Contact resistance between pentacene and indium–tin oxide (ITO) electrode with surface treatment

Contact resistance between indium–tin oxide (ITO) electrode and pentacene was studied by transmission line method (TLM). Organic solvent cleaned, inorganic alkali cleaned, and self-assembled monolayer (with OTS: octadecyltrichlorosilane) modified ITO electrode structures were compared. Pentacene layer of 300 Å thickness was vacuum deposited on patterned ITO layer at 70 °C with a deposition rate of 0.3 Å/s. Alkali cleaned and SAM modified ITO gave a lower contact resistance of about 6.34 × 10⁴ Ω cm² and 1.88 × 10³ Ω cm², respectively than organic solvent cleaned ITO of about 6.58 × 10⁵ Ω cm². Especially with the SAM treatment, the work function of ITO increased closer to the highest occupied molecular orbital (HOMO) level of pentacene, which lowers the injection barrier between ITO and pentacene. It was also believed that pentacene morphology was improved on SAM modified ITO surface due to the lowering of the surface energy. We could obtain the low contact resistance with SAM treatment which is comparable to the measured value of gold–pentacene contact, 1.86 × 10³ Ω cm². This specific contact resistance is still much higher than that of amorphous silicon thin film transistor (0.1–30 Ω cm²).     

铝电解电容器电极箔与引线间接触电阻的改进

铝电解电容器的内部电阻直接影响产品电性能,生产过程中必须降低并稳定电极箔与引线间的接触电阻。通过对铆接过程的分析和研究,提出改进铆接工艺的方法,即采用电极箔预冲孔的铆接工艺。实物测试表明,电极箔与引线间的接触电阻较工艺改进前降低8%～15%,其阻值离散度显著缩小,且后续制造工序及产品使用中的阻值也更稳定,有利于保证产品质量,延长产品寿命。     

Barrier effect of W-Ti interlayers in-Al ohmic contact systems

The barrier effect of W-Ti interlayers in Al ohmic contact systems is studied. An Al-Si/W-Ti/Si structure was continuously deposited by dc magnetron sputtering. Interfacial reaction was observed by a 1.5-MeV He⁺Rutherford backscattering spectrometry technique after tungsten-halogen lamp rapid thermal annealing was performed at 450-550°C. Reaction did not occur at temperatures below 480°C and at 500 °C for 20 s because the Al-Si interlayer provided a sufficient barrier. When annealing was performed at 550°C, however, interdiffusion took place at both interfaces. As a result, aluminum increasingly penetrated into the Si substrate. The contact resistance of W-Ti to n⁺Si in Al-Si/W-Ti/Si is held nearly constant at temperatures up to 480°C in furnace annealing. These results indicate that a sufficient barrier effect can be achieved in a W-Ti interlayer at temperatures below 480°C.     

ITO/HgInTe肖特基的光电特性

碲铟汞Hg3In2Te6是(In2Te3)x-(Hg3Te3)1-x(x=0.5)的化合物,被称为缺陷相化合物.在表面运用透明电极可以得到很高的量子效率.为了克服形成肖特基后漏电流过大的影响,运用等离子增强化学气相沉积在碲铟汞表面形成氧化层.运用直流平面磁控溅射技术和热电子蒸发技术分别在单晶HgInTe表面形成了ITO(SnO2 In2O3)/HgInTe和In/HgInTe接触,利用I-V测试仪对其I-V特性进行测量,运用能带结构和异质结理论对测量的,I-V结果进行了描述,测量结果符合热电子发射理论.结果表明:ITO/HgInTe形成具有整流特性的肖特基接触,通过计算得到了ITO/HglnTe的肖特基势垒高度为0.506 eV,理想因子n为3.2,串联电阻Rs为2 600 Ω;In/HgInTe形成欧姆接触.并且发现了在波长1.55 μm处有很好的响应光谱,同时室温下峰值探测率D*λ达到了1011cm·Hz1/2·W-1.     

Nitride-based LEDs with an SPS tunneling contact Layer and an ITO transparent contact

The indium-tin-oxide [ITO(80 nm)] and Ni(5 nm)-Au(10 nm) films were separately deposited on glass substrates, p-GaN layers, n/sup +/-InGaN-GaN short-period-superlattice (SPS) structures, and nitride-based light-emitting diodes (LEDs). It was found that ITO on n/sup +/-SPS structure could provide us an extremely high transparency (i.e., 93.2% at 465 nm) and also a reasonably small specific contact resistance of 1.6/spl times/10/sup -3//spl Omega//spl middot/cm/sup 2/. Although the forward voltage which corresponds to 20-mA operating current for LED with ITO on n/sup +/-SPS upper contact was slightly higher than that of the LED with Ni-Au on n/sup +/-SPS upper contact, a 30% higher output intensity could still be achieved by using ITO on n/sup +/-SPS upper contact. Moreover, the output power of packaged LED with ITO was about twice as large as that of the other conventional Ni-Au LEDs.     

Comparison of contact resistance between accumulation-mode and inversion-mode multigate FETs

The performances of accumulation-mode and inversion-mode multigate FETs are compared. The influence of gate underlap on the electrical properties is analyzed. Both simulation results and experimental data show that in a device with gate underlap, accumulation-mode devices have a higher current drive, lower source and drain resistance and less process variability than inversion-mode FETs.     

Measurement of contact resistance distribution using a 4k-contactsarray

A new test structure suitable for measuring a contact resistance distribution has been developed. It includes the following two components: a 256 row, 16 column (= 4096) four-terminal cross-contact array; and peripheral circuits, which consist of an eight-stage CMOS binary counter and 256-bit CMOS decoders. It was found that contact resistance can be fitted by a Gaussian distribution for more than three standard deviations of the mean value. The relationship between the contact size and the standard deviation of the contact resistance has been discussed for two types of contacts: Al/TiN/TiSi₂-n⁺Si, and WSi₂/poly-n⁺Si. This test structure can simultaneously measure the series resistance of a two-terminal contact chain and the individual contact resistance. By comparing the results of the two measurement modes, it was found that there are three kinds of contact resistance distribution in the chips which have high series resistance of the two-terminal contact chain     

Direct imaging of a high-power diode laser cavity using a transparent indium-tin-oxide (ITO) contact

We describe a novel "see-through" indium-tin-oxide contact on the n-side of a high power unstable resonator semiconductor laser (URSL) that allows direct observation of the cavity during high power operation. Under optimized annealing conditions this transparent ITO contact has a low enough specific contact resistivity to permit normal high power CW operation of the URSL and allows the observation of filamentation. This contact scheme is applicable to a wide range of semiconductor lasers and is especially appropriate for high power devices. The same structure can also be used to obtain a 2-D thermal map of the laser cavity.     

Performance characterization of InGaP Schottky contact with ITO transparent electrodes

We present the Schottky performance of transparent ITO on a wide bandgap InGaP semiconductor. For a transparent ITO Schottky electrode on InGaP, a transmittance of higher than 0.9, and a refractive index of 1.88 for a wavelength of 820 nm were obtained. We measured its associated resistivity as 1.94×10⁻³ Ω-cm after annealing at 300°C for 60 min under oxygen ambience. The effect of the thermal annealing temperature on the crystallization of ITO was examined by x-ray diffraction. As well an associated Schottky barrier height of 0.93 eV and an ideality factor of 1.07 were found using the Schottky diode configuration. The results indicate that ITO is a promising transparent Schottky material for electrooptical devices based on InGaP structures.     

The effects of the surface morphology of poly(3,4-ethylenedioxythiophene) electrodes on the growth of pentacene,and the electrical performance of the bottom contact pentacene transistor

An investigation is presented of the effect of the surface roughness of poly(3,4-ethylenedioxythiophene) (PEDOT) electrodes on the growth of pentacene and the electrical performance of PEDOT electrode bottom contact pentacene transistor. Smooth PEDOT films contained well-oriented and small sized pentacene islands whilst rough PEDOT films exhibited randomly oriented islands with non-uniformly sized islands. In addition, PEDOT electrodes provided morphological continuity at the electrode–channel interface, making the accumulation channel of the pentacene formed on the electrodes a main contributor to the contact resistance. Accordingly, the smooth PEDOT surface yielded the low contact resistance (5.7 kΩ cm), approximately half of that obtained with the rough surface.     

Specific contact resistance using a circular transmission line model

The measurement of the specific contact resistance of ohmic contacts to semiconductors can be made in a number of ways. One of the methods uses a transmission line model of an ohmic contact on a semiconductor and this paper describes the application of the transmission line model to a contact test pattern of circular symmetry. By using a circular test pattern, the mesa etch step necessary for the standard rectangular test pattern may be omitted, thus simplifying test pattern fabrication.     

ITO与Ni和n型GaAs非整流接触的研究

本文报道了氧化铟锡（ITO）分别与金属和半导体的接触电阻率。采用电子束蒸发的手段制备高质量ITO材料。薄膜电阻率为2.32×10-4 Ω?cm,可见光范围透射率为92.8%,禁带宽度为3.804 eV。采用圆点型传输线模型的方法,对ITO/金属和ITO/n型GaAs之间的接触电阻进行了分析。测得ITO与Ni之间最低接触电阻率为2.81×10-6 Ω?cm2 ,ITO与n型砷化镓之间的接触电阻低至7×10-5 Ω?cm2,这是目前所报道的最好的结果。根据以上结果,我们可以确定将ITO应用在GaAs基太阳电池中来提升器件的性能。     

Direct measurements of interfacial contact resistance, end contact resistance, and interfacial contact layer uniformity

A four-terminal microelectronic test structure and test method are described for electrically determining the degree of uniformity of the interfacial layer in metal-semiconductor contacts and for directly measuring the interfacial contact resistance. A two-dimensional resistor network model is used to obtain the relationship between the specific contact resistance and the measured interfacial contact resistance for contacts with a uniform interfacial layer. A new six-terminal test structure is used for the direct measurement of end contact resistance and the subsequent determination of front contact resistance. A methodology is described for reducing the effects of both contact-window mask misalignment and parasitic resistance associated with these measurements. Measurement results are given for 98.5-percent Al/1.5- percent Si and 100-percent Al contacts on n-type silicon.     

The effects of contact size and non-zero metal resistance on the determination of specific contact resistance

This paper presents theoretical and experimental results concerning two sources of error in the determination of specific contact resistance of ohmic contacts to semiconductor device structures that utilize circular test patterns with varying gap length. It is shown that the potential drop vs gap length data cannot be usually represented by a straight line and a non-zero metal overlay sheet resistance can significantly alter the effective contact resistance value.     

GaN-LED芯片上ITO膜侧蚀异常的改善

氧化锢锡(ITO)对可见光具有高透过率及高电导率,常当作透明电极被广泛应用于发光元件上.使用合金的热处理方式,探讨了ITO经热处理后对刻蚀的影响.用电子束蒸镀机在GaN外延片上蒸镀一层ITO膜,用wIn2O3>=0.95:0.05的ITO锭做靶材,然后把每个外延片切成两半,其中一半在氮气氛中合金,另一半不做合金,然后所有的半圆片去做光刻,最后刻蚀ITO,去胶测量图中圃形(电极直径)的尺寸并比较侧蚀量的大小,发现合金后刻蚀ITO比不合金直接刻蚀ITO要好.     

CTLM测量金属/半导体欧姆接触电阻率

系统地介绍了用圆形传输线模型（ Ｃ Ｔ Ｌ Ｍ） 测量金属／ 半导体欧姆接触电阻率的基本原理。以 Ａｌ／ Ｓｉ 接触为例研究了不同掺杂浓度和不同温度退火对接触特性和接触电阻率ρ Ｃ 的影响。测量得到 Ａｌ／ Ｓｉ 欧姆接触电阻率的最小值约为２ ．４ ×１０ － ５ Ω·ｃｍ ２ 。     

Relation between injection barrier and contact resistance in top-contact organic thin-film transistors

We theoretically investigate the carrier injection into top-contact bottom-gate organic thin film transistors. By means of a two-dimensional drift–diffusion model, we explicitly consider thermionic and tunneling injection in combination with subsequent carrier transport into the device. Based on numerical simulations with this model, we determine the contact resistance as a function of the nominal hole injection barrier height and temperature. Depending on the barrier height or the operating temperature, we find three distinct injection regimes. Our work reveals that in all three regimes self-regulating processes exist due to which the influx of current is adjusted according to the needs of the channel at the given point of operation.     

Effect of molybdenum electrode annealing on the interface properties between metal and pentacene

Contact resistance between molybdenum (Mo) electrode and pentacene was studied with transmission line method (TLM). The Mo electrodes were annealed at 200 °C, 400 °C, 600 °C and 800 °C for 1 h and pentacene layer of 300 Å thickness was vacuum deposited on patterned Mo to form Mo–pentacene contact. Current–voltage measurement for Mo–pentacene contact showed linear relationship and it was confirmed that ohmic contact was formed. XRD and AFM measurements showed that Mo could be crystallized at annealing temperatures above 600 °C. 800 °C annealed Mo showed larger grains and work function was increased from 4.60 eV to 4.80 eV due to the decrease in defect density. The contact resistance was reduced down to 11.2 MΩ cm from 37.8 MΩ cm of as-deposited Mo. Also the pentacene film deposited on annealed Mo was denser with better crystallinity. Bottom contact organic field-effect transistor made with 800 °C annealed Mo showed better performance than as deposited Mo.     

快速光退火对ITO薄膜结构和性能的改善

利用电子束蒸发技术在常温下制备ITO透明导电膜,在这种条件下很难得到性能良好的透明导电膜,试图通过研究快速光热退火下退火温度、退火时间对其性能的影响,致力于在低温退火工艺下改善薄膜性能.通过对退火后样品禁带宽度的计算得出随着退火温度或退火时间的增大,禁带宽度逐渐增大;对样品的微结构分析发现随着退火温度的提高或退火时间的延长,样品的微结构致密性提高,各晶向面间距和晶格常数逐渐趋于标准的晶体;但退火温度过高或退火时间过长反而不利于透明导电膜性能的提高,所以选取合适的退火温度和退火时闻是光退火下透光性和导电性都得到提升的关键.在200℃的退火温度下,退火12 min可实现样品的透光率在可见光范围内达到82%,电阻率ρ＝2.3×10-3Ω·cm.