PECVD生长nc—Si：H膜的沉积机理分析

ｎｃ－Ｓｉ：Ｈ膜具有显著不同α－Ｓｉ：Ｈ与μｃ－Ｓｉ：Ｈ膜的新颖结构与物性。从热力学反应的基元过程出发，定性地分析了本征ｎｃ－Ｓｉ：Ｈ与掺磷ｎｃ－Ｓｉ（Ｐ）：Ｈ膜的沉积机理，并提出了进一步改善膜层质量的新途径。     

液晶光阀阻光层研究

本文研究了阻光层在液晶光阀中的作用，报导了我们首先提出的ｎｃ－Ｓｉ：Ｈ作为液晶光阀阻光层。ａ－Ｓｉ：Ｈ光导层和ｎｃ－Ｓｉ：Ｈ阻光层通过辉光放电等离子体化学气相沉积法连续制得。本文研究了不同沉积条件下ｎｃ－Ｓｉ：Ｈ薄膜结构和光电性质。ａ－Ｓｉ：Ｈ和随这沉积的ｎｃ－Ｓｉ：Ｈ形成了ａ－Ｓｉ：Ｈ／ｎｃ－Ｓｉ：Ｈ异质结。采用ａ－Ｓｉ：Ｈ／ｎｃ－Ｓｉ：Ｈ异质结构液昌光阀可改进器件的许多性能。     

氮对纳米硅氮薄膜品化的影响

在电容式耦合等离子体化学气相沉积系统中，用高氢稀释硅烷和氮气为反应气氛制备纳米硅氮（ｎｃ－ＳｉＮｘ：Ｈ）薄膜结果表明：当Ｎ＿２／ＳｉＨ＿４气体流量比（Ｘｎ）从１增加为４时，薄膜的晶态年从５８％降至１４％，晶粒尺寸从１０ｎｍ降至５ｕｍ，Ｎ／Ｓｉ含量比从０．０３增至０．１２．当Ｘｎ≥５，则生成非晶硅氮（ａ－ＳｉＮｘ：Ｈ）薄膜．当Ｘｎ从１增加为１０时，薄膜暗电导率从１０￣（－５）（Ωｃｍ）￣（－１）降至１０￣（－１１）（Ωｃｍ）￣（－１），具有逾渗行为，这与薄膜的晶态率紧密相关．     

氮对纳米硅氮薄膜晶化的影响

在电容式耦合等离子体化学气相沉积系统中，用高氢稀释硅烷和氮气为反应气氛制备纳米硅氮（ｎｃ－ＳｉＮｘ２Ｈ）薄膜，结果表明，当Ｎ２／ＳｉＨ４气体流量比（Ｘｎ）从Ｉ增加为４时，薄膜的晶态率从５８％降至１４％，晶粒尺寸从１０ｎｍ降至５ｎｍ，Ｎ／Ｓｉ含量比从０．０３增至０．１２，当Ｘｎ≥５，则生成非晶硅氮（ａ－ＳｉｕＮｘ２Ｈ）薄膜，当Ｘｎ从１增加为１０时，薄膜暗电导率从１０＾－５（Ωｃｍ）＾－１降至１０＾－     

高氢稀释硅烷加乙烯法制备纳米硅碳薄膜

在等离子体化学气相沉积系统（ＰＥＣＶＤ）中，使用高氢稀释硅烷（ＳｉＨ４）加乙烯（Ｃ２Ｈ４）为反应气氛制备了纳米硅碳（ｎｃ－ＳｉＣｘ＾２Ｈ）薄膜，随着（Ｃ２Ｈ４＋ＳｉＨ４）／Ｈ２（Ｘｇ）从５％时，由于Ｈ蚀刻效应的减弱，薄膜的晶态率从４８％下降到８％，平均晶粒尺寸在３．５－１０ｎｍ。当Ｘｇ≥６％时，生成薄膜为非晶硅碳（ａ－ＳｉＣｘ＾２Ｈ）薄膜。ｎｃ－ＳｉＣｘ＾２Ｈ薄膜的电学性质具有与薄膜的晶态率紧密相     

a—Si：H薄膜结构对晶硅薄膜性能的影响

用ａ－Ｓｉ：Ｈ薄膜经退火晶化成的多晶硅薄膜,其晶化温度、晶粒尺寸的电性能薄膜的初始结构有密切关系,而ａ－Ｓｉ：Ｈ薄膜的切初结构依赖于沉积条件,用ＰＣＶＤ方法高速沉积的ａ－Ｓｉ：Ｈ薄膜,经５５０℃的低温退火,可以制备平均晶粒尺寸为几面ｎｍ,最大晶粒尺寸为２μｍ,电导率为１．６２（Ω．ｃｍ）＾－１的优质多晶硅薄膜。     

非晶硅碳合金(a-SiCx:H)薄膜的进展

从制备方法,结构特征和光电性能等各方面介绍了氢化非晶硅碳合金（ａ－ＳｉＣｘ：Ｈ）薄膜这种重要的半导体材料,对其发展现状及前景进行了综述。并对近年来出现的纳米硅碳（ｎｃ－ＳｉＣｘ：Ｈ）薄膜的发展状况作了专门评述。     

MSnO3和MSn0.5Zr0.5O3（M=Sr,Ba）的水热合成

本文利用水热合成方法对ＭＳｎＯ３和ＭＳｎ０．５Ｚｒ０．５（Ｍ＝Ｓｒ，Ｂａ）的合成进行了研究，并采用ＸＲＤ、ＳＥ几ＩＣＰ等进行产物进行了表征，结果表明：在Ｍ（ＯＨ）２．ＳｎＯ２（呈ＳｎＯ２＋ＺｒＯ２）－ＫＯＨ体系中，当ＫＯＨ／Ｓｎ和ＫＯＨ（Ｓｎ＋Ｚｒ）≥３０时，２６０℃下晶化５－７天，可获得ＭＳｎＯ３和ＭＳｎ０．５Ｏ３纯相，在Ｍ（ＯＨ）３－（ＳｎＯ２＋ＺｒＯ３）－ＫＯＨ－Ｈ２Ｏ体系中，可通过控制介质     

单晶硅和纳米晶硅空带的NEXAFS理论研究

利用多重散射团簇方法计算了单晶硅的Ｋ边ＮＥＸＡＦＳ谱，研究显示ＮＥＸＡＦＳ谱包含了导带态密度的信息。同时在模拟ｃ－Ｓｉ的团簇引入一定数量的空位，构造了纳米晶硅的模型，ＭＳＣ计算证实吸收边位置上升约０．５ｅＶ，说明纳米晶硅的禁带比ｃ－Ｓｉ的展宽了。     

MSnO_3和MSn_（0．5）Zr_（0．5）O_3（M＝Sr，Ba）的水热合

本文利用水热合成方法对ＭＳｎＯ３和ＭＳｎ（０．５）Ｚｒ（０．５）Ｏ３（Ｍ＝Ｓｒ，Ｂａ）的合成进行了研究，并采用ＸＲＤ、ＳＥＭ和ＩＣＰ等方法对产物进行了表征，结果表明：在Ｍ（ＯＨ）２－ＳｎＯ２（或ＳｎＯ２＋ＺｒＯ２）－ＫＯＨ体系中，当ＫＯＨ／Ｓｎ和ＫＯＨ／（Ｓｎ＋Ｚｒ）≥３０时，２６０℃下晶化５～７天，可获得ＭＳｎＯ３和ＭＳｎ（０．５）Ｚｒ（０．５）Ｏ３纯相，在Ｍ（ＯＨ）２－（ＳｎＯ２＋ＺｒＯ２）－ＫＯＨ－Ｈ２Ｏ体系中，可通过控制介质碱度来获得ＭＳｎＯ３＋ＭＺｒＯ３混合物和ＭＳｎ（０．５）Ｚｒ（０．５）Ｏ３，并根据合成规律初步探讨了反应过程．     

纳米Si薄膜的结构及压阻效应

使用ＨＲＥＭ及ＳＴＭ技术检测了纳米Ｓｉ薄膜的微结构，纳米Ｓｉ薄膜由大量的细微Ｓｉ晶粒以及大量的晶粒间界面区组成，这一特殊的结构造成纳米Ｓｉ薄膜具有较大的压阻效应及较高氢含量，本文分析讨论了薄膜微结构对其压阻效应的作用，并认为纳米Ｓｉ薄膜材料将是一种理想的传感器材料。     

纳米硅薄膜制备技术进展

本文综述了纳米硅薄膜制备新技术的进展。着重介绍了高氢稀释硅烷蚀刻法，微波氢基团增强化学气相沉积，逐层法和高频数值等离子体化学气相沉积技术制备纳米硅薄膜的沉积过程和生长机制．本文指出氢基团为各项新技术发展的关键并将在今后纳米硅薄膜制备技术发展中起重要作用。     

Preferred growth of nanocrystalline silicon in boron-doped nc-Si:H Films

Preferred growth of nanocrystalline silicon (nc-Si) was first found in boron-doped hydrogenated nanocrystalline (nc-Si:H) films prepared using plasma-enhanced chemical vapor deposition system. The films were characterized by high-resolution transmission electron microscope, X-ray diffraction (XRD) spectrum and Raman Scattering spectrum. The results showed that the diffraction peaks in XRD spectrum were at 2θ≈47° and the exponent of crystalline plane of nc-Si in the film was (2 2 0). A considerable reason was electric field derived from dc bias made the bonds of Si-Si array according to a certain orient. The size and crystalline volume fraction of nc-Si in boron-doped films were intensively depended on the deposited parameters: diborane (B₂H₆) doping ratio in silane (SiH₄), silane dilution ratio in hydrogen (H₂), rf power density, substrate's temperature and reactive pressure, respectively. But preferred growth of nc-Si in the boron-doped nc-Si:H films cannot be obtained by changing these parameters.     

Nc-Si:H薄膜器件的研究

介绍了氢化纳米硅(nc-Si:H)薄膜在电子学器件和光电转换器件(如隧道二极管、异质结二极管、变容二极管、单电子晶体管、太阳能电池、发光二极管)等方面的研究进展,分析了这些器件的性能与nc-Si:H薄膜结构之间的关系,阐述了新型器件的优点.     

Conductivity Properties of Phosphorus-doped Hydrogenated Nanocrystalline Silicon Film

1-IntroductionInordert0applythehydr0genatednan0crys-tallineSifilm(nc-Si:H)t0futureelectricaldevices,itisnecessarytofurtherimproveitselectricproperties.Accordingt0aSi:Hdopingtechnique,thedepositionofnc-Si:P:Hfilmwasstudiedandprimaryresults0fconductivityarerep0rted.2.ExperimentalAfterexperiments,followingparameterswerechosent0dep0sitnc-Si:P:Hfilms.Thegaseousphosphorus-dopingc0ncentrati0n(PH3/SiH4)is10-`~1;dilutionratio0fsaline(SiH4/H2)is0.1%~1%,substratetemperatureisfrom15O"Cto250"C.Th…     

Highly reflective nc-Si:H/a-CNx:H multilayer films prepared by r.f. PECVD technique

Multilayer thin films consisting of a-CN_x:H/nc-Si:H layers prepared by radio-frequency plasma enhanced chemical vapour (r.f. PECVD) deposition technique were studied. High optical reflectivity at a specific wavelength is one of major concern for its application. By using this technique, a-CN_x:H/nc-Si:H multilayered thin films (3-11 periods) were deposited on substrates of p-type (111) crystal silicon and quartz. These films were characterized using ultra-violet-visible-near infrared (UV-Vis-NIR) spectroscopy, Fourier transform infrared (FTIR) spectroscopy, field effect scanning electron microscopy (FESEM) and AUGER electron spectroscopy (AES). The multilayered films show high reflectivity and wide stop band width at a wavelength of approximately 650 ± 60 nm. The FTIR spectrum of this multilayered structure showed the formation of Si-H and Si-H₂ bonds in the nc-Si:H layer and CC and N-H bonds in a-CN_x:H layer. SEM image and AES reveal distinct formation of a-CN_x:H and nc-Si:H layers in the cross section image with a decrease in interlayer cross contamination with increasing number of periods.     

双纳米硅p层优化非晶硅太阳能电池

采用等离子体增强化学气相沉积(Plasma Enhanced Chemical Vapor Deposition,PECVD)技术在高功率密度、高反应气压和低衬底温度下制备出不同氢稀释比RH的硅薄膜.高分辨透射电镜(High-Resolution Transmission Electron Microscopy,HRT...     

Effects of hydrogen atmosphere on pulsed-DC sputtered nanocrystalline Si:H films

Hydrogenated nanocrystalline silicon (nc-Si:H) films were prepared by a pulsed-DC magnetron sputtering method under an atmosphere of hydrogen/argon mixture. The effects of hydrogen concentration on the structural and electrical properties of the films were systematically investigated using grazing incidence X-ray diffraction (GIXRD), Raman spectroscopy, and conductivity measurement. A threshold hydrogen concentration of about 70% was found necessary before any crystallinity was detectable. The deposition rate decreased monotonically with increasing hydrogen concentration, while the conductivity varied with crystallite size. The abnormally low conductivity level of these nc-Si:H films was due to the extraordinarily high defect density, which was attributed both to the enhanced ion bombardment from the pulsed-DC plasma and to the oxygen contamination from the target.     

Role of argon in hot wire chemical vapor deposition of hydrogenated nanocrystalline silicon thin films

Structural, optical and electrical properties of hydrogenated nanocrystalline silicon (nc-Si:H) films, deposited from silane (SiH₄) and argon (Ar) gas mixture without hydrogen by hot wire chemical vapor deposition (HW-CVD) method were investigated. Film properties are carefully and systematically studied as a function of argon dilution of silane (R_Ar). We observed that the deposition rate is much higher (4-23 Å/s) compared to conventional plasma enhanced chemical vapor deposited nc-Si:H films using Ar dilution of silane (0.5-0.83 Å/s). Characterization of these films with Raman spectroscopy revealed that Ar dilution of silane in HW-CVD endorses the growth of crystallinity and structural order in the nc-Si:H films. The Fourier transform infrared spectroscopic analysis showed that with increasing Ar dilution, the hydrogen bonding in the films shifts from di-hydrogen (Si-H₂) and (Si-H₂)_n complexes to mono-hydrogen (Si-H) bounded species. The hydrogen content in the films increases with increasing Ar dilution and was found to be < 4 at.% over the entire range of Ar dilutions of silane studied. However, the band gap shows decreasing trend with increase in Ar dilution of silane and it has been attributed to the decrease in the percentage of the amorphous phase in the film. The microstructure parameter was found to be > 0.4 for the films deposited at low Ar dilution of silane and ~ 0.1 or even less for the films deposited at higher Ar dilution, suggesting that there is an enhancement of structural order and homogeneity in the film. From the present study it has been concluded that the Ar dilution of silane is a key process parameter to induce the crystallinity and to improve the structural ordering in the nc-Si:H films deposited by the HW-CVD method.     

Plasma enhanced chemical vapor deposition of nanocrystalline silicon films from SiF4-H2-He at low temperature

A high degree of crystallinity is obtained in nc-Si:H films deposited by r.f. PECVD, produced from SiF₄-H₂-He mixtures. The amorphous-to-nanocrystalline transition is favored because of the presence of F atoms, which preferentially etch the amorphous phase. The addition of He to the SiF₄-H₂ gas mixture gives an increase of F and H atoms in the plasma, thus inducing higher crystallinity. A further improvement in the nc-Si:H film structure and properties is obtained by adjusting the r.f. power and the deposition temperature. Under optimized plasma conditions, substrate temperatures as low as 120°C can be reached for the deposition of nc-Si:H having 100% of crystallinity.