共查询到16条相似文献,搜索用时 156 毫秒
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用次磷酸钠取代传统化学镀铜中的甲醛作为还原剂,研究了化学镀铜的基本工艺,揭示了络合剂(酒石酸钾钠)用量、次磷酸钠用量对铜沉积速度的影响。确定了最佳工艺条件为酒石酸钾钠质量浓度15 g/L,次磷酸钠质量浓度30 g/L,镀液的pH值为11左右,温度65℃。 相似文献
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《电镀与涂饰》2015,(15)
以次磷酸钠为还原剂在腈纶纤维表面进行化学镀铜,研究了单一添加剂苯亚磺酸钠和N-羟乙基乙二胺三乙酸(HEDTA)的用量对镀层电阻、增重率和阴阳极极化过程的影响。单一添加剂苯亚磺酸钠和HEDTA在一定浓度范围内能明显促进次磷酸钠的阳极氧化,从而提高增重率,降低镀层电阻,最佳质量浓度分别为苯亚磺酸钠40 mg/L、HEDTA 60 mg/L。对比研究了无添加剂镀液和分别添加了苯亚磺酸钠40 mg/L、HEDTA 60 mg/L以及复合添加剂(40 mg/L苯亚磺酸钠+60 mg/L HEDTA)的镀液的阳极和阴级极化曲线,通过扫描电镜观察了所得铜镀层的表面形貌。较之单一添加剂,40 mg/L苯亚磺酸钠+60 mg/L HEDTA复合添加剂主要抑制了次磷酸钠的阳极氧化,使得镀层表面更加均匀、细致和平整。 相似文献
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先在普通打印机上用活化导电银油墨将线路图打印在聚酰亚胺(PI)基板上,固化后再化学镀铜制得印制电路板(PCB)。研究了导电银油墨的还原剂对不同体系镀液化学镀铜层厚度、导电性、结合力和抗氧化性的影响。结果表明,油墨的还原剂相同时,甲醛体系化学镀铜层的综合性能优于乙醛酸镀液。导电银油墨的最佳还原剂为丙酸,即油墨的最佳配方为:丙酸0.5 mol/L,Ag NO3 0.5 mol/L,10%(质量分数)OP乳化剂适量。采用0.5 mol/L丙酸油墨–甲醛镀液体系制得厚度为3.10μm的铜镀层,其抗氧化时间为44 s,电阻率为1.00×10-7?·m,与PI基板间的结合力良好,综合性能最佳。 相似文献
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采用AgNO_3取代传统的活化剂PdCl_2,改进PET及PVC基材表面化学镀铜预处理过程,开展了PET和PVC基材表面化学镀铜的比较研究。重点考察了化学镀铜温度和pH等操作工艺条件以及化学镀铜液中主盐和还原剂含量对镀铜效果的影响。结果表明:PET和PVC的镀铜增重率均随温度升高先增大而后减小,PET和PVC的最佳镀铜温度分别为70℃和75℃,二者镀铜的最佳pH值分别为12和11;PET和PVC镀铜时化学镀铜液中硫酸铜的最佳质量浓度均为15 g/L;PET镀液中甲醛的最佳用量为15 ml/L,PVC镀液中甲醛的最佳用量为20 ml/L。采用SEM测试对比考察了PET和PVC镀铜层表面和切面的形态形貌,结果表明,在相同化学镀条件下,PET基材表面的化学镀铜效果明显优于PVC。 相似文献
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R. Touir H. Larhzil M. EbnTouhami M. Cherkaoui E. Chassaing 《Journal of Applied Electrochemistry》2006,36(1):69-75
A new bath formulation was developed, which allowed deposition of copper-rich Cu–Ni–P alloys in electroless acidic solutions
in the absence of formaldehyde. The reducing agent was sodium hypophosphite. Though cupric ions do not catalyse the oxidation
of hypophosphite, we show that, in the presence of a low concentration of Ni(II) species, it is possible, even at low pHs,
to induce the reduction of the cupric species. A very strong preferential deposition of copper was observed, which gives Cu–Ni–P
layers with copper content up to 97 wt%. The phosphorus content decreased from 13% to 1% with increasing copper content. The
plating rate decreased when the copper sulfate concentration in the solution increased. It increased with increasing pH or
temperature, but the influence was less pronounced than in alkaline solutions. Compact layers were obtained with a nodular
morphology which did not markedly changed with composition. 相似文献
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Jun Li 《Electrochimica acta》2004,49(11):1789-1795
High electroless copper deposition rates can be achieved using hypophosphite as the reducing agent. However, the high deposition rate also results in dark deposits. In the hypophosphite baths, nickel ions (0.0057 M with Ni2+/Cu2+ mole ratio 0.14) were used to catalyze hypophosphite oxidation. In this study, additives (e.g. 2,2′-dipyridyl) were investigated to improve the microstructure and properties of the copper deposits in the hypophosphite (non-formaldehyde) baths. The influence of 2,2′-dipyridyl on the deposit composition, structure, properties, and the electrochemical reactions of hypophosphite (oxidation) and cupric ion (reduction) have been investigated. The electroless deposition rate decreased with the addition of 2,2′-dipyridyl to the plating solution and the color of the deposits changed from dark brown to a semi-bright with improved uniformity. The deposits also had smaller crystallite size and higher (1 1 1) plane orientation with the use of 2,2′-dipyridyl. The resistivity and nickel content of the deposit were not affected by 2,2′-dipyridyl additions to the bath. The electrochemical current-voltage results show that 2,2′-dipyridyl inhibits the catalytic oxidation of hypophosphite at the active nickel site. This results in a more negative electroless deposition potential and lower deposition rate. 相似文献
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化学镀铜在PCB生产中应用广泛,但常用的还原剂甲醛对人体和环境有害。本文综述了化学镀铜中替代甲醛的环保型还原剂的研究进展,介绍了以醛糖类、含硼化合物、低价金属盐、次磷酸盐作还原剂的化学镀铜研究现状及进展。 相似文献