The effect of preparation process of PMDA–ODA–DR1 polyimide on its second harmonic generation characteristics

In situ second harmonic generation (SHG) observation of PMDA–ODA–DR1 polyimide films prepared by different preparative procedures were studied to understand the effects of the residual acid and the imidization byproduct and the extent of imidization on the SHG characteristics of the PMDA–ODA–DR1 polyimides. PMDA–ODA–DR1 polyimides with or without removal of salt were also investigated to study the influence of remaining triethyl hydrogen ammonium chloride salt on the SHG characteristics and reliability of the polymers. A blue shift in the UV/vis spectrum during poling was observed for the low temperature-baked film, but did not occur for the high-temperature-baked film. Both high temperature imidization and removal of the byproduct organic salt did not only improve the poling efficiency of PMDA–ODA–DR1 polyimide as a SHG material, but also slowed down the relaxation of the film and made the film more reliable. © 1995 John Wiley & Sons, Inc.     

Adhesion mechanisms in the solid‐state bonding technique using submicrometer aromatic thermosetting copolyester adhesive

The adhesion mechanism between polyimides and aromatic thermosetting copolyester (ATSP) involved in the solid‐state bonding technique using submicrometer ATSP coatings was evaluated. The adhesion strength at the interface between ATSP and polyimide is strongly related to the diffusion of ATSP into the polyimide base layer. We used dynamic secondary ion mass spectrometry to study the interface width between deuterated ATSP and polyimides and found that the interface between ATSP and poly(4,4′‐diphenylether pyromellitimide) (PMDA‐ODA) is wider than the interface between ATSP and poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PPD) because of the less rigid chain in the PMDA‐ODA. By partially curing both polyimides, the interface width was greatly increased, which could lead to an improved adhesion at the interface between polyimide BPDA‐PPD and ATSP. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 3843–3856, 2004     

High-performance polymer films. III. Preparation and characterization

A series of polyimide and copolyimide films were prepared by film casting, drying, and thermal imidization from the respective precursor poly(amic acid) (PAA) and copoly(amic acid) solutions derived from two dianhydrides, pyromellitic dianhydride (PMDA) and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), and two diamines, 4,4′-oxydianiline (ODA) and a proprietary aromatic diamine (PD) as monomers. Depending on the solution's inherent viscosity value (molecular weight) and the nature of the polymer chains (derived from rigid or flexible monomers), precursor poly(amic acid) and copoly(amic acid) solution concentrations of 8–12% (w/w) were found to be suitable for the preparation of good quality polyimide/copolyimide films. The recovery of film toughness and creasability from the brittleness at the intermediate temperature of the cure cycle depended not only on the molecular weight of the precursor poly(amic acids)/copoly(amic acids) but also on their chain flexibility. The poly(amic acid) derived from both rigid dianhydride and diamine practically gave rise to a brittle film of polyimide even after curing to 360°C. The resulting polyimide and copolyimide films were compared with Du Pont's Kapton H film. The density of the films was in the range 1.39–1.42 g/cm³. The thickness of most of the films was in the range 20–30 μm. The HPF 3 film, based on PMDA–PD, appeared to be highly colored (reddish brown), and the HPF 2 film, based on BTDA–ODA, had the lightest yellow coloring among the films in this investigation, including Kapton H film. HPF 2, HPF 6, and HPF 8 films were more amorphous than the other films. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 976–988, 2001     

Residual stress and mechanical properties of polyimide thin films

Four different structure polyimide thin films based on 1,4‐phenylene diamine (PDA) and 4,4′‐oxydianiline (ODA) were synthesized by using two different dianhydrides, pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), and their residual stress behavior and mechanical properties were investigated by using a thin film stress analyzer and nanoindentation method. The residual stress behavior and mechanical properties were correlated to the morphological structure in polyimide films. The morphological structure of polyimide thin films was characterized by X‐ray diffraction patterns and refractive indices. The residual stress was in the range of ?5 to 38 MPa and increased in the following order: PMDA‐PDA < BPDA‐PDA < PMDA‐ODA < BPDA‐ODA. The hardness of the polyimide films increased in the following order: PMDA‐ODA < BPDA‐ODA < PMDA‐PDA < BPDA‐PDA. The PDA‐based polyimide films showed relatively lower residual stress and higher hardness than the corresponding ODA‐based polyimide films. The in‐plane orientation and molecularly ordered phase were enhanced with the increasing order as follows: PMDA‐ODA < BPDA‐ODA < BPDA‐PDA ～ PMDA‐PDA. The PDA‐based polyimides, having a rigid structure, showed relatively better‐developed morphological structure than the corresponding ODA‐based polyimides. The residual stress behavior and mechanical properties were correlated to the morphological structure in polyimide films. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Correlation of residual stress and adhesion on copper by the effect of chemical structure of polyimides for copper‐clad laminates

BACKROUND: Polyimide films coated on copper are a potential new substrate for fabricating printed circuit boards; however, adhesion between the copper and polyimide films is often poor. The relations between residual stress and adhesion strength according to the development of molecular orientation of polyimide films with different chemical backbone structure coated on copper were studied. RESULTS: The effect of chemical structures on properties including the residual stress and the adhesion strength were widely investigated for four different polyimides. Diamine 4,4′‐oxydianiline (ODA) and dianhydrides 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA), 4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA), 4,4′‐oxydiphthalic anhydride (ODPA) and 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) were used to synthesize polyimide. In an attempt to quantify the interaction of thermal mismatch with the polyimide films depending on various structures, residual stress experiments between polyimide film and Cu? Si wafer were carried out over a range of 25–400 °C using in situ thin film stress analysis. A universal test machine was used to conduct 180° peel test (ASTM D903‐98) of polyimide film from cooper foil. The residual stress on Cu? Si (100) wafer decreased in the order 6FDA‐ODA > BTDA‐ODA > ODPA‐ODA > PMDA‐ODA, and the interfacial adhesion strength decreased in the order BTDA‐ODA (5 N mm^?2) > ODPA‐ODA > PMDA‐ODA > 6FDA‐ODA. The results may suggest that the morphological structure, degree of crystallinity of chain orientation and packing significantly relate to the residual stress and adhesion strength in polyimide films. Wide‐angle X‐ray diffraction was used for characterizing the molecular order and orientation and X‐ray photoelectron spectroscopy was used for the analysis of components on copper after polyimide films were detached to confirm the existence of copper oxide chemical bonding and to measure the binding energy of elements on the copper surface. CONCLUSION: In this research, it is demonstrated that BTDA‐ODA polyimide has a low residual stress to copper, good adhesion property, good thermal property and low dielectric constant. Therefore, BTDA‐ODA would be expected to be a promising candidate for a two‐layer copper‐clad laminate. Copyright © 2007 Society of Chemical Industry     

Water‐sorption behavior of P‐phenylene diamine–based polyimide thin films

Four different p‐PDA–based polyimide thin films were prepared from their respective poly(amic acid)s through thermal imidization at 400°C: poly(p‐phenylene pyromellitimide) (PMDA‐PDA); poly(p‐phenylene biphenyltetra carboximide) (BPDA‐PDA); poly(p‐phenylene 3,3′,4,4′‐oxydiphthalimide) (ODPA‐PDA); and poly(p‐phenylene 4,4′‐hexafluoroisopropylidene diphthalimide) (6FDA‐PDA). Water‐sorption behaviors of polyimide films were gravimetrically investigated at 25°C and 22–100% relative humidity by using the modified electromicrobalance (Thin Film Diffusion Analyzer). The diffusion coefficients of water for the polyimides varies in the range of 1.6 to 10.5 × 10⁻¹⁰ cm²/s, and are in the increasing order: BPDA‐PDA < PMDA‐PDA ∼ ODPA‐PDA < 6FDA‐PDA. The water uptakes of polyimides vary from 1.46 to 5.80 wt %, and are in the increasing order: BPDA‐PDA < ODPA‐PDA < 6FDA‐PDA < PMDA‐PDA. The water‐sorption behaviors for the p‐PDA–based polyimides are closely related to the morphological structure; specifically, the diffusion coefficients in p‐PDA–based polyimide thin films are closely related to the in‐plane orientation and mean intermolecular distance, whereas the water uptakes are affected by the packing order. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1315–1323, 2000     

Preparation of thermally stable,low dielectric constant,pyridine‐based polyimide and related nanofoams

Reaction of 6‐chloronicotinoyl chloride with p‐phenylene diamine resulted in preparation of a dichloro diamide compound. Subsequently, chloro displacement of this compound with 4‐amino phenoxy groups led to production of a new pyridine‐based ether diamine named as N,N′‐(1,4‐phenylene)bis(6‐(4‐aminophenoxy) nicotinamide). Novel polyimide was prepared through polycondensation reaction of the diamine with hexafluoroisopropylidene diphthalic anhydride (6‐FDA) via two‐step imidization method. In addition, new nanoporous polyimide films were produced through graft copolymerization of polyimide as the continuous phase with a thermally labile poly (propylene glycol) oligomer as the labile phase. The grafted copolymers were synthesized using reaction of the diamine and 6‐FDA in the presence of poly (propylene glycol) 2‐bromoacetate as thermally labile constituent via a poly(amic acid) precursor process. The labile block was decomposed via thermal treatment to release inert molecules that diffused out of the matrix to leave pores with diameters between 30 and 60 nm. The structures and properties of polyimide and polyimide nanofoams were characterized by different techniques including ¹H‐NMR, FTIR, TGA, DMTA, SEM, TEM, dielectric constant, and tensile strength measurement. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Preparation of soluble copolyurethaneimide containing oxyethylene and oxypropylene units

Soluble copolyurethaneimides were synthesized by the isocyanate method in a solution of N‐methyl‐2‐pyrrolidone (NMP). The isocyanate‐terminated prepolyurethane prepared from low molecular weight poly(ethylene glycol) (PEG) or poly(propylene glycol) (PPG) and methylene diisocyanate was reacted with pyromellitic dianhydride at high temperature. The resulting copolyurethaneimides were soluble in polar solvents like N‐methyl‐2‐pyrrolidone and N,N'‐dimethylformamide. The film‐forming properties were investigated by changing the molecular weights of PEG and PPG. With PPG, the film‐forming property was enhanced. The inherent viscosity, solubility, thermal property, molecular weight distribution, and mechanical property were compared with the aromatic polyimide. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 3502–3507, 2002     

Nanoscale blending of aliphatic and aromatic polyimides: A clue for forming semi-molecular composites and in-situ generation of copolyimide fractions

Summary Nanoscale blending of aromatic and aliphatic polyimides has been attempted by employing corresponding poly(amic acid) precursors in order to elucidate clues for achieving a semi-molecular composite film. Pyromellitic dianhydride (PMDA) and 4,4’-oxydianiline (ODA) were used to make the precursor polymer of aromatic polyimide (PMDA-ODA PI) as a semi-rigid rod-like component, whilst bicyclo[2,2,2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (BOCA) and 4,4’-methylenebis(cyclohexylamine) (MCA) were used to prepare the precursor of aliphatic polyimide (BOCA-MCA PI) as a flexible coil-like component. The weight ratio of aromatic to aliphatic polyimides was varied from 100:0: to 0:100 by 10 wt % gap for monitoring the critical composition upon nanostructure changes. The micro/nanostructure of composite films was characterized by using small-angle X-ray scattering (SAXS) and X-ray diffraction (XRD), while the evolution and thermal property of semi-molecular composites were studied by using FT-IR spectroscopy and dynamic mechanical thermal analysis (DMTA). The result showed that the composite films exhibited a single glass transition behavior, which is ascribed to the molecular level mixing, in the presence of copolyimide fractions.     

Synthesis and characterization of a positive‐working,aqueous‐base‐developable photosensitive polyimide precursor

A positive‐working, aqueous‐base‐developable photosensitive polyimide precursor based on poly(amic ester)‐bearing phenolic hydroxyl groups and a diazonaphthoquinone photosensitive compound was developed. The poly(amic ester) was prepared from a direct polymerization of 2,2′‐bis‐(3‐amino‐4‐hydroxyphenyl)hexafluoropropane and bis(n‐butyl)ester of pyromellitic acid in the presence of phenylphosphonic dichloride as an activator. Subsequently, the thermal imidization of the poly(amic ester) precursor at 300°C produced the corresponding polyimide. The inherent viscosity of the precursor polymer was 0.23 dL/g. The cyclized polyimide showed a glass‐transition temperature at 356°C and a 5% weight loss at 474°C in nitrogen. The structures of the precursor polymer and the fully cyclized polymer were characterized by Fourier transform infrared spectroscopy and ¹H‐NMR. The photosensitive polyimide precursor containing 25 wt % diazonaphthoquinone photoactive compound showed a sensitivity of 150 mJ/cm² and a contrast of 1.65 in a 3 μm film with 1.25 wt % tetramethylammonium hydroxide developer. A pattern with a resolution of 10 μm was obtained from this composition. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 352–358, 2002     

Synthesis of polyimides containing pyridine or triazole moiety to improve their adhesion to sputter-deposited copper

Polyimides containing pyridine as well as triazole were synthesized. The incorporation of pyridine or triazole improves the adhesion between polyimides and sputter-deposited copper. 4,4′-oxydianiline (ODA) was separately mixed with 2,6-diaminopyridine (DAP) and 3,5-diaminol,2,4-triazole (DATA), to form co-diamines. A series of polyimides was obtained in two steps by reacting co-diamines and 3,3′,4,4′-pyromellitic dianhydride (PMDA). The structure of the polyimides was verified by Fourier Transform Infrared spectroscopy (FT-IR) and Nuclear Magnetic Resonance (NMR). Their thermal, mechanical and dielectric properties were investigated. The rigidity of both pyridine and triazole moieties influences the coefficient of thermal expansion, the tensile strength and the elastic modulus of the films. The adhesion strength of the sputter-deposited copper to polyimide films was proportional to the functional group content. At a molar ratio of DAP to ODA of 1 : 6, the 90°-peel strength of copper/polyimide laminates reached a maximum of 990 J/m². At a molar ratio of DATA to ODA of 1 : 6, the 90°-peel strength of copper/polyimide laminates reached a maximum of 696 J/m². The corresponding polyimide films exhibited a good balance in thermal, mechanical and dielectric properties, as did the PMDA-ODA film. The locus of failure (LOF) examination by X-ray photoelectron spectroscopy (XPS) indicated that the LOF of laminates with low to moderate adhesion was mostly at the interface near the polyimide; the LOF of laminates with high adhesion was mostly in the polyimide. The N_1s core level spectra of the delaminated copper surface revealed a peak at 398.4 eV in copper/polyimide with DAP/ODA ratio of 1 : 6 and a peak at 398 eV in copper/polyimide with DATA/ODA ratio of 1 : 6, perhaps due to the formation of N-Cu charge-transfer complex. This complex substantially promoted the adhesion between sputter-deposited copper and polyimides.     

The effect of curing history on the residual stress behavior of polyimide thin films

The effect of curing history on the residual stress behaviors in semiflexible structure poly(4,4′‐oxydiphenylene pyromellitimide) (PMDA–ODA) and rigid structure poly(p‐phenylene biphenyltetracarboximide) (BPDA–PDA) polyimide was investigated. Depending upon the curing history and different structures of polyimide, the residual stress behaviors and the morphology of polyimide thin films were detected in situ by using a wafer bending technique and wide angle X‐ray diffraction (WAXD), respectively. For the rigid structure BPDA–PDA polyimide, the residual stress and the slope decreased from 11.7 MPa and 0.058 MPa/°C to 4.2 MPa and 0.007 MPa/°C as the curing temperature increased, and the annealing process is done. However, for the semiflexible structure PMDA–ODA, the change of the residual stress and the slope was relatively not significant. In addition, it was found that the cured polyimide prepared at a higher temperature with a multistep curing process showed a higher order of chain in‐plain orientation and packing order than does the polyimide film prepared at a lower temperature with a one‐step curing process. These residual stress behaviors of polyimide thin films show good agreement with WAXD results, such as polyimide chain order, orientation, and intermolecular packing order, due to curing history. Specifically, it shows that the effect of curing history on residual stress as well as morphological change was significant in rigid BPDA–PDA polyimide but, not in semiflexible PMDA–ODA polyimide. Therefore, it suggests that the morphological structure depends upon curing history, and the polyimide backbone structure might be one of important factors to lead the low residual stress in polyimide thin films. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 3287–3298, 1999     

Syntheses and properties of polyimides derived from diamines containing 2,5‐disubstituted pyridine group

A series of novel homo‐ and copolyimides containing pyridine units were prepared from the heteroaromatic diamines, 2,5‐bis (4‐aminophenyl) pyridine and 2‐(4‐aminophenyl)‐5‐aminopyridine, with pyromelltic dianhydride (PMDA), and 3,3′, 4,4′‐biphenyl tertracarboxylic dianhydride (BPDA) via a conventional two‐step thermal imidizaton method. The poly(amic acid) precursors have inherent viscosities of 1.60–9.64 dL/g (c = 0.5 g/dL in DMAC, 30°C) and all of them can be cast and thermally converted into flexible and tough polyimide films. All of the polyimides show excellent thermal stability and mechanical properties. The polyimides have 10% weight loss temperature in the range of 548–598°C in air. The glass transition temperatures of the PMDA‐based samples are in the range of 395–438°C, while the BPDA‐based polyimides show two glass transition temperatures (T_g1 and T_g2), ranging from 268 to 353°C and from 395 to 418°C, respectively. The flexible films possess tensile modulus in the range of 3.42–6.39 GPa, strength in the range of 112–363 MPa and an elongation at break in the range of 1.2–69%. The strong reflection peaks in the wide‐angle X‐ray diffraction patterns indicate that the polyimides have a high packing density and crystallinity. The polymer films are insoluble in common organic solvents exhibiting high chemical resistance. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1844–1851, 2006     

Structure effect on water diffusion and hygroscopic stress in polyimide films

A bending-beam technique has been used to in situ monitor the diffusion of water in various polyimide films. The polyimides studied are pyromellitic dianhydride-4.4′-oxydianiline (PMDA–ODA), pyromellitic dianhydride-p-phenylenediamine (PMDA–PDA), and 3,3′,4,4′-benzophenone tetracarboxylic dianhydride-p-phenylenediamine (BPDA–PDA), and their blends and random copolymers. The diffusion of water in these films obeys Fick's law. In PMDA–ODA, the mean diffusion constant is 5.2 ± 0.4 × 10^?9 (cm²/s) for thicknesses ranging from 6.7 to 27.3 μm. In PMDA–PDA, it is 2.0 ± 0.4 × 10^?9 (cm²/s) for thicknesses ranging from 7.3 to 20.0 μm, and in BPDA–PDA, 0.27 ± 0.02 × 10^?9 (cm²/s) for thicknesses ranging from 4.8 to 21.0 μm. In the blends and random copolymer with 50 wt % PMDA–ODA and 50 wt % PMDA–PDA, the diffusion constants are slightly smaller than those in the pure PMDA–ODA, but much larger than in the pure PMDA–PDA. On the contrary, in those with 50 wt % BPDA–PDA and 50 wt % PMDA–PDA, the diffusion constants are much smaller than those in the pure PMDA–PDA, but slightly larger than in the pure BPDA–PDA. These diffusion constants are primarily affected by the chemical structure of the imide molecule. The morphology, such as crystallinity, of the films has played a secondary factor. Hygroscopic stresses due to water uptake in all the studied films increase as the film thickness increases. It can be attributed to that the film orientation decreases with the increase of thickness.     

Synthesis and properties of organosoluble polyimides based on novel flourene‐ring containing diacetamido‐diamine

A new diacetamido‐diamine monomer, N′‐[7‐(acetyl‐4‐aminoanilino)‐9,9‐dioctylflouren‐2‐yl]‐N′‐4‐aminophenyl) acetamide (ADOAc), with flourene‐based structure was prepared from the reaction of 4‐aminoacetanillide with 2,7‐dibromo‐9,9‐dioctylfluorene in the presence of 10 mol % CuI, 20 mol % N,N′‐dimethylethylene diamine as catalyst and K₂CO₃ as base. Two new flourene‐ring containing polyimides were prepared from the reaction of ADOAc with aromatic dianhydrides such as pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) via chemical imidization of poly(amic acid). The new diamine and the related polyimides were characterized by using conventional methods such as FT‐IR, NMR, and elemental analysis. The polyimides obtained from the reaction of ADOAc with PMDA (PIa) and of ADOAc with BTDA (PIb) had inherent viscosity of 0.49 and 0.58 dL/g respectively, and showed excellent solubility in a variety of organic solvents. The polyimides of PIa and PIb showed excellent thermal stability with 10% weight loss in nitrogen atmosphere at temperatures of 418°C and 407°C and T_g of 172°C and 167°C, respectively. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

The role of the ratio (PEG:PPG) of a triblock copolymer (PPG‐b‐PEG‐b‐PPG) in the cure kinetics,miscibility and thermal and mechanical properties in an epoxy matrix

The aim of this study was to evaluate the role of different poly(ethylene glycol):poly(propylene glycol) (PEG:PPG) molar ratios in a triblock copolymer in the cure kinetics, miscibility and thermal and mechanical properties in an epoxy matrix. The poly(propylene glycol)‐block‐poly(ethylene glycol)‐block‐poly(propylene glycol) (PPG‐b‐PEG‐b‐PPG) triblock copolymers used had two different molecular masses: 3300 and 2000 g mol^?1. The mass concentration of PEG in the copolymer structure played a key role in the miscibility and cure kinetics of the blend as well as in the thermal–mechanical properties. Phase separation was observed only for blends formed with the 3300 g mol^?1 triblock copolymer at 20 wt%. Concerning thermal properties, the miscibility of the copolymer in the epoxy matrix reduced the T_g value by 13 °C, although a 62% increase in fracture toughness (K_IC) was observed. After the addition of PPG‐b‐PEG‐b‐PPG with 3300 g mol^?1 there was a reduction in the modulus of elasticity by 8% compared to the neat matrix; no significant changes were observed in T_g values for the immiscible system. The use of PPG‐b‐PEG‐b‐PPG with 2000 g mol^?1 reduced the modulus of elasticity by approximately 47% and increased toughness (K_IC) up to 43%. Finally, for the curing kinetics of all materials, the incorporation of the triblock copolymer PPG‐b‐PEG‐b‐PPG delayed the cure reaction of the DGEBA/DDM (DGEBA, diglycidyl ether of bisphenol A; DDM, Q3‐4,4′‐Diaminodiphenylmethane) system when there is miscibility and accelerated the cure reaction when it is immiscible. All experimental curing reactions could be fitted to the Kamal autocatalytic model presenting an excellent agreement with experimental data. This model was able to capture some interesting features of the addition of triblock copolymers in an epoxy resin. © 2018 Society of Chemical Industry     

Development of polyimide membranes for the separation of water vapor from organic compounds

Attempts were made to develop solvent‐resistant polyimide capillary membranes with integrally skinned asymmetric structure to be used for the treatment of wood dryer emissions or vacuum pyrolysis aqueous effluents. Model mixtures of 1‐propanol (1‐PrOH)/H₂O and acetic acid (AA)/ H₂O, with concentrations of 10–90 wt % of organic components, were used as vaporous feeds. Solvent‐resistant membranes with good mechanical and excellent vapor separation properties were prepared from polyimides based on PMDA and BPDA by the dry/wet phase‐inversion technique. Molecular structure largely influences membrane properties. For the asymmetric polyimide membranes studied, a tendency similar to that of homogeneous dense membrane was found. Membranes prepared from polyimides with diamine and dianhydride moieties, both containing rigid backbone and aromatic rings, displayed higher permeability and selectivity. Test conditions exhibited influences on membrane separation performance. Membranes prepared from copolyimide BPDA–50DDS/50ODA and PMDA–50DDS/50ODA exhibited the best mechanical and chemical properties as well as water vapor separation properties, which are considered to be of practical usefulness for applications of these membranes in the removal of water from water/organic mixtures. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 139–152, 2002     

Synthesis and characterization of poly(acrylate amic acid) and its application as negative‐tone photosensitive polyimides

The dianhydride monomer 3,3′,4,4′‐benzophenone tetracarboxylic acid dianhydride and two diamine monomers, 4,4′‐diamino‐3,3′‐biphenyldiol (HAB) and 2,4‐diaminophenol dihydrochloride (DAP), were used to synthesize a series of poly(hydroxyl amic acid). Further functionalization by grafting acrylate groups yields the corresponding poly(acrylate amic acid) that underwent a crosslinking reaction on exposure to UV‐light and was used as a negative‐tone photosensitive polyimide (PSPI). The analysis of chemical composition and molecular weight of these poly(amic acid)s determined by nuclear magnetic resonance (NMR) spectroscopy, Fourier transform infrared spectroscopy, and gel permeation chromatography revealed that the molecular weight of the poly(hydroxyl amic acid) increased with the molar content of HAB in the feedstock, because HAB exhibited higher polymerization reactivity than DAP. Moreover, the degree of grafting acrylate groups onto poly(hydroxyl amic acid) was determined by ¹H‐NMR spectroscopy. The photoresist was formulated by adding 2‐benzyl‐2‐N,N‐dimethylamino‐1‐(4‐morpholinophenyl) butanone (IRG369) and isopropylthioxanthone as a photoinitiator, tetra(ethylene glycol) diacrylate as a crosslinker, and tribromomethyl phenyl sulfone as a photosensitizer. The PSPI precursor exhibited a photosensitivity of 200 mJ/cm² and a contrast of 1.78. A pattern with a resolution of 10 μm was observed in an optical micrograph after thermal imidization at 300°C. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Enhanced mechanical and thermal properties of polyimide/organically modified montmorillonite hybrid film based on stable poly(amic acid) ammonium salt

In this study, polyimide/organically modified montmorillonite (PI/OMMT) hybrid film was prepared by in situ polymerization from the stable poly(amic acid) ammonium salt/OMMT (PAAS/OMMT) precursor hybrid. PAAS was obtained by incorporating calculated triethylamine into terpolymer poly(amic acid) (PAA), which was synthesized by pyromellitic dianhydride (PMDA), 4,4′‐oxydianiline and p‐phenylenediamine in dimethylacetamide (DMAc). OMMT as a type of layered clays was prepared through surface treatment of montmorillonite (MMT) with 1‐hexadecylamine. Mechanical property measurements of PI/OMMT hybrid film indicated that the addition of 5 wt% of OMMT increased the Young's modulus of PI film up to 11.24 GPa, which is 58% higher than the pristine PI film from PAAS. Besides, the tensile strength increased to 168.36 MPa, which was higher than that of PI film derived from PAA (164.3 MPa) and PI film derived from PAAS (145.2 MPa). Moreover, the thermal stabilities of PI/OMMT hybrid film with appropriate OMMT content were also better than those of original PI films. POLYM. COMPOS., 34:2076–2081, 2013. © 2013 Society of Plastics Engineers     

Synthesis and characterization of calix[4]arene‐containing polyimides

Three types of amino‐functionalized calixarenes, i.e. the diaminocalix[4]arenes 5,17‐diaminomethyl‐25,26,27,28‐tetrapropoxycalix[4]arene, 25,27‐diaminoethoxy‐26,28‐dihydroxycalix[4]arene and 5,11,17,23‐tetra‐tert‐butyl‐25,27‐diaminoethoxy‐26,28‐dihydroxycalix[4]arene, were synthesized and incorporated as comonomers into the backbones of aromatic polyimides. As a first step, polyimide precursors (poly(amic acid)s) were prepared by condensation reaction of diamine with dianhydride at the stoichiometric ratio. The diamine component was composed of synthesized diaminocalix[4]arene and commercial 4,4′‐oxydianiline combined in various molar ratios. The dianhydride used was 4,4′‐oxydiphthalic anhydride. The poly(amic acid)s were characterized using intrinsic viscosity measurements and their chemical composition was determined using ¹H NMR spectroscopy. The precursors were then transformed into the polyimides using a thermal treatment. Thermal and dynamic mechanical behaviour, wide‐angle X‐ray diffraction and solubility of the resulting polyimide films in selected solvents were evaluated. The structure–property relationship of the novel types of synthesized polyimides is discussed in terms of the calixarene monomer used and the fraction of it incorporated into the polymer backbone. Copyright © 2010 Society of Chemical Industry