Electrical parameters of a DC sputtered Mo/n-type 6H-SiC Schottky barrier diode

A Mo/n-type 6H-SiC/Ni Schottky barrier diode (SBD) was fabricated by sputtering Mo metal on n-type 6H-SiC semiconductor. Before the formation of Mo/n-type 6H-SiC SBD, an ohmic contact was formed by thermal evaporation of Ni on n-type 6H-SiC and annealing at 950 °C for 10 min. It was seen that the structure had excellent rectification. The electrical parameters were extracted using its current–voltage (I–V) and capacitance–voltage (C–V) measurements carried out at room temperature. Very high (1.10 eV) barrier height and 1.635 ideality factor values were reported for Mo/n-type 6H-SiC using ln I–V plot. The barrier height and series resistance values of the diode were also calculated as 1.413 eV and 69 Ω from Norde׳s functions, respectively. Furthermore, 1.938 eV barrier height value of Mo/n-type 6H-SiC SBD calculated from C–V measurements was larger than the one obtained from I–V data.     

Determination of the laterally homogeneous barrier height of palladium Schottky barrier diodes on n-Ge (1 1 1)

We have studied the experimental linear relationship between barrier heights and ideality factors for palladium (Pd) on bulk-grown (1 1 1) Sb-doped n-type germanium (Ge) metal-semiconductor structures with a doping density of about 2.5×10¹⁵ cm^?3. The Pd Schottky contacts were fabricated by vacuum resistive evaporation. The electrical analysis of the contacts was investigated by means of current–voltage (I–V) and capacitance–voltage (C–V) measurements at a temperature of 296 K. The effective barrier heights from I–V characteristics varied from 0.492 to 0.550 eV, the ideality factor n varied from 1.140 to 1.950, and from reverse bias capacitance–voltage (C^?2–V) characteristics the barrier height varied from 0.427 to 0.509 eV. The lateral homogenous barrier height value of 0.558 eV for the contacts was obtained from the linear relationship between experimental barrier heights and ideality factors. Furthermore the experimental barrier height distribution obtained from I–V and (C^?2?V) characteristics were fitted by Gaussian distribution function, and their mean values were found to be 0.529 and 0.463 eV, respectively.     

Current–voltage and capacitance–voltage characteristics of Al Schottky contacts to strained Si-on-insulator in the wide temperature range

The electrical characteristics of Al/strained Si-on-insulator (sSOI) Schottky diode have been investigated using current–voltage (I–V) and capacitance–voltage (C–V) measurements in the wide temperature range of 200–400 K in steps of 25 K. It was found that the barrier height (0.57–0.80 eV) calculated from the I–V characteristics increased and the ideality factor (1.97–1.28) decreased with increasing temperature. The barrier heights determined from the C–V measurements were higher than those extracted from the I–V measurements, associated with the formation of an inhomogeneous Schottky barrier at the interface. The series resistance estimated from the forward I–V characteristics using Cheung and Norde methods decreased with increasing temperature, implying its strong temperature dependence. The observed variation in barrier height and ideality factor could be attributed to the inhomogeneities in Schottky barrier, explained by assuming Gaussian distribution of barrier heights. The temperature-dependent I–V characteristics showed a double Gaussian distribution with mean barrier heights of 0.83 and 1.19 eV and standard deviations of 0.10 and 0.16 eV at 200–275 and 300–400 K, respectively. From the modified Richardson plot, the modified Richardson constant were calculated to be 21.8 and 29.4 A cm⁻² K⁻² at 200–275 and 300–400 K, respectively, which were comparable to the theoretical value for p-type sSOI (31.6 A cm⁻² K⁻²).     

Characteristics of RF reactive sputter-deposited Pt/SiO2/n-InGaN MOS Schottky diodes

All RF sputtering-deposited Pt/SiO₂/n-type indium gallium nitride (n-InGaN) metal–oxide–semiconductor (MOS) diodes were investigated before and after annealing at 400 °C. By scanning electron microscopy (SEM), the thickness of Pt, SiO_2, n-InGaN layer was measured to be ~250, 70, and 800 nm, respectively. AFM results also show that the grains become a little bigger after annealing, the surface topography of the as-deposited film was smoother with the rms roughness of 1.67 nm and had the slight increase of 1.92 nm for annealed sample. Electrical properties of MOS diodes have been determined by using the current–voltage (I–V) and capacitance–voltage (C–V) measurements. The results showed that Schottky barrier height (SBH) increased slightly to 0.69 eV (I–V) and 0.82 eV (C–V) after annealing at 400 °C for 15 min in N₂ ambient, compared to that of 0.67 eV (I–V) and 0.79 eV (C–V) for the as-deposited sample. There was the considerable improvement in the leakage current, dropped from 6.5×10⁻⁷ A for the as-deposited to 1.4×10⁻⁷ A for the 400 °C-annealed one. The annealed MOS Schottky diode had shown the higher SBH, lower leakage current, smaller ideality factor (n), and denser microstructure. In addition to the SBH, n, and series resistance (R_s) determined by Cheungs׳ and Norde methods, other parameters for MOS diodes tested at room temperature were also calculated by C–V measurement.     

Effect of the work function of gate electrode on hysteresis characteristics of organic thin-film transistors with Ta2O5/polymer as gate insulator

Organic thin-film transistors (OTFTs) using high dielectric constant material tantalum pentoxide (Ta₂O₅) and benzocyclobutenone (BCBO) derivatives as double-layer insulator were fabricated. Three metals with different work function, including Al (4.3 eV), Cr (4.5 eV) and Au (5.1 eV), were employed as gate electrodes to study the correlation between work function of gate metals and hysteresis characteristics of OTFTs. The devices with low work function metal Al or Cr as gate electrode exhibited high hysteresis (about 2.5 V threshold voltage shift). However, low hysteresis (about 0.7 V threshold voltage shift) OTFTs were attained based on high work function metal Au as gate electrode. The hysteresis characteristics were studied by the repetitive gate voltage sweep of OTFTs, and capacitance–voltage (C–V) and trap loss-voltage (G_p/ω?V) measurements of metal–insulator–semiconductor (MIS) devices. It is proved that the hysteresis characteristics of OTFTs are relative to the electron injection from gate metal to Ta₂O₅ insulator. The electron barrier height between gate metal and Ta₂O₅ is enhanced by using Au as gate electrode, and then the electron injection from gate metal to Ta₂O₅ is reduced. Finally, low hysteresis OTFTs were fabricated using Au as gate electrode.     

Electrical characterization of inorganic-on-organic diode based InP and poly(3,4-ethylenedioxithiophene)/poly(styrenesulfonate) (PEDOT:PSS)

The electronic properties of metal–organic semiconductor-inorganic semiconductor diode between InP and poly(3,4-ethylenedioxithiophene)/poly(styrenesulfonate) (PEDOT:PSS) polymeric organic semiconductor film have been investigated via current–voltage and capacitance–voltage methods. The Al/PEDOT:PSS/p-InP contact exhibits a rectification behavior with the barrier height value of 0.98 eV and with the ideality factor value of 2.6 obtained from their forward bias current voltage (I–V) characteristics at the room temperature greater than the conventional Al/p-InP (0.83 eV, n = 1.13). This increase in barrier height and ideality factor can be attributed to PEDOT:PSS film formed at Al/p-InP interface.     

Electrical properties of Au–Sb/p-GaSe:Gd Schottky barrier diode

Experimental results of the fabricated Schottky barrier diode on a GaSe:Gd substrate are presented. The electrical analysis of Au–Sb/p-GaSe:Gd structure has been investigated by means of current–voltage (I–V) and capacitance–voltage (C–V) measurements at 296 K temperature. The diode ideality factor and the barrier height have been obtained to be 1.07 and 0.85 eV, respectively, by applying a thermionic emission theory. At high currents in the forward direction, the series resistance effect has been observed. The series resistance has been determined from I–V measurements using Cheung's method.     

Correlation between energy level alignment and device performance in planar heterojunction organic photovoltaics

Information on the interfacial electronic structure in organic photovoltaics (OPVs) is essential for fully understanding features of device operation such as the photocurrent generation and relative energy band offsets at the donor/acceptor interface, which directly affect the open circuit voltage (V_oc). Kelvin probe (KP) measurements fully reveal the energy level alignment in a prototype OPV with a copper phthalocyanine (CuPc)/fullerene (C₆₀) planar heterojunction. Energy level pinning at the CuPc/C₆₀ junction fixes the energy band offsets of C₆₀. A downward energy shift of about 0.9 eV appears at the C₆₀/bathocuproine junction, which may act as a hole-blocking barrier. A combination of KP and current density–voltage measurements indicates that photocurrent generation depends strongly on the magnitude of the upward energy shift at the CuPc/C₆₀ junction. The dependence of V_oc on the substrate work function is also discussed in terms of the energy level alignment at indium tin oxide/CuPc/C₆₀ junctions.     

Electrical and photoelectrical characterization of an organic–inorganic heterojunction based on quinoline yellow dye

An organic–inorganic contact was fabricated by forming a thin film of quinoline yellow dye (QY) on a p-Si wafer and evaporating Al metal on the film. The current–voltage (I–V) and capacitance–voltage (C–V) measurements of Al/QY/p-Si heterostructure were applied in dark and room temperature to calculate the characteristic parameters of diode like ideality factor, barrier height and series resistance. Ideality factor and barrier height values were found as 1.23 and 0.87 eV from I–V data, respectively. The series resistance value of the device was determined as 1.8 kΩ by using modified Norde function. The C–V measurements were carried out at different frequencies and it was seen that capacitance value decreased with increasing frequency. Interface state density distribution was calculated by means of I–V measurement. In addition the optical absorption of thin QY film on glass was measured and optical band gap of the film was found as 2.73 eV. Furthermore, I–V measurements of Al/QY/p-Si/Al were taken under illumination between 40 and 100 mW/cm². It was observed that reverse bias current of the device increased with light intensity. Thus, the heterojunction had a strong response to the light and it can be suitable for electrical and optoelectronic applications like a photodiode.     

Efficient electron transport in 4,4′-bis[N-(1-napthyl)-N-phenyl-amino] biphenyl and the applications in white organic light emitting devices

The electron transport capability of 4,4′-bis[N-(1-napthyl)-N-phenyl-amino] biphenyl (α-NPD) was investigated by fundamental physical measurements named as current–voltage (I–V) electrical property evaluation and displacement current measurement (DCM). In electron-dominated devices, the I–V characteristics of α-NPD were similar as that of (8-hydroxyquinolino) aluminum (Alq₃) owing to their same order of electron mobilities. The interface of Al/LiF and α-NPD was proven to be an Ohmic contact through the evaluation of I–V characteristics at low bias regime (<3 V). And an electron injection barrier, 0.21 eV, at Al/LiF/α-NPD was obtained by extrapolating the temperature dependent I–V curves. The electron transport behavior in α-NPD film was further confirmed by DCM evaluations. Furthermore, an efficient white organic light emission device was successfully fabricated by using α-NPD as hole transport layer and electron transport layer, respectively.     

Electrical and photovoltaic properties of SnSe/Si heterojunction

Thin film of SnSe is deposited on n-Si single crystal to fabricate a p-SnSe/n-Si heterojunction photovoltaic cell. Electrical and photoelectrical properties have been studied by the current density–voltage (J–V) and capacitance–voltage (C–V) measurements at different temperatures. The fabricated cell exhibited rectifying characteristics with a rectification ratio of 131 at ±1 V. At low voltages (V<0.55 V), the dark forward current density is controlled by the multi-step tunneling mechanism. While at a relatively high voltage (V>0.55 V), a space charge-limited-conduction mechanism is observed with trap concentration of 2.3×10²¹ cm⁻³. The C–V measurements showed that the junction is of abrupt nature with built-in voltage of 0.62 V which decreases with temperature by a gradient of 2.83×10⁻³ V/K. The cell also exhibited strong photovoltaic characteristics with an open-circuit voltage of 425 mV, a short-circuit current density of 17.23 mA cm⁻² and a power conversion efficiency of 6.44%. These parameters have been estimated at room temperature and under light illumination provided by a halogen lamp with an input power density of 50 mW cm⁻².     

Compositional dependence of work function and Fermi level position of the HfNx/SiO2 system

In situ Kelvin Probe (KP) measurements performed on HfN_x showed an increase of the vacuum work function as a function of N content from a value of 3.9 eV (silicon conduction band edge) for pure Hf to a value of 5 eV (silicon valence band edge) for x ～ 2. In contrast, capacitance–voltage (C–V) measurements showed that the effective work function increased only until x < 1 and saturated around a value of 4.6 eV (silicon midgap). This behavior is attributed to Fermi level pinning, which is probably due to oxidation of the HfN_x during the reactive sputtering deposition step.     

Determination of contact parameters of Ni/n-GaP Schottky contacts

The electrical analysis of Ni/n-GaP structure has been investigated by means of current–voltage (I–V), capacitance–voltage (C–V) and capacitance–frequency (C–f) measurements in the temperature range of 120–320 K in dark conditions. The forward bias I–V characteristics have been analyzed on the basis of standard thermionic emission (TE) theory and the characteristic parameters of the Schottky contacts (SCs) such as Schottky barrier height (SBH), ideality factor (n) and series resistance (R_s) have been determined from the I–V measurements. The experimental values of SBH and n for the device ranged from 1.01 eV and 1.27 (at 320 K) to 0.38 eV and 5.93 (at 120 K) for Ni/n-GaP diode, respectively. The interface states in the semiconductor bandgap and their relaxation time have been determined from the C–f characteristics. The interface state density N_ss has ranged from 2.08 × 10¹⁵ (eV^?1 m^?2) at 120 K to 2.7 × 10¹⁵ (eV^?1 m^?2) at 320 K. C_ss has increased with increasing temperature. The relaxation time has ranged from 4.7 × 10^?7 s at 120 K to 5.15 × 10^?7 s at 320 K.     

Investigation of deep level defects in electron irradiated indium arsenide quantum dots embedded in a gallium arsenide matrix

Gallium arsenide diodes with and without indium arsenide quantum dots were electron irradiated to investigate radiation induced defects. Baseline and quantum dot gallium arsenide pn-junction diodes were characterized by capacitance–voltage measurements, and deep level transient spectroscopy. Carrier accumulation was observed in the gallium arsenide quantum dot sample at the designed depth for the quantum dots via capacitance–voltage measurements. Prior to irradiation, a defect 0.84 eV below the conduction band (E_C – 0.84 eV) was observed in the baseline sample which is consistent with the native EL2 defect seen in gallium arsenide. After 1 MeV electron irradiation three new defects were observed in the baseline sample, labeled as E3 (E_C – 0.25 eV), E4 (E_C – 0.55 eV), and E5 (E_C – 0.76 eV), consistent with literature reports of electron irradiated gallium arsenide. Prior to irradiation, the addition of quantum dots appeared to have introduced defect levels at E_C – 0.21, E_C – 0.38, and E_C – 0.75 eV denoted as QD–DX1, QD–DX2, and QD–EL2 respectively. In the quantum dot sample after 1 MeV electron irradiation, QD–E3 (E_C – 0.28 eV), QD–E4 (E_C – 0.49 eV), and QD–EL2 (E_C – 0.72 eV) defects, similar to the baseline sample, were observed, although the trap density was dissimilar to that of the baseline sample. The quantum dot sample showed a higher density of the QD–E4 defect and a lower density of QD–E3, while the QD–EL2 defect seemed to be unaffected by electron irradiation. These findings suggest that the quantum dot sample may be more radiation tolerant to the E3 defect as compared to the baseline sample.     

Source/drain metallization effects on the specific contact resistance of indium tin zinc oxide thin film transistors

We report on the specific contact resistance of interfaces between thin amorphous semiconductor Indium Tin Zinc Oxide (ITZO) channel layers and different source/drain (S/D) electrodes (Al, ITO, and Ni) in amorphous oxide thin film transistors (TFTs) at different channel lengths using a transmission line model. All the contacts showed linear current–voltage characteristics. The effects of different channel lengths (200–800 μm, step 200 μm) and the contact resistance on the performance of TFT devices are discussed in this work. The Al/ITZO TFT samples with the channel length of 200 μm showed metallic behavior with a linear drain current-gate voltage (I_D–V_G) curve due to the formation of a conducting channel layer. The specific contact resistance (ρ_C) at the source or drain contact decreases as the gate voltage is increased from 0 to 10 V. The devices fabricated with Ni S/D electrodes show the best TFT characteristics such as highest field effect mobility (16.09 cm²/V·s), ON/OFF current ratio (3.27×10⁶), lowest sub-threshold slope (0.10 V/dec) and specific contact resistance (8.62 Ω·cm² at V_G=0 V). This is found that the interfacial reaction between Al and a-ITZO semiconducting layer lead to the negative shift of threshold voltage. There is a trend that the specific contact resistance decreases with increasing the work function of S/D electrode. This result can be partially ascribed to better band alignment in the Ni/ITZO interface due to the work function of Ni (5.04–5.35 eV) and ITZO (5.00–6.10 eV) being somewhat similar.     

D–A copolymer with high ambipolar mobilities based on dithienothiophene and diketopyrrolopyrrole for polymer solar cells and organic field-effect transistors

Donor–acceptor (D–A) type conjugated polymers have been developed to absorb longer wavelength light in polymer solar cells (PSCs) and to achieve a high charge carrier mobility in organic field-effect transistors (OFETs). PDTDP, containing dithienothiophene (DTT) as the electron donor and diketopyrrolopyrrole (DPP) as the electron acceptor, was synthesized by stille polycondensation in order to achieve the advantages of D–A type conjugated polymers. The polymer showed optical band gaps of 1.44 and 1.42 eV in solution and in film, respectively, and a HOMO level of 5.09 eV. PDTDP and PC₇₁BM blends with 1,8-diiodooctane (DIO) exhibited improved performance in PSCs with a power conversion efficiency (PCE) of 4.45% under AM 1.5G irradiation. By investigating transmission electron microscopy (TEM), atomic force microscopy (AFM), and the light intensity dependence of J_SC and V_OC, we conclude that DIO acts as a processing additive that helps to form a nanoscale phase separation between donor and acceptor, resulting in an enhancement of μ_h and μ_e, which affects the J_SC, EQE, and PCE of PSCs. The charge carrier mobilities of PDTDP in OFETs were also investigated at various annealing temperatures and the polymer exhibited the highest hole and electron mobilities of 2.53 cm² V⁻¹ s⁻¹ at 250 °C and 0.36 cm² V⁻¹ s⁻¹ at 310 °C, respectively. XRD and AFM results demonstrated that the thermal annealing temperature had a critical effect on the changes in the crystallinity and morphology of the polymer. The low-voltage device was fabricated using high-k dielectric, P(VDF-TrFE) and P(VDF-TrFE-CTFE), and the carrier mobility of PDTDP was reached 0.1 cm² V⁻¹ s⁻¹ at V_d = −5 V. PDTDP complementary inverters were fabricated, and the high ambipolar characteristics of the polymer resulted in an output voltage gain of more than 25.     

Evaluation of lateral barrier height of inhomogeneous photolithography-fabricated Au/n-GaAs Schottky barrier diodes from 80 K to 320 K

In order to evaluate current conduction mechanism in the Au/n-GaAs Schottky barrier diode (SBD) some electrical parameters such as the zero-bias barrier height (BH) Φ_bo(I–V) and ideality factor (n) were obtained from the forward bias current–voltage (I–V) characteristics in wide temperature range of 80–320 K by steps of 10 K. By using the thermionic emission (TE) theory, the Φ_bo(I–V) and n were found to depend strongly on temperature, and the n decreases with increasing temperature while the Φ_bo(I–V) increases. The values of Φ_bo and n ranged from 0.600 eV and 1.51(80 K) to 0.816 eV and 1.087 (320 K), respectively. Such behavior of Φ_bo and n is attributed to Schottky barrier inhomogeneities by assuming a Gaussian distribution (GD) of BHs at Au/n-GaAs interface. In the calculations, the electrical parameters of the experimental forward bias I–V characteristics of the Au/n-GaAs SBD with the homogeneity in the 80–320 K range have been explained by means of the TE, considering GD of BH with linear bias dependence.     

Optical and electrical characterization of thin films based on anthracene polyether polymers

Two new anthracene derivatives were characterized to improve the optoelectronic properties of π-conjugated anthracene polymers. The optical properties of the polymers were investigated by UV-visible absorption and photoluminescence (PL) spectroscopy. The energy bandgaps of anthracene-based polyether thin films were in the range 2.8–2.97 eV. Green emission (504 nm) was observed for anthracene/bisphenol A (An-BPA) and green-yellow emission (563 nm) for anthracene/fluorinated bisphenol A. (An-BPAF) Organic diodes formed by sandwiching anthracene layers between indium–tin oxide (ITO) and aluminum contacts were characterized. The dc electrical properties of ITO/anthracene derivatives/Al diodes were studied using current–voltage measurements and showed ohmic behavior at low voltage. The conduction mechanism seems to be a space-charge-limited current with exponential trap distribution at high applied bias voltage. The ac electrical transport of the anthracene derivatives was studied as a function of frequency (100 Hz–10 MHz) and applied bias in impedance spectroscopy analyses. We interpreted Cole–Cole plots in terms of the equivalent circuit model as a single parallel resistance and a capacitance network in series with a relatively small resistance. The evolution of the electrical parameters deduced from fitting of the experimental data is discussed. The conduction mechanism revealed by I–V characteristics is in agreement with the impedance spectroscopy results.     

The influence of high energy electron irradiation on the Schottky barrier height and the Richardson constant of Ni/4H-SiC Schottky diodes

The influence of high energy electron (HEE) irradiation from a Sr-90 radio-nuclide on n-type Ni/4H–SiC samples of doping density 7.1×10¹⁵ cm⁻³ has been investigated over the temperature range 40–300 K. Current–voltage (I–V), capacitance–voltage (C–V) and deep level transient spectroscopy (DLTS) were used to characterize the devices before and after irradiation at a fluence of 6×10¹⁴ electrons-cm⁻². For both devices, the I–V characteristics were well described by thermionic emission (TE) in the temperature range 120–300 K, but deviated from TE theory at temperature below 120 K. The current flowing through the interface at a bias of 2.0 V from pure thermionic emission to thermionic field emission within the depletion region with the free carrier concentrations of the devices decreased from 7.8×10¹⁵ to 6.8×10¹⁵ cm⁻³ after HEE irradiation. The modified Richardson constants were determined from the Gaussian distribution of the barrier height across the contact and found to be 133 and 163 A cm⁻² K⁻² for as-deposited and irradiated diodes, respectively. Three new defects with energies 0.22, 0.40 and 0.71 eV appeared after HEE irradiation. Richardson constants were significantly less than the theoretical value which was ascribed to a small active device area.     

Investigation of deep level defects in copper irradiated bipolar junction transistor

Commercial bipolar junction transistor (2N 2219A, npn) irradiated with 150 MeV Cu¹¹⁺-ions with fluence of the order 10¹² ions cm^?2, is studied for radiation induced gain degradation and deep level defects. I–V measurements are made to study the gain degradation as a function of ion fluence. The properties such as activation energy, trap concentration and capture cross-section of deep levels are studied by deep level transient spectroscopy (DLTS). Minority carrier trap levels with energies ranging from E_C ? 0.164 eV to E_C ? 0.695 eV are observed in the base–collector junction of the transistor. Majority carrier trap levels are also observed with energies ranging from E_V + 0.203 eV to E_V + 0.526 eV. The irradiated transistor is subjected to isothermal and isochronal annealing. The defects are seen to anneal above 350 °C. The defects generated in the base region of the transistor by displacement damage appear to be responsible for transistor gain degradation.