) thin film has a c‐axis‐aligned crystal (CAAC) structure and maintains crystallinity even on an amorphous base layer. Although the crystal has c‐axis alignment, its a‐axis and b‐axis have random arrangement; moreover, a clear grain boundary is not observed. We fabricated a back‐channel‐etched thin‐film transistor (TFT) using the CAAC‐IGZO film. Using the CAAC‐IGZO film, more stable TFT characteristics, even with a short channel length, can be obtained, and the instability of the back channel, which is one of the biggest problems of IGZO TFTs, is solved. As a result, we improved the process of manufacturing back‐channel‐etched TFTs.     

Development of flexible displays using back‐channel‐etched In–Sn–Zn–O thin‐film transistors and air‐stable inverted organic light‐emitting diodes

We developed flexible displays using back‐channel‐etched In–Sn–Zn–O (ITZO) thin‐film transistors (TFTs) and air‐stable inverted organic light‐emitting diodes (iOLEDs). The TFTs fabricated on a polyimide film exhibited high mobility (32.9 cm²/Vs) and stability by utilization of a solution‐processed organic passivation layer. ITZO was also used as an electron injection layer (EIL) in the iOLEDs instead of conventional air‐sensitive materials. The iOLED with ITZO as an EIL exhibited higher efficiency and a lower driving voltage than that of conventional iOLEDs. Our approach of the simultaneous formation of ITZO film as both of a channel layer in TFTs and of an EIL in iOLEDs offers simple fabrication process.     

Flexible active‐matrix OLED displays: Challenges and progress

Abstract— Organic light‐emitting‐device (OLED) devices are very promising candidates for flexible‐display applications because of their organic thin‐film configuration and excellent optical and video performance. Recent progress of flexible‐OLED technologies for high‐performance full‐color active‐matrix OLED (AMOLED) displays will be presented and future challenges will be discussed. Specific focus is placed on technology components, including high‐efficiency phosphorescent OLED technology, substrates and backplanes for flexible displays, transparent compound cathode technology, conformal packaging, and the flexibility testing of these devices. Finally, the latest prototype in collaboration with LG. Phillips LCD, a flexible 4‐in. QVGA full‐color AMOLED built on amorphous‐silicon backplane, will be described.