第十八届国际固体器件和材料会议

<正>第十八届国际固体器件和材料会议于1986年8月20日至22日在日本东京召开.参加本届会议的代表近千名,他们分别来自二十多个国家.会议收到论文174篇,最新消息35篇,其中特邀报告23篇.论文内容包括:光刻,Si和GaAs外延工艺,MOS器件及工艺,Si上生长GaAs,异质结器件,高速GaAs集成电路,绝缘栅和热电子等26个专题.这些论文分别在东京Price Hotel的四个会场进行宣读和讨论.我国有5篇(其中台湾省2篇)论文,我所朱恩均同志也作了报告.这些论文的内容反映了国际微波器件和材料在小型器件、异质结、光器件、低温操作和半导体材料工艺上又有了重大的进展.现分两个方面进行介绍.     

氧化非晶硅发射极微波晶体管近期进展

<正> 当前,随着分子束外延和金属有机化学汽相淀积两种异质结工艺技术的日趋完善,化合物半导体材料的HBT器件其高频性能不断提高。据报道,GaAs/GaAlAs HBT器件的特征频率f_T已提高到105GHz,用GaAs/GaAlAs制成的环形振荡器其每门的传输延迟时间为5.5ps(室温下),功耗为20mW,这是目前最快的半导体三端开关器件。 在硅HBT器件研究中,近年来的报道集中在a-Si/c-Si异质结界面及其HBT的直流特性上,研究如何利用异质界面的高注入来获得尽可能高的电流增益和低的基区电阻。然而,直到目前仍未见到a-Si HBT高频性能的报道。本文首先报道采用氢化非晶硅发射极,而基     

微波功率SiGe HBT研究进展

Si的热导率比大部分化合物半导体(如GaAs)的热导率高,SiGe HBT在一个较宽的温度范围内稳定,SiGe HBT的发射结电压VBE的温度系数dVBE/dT比Si的小,双异质结SiGe HBT本身具有热-电耦合自调能力,所加镇流电阻可以较小,所有这些使SiGe HBT比GaAs HBT和SiBJT在功率处理能力上占一定优势。文章对微波功率SiGe HBT一些重要方面的国内外研究进展进行评述,希望对从事微波功率SiGe HBT的研究者有所帮助。     

InP基及含磷化合物HBT材料的GSMBE生长与特性

通过对外延材料结构设计和GSMBE生长工艺的深入研究,解决了生长InP基及含磷化合物HBT外延材料的关键问题,建立了稳定优化的GSMBE生长工艺,研制出性能优良的φ50mm InP基HBT和φ100mm InGaP/GaAs HBT外延材料.所发展的GSMBE外延技术,在As/P气氛切换、基区p型重掺杂扩散抑制、双异质结HBT结构设计等方面具有自己的特色.器件单位采用所提供的外延材料研制出的InP基HBT和InGaP/GaAs HBT器件与电路,达到了目前采用国产HBT外延材料研制的最好水平.     

InP基及含磷化合物HBT材料的GSMBE生长与特性

通过对外延材料结构设计和GSMBE生长工艺的深入研究,解决了生长InP基及含磷化合物HBT外延材料的关键问题,建立了稳定优化的GSMBE生长工艺,研制出性能优良的φ50mm InP基HBT和φ100mm InGaP/GaAs HBT外延材料.所发展的GSMBE外延技术,在As/P气氛切换、基区p型重掺杂扩散抑制、双异质结HBT结构设计等方面具有自己的特色.器件单位采用所提供的外延材料研制出的InP基HBT和InGaP/GaAs HBT器件与电路,达到了目前采用国产HBT外延材料研制的最好水平.     

pnp型SiGe HBT的制备研究

从pnp型Si/SiGe HBT的能带结构出发，阐述pnp型Si/SiGe HBT的较大原理，采用MBE方法生长Si/Si1-xGex合金材料，并对Si/Si1-xGex合金材料的物理特性和异质结特性进行表征，在重庆固体电子研究所工艺线上，研制出了pnp型Si/SiGe HBT器件，器件参数为：Vcb0=9V,Vcc0=2.5V,Veb0=5V,β＝10。     

超晶格器件

超晶格器件(Super Lattice)不是用天然材料制作的,而是用新的人工超晶格材料作成的器件。它是一种新的功能器件。随着半导体技术的迅速发展,可高精度地制作半导体超薄膜和多层结构。1955年Schrieffer预言电子限制在这种超薄膜中可产生异常性质;1966年Fowler等人发现了在甚低温状态下工作的Si—MOS—FET中电子的驻波状态;60年代后期制成了半导体异质结;1970年江崎等人实现了厚度与电子波长相当的超晶格结构。超晶格结构的形状图示于图1。以后用异质结     

半导体光电器件制作技术的最新进展(续)

本文就近一、二年以来半导体光电器件制作技术的新工艺、新技术作了较全面的介绍。该文内容包括Ⅲ-Ⅴ族、Ⅱ-Ⅵ族化合物的单晶膜的外延生长工艺的改进;新的外延生长技术;Si及GaAs衬底上异质结电子学技术;制管工艺中重点工艺的最新进展。并介绍了这些新技术在半导体光电器件中所取得的成就。     

半导体光电器件制作技术的最新进展

本文就近一、二年以来半导体光电器件制作技术的新工艺、新技术作了较全面的介绍。该文内容包括Ⅲ—Ⅴ族、Ⅱ—Ⅵ族化合物的单晶膜的外延生长工艺的改进;新的外延生长技术;Si及GaAs衬底上异质结电子学技术;制管工艺中的重点工艺的最新进展。井介绍了这些新技术在半导体光电器件中所取得的成就。     

Si_(1-x-y)Ge_xC_y合金半导体技术及其应用

随着半导体材料及工艺水平的迅速发展,Si1-x-yGexCy合金材料在近年内受到了广泛重视。C组分的引入所带来的应变补偿作用,很好地解决了Si1-xGex合金中的晶格失配问题,使Si衬底上生长的外延层质量和厚度都得到相应提高,并且由于C组分所带来的能带补偿作用,使材料的光电特性也得到改进。文章综述了Si1-x-yGexCy合金的研究进展及其物理特性,并对其在FET、HBT、光电子器件等方面的应用进行了详细的阐述。     

Variable Frequency Microwave and Convection Furnace Curing of Polybenzoxazole Buffer Layer for GaAs HBT Technology

Photosensitive polybenzoxazole (PBO) film has been used in GaAs heterojunction bipolar transistor (HBT) technology for stress buffer and mechanical protection layer applications. However, this film needs to be cured at high temperatures for a long period of time in order to obtain its desired excellent material characteristics. High-temperature curing can result in degradation to the electrical characteristics and performance of the underlying GaAs devices due to limited thermal budget. In this paper, we have characterized the effects of curing the PBO film on GaAs HBT wafers using a conventional convection furnace and using a variable frequency microwave (VFM) furnace. The results show that a VFM cure can achieve similar excellent physical, mechanical, thermal, and chemical material characteristics at a lower curing temperature and in a much shorter time, as compared to convection furnace curing, therefore resulting in minimal GaAs device degradation. Based on these results, an optimum curing condition using the VFM method can be obtained that satisfies both stress buffer layer material and device requirements for GaAs HBT technology.     

GaAs solar cells grown on Si substrates for space use

GaAs single‐junction and InGaP/GaAs multi‐junction thin‐film solar cells fabricated on Si substrates have great potential for high‐efficiency, low‐cost, lightweight and large‐area space solar cells. Heteroepitaxy of GaAs thin films on Si substrates has been examined and high‐efficiency GaAs thin‐film solar cells with total‐area efficiencies of 18·3% at AM0 and 20·0% at AM 1·5 on Si substrates (GaAs‐on‐Si solar cells) have been fabricated. In addition, 1‐MeV electron irradiation damage to GaAs‐on‐Si cells has been studied. The GaAs‐on‐Si cells are found to show higher end‐of‐life efficiency than the conventional GaAs cells fabricated on GaAs substrates (GaAs‐ on‐GaAs cells) under high‐fluence 1‐MeV electron irradiation of more than 1 × 10¹⁵ cm⁻². The first space flight to make use of them has been carried out. Forty‐eight 2 × 2 cm GaAs‐on‐Si cells with an average AM0 total‐area efficiency of 16·9% have been evaluated in the Engineering Test Satellite No.6 (ETS‐VI). The GaAs‐on‐Si cells have been demonstrated to be more radiation‐resistant in space than GaAs‐on‐GaAs cells and 50, 100 and 200‐μm‐thick Si cells. These results show that the GaAs‐on‐Si single‐junction and InGaP/GaAs‐on‐Si multi‐junction cells have great potential for space applications. Copyright © 2001 John Wiley & Sons, Ltd.     

新型恒压控制型负阻HBT的研制进展

研究了HBT产生负阻的可能机制,通过对材料结构和器件结构的特殊设计,采用常规台面HBT工艺,先后研制出3类高电流峰谷比的恒压控制型负阻HBT.超薄基区HBT的负阻特性是由超薄基区串联电阻压降调制效应造成的,在GaAs基InGaP/GaAs和AlGaAs/GaAs体系DHBT中均得到了验证.双基区和电阻栅型负阻HBT均为复合型负阻器件.双基区负阻HBT通过刻断基区,电阻栅负阻HBT通过在集电区制作基极金属形成集电区反型层,构成纵向npn与横向pnp的复合结构,由反馈结构(pnp)的集电极电流来控制主结构(npn)的基极电流从而产生负阻特性.3类负阻HBT与常规HBT在结构和工艺上兼容,兼具HBT的高速高频特性和负阻器件的双稳、自锁、节省器件的优点.     

Life‐cycle assessment of photovoltaic modules: Comparison of mc‐Si,InGaP and InGaP/mc‐Si solar modules

A higher conversion efficiency of photovoltaic modules does not automatically imply a lower environmental impact, when the life‐cycle of modules is taken into account. An environmental comparison is carried out between the production and use phase, except maintenance, of an indium–gallium–phosphide (InGaP) on multicrystalline silicon (mc‐Si) tandem module, a thin‐film InGaP cell module and a mc‐Si module. The evaluation of the InGaP systems was made for a very limited industrial production scale. Assuming a fourfold reuse of the GaAs substrates in the production of the thin‐film InGaP (half) modules, the environmental impacts of the tandem module and of the thin‐film InGaP module are estimated to be respectively 50 and 80% higher than the environmental impact of the mc‐Si module. The energy payback times of the tandem module, the thin‐film InGaP module and the mc‐Si module are estimated to be respectively 5.3, 6.3 and 3.5 years. There are several ways to improve the life‐cycle environmental performance of thin‐film InGaP cells, including improved materials efficiency in production and reuse of the GaAs wafer and higher energy efficiency of the metalorganic chemical vapour deposition process. Copyright © 2003 John Wiley & Sons, Ltd.     

Low-resistance vertical conduction across epitaxially lifted-off n-GaAs film and Pd/Ge/Pd coated Si substrate

Low-resistance ohmic conduction across an epitaxially lifted-off (ELO) thin n-GaAs film and a Si substrate was obtained by attaching the ELO film on the Si substrate coated with a Pd/Ge/Pd multilayer. Good bonding and ohmic contacts to both GaAs and Si were achieved at the same time after annealing. The interface compound formation was studied by secondary ion mass spectroscopy and x-ray diffraction analyses. The ELO technology was used to fabricate an ELO stripe geometry diode laser on Si with the back-side contact on Si substrate. Good laser performance with comparable characteristics as conventional laser diodes on GaAs substrates was obtained.     

Performance comparison of state-of-the-art heterojunction bipolar devices (HBT) based on AlGaAs/GaAs, Si/SiGe and InGaAs/InP

This paper presents a comprehensive comparison of three state-of-the-art heterojunction bipolar transistors (HBTs); the AlGaAs/GaAs HBT, the Si/SiGe HBT and the InGaAs/InP HBT. Our aim in this paper is to find the potentials and limitations of these devices and analyze them under common Figure of Merit (FOM) definitions as well as to make a meaningful comparison which is necessary for a technology choice especially in RF-circuit and system level applications such as power amplifier, low noise amplifier circuits and transceiver/receiver systems. Simulation of an HBT device with an HBT model instead of traditional BJT models is also presented for the AlGaAs/GaAs HBT. To the best of our knowledge, this work covers the most extensive FOM analysis for these devices such as I-V behavior, stability, power gain analysis, characteristic frequencies and minimum noise figure. DC and bias point simulations of the devices are performed using Agilent's ADS design tool and a comparison is given for a wide range of FOM specifications. Based on our literature survey and simulation results, we have concluded that GaAs based HBTs are suitable for high-power applications due to their high-breakdown voltages, SiGe based HBTs are promising for low noise applications due to their low noise figures and InP will be the choice if very high-data rates is of primary importance since InP based HBT transistors have superior material properties leading to Terahertz frequency operation.     

移动通信中的射频集成电路

介绍分析了在蜂窝和个人通信业务 (PCS)市场中适用于 RFIC的多种射频晶体管技术。Ga As HBT技术被作为介绍的基线 ,并且与目前已有的技术进行比较 ,得出对于射频应用 ,Ga AsHBT综合了 Si BJT和 Ga As FET两者优点的结论。文中还介绍了近年来国外 Ga As HBT MMIC,PHEMT MMIC和 In P HBT MMIC的研究进展情况。     

Efficiency calculations for thin-film polycrystalline semiconductor Schottky barrier solar cells

Numerical calculations have been made of the effect of grain size on the short-circuit current and the AM1 efficiency of polycrystalline thin film InP, GaAs, and Si Schottky barrier solar cells. Si cells 10 µm thick are at best 8 percent efficient for 100-µm grain sizes; 25-µm-thick Si cells can be about 10 percent efficient for this grain size. GaAs cells 2 µm thick can be 12 percent efficient for grain sizes of 3 µm or greater.     

固态微波毫米波、太赫兹器件与电路的新进展

固态微波毫米波、太赫兹器件与电路是微电子、纳电子领域的战略制高点之一,SiCMOS技术进入纳米加工时代,GaAs,InP材料的"能带工程"(超晶格、异质结),GaN材料的宽禁带和界面特性以及石墨烯纳米级新材料的创新发展都深刻影响着固态微波毫米波、太赫兹器件与电路的进展。描述了固态微波、毫米波和太赫兹器件与电路当前发展的新亮点,包括纳米加工技术、石墨烯新材料、GaN MMIC功率合成突破3 mm频段百瓦级、三端器件进入太赫兹和两端器件倍频链突破2.7 THz微瓦功率。并重点就当前发展的RF CMOS,SiGe HBT,LDMOS,GaAsPHEMT,GaAs MHEMT,InP HEMT,InP HBT,GaN HEMT,GFET和THz倍频链等10个领域的发展特点、2011年最新发展以及未来发展趋势进行介绍。     

A Structural Investigation of CdTe(001) Thin Films on GaAs/Si(001) Substrates by High-Resolution Electron Microscopy

Epitaxial CdTe thin films were grown on GaAs/Si(001) substrates by metalorganic chemical vapor deposition using thin GaAs as a buffer layer. The interfaces were investigated using high-resolution transmission electron microscopy and geometric phase analysis strain mapping. It was observed that dislocation cores exist at the CdTe/GaAs interface with periodic distribution. The spacing of the misfit dislocation was measured to be about 2?nm, corresponding to the calculated spacing of a misfit dislocation (2.6?nm) in CdTe/Si with Burgers vector of a[110]/2. From these results, it is suggested that the GaAs buffer layer effectively absorbs the strain originating from the large lattice mismatch between the CdTe thin film and Si substrate with the formation of periodic structural defects.