Effect of oxygen partial pressure on electrical characteristics of amorphous indium gallium zinc oxide thin-film transistors fabricated by thermal annealing

We report the fabrication and electrical characteristics of high-performance amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) with a polymer gate dielectric prepared by spin coating on a glass substrate at different oxygen partial pressure values. The transmittance of the deposited polymer film was greater than 90% at 600 nm a-IGZO thin films were deposited on glass substrates using RF magnetron sputtering at different oxygen partial pressure values. The a-IGZO TFTs were prepared by rapid thermal annealing at 350 °C for 10 min at a 0.2% oxygen partial pressure. It was observed that a-IGZO TFTs with an active channel layer exhibited enhanced mode operation, a threshold voltage of 1 V, an on-off current ratio of 10³, and a field-effect mobility of 18 cm²/Vs.     

High-performance amorphous indium-gallium-zinc oxide thin-film transistors with polymer gate dielectric

The fabrication of amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistors (TFTs) with a spin-coated polymer gate dielectric on a glass substrate is reported. The interface state density at the poly(4-vinylphenol)/a-IGZO interface is only around 4.05 × 10¹¹ cm^− 2. The TFTs' threshold voltage, subthreshold swing, on-off current ratio, and carrier mobility are 2.6 V, 1.3 V/decade, 1 × 10⁵, and 21.8 cm²/V s, respectively. These characteristics indicate that the TFTs are suitable for use as nonvolatile memory devices and in flexible electronic applications.     

Transparent amorphous In-Ga-Zn-O thin film as function of various gas flows for TFT applications

The electrical and optical properties of amorphous indium gallium zinc oxide (a-IGZO) films, which can be used as a channel layer, deposited by radio frequency (rf) magnetron sputtering system at room temperature (RT), were investigated as function of various gas flows. The optical transmittance of films deposited under Ar, O₂ / Ar + O₂ and O₂ / Ar-4% H₂ + O₂ atmospheres in the visible wavelength was consistently above 90% at a wavelength of 550 nm at all gas flows, although the film deposited under Ar-4% H₂ atmosphere exhibited a transmittance of below 50%. The carrier concentration and mobility of the a-IGZO films fabricated under Ar and Ar-4% H₂ were observed slight decrease as a function of the flow, respectively. The thin film transistors (TFTs) with an a-IGZO channel deposited under Ar and Ar-4% H₂ atmosphere exhibited the following good characteristics: V_th of 0.34 V, µ_FE of 3.6 cm² V^− 1 s^− 1, on/off ratio of 10⁶, and S value of 0.04 V decade^− 1.     

Electrical and optical properties of ITO:Ca composite thin films for TEOLED cathode

ITO:Ca composite thin films were deposited on glass substrate by the rf magnetron co-sputtering method with various numbers of Ca chips and oxygen partial pressures. The carrier concentration of the ITO:Ca thin film was 7 × 10²⁰ cm^− 3 when the number of Ca chips was 4 at an oxygen partial pressure of 1.4%. The sheet resistance and optical transmittance of the ITO:Ca thin films were 68.2 Ω/sq. and 87%, respectively. The work function of the ITO:Ca thin films with 8 Ca chips was changed from 4.6 eV to 5.0 eV when the oxygen partial pressure was increased from 0.8% to 2.2%. When the oxygen partial pressure was 1.2%, a low work function of 4.6 eV was obtained for the ITO:Ca thin films.     

Oxygen partial pressure dependence of the structural properties of CdO thin films deposited by a modified reactive vacuum evaporation process

Thin films of cadmium oxide were thermally deposited on glass substrates at partial pressures of oxygen, pO₂ in the range 1.33×10⁻² to 0.133 Pa at a substrate temperature of 160 °C. Energy dispersive analysis of X-ray fluorescence (EDAX) revealed that the CdO films deposited at pO₂ value of 4.00×10⁻² Pa were nearly stoichiometric. X-ray diffractometry (XRD) confirmed the polycrystalline nature of the film structure. All the films showed an fcc structure of the NaCl-type, as the dominant phase. The films exhibited preferred orientation along the (1 1 1) diffraction plane. The texture coefficients calculated for the various planes at different oxygen partial pressures (pO₂) indicated that the maximum preferred orientation of the films occurred along the (1 1 1) plane at an oxygen partial pressure of 4.00×10⁻² Pa. This was interpreted in terms of oxygen chemisorption and desorption processes. The lattice parameters determined from the diffraction peaks were in the range 4.655–4.686 Å. The average lattice parameter a₀ found by extrapolation using the Nelson–Riley function was 4.696 Å. Both the lattice parameter and the crystallite size were found to increase with increased partial pressure of oxygen. On the other hand, the strain and dislocation density were found to decrease as the partial pressure of oxygen was raised. A maximum (80%) in the optical transmittance at λ=600 nm and minimum in the electrical resistivity (9.1×10⁻⁴ Ω cm) of the films occurred at an optimum partial pressure of oxygen of 4.00×10⁻² Pa. The results are discussed.     

Property variations of direct-current reactive magnetron sputtered copper oxide thin films deposited at different oxygen partial pressures

Cuprous oxide (Cu₂O) and cupric oxide (CuO) thin films were deposited on glass substrates at different oxygen partial pressures by direct-current reactive magnetron sputtering of pure copper target in a mixture of argon and oxygen gases. Oxygen partial pressure was found to be a crucial parameter in controlling the phases and, thus, the physical properties of the deposited copper oxide thin films. Single-phase Cu₂O thin films with cubic structure were obtained at low oxygen partial pressure between 0.147 Pa and 0.200 Pa while higher oxygen partial pressure promoted the formation of CuO thin films with base-centered monoclinic structure. Polycrystalline Cu₂O thin films deposited with oxygen partial pressure at 0.147 Pa possessed the lowest p-type resistivity of 1.76 Ω cm as well as an optical band gap of 2.01 eV. On the other hand, polycrystalline CuO thin films deposited with oxygen partial pressure at 0.320 Pa were also single phase but showed a n-type resistivity of 0.19 Ω cm along with an optical band gap of 1.58 eV.     

Radio frequency sputter deposition of high-quality conductive and transparent ZnO:Al films on polymer substrates for thin film solar cells applications

Thick aluminum-doped zinc oxide films were deposited at substrate temperatures from 100 °C to room temperature on polyethylene terephthalate by radio frequency magnetron sputtering, varying the deposition parameters such as radio frequency power and working pressure.Structural, optical and electrical properties were analyzed using an x-ray diffractometer, a spectrophotometer and a four-point probe, respectively. Films were polycrystalline showing a strong preferred c-axis orientation (002). The best optical and electrical results were achieved using a substrate temperature of 100 °C. Furthermore, high transmittances close to 80% in the visible wavelength range were obtained for those films deposited at the lowest Argon pressure used of 0.2 Pa. In addition, resistivities as low as 1.1 × 10^− 3 Ω cm were reached deposited at a RF power of 75 W. Finally, a comparison of the properties of the films deposited on polymer and glass substrates was performed, obtaining values of the figure of merit for the films on polymer comparable to those obtained on glass substrates, 17,700 Ω^− 1 cm^− 1 vs 14,900 Ω^− 1 cm^− 1, respectively.     

Structural and optical studies on dc reactive magnetron sputtered Cu2O films

Cuprous oxide (Cu₂O) thin films were deposited by dc reactive magnetron sputtering technique onto glass substrates by sputtering of pure copper target in a mixture of argon and oxygen gases under various oxygen partial pressures in the range 8 × 10^− 3–1 × 10^− 1 Pa at a constant substrate temperature of 473 K and a sputtering pressure of 4 Pa. The dependence of cathode potential on the oxygen partial pressure was explained in terms of cathode poisoning effect. The influence of oxygen partial pressure on the structural and optical properties of Cu₂O films was systematically studied. Single phase films of Cu₂O were obtained at an oxygen partial pressure of 2 × 10^− 2 Pa. The films formed at an oxygen partial pressure of 2 × 10^− 2 Pa were polycrystalline with cubic structure and exhibited an optical band gap of 2.04 eV.     

Influence of the growth conditions on the stoichiometry and on the optical properties of titanium oxide thin films prepared by reactive sputtering

Titanium oxide thin films are deposited at room temperature by reactive DC sputtering onto glass and Si (100) substrates. Different conditions of deposition were varied such as sputtering power, deposition time and oxygen partial pressure to study their influence on the titanium oxide thin films growth. The absolute amount of oxygen and the relative O/Ti composition of films have been determined by Nuclear Reaction Analysis and Rutherford Backscattering Spectroscopy, respectively. Additionally, the band-gap was determined by measuring the optical absorption and its behavior correlated with the oxygen film content. From the present study, it is possible to establish that the optical band-gap energy depends mainly on the sputtering oxygen partial pressure used at the preparation and that films prepared with a partial oxygen pressure of 4 × 10^− 2 Pa allows titanium oxide with near stoichiometric composition. Additionally, from the optical point of view, band-gap energies of 3.4 eV are obtained for near stoichiometric films and a decrease is observed for samples prepared with higher oxygen concentrations.     

Room temperature deposition of IZTO transparent anode films for organic light-emitting diodes

This study was to investigate anodic electrode IZTO films deposited by pulsed DC magnetron sputter at room temperature with various oxygen partial pressures onto glass substrate and to analyze the structural, electrical, and optical properties, as well as the relationship between the chemical binding state of the surface and the characteristics of IZTO films. In addition, the prepared IZTO films were used to fabricate the organic light emitting diodes (OLEDs) as an anode layer to study the device performances. The IZTO film deposited at optimal oxygen partial pressure of 2.0% in sputtering process showed the best properties, such as a low electrical resistivity and high optical transmittance of <5.1 × 10^?4 Ω cm and >80% in the visible wavelength of 400–800 nm, respectively. The OLED characteristics with the optimum condition showed good brightness and the lowest turn-on voltage of >10,000 cd/m² and 4.67 V. These results indicate that IZTO films can be a promising candidate as an alternative TCO electrode material for flexible and OLED devices.     

DC sputter deposition of amorphous indium-gallium-zinc-oxide (a-IGZO) films with H2O introduction

Amorphous indium-gallium-zinc-oxide (a-IGZO) films were deposited by dc magnetron sputtering with H₂O introduction and how the H₂O partial pressure (P_H2O) during the deposition affects the electrical properties of the films was investigated in detail. Resistivity of the a-IGZO films increased dramatically to over 2 × 10⁵ Ωcm with increasing P_H2O to 2.7 × 10^− 2 Pa while the hydrogen concentration in the films increased to 2.0 × 10²¹ cm^− 3. TFTs using a-IGZO channels deposited under P_H2O at 1.6-8.6 × 10^− 2 Pa exhibited a field-effect mobility of 1.4-3.0 cm²/Vs, subthreshold swing of 1.0-1.6 V/decade and on-off current ratio of 3.9 × 10⁷-1.0 × 10⁸.     

Strain dependence electrical resistance and cohesive strength of ITO thin films deposited on electroactive polymer

Transparent, conducting, indium tin oxide (ITO) films have been deposited, by pulsed dc magnetron sputtering, on glass and electroactive polymer (poly(vinylidene fluoride)—PVDF) substrates. Samples have been prepared at room temperature by varying the oxygen partial pressure. Electrical resistivity around 8.4 × 10^− 4 Ω cm has been obtained for films deposited on glass, while a resistivity of 1.7 × 10^− 3 Ω cm has been attained in similar coatings on PVDF. Fragmentation tests were performed on PVDF substrates with thicknesses of 28 μm and 110 μm coated with 40 nm ITO layer. The coating's fragmentation process was analyzed and the crack onset strain and cohesive strength of ITO layers were evaluated.     

Structural and electrical properties of Al doped ZnO thin films deposited at room temperature on poly(vinilidene fluoride) substrates

Transparent, conducting, Al-doped ZnO films have been deposited, by dc and pulsed dc magnetron sputtering, on glass and electroactive polymer (poly(vinylidene fluoride)–PVDF) substrates. Samples have been prepared at room temperature varying the argon sputtering pressure, after optimizing other processing conditions. All ZnO:Al films are polycrystalline and preferentially oriented along the [002] axis. Electrical resistivity around 3.3 × 10^− 3 Ω cm and optical transmittance of ~ 85% at 550 nm have been obtained for AZOY films deposited on glass, while a resistivity of 1.7 × 10^− 2 Ω cm and transmittance of ~ 70% at 550 nm have been attained in similar coatings on PVDF. One of the main parameters affecting film resistivity seems to be the roughness of the substrate.     

Cu2O thin films deposited by reactive direct current magnetron sputtering

The Cu₂O thin films were prepared on quartz substrate by reactive direct current magnetron sputtering. The influences of oxygen partial pressure and gas flow rate on the structures and properties of deposited films were investigated. Varying oxygen partial pressure leads to the synthesis of Cu₂O, Cu₄O₃ and CuO with different microstructures. At a constant oxygen partial pressure of 6.6 × 10^− 2 Pa, the single Cu₂O films can be obtained when the gas flow rate is below 80 sccm. The as-deposited Cu₂O thin films have a very high absorption in the visible region resulting in the visible-light induced photocatalytic activity.     

Low resistivity transparent conducting CdO thin films deposited by DC reactive magnetron sputtering at room temperature

Transparent conducting cadmium oxide (CdO) films were deposited on PET (polyethylene terephthalate) substrate by DC reactive magnetron sputtering at room temperature. All the films deposited at room temperature were polycrystalline in rock-salt structure. Dependences of the physical properties of the CdO films on the oxygen partial pressure were systematically studied. The films deposited at low oxygen flow rate were (200) oriented, while the films deposited at an oxygen flow rate greater than 20 sccm were (111) oriented. The average grain size of the CdO films decreased as the oxygen flow rate increases as determined by XRD and SEM. The Hall effect measurement showed that CdO films have high concentration, low resistivity, and high mobility. Both the mobility and the concentration of the carrier decreased with the increase of the oxygen flow rate. A minimum sheet resistance of 36.1 Ω/□, or a lowest resistivity of 5.44 × 10^− 4 Ω cm (6.21 × 10²⁰/cm³, μ = 19.2 cm²/Vs) was obtained for films deposited at an oxygen flow rate of 10 sccm.     

Tungsten-doped tin oxide thin films prepared by pulsed plasma deposition

Transparent conductive oxide tungsten-doped tin oxide thin films were deposited on glass substrates from ceramic targets by the pulsed plasma deposition method. The structural, electrical and optical properties have been investigated as functions of tungsten doping content and oxygen partial pressure. The lowest resistivity of 2.1 × 10^? 3 Ω?cm was reproducibly obtained, with carrier mobility of 30 cm²V^? 1s^? 1 and carrier concentration of 9.6 × 10¹⁹ cm^? 3 at the oxygen partial pressure of 1.8 Pa. The average optical transmission was in excess of 80% in the visible region from 400 to 700 nm, with the optical band gap ranging from 3.91 to 4.02 eV.     

Overview about the optical properties and mechanical stress of different dielectric thin films produced by reactive-low-voltage-ion-plating

Thin films of Ta₂O₅, Nb₂O₅, and HfO₂ were deposited by reactive-low-voltage-ion-plating (RLVIP) on unheated glass and silicon substrates. The film thickness was about 200 nm. Optical properties as well as mechanical film stress of these layers were investigated in dependence of various deposition parameters, i.e. arc current and oxygen partial pressure. For an arc current in the range between 40 and 50 A and an oxygen partial pressure of at least 11 · 10^− 4 mbar good results were obtained. The refractive index and film thickness were calculated from spectrophotometric transmission data using the Swanepoel theory. For example at 550 nm wavelength the refractive index for thin RLVIP-Nb₂O₅-films was found to be n₅₅₀ = 2.40. The optical absorption was obtained by photo-thermal deflection spectrometry. For the investigated materials absorption coefficients in the range of k = 5 · 10^− 4 at 515 nm wavelength were measured. The mechanical film stress was determined by measuring the difference in bending of silicon substrates before and after the deposition process. For dense films, i.e. no water vapour sorption on atmosphere, the mechanical film stress was always compressive with values of some hundred MPa. In case of films deposited with higher arc currents (I_arc > 60A) and lower oxygen pressure (< 15 · 10^− 4 mbar) the influence of a post deposition heat treatment at 350 °C for 4 h on air was also investigated. For these films the properties could clearly be improved by such treatment. However, by using lower arc currents and higher oxygen partial pressure during the ion plating process, immediately dense and environmental stable films with good optical as well as mechanical properties could be achieved without post deposition heat treatment. All the results obtained will be presented in graphs and diagrams.     

Evaluation of Y2O3 gate insulators for a-IGZO thin film transistors

In this work, Y₂O₃ was evaluated as a gate insulator for thin film transistors fabricated using an amorphous InGaZnO₄ (a-IGZO) active layer. The properties of Y₂O₃ were examined as a function of various processing parameters including plasma power, chamber gas conditions, and working pressure. The leakage current density for the Y₂O₃ film prepared under the optimum conditions was observed to be ~ 3.5 × 10^− 9 A/cm² at an electric field of 1 MV/cm. The RMS roughness of the Y₂O₃ film was improved from 1.6 nm to 0.8 nm by employing an ALD (Atomic Layer Deposition) HfO₂ underlayer. Using the optimized Y₂O₃ deposition conditions, thin film transistors (TFTs) were fabricated on a glass substrate. The important TFT device parameters of the on/off current ratio, sub-threshold swing, threshold voltage, and electric field mobility were measured to be 7.0 × 10⁷, 0.18 V/dec, 1.1 V, and 3.3 cm²/Vs, respectively. The stacked insulator consisting of Y₂O₃/HfO₂ was highly effective in enhancing the device properties.     

Characterization of CuAlO2 films prepared by dc reactive magnetron sputtering

Thin films of copper aluminum oxide (CuAlO₂) were prepared on glass substrates by dc magnetron sputtering at a substrate temperature of 523 K under various oxygen partial pressures in the range 1 × 10⁻⁴–3 × 10⁻³ mbar. The dependence of cathode potential on the oxygen partial pressure was explained in terms of oxidation of the sputtering target. The influence of oxygen partial pressure on the structural, electrical and optical properties was systematically studied. p-Type CuAlO₂ films with polycrystalline nature, electrical resistivity of 3.1 Ω cm, Hall mobility of 13.1 cm² V⁻¹ s⁻¹ and optical band gap of 3.54 eV were obtained at an oxygen partial pressure of 6 × 10⁻⁴ mbar.     

Amorphous InGaZnO thin film transistors with SiO2/HfO2 double-layer gate dielectric fabricated at low temperature

Amorphous InGaZnO (a-IGZO) thin film transistors (TFTs) with double-layer gate dielectric were fabricated at low temperature and characterized. A stacked 150 nm-thick SiO₂/50 nm-thick HfO₂ dielectric layer was employed to improve the capacitance and leakage characteristics of the gate oxide. The SiO₂/HfO₂ showed a higher capacitance of 35 nF/cm² and a lower leakage current density of 4.6 nA/cm² than 200 nm-thick SiO₂. The obtained saturation mobility (μ_sat), threshold voltage (V_th), and subthreshold swing (S) of the fabricated TFTs were 18.8 cm² V^?1 s^?1, 0.88 V, and 0.48 V/decade, respectively. Furthermore, it was found that oxygen pressure during the IGZO channel layer deposition had a great influence on the performance of the TFTs.